CN216311774U - Electronic component module and switching power supply provided with same - Google Patents
Electronic component module and switching power supply provided with same Download PDFInfo
- Publication number
- CN216311774U CN216311774U CN202122457289.8U CN202122457289U CN216311774U CN 216311774 U CN216311774 U CN 216311774U CN 202122457289 U CN202122457289 U CN 202122457289U CN 216311774 U CN216311774 U CN 216311774U
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- China
- Prior art keywords
- electronic component
- lead frame
- component module
- multilayer wiring
- module according
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Provided are an electronic component module and a switching power supply provided with the electronic component module, which can be favorably miniaturized. An electronic component module (100) has a laminated structure in which a multilayer wiring substrate (110) and a lead frame (120) are laminated, the multilayer wiring substrate (110) and the lead frame (120) are connected by a conductive columnar terminal (103), the multilayer wiring substrate (110) and the lead frame (120) are sealed by an insulating sealing resin (104), an electronic component (130) is mounted near the conductive columnar terminal (103) on a first surface of the lead frame (120) facing the multilayer wiring substrate (110), a second surface of the lead frame (120) on the opposite side of the first surface is exposed from the sealing resin (104), and the lead frame (120) serves as an external connection terminal of the electronic component module (100).
Description
Technical Field
The present invention relates to an electronic component module and a switching power supply including the electronic component module.
Background
Conventionally, an electronic component module having a three-dimensional structure in which an electronic component is sandwiched between two substrates and encapsulated with a resin is known. In such a conventional electronic component module, the electronic component module is downsized by a three-dimensional structure.
As an application of such a technique, there is an electronic component module having a two-layer laminated structure in which a substrate is provided on an upper portion and a lead frame is provided on a lower portion, in which electronic components are mounted only on both surfaces of the substrate without mounting the electronic components on the surfaces of the lead frame, and the lead frame is used as a terminal for mounting the electronic component module on a mounting substrate (for example, a customer mounting substrate). In such an electronic component module, since electronic components are mounted only on both surfaces of the substrate, the mounting area is limited, and the miniaturization of the electronic component module is influenced by the mounting area of the substrate.
In addition, when an Integrated Circuit (IC) chip is mounted on the surface of the substrate facing the lead frame, that is, on the back surface of the substrate, underfill may be required, and if the underfill material comes into contact with a passive component on the back surface of the substrate, the passive component may be broken due to a difference in thermal expansion between the sealing resin and the underfill material. Therefore, in order to prevent the passive component from being broken, it is necessary to keep the passive component away from the IC chip by a certain distance, or to provide a dam (dam) around the IC chip on the back surface of the substrate. However, in this case, the mounting area is reduced, which affects the miniaturization of the product.
SUMMERY OF THE UTILITY MODEL
The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electronic component module having a laminated structure in which a plurality of layers of wiring boards and lead frames are laminated, and to provide a switching power supply including the electronic component module, which can be suitably downsized.
In order to solve the above-described problems, an electronic component module according to an aspect of the present invention includes a laminated structure in which a multilayer wiring board and a lead frame are laminated, wherein the multilayer wiring board and the lead frame are connected by a conductive columnar terminal, the multilayer wiring board and the lead frame are sealed with an insulating sealing resin, an electronic component is mounted near the conductive columnar terminal on a first surface of the lead frame facing the multilayer wiring board, a second surface of the lead frame opposite to the first surface is exposed from the sealing resin, and the lead frame serves as an external connection terminal of the electronic component module.
In the electronic component module according to the present invention, it is preferable that an electronic component is mounted on the first surface of the lead frame outside the conductive columnar terminal.
In the electronic component module according to the present invention, it is preferable that the electronic component mounted on the first surface outside the conductive columnar terminal is a first capacitor.
In the electronic component module according to the present invention, it is preferable that the first capacitor is arranged at a position closest to an input terminal or an output terminal of the lead frame in terms of a circuit configuration.
In the electronic component module according to the present invention, it is preferable that an electronic component is mounted on a third surface of the multilayer wiring board facing the lead frame, and a second capacitor is disposed in a central region of the first surface at a position facing the electronic component mounted on the third surface.
Further, according to the electronic component module of the present invention, it is preferable that the second capacitor is connected in parallel with the first capacitor.
In the electronic component module according to the present invention, it is preferable that an electronic component is mounted on at least one of a third surface of the multilayer wiring substrate facing the lead frame and a fourth surface of the multilayer wiring substrate opposite to the third surface.
In the electronic component module according to the present invention, it is preferable that an electronic component requiring underfill is disposed on the third surface of the multilayer wiring board.
In the electronic component module according to the present invention, it is preferable that the lead frame includes a wiring pattern, and a bypass capacitor is disposed between terminals in the wiring pattern on the first surface of the lead frame.
In the electronic component module according to the present invention, it is preferable that the conductive columnar terminal and the multilayer wiring board are connected by a conductive adhesive, and the conductive columnar terminal and the lead frame are connected by a conductive adhesive.
Further, according to the electronic component module of the present invention, it is preferable that the electronic component mounted on the first surface of the lead frame is a passive element.
Further, according to the electronic component module of the present invention, it is preferable that the lead frame is made of copper, and the insulating sealing resin is a polyamide resin, a polycarbonate resin, or a polybutylene terephthalate resin.
A switching power supply according to another aspect of the present invention includes the electronic component module.
Effect of the utility model
According to the present invention, in an electronic component module having a laminated structure in which a plurality of layers of wiring boards and lead frames are laminated, by mounting an electronic component on a lead frame as well, it is possible to favorably reduce the size of the electronic component module. In addition, the switching power supply including the electronic component module of the present invention can be preferably downsized.
Drawings
The above objects, advantages and features of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings in which:
fig. 1 is a schematic cross-sectional view showing the structure of an electronic component module of the present invention.
Fig. 2 is a schematic perspective view showing the structure of the electronic component module of the present invention.
Fig. 3 is a schematic cross-sectional view showing another structure of the electronic component module of the present invention.
Fig. 4 is a schematic sectional view showing the structure of an electronic component module of the related art.
Description of the reference numerals
100 electronic component module
110 multilayer wiring board
120 lead frame
103 conductive columnar terminal
104 insulating sealing resin
130 electronic component
105 electronic component
106 capacitor
400 electronic component module
401 substrate
402 lead frame
403 electronic component
404 IC chip
405 electronic component
406 sealing the resin.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments and examples described herein are merely illustrative of the relevant invention and are not to be construed as limiting the utility model. It should be noted that, for convenience of description, only the relevant portions of the related inventions are shown in the drawings. In addition, the same elements may be denoted by the same reference numerals, and redundant description thereof may be omitted. Note that, in some cases, redundant description of elements having the same function or structure or corresponding elements may be omitted.
Before describing the present invention, a structure of a conventional electronic component module will be briefly described with reference to the drawings.
Fig. 4 is a schematic sectional view showing the structure of an electronic component module of the related art. As shown in fig. 4, the electronic component module 400 includes an upper substrate 401 and a lower lead frame 402, and electronic components 403, IC chips 404, and electronic components 405 are provided on upper and lower surfaces of the substrate 401 and sealed with a sealing resin 406.
In the component built-in substrate in which the electronic component is sandwiched between the substrate and the lead frame, such as the electronic component module 400, since the electronic component is mounted only on both surfaces of the substrate, the mounting area is limited, and the miniaturization of the electronic component module is affected by the mounting area of the substrate. In addition, in the case where it is necessary to fill the underfill material between the substrate 401 and the IC chip 404, if the underfill material comes into contact with the electronic component 405 in the vicinity of the IC chip 404, the electronic component 405 may be broken due to a difference in thermal expansion between the sealing resin and the underfill material. Therefore, in order to prevent the electronic component 405 from being broken, it is necessary to keep the electronic component 405 away from the IC chip 404 by a predetermined distance, or to provide a dam (not shown) around the IC chip 404 on the back surface of the substrate. However, in this case, the mounting area on the substrate is reduced, which affects the miniaturization of the product.
In view of the above, the present invention provides an electronic component module having a laminated structure in which a plurality of layers of wiring boards and lead frames are laminated, wherein the electronic component module can be reduced in size.
Fig. 1 is a schematic cross-sectional view showing the structure of an electronic component module of the present invention. Fig. 2 is a schematic perspective view showing the structure of the electronic component module of the present invention.
As shown in fig. 1 and 2, an electronic component module 100 according to the present invention has a laminated structure in which a multilayer wiring substrate 110 and a lead frame 120 are laminated, the multilayer wiring substrate 110 and the lead frame 120 are connected by a conductive columnar terminal 103, the multilayer wiring substrate 110 and the lead frame 120 are sealed with an insulating sealing resin 104, an electronic component 130 is mounted near the conductive columnar terminal 103 on a surface 121 (first surface) of the lead frame 120 facing the multilayer wiring substrate 110, a surface 122 (second surface) of the lead frame 120 opposite to the surface 121 is exposed from the sealing resin 104, and the lead frame 120 serves as an external connection terminal of the electronic component module 100. Here, the external connection terminal refers to a terminal for connecting the electronic component module 100 to a mounting substrate (e.g., a customer mounting substrate) on which the electronic component module 100 is mounted.
In the electronic component module 100 of the present invention, by mounting the electronic component on the lead frame 120 as well, the mounting area of the electronic component can be enlarged, the degree of freedom in designing the electronic component module 100 can be improved, and the electronic component module 100 can be favorably downsized. In addition, the switching power supply and the like including the electronic component module 100 of the present invention can be also reduced in size.
In one preferred embodiment of the present invention, as shown in fig. 1 and 2, an electronic component 130 is mounted on the surface 121 of the lead frame 120 outside the conductive columnar terminal 103. By disposing the electronic component 130 on the surface 121 of the lead frame 120 outside the conductive columnar terminal 103, the degree of freedom in designing the electronic component on the surface 111 (third surface) of the substrate 110 facing the lead frame 120 can be increased, and the heat dissipation of the electronic component 130 can be increased. In fig. 1, the case where the electronic component 130 is arranged outside the conductive columnar terminal 103 on the surface 121 of the lead frame 120 is illustrated, but according to the inventive concept of the present invention, the electronic component 130 may be arranged in the vicinity of the conductive columnar terminal 103.
When the electronic component module 100 has a laminated structure in which the multilayer wiring substrate 110 and the lead frame 120 are laminated, the wiring lengths of the substrate, the connection terminal, and the lead frame become longer than those of a product including only the substrate, and noise may be generated due to parasitic inductance.
In one preferred embodiment of the present invention, the electronic component 130 mounted on the surface 121 of the lead frame 120 outside the conductive columnar terminal 103 is a capacitor (first capacitor). Accordingly, parasitic inductance can be eliminated.
In a preferred embodiment of the present invention, the capacitor mounted on the outer side of the conductive columnar terminal 103 on the surface 121 of the lead frame 120 is arranged at a position closest to the input terminal or the output terminal of the lead frame 120 in terms of circuit configuration. According to this structure, parasitic inductance can be effectively eliminated.
Fig. 3 is a schematic cross-sectional view showing another structure of the electronic component module of the present invention.
As shown in fig. 3, electronic component 105 is mounted on surface 111 of multilayer wiring board 110 facing lead frame 120, and capacitor 106 (second capacitor) is disposed in a central region of surface 121 of lead frame 120 at a position facing electronic component 105 mounted on surface 111. With this configuration, heat dissipation can be improved.
In one preferred embodiment of the present invention, an electronic component requiring underfill is disposed on the surface 111 of the multilayer wiring board 110. The electronic component requiring underfill is, for example, an IC chip, and specific examples thereof are a control chip and the like. By disposing the electronic component requiring underfill on the surface 111 of the multilayer wiring board 110 and disposing the electronic component, which has been conventionally disposed on the surface 111 of the multilayer wiring board 110 in the vicinity of the electronic component requiring underfill, on the lead frame 120, it is possible to avoid contact between the electronic component and the underfill, and thus it is possible to avoid damage to the electronic component due to a difference in thermal expansion caused by contact between the sealing resin and the underfill and the electronic component.
In one preferred embodiment of the present invention, the capacitor 106 disposed in the central region of the surface 121 of the lead frame 120 is connected in parallel to the electronic component 130 mounted on the surface 121 of the lead frame 120 outside the conductive columnar terminal 103. With this configuration, the output capacitance can be increased, and the influence of parasitic inductance can be effectively eliminated.
In a preferred embodiment of the present invention, the lead frame 120 includes a wiring pattern, and a bypass capacitor is disposed between terminals in the wiring pattern on the surface 121 of the lead frame 120. According to this structure, the influence of parasitic inductance can be effectively eliminated.
In the present invention, an electronic component may be mounted on at least one of the surface 111 of the multilayer wiring substrate 110 and the surface 112 (fourth surface) opposite to the surface 111 of the multilayer wiring substrate 110 (see fig. 1).
In the present invention, the conductive columnar terminal 103 and the multilayer wiring board 110 may be connected by a conductive adhesive, and the conductive columnar terminal 103 and the lead frame 120 may be connected by a conductive adhesive.
In the present invention, the lead frame 120 may be made of metal, and among them, the lead frame 120 is preferably made of copper, and the insulating sealing resin 104 is preferably a high heat dissipation resin. Examples of the high heat dissipation resin include polyamide resins, polycarbonate resins, and polybutylene terephthalate resins.
In another embodiment of the present invention, there is provided a switching power supply including the electronic component module of the present invention. Here, the description is omitted.
Although the capacitor has been described as an example of the electronic component disposed on the lead frame 120, the electronic component disposed on the lead frame 120 is not limited to the capacitor and may be another electronic component. In the present invention, the electronic components mounted on the surface 121 of the lead frame 120 are preferably passive elements such as capacitors, inductors, and resistors.
In the present invention, the number of electronic components disposed on the multilayer wiring substrate 110 and the lead frame 120 is not particularly limited.
Although the present invention has been described in conjunction with the preferred embodiments thereof, those skilled in the art will appreciate that various modifications, substitutions and alterations can be made thereto without departing from the spirit and scope of the present invention. Accordingly, the present invention should not be limited by the above-described embodiments, but should be defined by the appended claims and their equivalents.
Claims (13)
1. An electronic component module having a laminated structure in which a plurality of layers of wiring boards and lead frames are laminated,
the multilayer wiring board and the lead frame are connected by a conductive columnar terminal,
the multilayer wiring board and the lead frame are sealed with an insulating sealing resin,
an electronic component is mounted on a first surface of the lead frame facing the multilayer wiring board in the vicinity of the conductive columnar terminal,
a second surface of the lead frame opposite to the first surface is exposed from a sealing resin, and the lead frame serves as an external connection terminal of the electronic component module.
2. The electronic component module of claim 1,
an electronic component is mounted on the first surface of the lead frame outside the conductive columnar terminal.
3. The electronic component module of claim 2,
the electronic component mounted on the first surface outside the conductive columnar terminal is a first capacitor.
4. The electronic component module according to claim 3,
the first capacitor is arranged at a position closest to an input terminal or an output terminal of the lead frame in a circuit configuration.
5. The electronic component module according to claim 3 or 4,
an electronic component is mounted on a third surface of the multilayer wiring board facing the lead frame,
a second capacitor is disposed in a central region of the first surface at a position facing the electronic component mounted on the third surface.
6. The electronic component module according to claim 5,
the second capacitor is connected in parallel with the first capacitor.
7. The electronic component module according to any one of claims 1 to 4,
an electronic component is mounted on at least one of a third surface of the multilayer wiring substrate facing the lead frame and a fourth surface of the multilayer wiring substrate opposite to the third surface.
8. The electronic component module of claim 7,
an electronic component requiring underfill is disposed on the third surface of the multilayer wiring board.
9. The electronic component module according to any one of claims 1 to 4,
the lead frame is provided with a wiring pattern, and a bypass capacitor is arranged between terminals in the wiring pattern on the first surface of the lead frame.
10. The electronic component module according to any one of claims 1 to 4,
the conductive columnar terminal and the multilayer wiring substrate are connected by a conductive adhesive,
the conductive columnar terminal and the lead frame are connected by a conductive adhesive.
11. The electronic component module according to claim 1 or 2,
the electronic component mounted on the first surface of the lead frame is a passive element.
12. The electronic component module according to any one of claims 1 to 4,
the lead frame is made of copper, and the insulating sealing resin is polyamide resin, polycarbonate resin or polybutylene terephthalate resin.
13. A switching power supply, characterized in that,
an electronic component module according to any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122457289.8U CN216311774U (en) | 2021-10-12 | 2021-10-12 | Electronic component module and switching power supply provided with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122457289.8U CN216311774U (en) | 2021-10-12 | 2021-10-12 | Electronic component module and switching power supply provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216311774U true CN216311774U (en) | 2022-04-15 |
Family
ID=81114413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122457289.8U Active CN216311774U (en) | 2021-10-12 | 2021-10-12 | Electronic component module and switching power supply provided with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216311774U (en) |
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2021
- 2021-10-12 CN CN202122457289.8U patent/CN216311774U/en active Active
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