CN216311770U - Integrated circuit packaging device - Google Patents
Integrated circuit packaging device Download PDFInfo
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- CN216311770U CN216311770U CN202122181363.8U CN202122181363U CN216311770U CN 216311770 U CN216311770 U CN 216311770U CN 202122181363 U CN202122181363 U CN 202122181363U CN 216311770 U CN216311770 U CN 216311770U
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Abstract
The utility model discloses an integrated circuit packaging device, which relates to the technical field of integrated circuits and comprises a packaging device main body, wherein the packaging device main body comprises a base and an integrated circuit main body, a packaging cover is hinged above the packaging device main body, the integrated circuit main body is arranged inside the packaging device main body, an anti-vibration mechanism is arranged inside the base, a heat dissipation device is fixedly arranged on the side surface of the packaging device main body, and the anti-vibration mechanism comprises an anti-vibration strip and a connecting ring. The fan is used for sucking hot air in the testing device, the sucked hot air enters the heat dissipation device, the cold air emitted by the cooling chamber is used for cooling the hot air, then the heat is further dissipated through the matching of the heat dissipation pipe and the heat absorption column, and the heat is absorbed by the heat dissipation plate, so that the device has the heat dissipation capacity, and the effect of improving the use efficiency of the device is achieved.
Description
Technical Field
The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit packaging device.
Background
The location where the integrated circuit is packaged in the electronic pyramid is both the apex of the pyramid and the base of the pyramid. It is sufficient to say that it is in both positions at the same time. ICs represent the tip of electronics in terms of the density of electronic components (e.g., transistors). However, IC is a starting point and a basic structural unit, which is the basis for most electronic systems in our lives. Similarly, ICs are not just monolithic chips or basic electronic structures, but are widely varied in variety (analog, digital, radio frequency, sensors, etc.) and thus vary in packaging requirements and requirements.
The following problems exist in the prior art:
1. when the existing packaging device is used, the integrated circuit is glued under the condition that the position is incorrect when the integrated circuit is packaged, so that the existing packaging device jolts continuously in the transportation process, the damage of parts of the integrated circuit is influenced, and the utilization efficiency of the device is reduced;
2. when the existing packaging device is used, the integrated circuit in the package is easily damaged under the condition of high temperature, and the use efficiency of the device is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model provides an integrated circuit packaging device, which aims to have shock resistance and solve the problem that gluing is easily carried out under the condition of incorrect positions when the integrated circuit is packaged, so that bumping is continuous in the transportation process, the damage of parts of the integrated circuit is influenced, and the utilization efficiency of the device is reduced; the other purpose is to solve the problem that the use efficiency of the device is reduced due to the fact that the integrated circuit in the package is easily damaged under the high-temperature condition, so that the effect of improving the heat dissipation of the device is achieved.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:
the packaging device body comprises a base and an integrated circuit body, a packaging cover is hinged above the packaging device body, the integrated circuit body is arranged in the packaging device body, an anti-vibration mechanism is arranged in the base, and a heat dissipation device is fixedly mounted on the side face of the packaging device body.
The anti-seismic mechanism comprises an anti-seismic strip and a connecting ring, and the anti-seismic strip is fixedly arranged on the side surface of the inner cavity of the anti-seismic mechanism through the connecting ring.
The heat dissipation device comprises a heat dissipation device shell and a heat dissipation plate, wherein the heat dissipation plate is arranged inside the heat dissipation device shell.
The technical scheme of the utility model is further improved as follows: the anti-seismic mechanism is characterized in that a limiting rod is arranged inside the anti-seismic mechanism, the limiting rod is fixedly installed on the side face of the inner cavity of the anti-seismic mechanism, an anti-seismic plate is fixedly connected to the other end of the limiting rod, and two ends of the anti-seismic plate are fixedly connected with the side faces of the anti-seismic strips.
The technical scheme of the utility model is further improved as follows: the anti-seismic mechanism is characterized in that a spring and a rubber block are arranged inside the anti-seismic mechanism, the spring is fixedly installed at the bottom of an inner cavity of the anti-seismic mechanism, and the rubber block is arranged at the top of the inner cavity of the anti-seismic mechanism.
The technical scheme of the utility model is further improved as follows: the fan is fixedly mounted on one side of the inner cavity of the heat dissipation device shell, limiting columns are arranged on two sides of the fan, one ends of the limiting columns are fixedly connected with the side faces of the heat dissipation plate, and two ends of the heat dissipation plate are fixedly connected with the inner wall of the heat dissipation shell.
The technical scheme of the utility model is further improved as follows: the side fixedly connected with dead lever of heating panel, the one end fixedly connected with cooling chamber of dead lever, the below of cooling chamber is provided with the cooling tube, cooling tube fixed surface is connected with the heat absorption cylinder, the one end of heat absorption cylinder and the inner chamber bottom of heat abstractor casing.
The technical scheme of the utility model is further improved as follows: the inner surface fixed mounting of encapsulation lid has the reference column, the inside of packaging hardware main part is including fixed column and fixed plate, the fixed plate passes through fixed column fixed mounting in the inner chamber side of packaging hardware main part, the side fixedly connected with grip block of fixed plate.
Due to the adoption of the technical scheme, compared with the prior art, the utility model has the technical progress that:
1. the utility model provides an integrated circuit packaging device, which is characterized in that jolts generated in the transportation process of the device are limited and fixed on an anti-seismic plate through a limiting rod through the matching among the limiting rod, the anti-seismic plate, an anti-seismic strip, a connecting ring, a spring and a rubber block, the shock generated by the shock is subjected to anti-seismic action through the matching of the anti-seismic strip and the connecting ring, then the jolt shock is buffered through the spring, and the whole device is subjected to anti-seismic through the rubber block, so that the device has anti-seismic performance, and the effect of improving the utilization efficiency of the device is achieved.
2. The utility model provides an integrated circuit packaging device, which is characterized in that a fan is used for sucking hot air in a testing device through the cooperation of the fan, a limiting column, a heat dissipation plate, a fixing rod, a cooling chamber and a heat dissipation pipe, the sucked hot air enters the inside of the heat dissipation device, the hot air is cooled through cold air dissipated from the cooling chamber, then the heat is further dissipated through the cooperation of the heat dissipation pipe and a heat absorption column, and then the heat is absorbed through the heat dissipation plate, so that the device has the heat dissipation capacity, and the effect of improving the use efficiency of the device is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of a structural seismic resistant mechanism of the present invention;
FIG. 3 is a cross-sectional view of the heat dissipation device with structure of the present invention;
fig. 4 is a perspective view of the structure packaging apparatus of the present invention.
In the figure: 1. packaging the device body; 11. a package cover; 12. a positioning column; 13. fixing a column; 14. a fixing plate; 15. a clamping plate; 2. an integrated circuit body;
3. an anti-seismic mechanism; 31. a limiting rod; 32. a seismic plate; 33. an anti-seismic strip; 34. a connecting ring; 35. a spring; 36. a rubber block;
4. a heat sink; 41. a fan; 42. a limiting column; 43. a heat dissipation plate; 44. fixing the rod; 45. a cooling chamber; 46. a radiating pipe; 47. a heat absorbing cylinder.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in fig. 1-4, the present invention provides an integrated circuit package device, which includes a package device body 1, the package device body 1 includes a base and an integrated circuit body 2, a package cover 11 is hinged above the package device body 1, the integrated circuit body 2 is disposed inside the package device body 1, an anti-vibration mechanism 3 is disposed inside the base, a heat dissipation device 4 is fixedly mounted on a side surface of the package device body 1, the anti-vibration mechanism 3 includes an anti-vibration bar 33 and a connection ring 34, the anti-vibration bar 33 is fixedly mounted on an inner side surface of the anti-vibration mechanism 3 through the connection ring 34, the heat dissipation device 4 includes a heat dissipation device housing and a heat dissipation plate 43, the heat dissipation plate 43 is disposed inside the heat dissipation device housing, a limit rod 31 is disposed inside the anti-vibration mechanism 3, the limit rod 31 is fixedly mounted on an inner cavity side surface of the anti-vibration mechanism 3, and an anti-vibration plate 32 is fixedly connected to another end of the limit rod 31, the both ends of antidetonation board 32 and the side fixed connection of antidetonation strip 33, the inside of antidetonation mechanism 3 is provided with spring 35 and block rubber 36, and spring 35 fixed mounting is in the inner chamber bottom of antidetonation mechanism 3, and block rubber 36 sets up the inner chamber top at antidetonation mechanism 3.
In this embodiment, the anti-seismic plate 32 is fixed in a limiting manner by the limiting rod 31, the anti-seismic strip 33 and the connecting ring 34 are matched to perform an anti-seismic effect on the generated vibration, the jolt vibration is buffered by the spring 35, and the whole device is subjected to anti-seismic performance by the rubber block 36, so that the device has anti-seismic performance, and the effect of improving the utilization efficiency of the device is achieved.
Example 2
As shown in fig. 1 to 4, on the basis of embodiment 1, the present invention provides a technical solution: preferably, a fan 41 is fixedly mounted on one side of the inner cavity of the heat dissipation device shell, limiting columns 42 are disposed on two sides of the fan 41, one ends of the limiting columns 42 are fixedly connected with the side surfaces of the heat dissipation plates 43, two ends of the heat dissipation plates 43 are fixedly connected with the inner wall of the heat dissipation shell, fixing rods 44 are fixedly connected to the side surfaces of the heat dissipation plates 43, one ends of the fixing rods 44 are fixedly connected with a cooling chamber 45, a heat dissipation pipe 46 is disposed below the cooling chamber 45, a heat absorption cylinder 47 is fixedly connected to the surface of the heat dissipation pipe 46, and one end of the heat absorption cylinder 47 is connected with the bottom of the inner cavity of the heat dissipation device shell.
In this embodiment, absorb the hot gas in the testing arrangement through fan 41, the hot gas after absorbing enters into heat abstractor's inside, utilizes the play air conditioning of cooling chamber 45 to cool off hot gas, then further dispels the heat through the cooperation of cooling tube 46 and heat absorption cylinder 47, and rethread heating panel 43 absorbs the heat to the air to make the device possess radiating ability, thereby reached the effect that improves device availability factor.
Example 3
As shown in fig. 1 to 4, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the inner surface of the package cover 11 is fixedly mounted with a positioning post 12, the interior of the package device body 1 includes a fixing post 13 and a fixing plate 14, the fixing plate 14 is fixedly mounted on the side surface of the inner cavity of the package device body 1 through the fixing post 13, and the side surface of the fixing plate 14 is fixedly connected with a clamping plate 15.
In this embodiment, the fixing plate 14 is supported by the fixing posts 13, so that the fixing plate 14 can support the clamping plate 15, then the clamping plate 15 is utilized to clamp the integrated circuit, and after the clamping is fixed, the positioning posts 12 are utilized to package, thereby achieving the effect of improving the practicability of the device.
The operation of the integrated circuit package device will be described in detail below.
As shown in fig. 1-4, firstly, when the integrated circuit is packaged, the fixing board 14 is supported by the fixing posts 13, so that the fixing board 14 can support the clamping board 15, then the integrated circuit is clamped by the clamping board 15, after clamping and fixing, the integrated circuit is packaged by the positioning posts 12, during transportation after packaging, the anti-vibration board 32 can be limited and fixed by the limiting rods 31, then the anti-vibration strip 33 and the connecting ring 34 are matched for anti-vibration, then the bumpy vibration is buffered by the springs 35, the whole device is anti-vibration by the rubber blocks 36, so that the device has anti-vibration performance, then under high-temperature transportation conditions for a long time, the hot air in the testing device is sucked by the fan 41, the sucked hot air enters the inside of the heat dissipation device, and the cold air is cooled by the cold air discharged from the cooling chamber 45, then, the heat is further dissipated through the cooperation of the heat dissipating pipe 46 and the heat absorbing cylinder 47, and the heat absorbing plate 43 absorbs the heat from the air, so that the device has the heat dissipating capability, thereby achieving the effect of improving the use efficiency of the device.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the utility model without departing from the spirit of the inventive concept.
Claims (6)
1. An integrated circuit package device, comprising a package device body (1), wherein the package device body (1) comprises a base and an integrated circuit body (2), a package cover (11) is hinged above the package device body (1), and the integrated circuit body (2) is arranged inside the package device body (1), characterized in that: an anti-seismic mechanism (3) is arranged in the base, and a heat dissipation device (4) is fixedly mounted on the side surface of the packaging device main body (1);
the anti-seismic mechanism (3) comprises an anti-seismic strip (33) and a connecting ring (34), and the anti-seismic strip (33) is fixedly arranged on the side surface of the inner cavity of the anti-seismic mechanism (3) through the connecting ring (34);
the heat dissipation device (4) comprises a heat dissipation device shell and a heat dissipation plate (43), wherein the heat dissipation plate (43) is arranged inside the heat dissipation device shell.
2. The integrated circuit package assembly of claim 1, wherein: the anti-seismic mechanism is characterized in that a limiting rod (31) is arranged inside the anti-seismic mechanism (3), the limiting rod (31) is fixedly installed on the side face of an inner cavity of the anti-seismic mechanism (3), an anti-seismic plate (32) is fixedly connected to the other end of the limiting rod (31), and two ends of the anti-seismic plate (32) are fixedly connected with the side face of an anti-seismic strip (33).
3. The integrated circuit package assembly of claim 1, wherein: the anti-seismic mechanism is characterized in that a spring (35) and a rubber block (36) are arranged inside the anti-seismic mechanism (3), the spring (35) is fixedly installed at the bottom of an inner cavity of the anti-seismic mechanism (3), and the rubber block (36) is arranged at the top of the inner cavity of the anti-seismic mechanism (3).
4. The integrated circuit package assembly of claim 1, wherein: the heat dissipation device comprises a heat dissipation device shell and is characterized in that a fan (41) is fixedly mounted on one side of an inner cavity of the heat dissipation device shell, limiting columns (42) are arranged on two sides of the fan (41), one end of each limiting column (42) is fixedly connected with the side face of a heat dissipation plate (43), and two ends of each heat dissipation plate (43) are fixedly connected with the inner wall of the heat dissipation shell.
5. The integrated circuit package assembly of claim 1, wherein: the side fixedly connected with dead lever (44) of heating panel (43), the one end fixedly connected with cooling chamber (45) of dead lever (44), the below of cooling chamber (45) is provided with cooling tube (46), cooling tube (46) fixed surface is connected with heat absorption cylinder (47), the one end of heat absorption cylinder (47) and the inner chamber bottom of heat abstractor casing.
6. The integrated circuit package assembly of claim 1, wherein: the inner surface of the packaging cover (11) is fixedly provided with a positioning column (12), the packaging device main body (1) comprises a fixing column (13) and a fixing plate (14), the fixing plate (14) is fixedly arranged on the side face of an inner cavity of the packaging device main body (1) through the fixing column (13), and the side face of the fixing plate (14) is fixedly connected with a clamping plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122181363.8U CN216311770U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122181363.8U CN216311770U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216311770U true CN216311770U (en) | 2022-04-15 |
Family
ID=81088780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122181363.8U Active CN216311770U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216311770U (en) |
-
2021
- 2021-09-09 CN CN202122181363.8U patent/CN216311770U/en active Active
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