CN116528502B

CN116528502B - Patch device

Info

Publication number: CN116528502B
Application number: CN202310817509.4A
Authority: CN
Inventors: 卢东娟; 朱冲冲; 周海龙; 李博; 戴敏; 王安林; 古龙
Original assignee: Beijing Sanzhonghuaxing Electronic Technology Co ltd
Current assignee: Beijing Sanzhonghuaxing Electronic Technology Co ltd
Priority date: 2023-07-05
Filing date: 2023-07-05
Publication date: 2023-08-22
Anticipated expiration: 2043-07-05
Also published as: CN116528502A

Abstract

The invention discloses a patch device, comprising: a spindle mechanism; a suction nozzle; a first spring arranged between the suction nozzle and the spindle mechanism; a gas flow path formed in the main shaft mechanism and the suction nozzle, the lower end of the suction nozzle forming a first suction port; an annular component having an annular inner cavity and an annular bottom surface, wherein the lower end of the suction nozzle penetrates through a central hole of the annular component to penetrate through the annular bottom surface, so that the annular bottom surface surrounds the first suction port to form a pickup surface, a shaft section of the suction nozzle penetrating through the annular component is provided with a vent hole which penetrates through radially and is used for enabling the annular inner cavity to be communicated with a gas flow path, and a second suction port communicated with the annular inner cavity is formed in a region where the pickup surface is located; the elastic component is uniformly distributed on the periphery of the lower end of the suction nozzle, and is provided with a protruding part protruding below the pick-up surface and circumferentially surrounding the pick-up surface, wherein the bottoms of the circumferentially surrounding protruding parts are positioned on the same plane and the protruding distance of the circumferentially surrounding protruding parts relative to the pick-up surface is larger than a preset distance.

Description

Patch device

Technical Field

The present invention relates to the field of electronic component mounting technology, and in particular, to a chip mounting device for mounting an electronic component on a printed circuit board.

Background

A chip mounter is a device for picking up electronic components from a component supply system and mounting the electronic components on a printed circuit board. In general, a chip mounter includes a spindle mechanism and a tubular suction nozzle provided at a lower end of the spindle mechanism, the suction nozzle and an inside of the spindle mechanism configure a gas flow path, and the gas flow path is penetrated to the lower end of the suction nozzle so that the lower end of the suction nozzle forms a suction port, and a negative pressure system is connected to the gas flow path so that the suction nozzle picks up (adsorbs) an electronic component to a lower end surface of the suction nozzle, which is thus also called a pick-up surface, by sucking the gas flow path into a negative pressure state, the proper adsorption surface being adapted according to a size of an area where the electronic component is picked up. When the electronic component is mounted on the printed circuit board, the negative pressure state of the gas flow path is canceled, so that the electronic component is released by the suction nozzle.

In the process of picking up and mounting an electronic component, a driving mechanism is required to drive a patch device to move downwards so as to enable a suction nozzle to be in contact with the electronic component and a printed circuit board, in order to prevent the electronic component and/or the printed circuit board from being damaged or even damaged due to overlarge impact on the electronic component and the printed circuit board caused by rigid contact of a pick-up surface of the suction nozzle, in the prior art, the patch device is arranged in a telescopic structure of the suction nozzle relative to a main shaft mechanism, and a spring is arranged between the suction nozzle and the main shaft mechanism, and can release the impact generated during contact to a certain extent when the suction nozzle is in contact with the electronic component and the electronic component picked up by the suction nozzle is in contact with the printed circuit board, namely, the spring has a buffer effect. The specific actions of picking up the electronic component and mounting the electronic component on the printed circuit board of the patch device are as follows:

Process of picking up electronic components: the driving mechanism drives the chip mounting device to enable the suction nozzle to move to the position above the electronic component to be picked up of the component supply system, then the driving mechanism drives the chip mounting device to move downwards, in the downward movement process, the pick-up surface of the suction nozzle is contacted with the electronic component, and at the moment of contact, the spring yields and is compressed, so that the suction nozzle and the electronic component can be prevented from generating excessive impact due to rigid contact, and the suction nozzle is retracted relative to the spindle mechanism due to the yielding of the spring; then, the driving mechanism drives the surface mount device to move upwards, so that the main shaft mechanism moves upwards, the suction nozzle stretches out again until reaching the maximum amount, and before the suction nozzle stretches out to the maximum amount, the negative pressure system sucks the air flow path into negative pressure to a certain degree, so that a suction port of the suction nozzle forms enough adsorption force to pick up the electronic component, and the surface mount device picks up the electronic component.

Process of mounting electronic components: the driving mechanism drives the paster device to enable the suction nozzle picking up the electronic component to move to the position above the position to be mounted of the printed circuit board, then the driving mechanism drives the paster device to move downwards, in the downward movement process, the electronic component below the picking-up surface is in contact with the printed circuit board, the spring yields and is compressed, the suction nozzle is retracted, meanwhile, the spring exerts pressure on the suction nozzle to enable the suction nozzle to apply the pressure to the electronic component, and the pressure is used as mounting force to facilitate the electronic component to be mounted on the printed circuit board. Then, the driving mechanism drives the chip mounting device to move upward, the suction nozzle is stretched again, the spring is reset, and before the suction nozzle is fully stretched, the positive pressure system (a system for supplying gas far higher than the atmospheric pressure) is used for providing air flow to the air flow path, so that the air flow path has positive pressure, the suction nozzle releases the electronic component due to the fact that the air flow is in a non-negative pressure state in the air flow path before the pick-up surface of the suction nozzle leaves the electronic component, and the air flow flows out of the suction nozzle and is blown to the electronic component to prevent the electronic component from being in a 'following' phenomenon. The "following" phenomenon refers to that a gap between the pick-up surface and the electronic component forms a negative pressure due to the inability to timely compensate air before the suction nozzle is separated from the electronic component by a small distance, so that the electronic component also moves up along with the pick-up surface, and the "following" phenomenon may cause a poor bonding effect of the electronic component and a colloid (e.g., solder paste) at a mounting position. Therefore, the electronic component can be effectively prevented from being "followed" by the airflow formed by the positive stress in the gas flow path.

However, the patch device in the prior art still has the following problems in the process of picking up and mounting electronic components:

1. during the mounting process, the "following" phenomenon occurs only within a small distance range of the pick-up surface from the electronic component, in which range the air flow is advantageous for the mounting of the electronic component because the occurrence of the "following" phenomenon can be avoided, however, after the pick-up surface moves up with the chip mounter more than this range, the air flow may be harmful for the mounting of the electronic component, because: after the pickup surface moves up a long distance larger than the "following" distance, the force acting on the electronic component by the air flow ejected from the suction port may be uneven due to manufacturing errors of the suction port, etc., and the electronic component may be "drifting" with respect to the original mounting position due to a certain thickness of a colloid such as solder paste under the electronic component and unstable morphology (in paste form). Particularly, the "drift" phenomenon is more likely to occur when the area of the mounted electronic component is larger.

2. In the pick-up process, although the spring can function to some extent to cushion the electronic component by yielding, since the spring also serves to provide the mounting force for the electronic component, the resistance (counter force of the electronic component to the suction nozzle) needs to be to some extent to yield the spring, and thus, a small impact is generated when the pick-up surface is in contact with the electronic component. Also, the larger the area of the electronic component, the greater the mounting force that may be required, and the greater the yield resistance of the spring in the configuration required to provide sufficient mounting force, and thus, the greater the area of the electronic component, the greater the impact of the nozzle typically.

3. In the prior art, there is little means for detecting the retraction damping of the suction nozzle (the damping mainly comprises the friction force applied by the suction nozzle when retracting and the elastic force of the spring on the suction nozzle), which results in that whether the installation force provided by the spring exceeds the required installation force range is unknown, and the surface (area) thickness is relatively large, so that the method is particularly harmful to the installation of electronic components with strict installation force requirements.

Disclosure of Invention

Aiming at the technical problems in the prior art, the embodiment of the invention provides a patch device.

In order to solve the technical problems, the technical scheme adopted by the embodiment of the invention is as follows:

a patch device, comprising:

a spindle mechanism connected to the drive mechanism;

a suction nozzle provided at a lower end of the spindle mechanism and capable of expanding and contracting with respect to the spindle mechanism;

a first spring provided between the suction nozzle and the spindle mechanism;

a gas flow path formed inside the spindle mechanism and the suction nozzle, the gas flow path penetrating to a lower end of the suction nozzle to form a first suction port at the lower end of the suction nozzle, a negative pressure system connected to the gas flow path for selectively sucking the gas flow path into a negative pressure state;

an annular member having an annular inner cavity and an annular bottom surface, wherein a lower end of the suction nozzle penetrates through a central hole of the annular member to the annular bottom surface, so that the annular bottom surface surrounds the first suction port to form a pickup surface, a shaft section of the suction nozzle penetrating through the annular member is provided with a vent hole penetrating radially, the vent hole is used for enabling the annular inner cavity to be communicated with the gas flow path, and a second suction port communicated with the annular inner cavity is formed in a region where the pickup surface is located;

The elastic parts are uniformly distributed on the periphery of the lower end of the suction nozzle, each elastic part is provided with a protruding part protruding below the pickup surface and circumferentially encircling the pickup surface, and the bottoms of the circumferentially encircling protruding parts are located on the same plane and the protruding distance relative to the pickup surface is larger than a preset distance;

during the downward movement of the pick-up face into contact with the electronic component to be picked up, the elastic member yields before the first spring so that the protruding portion is retracted from below the pick-up face to above the pick-up face;

the elastic member is reset such that the projecting portion projects again from the pick-up face in a process of moving the pick-up face upward to be separated from the electronic component which has been placed, and the projecting portion is in a state of being pressed against the electronic component in the projecting process.

Preferably, the picking surface is provided with a plurality of hollowed-out parts penetrating through the annular inner cavity, the hollowed-out parts are circumferentially arranged, and the periphery of each hollowed-out part is provided with a step part;

the elastic member includes:

the guide sleeve is positioned in the annular inner cavity, sleeved outside the suction nozzle and can axially slide relative to the suction nozzle;

The actuating flat plates are circumferentially arranged and correspond to the hollowed-out parts one by one, the radial inner end of each actuating flat plate is connected to the guide sleeve through a vertical plate, and the bottom surfaces of the actuating flat plates are located on the same plane;

the second spring is arranged in the annular inner cavity and sleeved outside the suction nozzle to be used for pushing the guide sleeve downwards so that the actuating plate protrudes out of the pick-up surface to form the protruding part;

during the downward movement of the pick-up face into contact with the electronic component to be picked up, the second spring yields before the first spring so that the actuation plate retracts above the pick-up face to be stopped by the step;

the second suction port is arranged on the actuating plate.

Preferably, the pick-up surface is provided with a plurality of avoidance grooves penetrating through the annular inner cavity, the plurality of avoidance grooves are circumferentially distributed, and each avoidance groove extends along the radial direction;

the elastic component comprises a cage-shaped component, the cage-shaped component is arranged in the annular inner cavity, and the upper end of the cage-shaped component is fixed on the top wall of the annular inner cavity; the cage-like member includes a plurality of elastic rings arranged circumferentially, the elastic rings being concave toward opposite sides in regions corresponding to both a radially inner wall and a radially outer wall of the cage-like member so that the elastic rings are elastically stretchable in an axial direction; the lower parts of the elastic rings respectively correspond to the pick-up surfaces which extend out of the avoidance grooves, and the bottom surfaces of the lower parts of the elastic rings are positioned on the same plane;

During the downward movement of the pick-up face into contact with the electronic component to be picked up, the cage member yields before the first spring to retract the elastic ring above the pick-up face;

the second suction port is arranged on the pick-up surface between every two adjacent avoidance grooves.

Preferably, the pick-up surface is provided with a plurality of openings penetrating through the annular inner cavity, the plurality of openings are circumferentially distributed, and each opening extends radially;

the elastic component comprises a ring body and a plurality of elastic strips which are integrally formed with the ring body and circumferentially arranged, and each elastic strip radially extends;

the ring body is sleeved outside the suction nozzle and fixed on the bottom wall of the annular inner cavity, and the elastic strips are respectively in one-to-one correspondence with the openings;

each elastic strip is provided with a flat part at the radial distal end and a bending part which is arranged between the flat part and the ring body and bends downwards, and the bending part enables the flat part to protrude out of the picking surface to form the protruding part; the bottom surfaces of the flat parts of the elastic strips which are circumferentially arranged are positioned on the same plane;

during the downward movement of the pick-up face into contact with the electronic component to be picked up, the elastic strip yields before the first spring so that the elastic strip retracts above the pick-up face;

The second suction port is arranged on the pick-up surface between every two adjacent openings.

Preferably, the spindle mechanism comprises a first spindle and a second spindle; the first main shaft is positioned below the second main shaft; the upper end of the suction nozzle stretches into the first main shaft and can stretch and retract relative to the first main shaft; the first spring is arranged in the first main shaft and pushes the suction nozzle downwards; wherein:

a pretensioning member that yields in an axial direction is provided between the first spindle and the second spindle, and a yield timing of the pretensioning member is configured to: when the maximum damping suffered by the suction nozzle in the compression retraction process is greater than the preset damping, the pre-tightening part yields;

the upper end of the first main shaft is provided with a guide shaft which extends into the second main shaft, and the outer peripheral surface of the shaft section of the second main shaft, which is positioned by the guide shaft, is provided with an annular groove; two radial through air holes are formed in two sides of the second main shaft, the two air holes are located above the annular groove, and the two air holes are connected to an air circuit with a gas detection sensor;

when the pre-tightening part yields, the guide shaft moves upwards so that the annular groove communicates the two air guide holes.

Preferably, the pre-tightening component comprises a plurality of axially stacked elastic units, the elastic units are in an annular structure, each elastic unit comprises an annular main body part and two elastic ring plates which are integrally formed with the main body part and are positioned on the outer side of the main body part in the radial direction, and an elastic deformation gap is formed between the two elastic ring plates.

Preferably, the annular groove is constructed in a wedge-shaped cross-section structure with a wide upper part and a narrow lower part.

Preferably, an adjusting nut is sleeved on the outer peripheral surface of the lower end of the second main shaft, and the adjusting nut is screwed to adjust the compression amount of the pre-tightening part.

Preferably, the gas flow path is selectively provided with a gas flow damping member; the airflow damping member includes:

the outer peripheral surface of the conical basket is provided with a plurality of finger-shaped air passing holes which are circumferentially distributed;

the inner layer component is arranged in the conical basket and is provided with a plurality of finger-shaped elastic sheets which are circumferentially arranged, the finger-shaped through holes are blocked by the plurality of finger-shaped elastic sheets at intervals, so that one of every two adjacent finger-shaped through holes is in a closed state, and the other finger-shaped through holes are in an open state.

Preferably, the annular member includes: the lower ring plate, the upper ring plate positioned above the lower ring plate and the coaming plate between the upper ring plate and the lower ring plate; the pick-up surface is formed on the annular bottom surface of the lower annular plate.

Compared with the prior art, the patch device provided by the embodiment of the invention has the beneficial effects that:

1. the patch device provided by the invention can effectively avoid the drift phenomenon of the electronic element when the electronic element is attached, and a positive pressure system is not needed.

2. The patch device provided by the invention can detect whether the damping suffered by the suction nozzle in the retraction process exceeds a preset value, and further can effectively detect whether the mounting force provided by the patch device exceeds the required mounting force.

3. Compared with the traditional chip mounting device, the chip mounting device provided by the invention has better buffering effect on electronic elements.

4. The surface mounting device provided by the invention can be directly applied to a traditional surface mounting machine with a positive pressure system, and negative pressure in a gas flow path can be compensated by using the positive pressure system.

Drawings

Fig. 1 is a schematic view of the three-dimensional structure of the patch device according to the present invention (the elastic member shown is the elastic member provided in embodiment 1).

Fig. 2 is a perspective cross-sectional view of the patch device provided by the present invention (the elastic member shown is the elastic member provided in embodiment 1).

Fig. 3 is an enlarged view of a portion a of fig. 2 (the bottom of the elastic member is in a state protruding below the pick-up surface).

Fig. 4 is an enlarged view of a portion a of fig. 2 (the bottom of the elastic member is in a state retracted above the pick-up surface).

Fig. 5 is an enlarged view of a portion B of fig. 2.

Fig. 6 is a view showing a state of the chip mounter according to the present invention during mounting of components (the elastic member is in a state of being fully extended from the pick-up surface and being about to leave the electronic component)

Fig. 7 is a schematic view showing the structure of the annular member mounted with the elastic member provided in embodiment 2.

Fig. 8 is a perspective cross-sectional view of an annular member to which the elastic member provided in embodiment 2 is attached.

Fig. 9 is a schematic perspective view of an elastic member according to embodiment 2.

Fig. 10 is a schematic view showing the structure of the annular member mounted with the elastic member provided in embodiment 3.

Fig. 11 is a perspective cross-sectional view of an annular member to which the elastic member provided in embodiment 3 is attached.

Fig. 12 is a schematic perspective view of an elastic member according to embodiment 3.

Fig. 13 is a schematic perspective view of a spindle mechanism with an airflow damping member mounted thereto.

Fig. 14 is a schematic perspective view of an airflow damping member.

In the figure:

10-a suction nozzle; 11-a first suction opening; 12-vent holes; 13-a limiting table; 30-a spindle mechanism; 31-a first spindle; 311-a first stop table; 312-applying a retainer ring; 32-a second spindle; 321-a second stop table; 33-a guide shaft; 331-a retainer ring for the shaft; 40-an annular member; 41-picking up surface; 42-lower ring plate; 421-hollowed-out parts; 422-step; 423-avoiding grooves; 424-opening; 43-upper ring plate; 44-coaming; 45-annular space; 46-a second suction opening; 46' -a second suction opening; 46 "-a second suction opening; 50-a first spring; 60-pretensioning part; 61-an elastic unit; 611-elastic ring plates; 612-a body portion; 70-gas flow path; 81-an annular groove; 82-air vent; 90-an airflow damping member; 91-conical basket; 911-finger-shaped air holes; 92-an inner layer component; 921-finger-like spring pieces; 100-electronic components; 200-a printed circuit board; 300-colloid; 20-an elastic member; 21-an actuation plate; 22-a guide sleeve; 23-vertical plates; 24-a second spring; a 20' -elastic member; 21' -cage-like members; 211' -an elastic ring; 20 "-elastic means; 21 "-an elastic strip; 211 "-a flat portion; 212 "-a bend; 22'' -ring body.

Detailed Description

The present invention will be described in detail below with reference to the drawings and detailed description to enable those skilled in the art to better understand the technical scheme of the present invention.

The embodiment of the invention discloses a chip mounting device which is arranged at the bottom of a chip mounter, and is driven by a driving mechanism of the chip mounter to perform vertical movement and horizontal movement, and a gas system (at least comprising a negative pressure system) of the chip mounter is utilized to pick up, transport and mount electronic elements 100.

As shown in fig. 1 to 4, the patch device includes: the suction nozzle 10, the spindle mechanism 30, the gas flow path 70, the first spring 50, the ring-shaped member 40, and the elastic member (fig. 1 to 4 show the elastic member 20 of one structure provided in the following embodiment 1, of course, the elastic member may also be the elastic structure 20' of one structure provided in the following embodiment 2 as shown in fig. 7, the elastic member may also be the elastic structure 20″ of one structure provided in the following embodiment 3 as shown in fig. 10, or the elastic member may also be a structure not shown in all of the drawings of the specification drawings).

The suction nozzle 10 is configured in a tubular structure, i.e., the suction nozzle 10 has an inner bore that is axially through; the spindle mechanism 30 is configured to have an inner hole penetrating axially therein; the upper end of the suction nozzle 10 extends into the spindle mechanism 30 from the lower end of the spindle mechanism 30, and enables the suction nozzle 10 to axially slide relative to the spindle mechanism 30; thus, the inner hole of the spindle mechanism 30 communicates with the inner hole of the suction nozzle 10, and the inner hole of the suction nozzle 10 and the inner hole of the spindle mechanism 30 form a gas flow path 70; the upper end of the spindle unit 30 is connected to the main body device of the mounter, and the negative pressure system is connected to the upper end of the spindle unit 30 through an air passage or an air pipe, so that the upper end of the gas flow path 70 is connected to the negative pressure system, and after the negative pressure system sucks the gas into the gas flow path 70 so that a negative pressure state is formed in the gas flow path 70, the lower port of the suction nozzle 10 (i.e., the lower end of the gas flow path 70) can pick up (adsorb) the electronic component 100, and thus the lower port of the suction nozzle 10 forms a suction port of the suction nozzle 10 (or a suction port of the gas flow path 70), which may be referred to as the first suction port 11. Preferably, by providing a seal ring between the upper portion of the suction nozzle 10 and the inner hole of the spindle mechanism 30, it is possible to prevent the outside air from entering the air flow path 70 through between the suction nozzle 10 and the spindle mechanism 30 when the air flow path 70 is in a negative pressure state.

The first spring 50 is provided between the spindle mechanism 30 and the suction nozzle 10, and the first spring 50 is known to provide a certain degree of buffering when the suction nozzle 10 picks up the electronic component 100 and when the suction nozzle 10 mounts the electronic component 100, and to provide a mounting force for mounting the electronic component 100 on a paste 300 (e.g., solder paste) of the printed circuit board 200 when the electronic component 100 is mounted. As shown in fig. 2, specifically, the upper end of the suction nozzle 10 is formed with a radially outwardly expanding stopper 13, the inner hole of the main shaft mechanism 30 is formed with a first stopper 311, the stopper 13 is abutted against the first stopper 311 to prevent the upper end of the suction nozzle 10 from coming out of the lower end of the main shaft mechanism 30, a first spring 50 is provided in the inner hole of the main shaft mechanism 30 above the suction nozzle 10, a collar 312 is provided in the inner hole of the main shaft mechanism 30, the first spring 50 is interposed between the collar 312 and the upper end of the suction nozzle 10, and the first spring 50 has a certain compression amount, so that the first spring 50 provides an elastic force for the suction nozzle 10 for providing a mounting force when the suction nozzle 10 mounts the electronic component 100 on the printed circuit board 200, and for re-extending the suction nozzle 10 for resetting after the suction nozzle 10 picks up the electronic component 100 and leaves the component supply system and the suction nozzle 10 mounts the electronic component 100 on the printed circuit board 200 off the printed circuit board 200.

As shown in fig. 3 and 4, the annular member 40 is provided at the lower end of the suction nozzle 10, and specifically, the annular member 40 includes a lower annular plate 42, an upper annular plate 43, and a cylindrical shroud 44, the upper annular plate 43 being located above the lower annular plate 42 and coaxial with the lower annular plate 42, the shroud 44 being interposed between edges of the two annular plates; the lower end of the suction nozzle 10 extends from the center hole of the upper ring plate 43 to the center hole of the lower ring plate 42, so that the inside of the ring-shaped member 40 forms an annular inner cavity. The lower end surface of the suction nozzle 10 is located above or flush with the annular bottom surface of the lower annular plate 42, the annular bottom surface surrounds the first suction port 11 of the suction nozzle 10, and after the electronic component 100 is picked up by the first suction port 11, the electronic component 100 is attached to the annular bottom surface, and thus, the annular bottom surface is the pickup surface 41 of the chip mounter. Thus, the chip mounter is suitable for picking up an electronic component 100 having a larger area 41 than the lower end surface of the suction nozzle 10.

A plurality of ventilation holes 12 which are radially penetrated and circumferentially arranged are formed in a shaft section of the suction nozzle 10 penetrating the annular member 40 (i.e., in a shaft section of the suction nozzle 10 located in the annular inner chamber), and the ventilation holes 12 allow the annular inner chamber to communicate with the gas flow path 70, so that when the negative pressure system sucks the gas flow path 70 into a negative pressure state, the annular inner chamber is also sucked into a negative pressure state. Preferably, the vent hole 12 is configured as an axially extending slot for reducing resistance to airflow through the vent hole 12. As shown in fig. 3, a second suction port (fig. 3 shows a second suction port 46 of a structure and position provided in embodiment 1 below, which may, of course, be a second suction port 46' of a structure and position provided in embodiment 2 below, as shown in fig. 7), which may also be a second suction port 46″ of a structure and position provided in embodiment 3 below, as shown in fig. 10, or which may also be a structure not shown in all of the drawings of the specification drawings), which includes a plurality of second suction ports, which are circumferentially distributed, and which, after the negative pressure system sucks the air flow path 70 into a negative pressure state, the first suction port 11 sucks the electronic component 100 from the middle of the electronic component 100, and the second suction port sucks the electronic component 100 from the periphery of the middle of the electronic component 100, so that the first suction port 11 cooperates with the second suction port to pick up the electronic component 100, thereby being able to exert a large pick-up force on the electronic component 100, particularly suitable for the electronic component 100.

In the present invention, at least two functions of the annular member 40 are: firstly, a pick-up surface 41 positioned at the periphery of the suction nozzle 10 is formed to be suitable for the electronic component 100 with larger pick-up surface 41 area; second, it is convenient to construct a second suction opening for picking up the electronic component 100 for providing a more uniform pick-up force for the electronic component 100.

The elastic member is configured to be capable of expanding and contracting by restoring and yielding in the axial direction, is disposed on the periphery of the suction nozzle 10 and surrounds the suction nozzle 10, and is fixed in the annular inner cavity of the annular member 40. The dimension of the elastic member in the axial direction is configured to: as shown in fig. 3, in a natural state, i.e., in an unyielding state, the bottom of the elastic member passes through the lower ring plate 42 to be located below the pick-up surface 41, i.e., in a natural state, the elastic member has a convex portion located below the pick-up surface 41 such that the bottom surfaces of the convex portions are located on the same plane and such that the distance of the bottom surfaces of the convex members from the pick-up surface 41 is greater than a preset distance. The preset distance setting rule is as follows: the preset distance is a distance such that the pick-up surface 41 is away from the electronic component 100 that has been mounted on the printed circuit board 200 without generating a "following" phenomenon, that is, the preset distance is a distance value equal to or greater than the "following" distance.

The yield time of the elastic member is configured to: during the driving mechanism driving the patch device to move down to contact the electronic component 100, the elastic member is first yielding and then the first spring 50 is yielding, which can be achieved by designing the overall stiffness of the elastic member to be smaller than the overall stiffness of the first spring 50.

The operation of the above-structured chip mounter in picking up the electronic component 100 from the component supply system and mounting the electronic component 100 on the printed circuit board 200 will be described below.

Process of picking up the electronic component 100: the driving mechanism drives the chip mounting device so that the suction nozzle 10 in the extended state moves above the electronic component 100 of the component supply system and aligns the pickup surface 41 with the electronic component 100; then, the driving mechanism drives the chip mounting device to move down so that the pick-up surface 41 moves down, during which the protruding portion of the elastic member located under the pick-up surface 41 is first brought into contact with the electronic component 100, and the protruding portion retracts with the downward movement of the pick-up surface 41 due to the elastic member yielding prior to the first spring 50, and when the pick-up surface 41 contacts the electronic component 100, the protruding portion retracts above the pick-up surface 41; after the pick-up surface 41 contacts the electronic component 100, the second spring 24 starts to yield, the suction nozzle 10 is retracted relative to the spindle mechanism 30, and after the pick-up surface 41 contacts the electronic component 100, the negative pressure system sucks the air flow path 70 into a negative pressure state, so that the first suction port 11 and the second suction port simultaneously suck and pick up the electronic component 100; subsequently, the driving mechanism drives the chip mounter to move up, at this time, the suction nozzle 10 is again protruded with respect to the spindle mechanism 30, and when the protrusion is made to the maximum amount, the pickup surface 41 picks up the electronic component 100 off the component supply system, and the pickup operation is completed.

In the process of picking up the electronic component 100, since the elastic component first contacts the electronic component 100 and yields before the first spring 50, the elastic component can reduce the impact of the first spring 50 on the electronic component 100 caused by a certain yield resistance to a certain extent, and compared with the case of buffering the contact of the electronic component 100 by using only the spring (the first spring 50), the patch device provided by the invention has better buffering effect on the electronic component 100 in the process of picking up the electronic component 100.

Process of mounting electronic component 100: the driving mechanism drives the patch device to enable the pick-up surface 41 for picking up the electronic component 100 to move to the position above the position to be mounted of the printed circuit board 200 and enable the electronic component 100 to be aligned with the position to be mounted; then, the driving mechanism drives the pick-up surface 41 of the electronic component 100 to move downward, during which the electronic component 100 located below the pick-up surface 41 contacts the printed circuit board 200, then the first spring 50 yields to retract the suction nozzle 10 relative to the spindle mechanism 30, the elastic force of the first spring 50 against the suction nozzle 10 increases to increase the pressure of the pick-up surface 41 against the electronic component 100, thereby providing a mounting force for the electronic component 100, during which the negative pressure system withdraws the suction of the gas flow path 70 and can cancel the negative pressure state in the gas flow path 70 by communicating the gas flow path 70 with the atmosphere, after the suction nozzle 10 retracts to bring the mounting force of the pick-up surface 41 against the electronic component 100 to a set mounting force, the driving mechanism drives the pick-up device to move upward, and then the pick-up nozzle 10 is readmitted, after the suction nozzle 10 extends to the maximum, the pick-up surface 41 leaves the electronic component 100, and when the pick-up surface 41 leaves the electronic component 100, the lower part of the elastic component is pressed against the convex surface of the electronic component 100 all the time as shown in fig. 6, and the electronic component is completely removed from the bottom of the electronic component 100.

In the mounting process, the elastic member is particularly important: as shown in fig. 6, since the distance from the bottom surface of the protruding portion of the elastic member to the pick-up surface 41 is greater than the preset distance, which is a distance that causes the electronic component 100 not to "follow" the phenomenon, when the elastic member leaves the electronic component 100, as long as the air flow path 70 is not in a negative pressure state, the electronic component 100 will not "follow" the phenomenon, and thus it is unnecessary to provide an excessive air flow to the electronic component 100 during the process of leaving the electronic component 100 from the pick-up surface 41, so that the probability of occurrence of the drift phenomenon of the electronic component 100 can be effectively reduced.

In addition, in the new chip mounter configured based on the structure and the working principle of the chip mounter according to the present invention, it is unnecessary to provide a positive pressure system in the gas system, and only the negative pressure system and the pipeline communicating with the atmosphere need to be constructed, which can not only effectively reduce the cost, but also avoid the noise and the easy damage caused by the switching of the valve between the positive pressure system and the negative pressure system.

The present invention provides several structural forms of the elastic member by the following embodiments.

Examples

As shown in fig. 3 and 4, in the present embodiment, a plurality of fan-shaped hollowed-out portions 421 penetrating into the annular inner cavity are formed on the pick-up surface 41, the hollowed-out portions 421 are circumferentially arranged, and a step portion 422 is formed on the periphery of each hollowed-out portion 421.

The elastic member 20 includes: a guide sleeve 22, an actuating plate 21 and a second spring 24. The guide sleeve 22 is located in the annular inner cavity, sleeved outside the suction nozzle 10, and can axially slide relative to the suction nozzle 10. The actuating plate 21 includes a plurality of actuating plates 21, each actuating plate 21 is configured to be matched with the shape of the hollowed-out portion 421 and has a fan-shaped structure with a size slightly smaller than the hollowed-out portion 421, the plurality of actuating plates 21 are in circumferential Xiang Paibu and one-to-one correspondence with the plurality of hollowed-out portions 421, the radially inner end of each actuating plate 21 is connected to the guide sleeve 22 through the vertical plate 23, and the bottom surfaces of the plurality of actuating plates 21 are located on the same plane. The second spring 24 is disposed in the annular cavity and sleeved outside the suction nozzle 10 for pushing down against the guide sleeve 22, so that the actuating plate 21 protrudes from the pick-up surface 41 to form a protruding portion. During the downward movement of the pick-up surface 41 into contact with the electronic component 100 to be picked up, the second spring 24 yields before the first spring 50 so that the actuation plate 21 retracts above the pick-up surface 41 to be stopped by the stepped portion 422.

A second suction opening 46 is provided in each of the actuation plates 21, and specifically, the second suction opening 46 includes a radially extending elongated hole and circular holes located on both sides of the elongated hole.

In picking up the electronic component 100, the lower plate surface of the actuation plate 21 protruding from the pick-up surface 41 is first brought into contact with the electronic component 100 and then retracted, and after the air flow path 70 is sucked into a negative pressure state, the second suction port 46 located on the actuation plate 21 is engaged with the first suction port 11 to synchronously pick up the electronic component 100.

The elastic member 20 of this structure has advantages in that:

1. after the electronic component 100 is picked up, the second suction port 46 is opened on the actuation plate 21, so that the actuation plate 21 does not apply pushing force to the electronic component 100, and deformation of the electronic component 100 due to mechanical force (pushing force is mechanical force) can be effectively reduced. Thus, the elastic member 20 having this structure type is more suitable for picking up a thin electronic component 100 having a relatively large suction surface (area) thickness.

2. Since the elastic member 20 of this structure is allowed to expand and contract the operation plate 21 by the return and yielding of the second spring 24, the accuracy with which the bottom surfaces of all the operation plates 21 are positioned on the same plane is high, and the pressure applied to the electronic component 100 is very uniform when the electronic component 100 is in contact with the same.

It should be noted that: the width of the actuation plate 21 is minimized and the number of circumferential arrangements of the actuation plate 21 is maximized while providing sufficient area for opening the second suction opening 46.

Example 2

As shown in fig. 7 to 9, in the present embodiment, a plurality of avoidance grooves 423 penetrating into the annular inner cavity are formed on the pickup surface 41, the plurality of avoidance grooves 423 are circumferentially arranged, and each avoidance groove 423 extends in a radial direction.

The elastic member 20 'includes a cage member 21', the cage member 21 'is disposed in the annular cavity and an upper end of the cage member 21' is fixed to a top wall of the annular cavity; the cage member 21' includes a plurality of elastic rings 211' arranged circumferentially, the elastic rings 211' being recessed toward the opposite sides in regions corresponding to the radially inner wall and the radially outer wall of the cage member 21' so that the elastic rings 211' can elastically expand and contract in the axial direction; the lower parts of the plurality of elastic rings 211 'respectively correspond to the pick-up surface 41 which is extended out of the avoidance grooves 423, and the bottom surfaces of the lower parts of the plurality of elastic rings 211' are positioned on the same plane; during the downward movement of the pick-up surface 41 into contact with the electronic component 100 to be picked up, the cage member 21 'yields before the first spring 50, retracting the elastic ring 211' above the pick-up surface 41.

In picking up the electronic component 100, the bottom surface of the circumferentially arranged elastic ring 211' protruding from the pick-up surface 41 is first brought into contact with the electronic component 100 and is bent by the concave region of the cage member 21' so as to retract above the pick-up surface 41, and after the gas flow path 70 is sucked into a negative pressure state, the second suction port 46' located on the pick-up surface 41 cooperates with the first suction port 11 to pick up the electronic component 100 simultaneously.

In the process of mounting the electronic component 100, after the pick-up surface 41 leaves the electronic component 100, the bottom surface of the elastic ring 211' is pressed against the electronic component 100, and after the elastic ring 211' is completely reset, the bottom of the elastic ring 211' leaves the electronic component 100.

The advantage of the elastic member 20' of this construction is that:

1. when the electronic component 100 is mounted, the elastic ring 211 'is separated from the electronic component 100, and the elastic ring 211' has a small area corresponding to the electronic component 100, so that the gap between the elastic ring and the electronic component is easily compensated by air in time.

2. The elastic member 20' of this structure can provide a relatively large elastic force and yield resistance, and thus is more suitable for sucking the electronic component 100 having a relatively large thickness.

Examples

As shown in fig. 10 to 12, in this embodiment, the pick-up surface 41 is provided with a plurality of openings 424 penetrating into the annular cavity, and the plurality of openings 424 are circumferentially arranged, and each opening 424 extends radially.

The elastic member 20' comprises a ring 22' and a plurality of elastic strips 21' formed integrally with the ring 22' and circumferentially arranged, each elastic strip 21' extending radially; the ring body 22 'is sleeved outside the suction nozzle 10 and fixed on the bottom wall of the annular inner cavity, and the plurality of elastic strips 21' are respectively in one-to-one correspondence with the plurality of openings 424; each elastic strip 21' has a flat portion 211' at a radial distal end and a bent portion 212' bent downward between the flat portion 211' and the ring body 22', the bent portion 212' protruding the flat portion 211' from the pick-up surface 41 to form a protruding portion; the bottoms of the flat portions 211 'of the circumferentially arranged elastic strips 21' are located on the same plane. During the downward movement of the pick-up surface 41 into contact with the electronic component 100 to be picked up, the elastic strip 21″ yields before the first spring 50 so that the elastic strip 21″ is retracted above the pick-up surface 41; the second suction opening 46″ is provided in the pick-up surface 41 between every adjacent two of the openings 424.

The advantage of the elastic member 20″ of this structure is that: the elastic member 20″ is simple to manufacture and occupies a small space.

As shown in fig. 5 in combination with fig. 1 and 2, the present invention further provides a spindle mechanism 30 with a preferred structure, and the spindle mechanism 30 with a preferred structure can detect whether damping applied during the retraction process of the suction nozzle 10 meets a preset requirement.

The spindle mechanism 30 includes: the first spindle 31, the second spindle 32, the guide shaft 33, and the pre-tightening member 60. The first spindle 31 is located at the lower end of the second spindle 32, and the upper end of the suction nozzle 10 extends into the first spindle 31, and the first spring 50 is also disposed in the first spindle 31.

The lower end of the guide shaft 33 is connected to the upper end of the first main shaft 31 in a screw-fit manner, and the upper end of the guide shaft 33 extends into the second main shaft 32 from the lower end of the second main shaft 32; the pre-tightening part 60 is sleeved on the guide shaft 33 and is arranged between the first main shaft 31 and the second main shaft 32; the upper end of the first spindle 31 is provided with a shaft retainer ring 331, the inner wall of the second spindle 32 is provided with a second stopper 321, and the shaft retainer ring 331 is stopped on the second stopper 321, so that the first spindle 31 is assembled with the second spindle 32 through the guide shaft 33, and the guide shaft 33 is processed into a smooth surface with higher precision, thereby enabling the guide shaft 33 to axially slide relative to the second spindle 32 with less damping.

The pre-tightening member 60 is fitted over the guide shaft 33 and interposed between the second main shaft 32 and the first main shaft 31 (or the stepped end surface of the guide shaft 33), and the pre-tightening member 60 is configured to be capable of expanding and contracting, that is, to yield when receiving a certain pressure to generate compression, and to return after the certain pressure is released. The yield timing (i.e., the timing at which compression deformation occurs) of the pretensioning member 60 is configured to: when the maximum damping experienced during compression retraction of the suction nozzle 10 is greater than the preset damping, the pre-tension member 60 yields. The preset damping is determined based on the mounting force required for mounting the electronic component 100, and the mounting force of the electronic component 100 depends on the sum of the elastic force of the first spring 50 and the frictional force between the suction nozzle 10 and the inner hole of the first main shaft 31 when the suction nozzle 10 is retracted (in a normal state, the frictional force is small, which is much smaller than where the first spring 50 is attached). Thus, the mounting force required for the electronic component 100 can be set as a preset damping. Thus, when the pre-tension member 60 yields, it is indicated that the actual mounting force of the pick-up surface 41 to the electronic component 100 has exceeded the required mounting force, and damage to the electronic component 100 and/or the printed circuit board 200 is likely to occur when the actual mounting force exceeds the required mounting force. And whether the actual installation force exceeds the required installation force can be detected based on the yield of the pre-tension member 60.

It should be noted that: since the spring (i.e., the first spring 50) does not generally increase in spring force during use after the spring force setting is completed as required, if the pre-tightening unit 60 yields, a large friction force increases between the suction nozzle 10 and the first spindle 31, indicating that the engagement between the suction nozzle 10 and the first spindle 31 may fail due to long-term use, lack of lubrication, or dirt mixing. Therefore, it is possible to further detect whether or not the fitting relationship between the suction nozzle 10 and the spindle mechanism 30 is out of order and whether or not replacement or maintenance is necessary by the yield of the pre-tightening member 60.

Visually monitoring whether the pretensioning member 60 yields not only increases the space occupied by the spindle mechanism 30, but also results in less accurate monitoring because the spindle mechanism 30 is a moving member.

In the present invention, an annular groove 81 is formed on the outer peripheral surface of the shaft section of the guide shaft 33 located in the inner hole of the second main shaft 32, two air guide holes 82 penetrating radially are formed on both sides of the second main shaft 32, the two air guide holes 82 are located above the annular groove 81 and abut against the annular groove 81, and the annular structure is constructed in a structure with a wedge-shaped cross section with a wide upper part and a narrow lower part. Two pilot holes are connected to a gas path for providing positive or negative pressure, for example, the gas path is connected to the above-mentioned negative pressure system, and a flow sensor (or pressure sensor) for checking whether the flow rate of the gas flow is changed is installed in the gas path. In this way, after the pre-tightening part 60 yields and the guide sleeve 22 moves up to cause the annular groove 81 to move up to connect the two guide holes, at this time, the sensor detects the change of the air flow (air pressure) in the air path to acquire the yield information generated by the pre-tightening part 60, and transmits the yield information to the control center, so that whether the mounting force of the patch device on the electronic component 100 meets the requirement and whether the related components need to be replaced or maintained can be detected at any time. The advantage of providing the annular groove 81 with a wedge-shaped cross section is that: after the annular groove 81 conducts the two air guide holes 82 only through the upper part, the air flow (pressure) in the air path can be changed greatly, so that the sensitivity of detection is provided.

In some preferred structures, as shown in fig. 5, the pre-tightening member 60 includes a plurality of elastic units 61 stacked axially, the elastic units 61 have a ring-shaped structure, the elastic units 61 include a ring-shaped main body portion 612 and two elastic ring 211 'plates 611 formed integrally with the main body portion 612 and located radially outside the main body portion 612, and an elastic deformation gap is provided between the two elastic ring 211' plates 611. The advantage of this structure is that: the amount of yield under the same pressure value can be adjusted by increasing or decreasing the number of elastic units 61.

In some preferred structures, the lower end of the second spindle 32 is sleeved with an adjusting nut, and the adjusting nut is screwed to adjust the compression amount of the pre-tightening part 60, so as to be used for matching with the first spring 50 to meet the requirement of different electronic components 100 on the installation force, for example, if a certain type of electronic components 100 require a larger installation force, the matching can be performed by improving the elasticity coefficient of the first spring 50 and increasing the compression amount of the pre-tightening part 60.

As shown in fig. 13 and 14, the present invention also provides an air flow damper member 90, which is selectively installed in the air flow path 70 as an optional member, specifically, when the above-described chip mounter is installed on a conventional chip mounter equipped with a positive pressure system without a pipe line communicating with the atmosphere, in which state the air flow damper member 90 needs to be installed in the air flow path 70 of the spindle mechanism 30. The airflow damping member 90 includes: the cone-shaped basket 91 and the inner layer part 92, wherein a plurality of finger-shaped air passing holes 911 which are circumferentially distributed are formed on the outer circumferential surface of the cone-shaped basket 91; the inner member 92 is disposed in the tapered basket 91, and the inner member 92 has a plurality of finger tabs 921 circumferentially arranged, the plurality of finger tabs 921 spacing to close off the finger-shaped air holes 911 such that one of each adjacent two of the finger-shaped air holes 911 is in a closed state and the other is in an open state.

When the negative pressure system is used to suck the gas flow path 70 for sucking the gas flow path 70 at the suction nozzle 10 to a negative pressure state, all the fingers of the inner member 92 are elastically deformed to open the blocked finger-shaped air passing holes 911, so that the air flow damper member 90 does not or less hinder the suction efficiency of the negative pressure system. Further, by providing the gas damper member in a tapered structure, the cross section of the gas flow passing through the region is increased, and thus, an increase in suction load due to the provision of the gas damper member 90 and a decrease in suction efficiency can be completely avoided.

During the mounting process, the positive pressure system supplies pressure gas to the gas flow path 70 during the process of leaving the electronic component 100 from the pick-up surface 41, and at this time, half of the finger-shaped air holes 911 on the gas damping member are re-blocked by the finger-shaped elastic pieces 921, so that the gas can be effectively throttled, and only a part of the gas flow path 70 downstream of the gas damping member enters for compensating the negative pressure, so that only a gas flow with a low flow rate is ejected at the pick-up surface 41. Therefore, the invention can also be applied to the traditional chip mounter without modifying the gas system of the chip mounter.

The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this invention will occur to those skilled in the art, and are intended to be within the spirit and scope of the invention.

Claims

1. A patch device, comprising:

a spindle mechanism connected to the drive mechanism;

a first spring provided between the suction nozzle and the spindle mechanism;

2. The patch device according to claim 1, wherein the pick-up surface is provided with a plurality of hollowed-out parts penetrating through the annular inner cavity, the hollowed-out parts are circumferentially arranged, and a step part is formed at the periphery of each hollowed-out part;

the elastic member includes:

the second suction port is arranged on the actuating plate.

3. The patch device of claim 1, wherein the pick-up surface is provided with a plurality of avoidance grooves penetrating into the annular inner cavity, the plurality of avoidance grooves are circumferentially arranged, and each avoidance groove extends along a radial direction;

4. The patch device of claim 1, wherein the pick-up surface is provided with a plurality of openings extending through to the annular cavity, the plurality of openings being circumferentially arranged, each of the openings extending radially;

5. The patch device of claim 1, wherein the spindle mechanism comprises a first spindle and a second spindle; the first main shaft is positioned below the second main shaft; the upper end of the suction nozzle stretches into the first main shaft and can stretch and retract relative to the first main shaft; the first spring is arranged in the first main shaft and pushes the suction nozzle downwards; wherein:

6. The patch device of claim 5, wherein the pre-tightening member comprises a plurality of axially stacked elastic units, the elastic units are in an annular structure, the elastic units comprise an annular main body portion and two elastic ring plates integrally formed with the main body portion and located radially outside the main body portion, and an elastic deformation gap is formed between the two elastic ring plates.

7. The patch device of claim 5, wherein the annular channel is configured in a wedge-shaped cross-section configuration with a wider upper portion and a narrower lower portion.

8. The patch device according to claim 5, wherein an adjusting nut is fitted over an outer peripheral surface of the lower end of the second spindle, and the compression amount of the pre-tightening member is adjusted by screwing the adjusting nut.

9. The patch device of claim 1, wherein the gas flow path is optionally provided with a gas flow damping member; the airflow damping member includes:

10. The patch device of claim 1, wherein the annular member comprises: the lower ring plate, the upper ring plate positioned above the lower ring plate and the coaming plate between the upper ring plate and the lower ring plate; the pick-up surface is formed on the annular bottom surface of the lower annular plate.