CN210956621U - Chip carrying suction head for semiconductor production - Google Patents
Chip carrying suction head for semiconductor production Download PDFInfo
- Publication number
- CN210956621U CN210956621U CN201922329082.5U CN201922329082U CN210956621U CN 210956621 U CN210956621 U CN 210956621U CN 201922329082 U CN201922329082 U CN 201922329082U CN 210956621 U CN210956621 U CN 210956621U
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- CN
- China
- Prior art keywords
- sucker
- fixedly connected
- chip
- mounting rod
- rod
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a chip carrying suction head for semiconductor production, which is characterized by comprising a vacuum rod, wherein a sucker mounting rod is fixedly connected below the vacuum rod, one end of the sucker mounting rod is fixedly connected with the vacuum rod, and the other end of the sucker mounting rod is fixedly connected with a sucker; a spring is fixedly connected in the inner cavity of the sucker mounting rod, one end of the spring is fixedly connected with the inner cavity of the sucker mounting rod, and the other end of the spring is fixedly connected with a sucker ejector pin; the sucker ejector pin penetrates through the sucker and extends; and a sealing air path is arranged in the sucker mounting rod, an air path is arranged in the vacuum rod, and the air path is communicated with the sealing air path. The utility model discloses simple structure, convenient to use, in high-speed motion process, it is fast to absorb and place the chip, does not influence the precision.
Description
Technical Field
The utility model relates to a semiconductor processing field especially relates to a suction head that is used for carrying the chip on the semiconductor processing equipment.
Background
In semiconductor processing equipment, it is common to pick up and place chips with suction nozzles. The chip is sucked in a vacuum suction mode during sucking, and the chip is placed in an air blowing mode during placing. In the process of high-speed movement, an air source is required to be converted from suction to air flow for blowing every time, so that the efficiency is low and the speed is low; meanwhile, the chip is deviated due to air blowing, so that the precision of the equipment is influenced.
In order to solve the problems of stability and precision, for example, the patent of the utility model in China with the publication number CN209417097U discloses a chip suction nozzle with high adsorption stability, which comprises a positioning head, a suction nozzle body, an adsorption channel, a positioning shaft shoulder and a positioning block fixedly connected with a connecting part, wherein the adsorption head is provided with a plurality of vacuum holes, each vacuum hole is respectively communicated with the adsorption channel, the positioning shaft shoulder is arranged at the periphery of the suction nozzle body and is provided with a rotation stopping plane positioned on the circumference, the positioning groove corresponding to the positioning block is arranged at the position of one opposite side of the rotation stopping plane, the positioning shaft shoulder is symmetrically provided with two cylindrical grooves corresponding to the inner wall of the positioning groove, the cylindrical grooves are internally provided with thrust springs, one ends of the thrust springs are fixedly connected with the groove bottoms of the cylindrical grooves, the other ends of the thrust springs are fixedly connected with limiting rods, and the side walls of the positioning block are provided with limiting grooves corresponding to the limiting rods. The utility model discloses can realize dismantling convenient to use to the firm and quick installation of chip suction nozzle. But the scheme still can not solve the problem that the chip displacement is caused by air blowing.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects of the prior art and providing a chip carrying suction head for semiconductor production.
The utility model adopts the technical proposal that: a chip carrying suction head for semiconductor production is characterized by comprising a vacuum rod, wherein a suction cup mounting rod is fixedly connected below the vacuum rod, one end of the suction cup mounting rod is fixedly connected with the vacuum rod, and the other end of the suction cup mounting rod is fixedly connected with a suction cup; a spring is fixedly connected in the inner cavity of the sucker mounting rod, one end of the spring is fixedly connected with the inner cavity of the sucker mounting rod, and the other end of the spring is fixedly connected with a sucker ejector pin; the sucker ejector pin penetrates through the sucker and extends; and a sealing air path is arranged in the sucker mounting rod, an air path is arranged in the vacuum rod, and the air path is communicated with the sealing air path.
As a further improvement of the utility model, the bottom of the sucker is provided with 4 air vents.
As a further improvement of the utility model, the sucker ejector pin is positioned at the middle position of the 4 vent holes.
The utility model discloses a beneficial effect be: when the chip carrying suction head picks up the chip, negative pressure is generated to suck the chip; when the chip is placed on the suction head, the internal air pressure is recovered to normal air pressure, and the spring is reset to eject the ejector pin of the suction disc, so that the chip is quickly separated from the suction head. The utility model discloses simple structure, convenient to use, in high-speed motion process, it is fast to absorb and place the chip, does not influence the precision.
Drawings
Fig. 1 is a schematic view of the present invention.
Fig. 2 is a side view of the present invention.
Fig. 3 is a bottom view of the present invention.
Fig. 4 is a sectional view taken along the plane a-a of fig. 2.
Shown in the figure: 1 vacuum rod, 2 sucker mounting rods, 3 suckers, 4 springs and 5 sucker thimbles.
Detailed Description
The present invention will be further described with reference to fig. 1 to 4.
As shown in the figure, the chip carrying suction head for semiconductor production comprises a vacuum rod 1, a suction cup mounting rod 2, a suction cup 3, a spring 4 and a suction cup ejector pin 5. The conveying suction head of the structure conveys the chip in a suction mode. The sucker mounting rod 2 forms a main body structure, and a space for accommodating the spring 4 and the sucker thimble 5 is formed in the sucker mounting rod 2. The spring 4 is arranged on the upper part of the sucker thimble 5 and tightly abuts against the upper part of the sucker thimble 5, and the spring 4 is configured to drive the sucker thimble 5 to move towards the outside of the sucker body; the sucker ejector pin 5 is arranged in the sucker mounting rod 2, the sucker ejector pin 5 can move axially relative to the sucker mounting rod 2, and the sucker ejector pin extends out of the sucker mounting rod; sucking disc 3 is installed in 2 lower parts of sucking disc installation pole, and vacuum rod 1 is connected on 2 upper portions of sucking disc installation pole, is provided with sealed gas circuit in the sucking disc installation pole 2, and there is the air vent sucking disc 3 bottom, has the air flue in the vacuum rod 1, air flue and sealed gas circuit intercommunication, and sucking disc 3 is configured to be the absorption chip of breathing in through the air flue. The spring 4 provides along the downward elasticity of self axial, and when the air supply stopped breathing in on the vacuum rod 1, external air pressure reduced, spring 4 recovered deformation, and sucking disc thimble 5 stretches out from sucking disc installation pole 2, and the chip breaks away from 3 bottom surfaces of sucking disc, places in the working face. The chip is blown away without ventilation in the vacuum rod 1, so that the placing speed and stability of the chip are improved, and the chip is prevented from being deviated.
The utility model discloses a following work: when picking up, the mechanism moves downwards, the sucker ejector pin 5 pushes the chip, the sucker ejector pin 5 moves upwards, the spring 4 is compressed, the chip is in contact with the sucker 3, the chip is tightly attached to the sucker 3 through vacuum pressure, and the chip is tightly adsorbed on the sucker. When the chip is placed, normal air pressure is restored in the vacuum rod 1, the spring 4 is reset, the sucker ejector pin 5 moves downwards and extends out of the sucker mounting rod 2, and then the chip is separated from the surface of the sucker 3 and placed on the workbench.
Further, 3 bottoms of sucking disc are the square structure, open and have four air vents, and these four air vents evenly set up in 3 bottoms of sucking disc, have improved the stability when absorbing the chip, can prevent to absorb in-process chip and rotate.
Furthermore, the sucker ejector pins 5 are located in the middle of the four vent holes, so that the stress of the chip is more uniform, and the chip cannot deviate.
When the chip carrying suction head picks up the chip, negative pressure is generated to suck the chip; when the chip is placed on the suction head, the internal air pressure is recovered to normal air pressure, and the spring is reset to eject the ejector pin of the suction disc, so that the chip is quickly separated from the suction head. The utility model discloses simple structure, convenient to use, in high-speed motion process, it is fast to absorb and place the chip, does not influence the precision.
It should be known to those skilled in the art that the protection scheme of the present invention is not limited to the above-mentioned embodiments, and various permutations, combinations and transformations can be performed on the basis of the above-mentioned embodiments, without violating the spirit of the present invention, all the transformations performed by the present invention fall within the protection scope of the present invention.
Claims (3)
1. A chip carrying suction head for semiconductor production is characterized by comprising a vacuum rod (1), wherein a suction cup mounting rod (2) is fixedly connected to the lower part of the vacuum rod (1), one end of the suction cup mounting rod (2) is fixedly connected with the vacuum rod (1), and the other end of the suction cup mounting rod is fixedly connected with a suction cup (3); a spring (4) is fixedly connected in the inner cavity of the sucker mounting rod (2), one end of the spring is fixedly connected with the inner cavity of the sucker mounting rod (2), and the other end of the spring is fixedly connected with a sucker thimble (5); the sucker ejector pin (5) penetrates through the sucker (3) and extends; and a sealing air path is arranged in the sucker mounting rod (2), an air path is arranged in the vacuum rod (1), and the air path is communicated with the sealing air path.
2. A chip handling suction head for semiconductor production according to claim 1, wherein the suction head (3) is provided with 4 vent holes at the bottom.
3. A chip handling suction head for semiconductor manufacturing according to claim 2, characterized in that said suction head ejector pins (5) are located at the middle of 4 vent holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922329082.5U CN210956621U (en) | 2019-12-23 | 2019-12-23 | Chip carrying suction head for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922329082.5U CN210956621U (en) | 2019-12-23 | 2019-12-23 | Chip carrying suction head for semiconductor production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956621U true CN210956621U (en) | 2020-07-07 |
Family
ID=71381167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922329082.5U Expired - Fee Related CN210956621U (en) | 2019-12-23 | 2019-12-23 | Chip carrying suction head for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210956621U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993308A (en) * | 2020-08-17 | 2020-11-27 | 立讯智造(浙江)有限公司 | Pressure maintaining suction pen |
-
2019
- 2019-12-23 CN CN201922329082.5U patent/CN210956621U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993308A (en) * | 2020-08-17 | 2020-11-27 | 立讯智造(浙江)有限公司 | Pressure maintaining suction pen |
| CN111993308B (en) * | 2020-08-17 | 2022-04-15 | 立讯智造(浙江)有限公司 | Pressure maintaining suction pen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200707 Termination date: 20201223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |