CN216291607U - Power module and LED display module - Google Patents
Power module and LED display module Download PDFInfo
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- CN216291607U CN216291607U CN202122984488.4U CN202122984488U CN216291607U CN 216291607 U CN216291607 U CN 216291607U CN 202122984488 U CN202122984488 U CN 202122984488U CN 216291607 U CN216291607 U CN 216291607U
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- condenser
- avoiding hole
- power module
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Abstract
The application relates to a power module and LED display module assembly, it includes circuit board and first condenser, the pin of first condenser connect in the circuit board, the circuit board has been seted up and has been kept away the position hole, first condenser set up in keep away in the position hole. The application has the effect of thinner structure.
Description
Technical Field
The application relates to the technical field of electrical components, in particular to a power module and an LED display module.
Background
With the development of science and technology, the LED display screen is developed in a light and thin direction, and accordingly, each component applied to the LED display screen is also adapted to the development requirement.
At present, a cuboid capacitor in a power module is generally vertically or horizontally welded on a circuit board, so that the structure of the circuit board is generally thicker, and the requirement on the thinness of an LED display screen cannot be met.
The above related art has the defect that the overall structure of the power module is too thick.
SUMMERY OF THE UTILITY MODEL
In order to improve the problem that power module overall structure is thick partially, this application provides a power module and LED display module assembly.
In a first aspect, the present application provides a power module, which adopts the following technical scheme:
a power module comprises a circuit board and a first capacitor, wherein a pin of the first capacitor is connected to the circuit board, a position avoiding hole is formed in the circuit board, and the first capacitor is arranged in the position avoiding hole.
Through adopting above-mentioned technical scheme, set up first condenser in the aversion position hole of circuit board, for directly setting up the condenser on the circuit board among the correlation technique, the first condenser of this application highly sinks the thickness of circuit board, has reduced the height of first condenser on the circuit board for power module's overall structure thins.
Optionally, the first capacitor is horizontally disposed in the avoiding hole.
Through adopting above-mentioned technical scheme, first condenser horizontal setting has reduced the height of first condenser on the circuit board in keeping away the position hole for power module's overall structure thins.
Optionally, a second capacitor is disposed on a side of the first capacitor away from the circuit board, the second capacitor is parallel to the first capacitor, the second capacitor is disposed on a side of the first capacitor away from the circuit board, and a pin of the second capacitor is electrically connected to the circuit board.
Through adopting above-mentioned technical scheme, set up the second condenser on the circuit board in the one side that first condenser deviates from the circuit board, reduced the area that the second condenser occupies the circuit board effectively.
Optionally, the avoiding hole is matched with the first capacitor, and the horizontal cross-sectional area of the first capacitor is smaller than the horizontal cross-sectional area of the second capacitor.
By adopting the technical scheme, the cross sectional area of the first capacitor in the horizontal direction is smaller than that of the second capacitor in the horizontal direction, the spacing hole is matched with the first capacitor, the opening area of the spacing hole is reduced, and the limited space of the circuit board is fully utilized.
Optionally, the first capacitor is vertically disposed in the avoiding hole.
Through adopting above-mentioned technical scheme, first condenser is vertical to be set up in keeping away the position hole, when reducing the height of vertical first condenser on the circuit board, has still reduced the trompil area of keeping away the position hole, has reduced the area that first condenser occupies the circuit board.
Optionally, a third capacitor is disposed on the circuit board, the third capacitor is parallel to the first capacitor, the third capacitor is disposed in the avoiding hole, and a pin of the third capacitor is electrically connected to the circuit board.
By adopting the technical scheme, the third capacitor and the first capacitor on the circuit board are vertically arranged in the avoiding hole together, and the third capacitor is parallel to the first capacitor, so that the thickness of the circuit board is reduced by the height of the third capacitor, and the overall structure of the power module is thinned.
In a second aspect, the present application provides a power module, which adopts the following technical solution:
a power module comprises a circuit board and a first capacitor, wherein the first capacitor is arranged on the peripheral side of the circuit board, and a pin of the first capacitor is electrically connected with the circuit board.
By adopting the technical scheme, the first capacitor is arranged on the peripheral side of the circuit board, so that the height of the first capacitor is reduced by the thickness of the circuit board, on one hand, the height of the first capacitor on the circuit board is reduced, and the overall structure of the power module is thinned; on the other hand, the first capacitor does not need to be arranged on the circuit board through a hole, so that the steps are simplified, and the area of the circuit board occupied by the first capacitor is reduced.
In a second aspect, the present application provides an LED display module, which adopts the following technical solution:
an LED display module comprises the power supply module.
By adopting the technical scheme, the overall structure of the LED display module becomes thinner.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the first capacitor is arranged in the avoiding hole of the circuit board, so that the height of the first capacitor on the circuit board is reduced, and the overall structure of the power module is thinned;
2. the first capacitor is arranged on the peripheral side of the circuit board, so that the height of the first capacitor on the circuit board is reduced, and the overall structure of the power module is thinned; on the other hand, the first capacitor does not need to be placed in the hole formed in the circuit board, so that the steps are simplified, and the area of the circuit board occupied by the capacitor is reduced.
Drawings
Fig. 1 is a schematic view of the overall structure of embodiment 1 of the present application.
Fig. 2 is a cross-sectional view of the capacitor and circuit board relationship of section a-a of fig. 1.
Fig. 3 is a schematic view of the overall structure of embodiment 2 of the present application.
Fig. 4 is a schematic view of the overall structure of embodiment 3 of the present application.
Fig. 5 is a cross-sectional view of the capacitor and circuit board relationship of portion B-B of fig. 4.
Fig. 6 is a sectional view of the capacitor disposed on one side of the circuit board.
Description of reference numerals: 1. a circuit board; 11. avoiding holes; 2. a first capacitor; 3. a second capacitor; 4. a third capacitor.
Detailed Description
In the description of the present invention, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
The present application is described in further detail below with reference to figures 1-6.
The embodiment of the application discloses a power module.
Example 1
Referring to fig. 1, a power module includes a circuit board 1 and a first capacitor 2, a pin of the first capacitor 2 being electrically connected to the circuit board 1; the circuit board 1 is provided with a avoiding hole 11, and the first capacitor 2 is arranged in the avoiding hole 11. Specifically, the first capacitor 2 in the embodiment of the present application is a square capacitor, the size of the avoiding hole 11 is adapted to the size of the first capacitor 2, and the first capacitor 2 is disposed in the avoiding hole 11, and compared with the related art in which the first capacitor 2 is directly fixed on the circuit board, the embodiment of the present application enables the first capacitor 2 to sink by the thickness equivalent to the thickness of the circuit board, so that the overall height of the power module is reduced by the thickness of the circuit board, and the overall structure of the power module is thinned.
Referring to fig. 2, the first capacitor 2 is horizontally disposed in the clearance hole 11, and the height of the first capacitor 2 on the circuit board 1 is reduced. The circuit board 1 is further provided with a second capacitor 3, the second capacitor 3 is parallel to the first capacitor 2, and the second capacitor 3 is stacked right above the first capacitor 2. The pins of the first capacitor 2 and the second capacitor 3 are arranged on the same side surface and are electrically connected with the circuit board 1 through welding. The cross sectional area of the first capacitor 2 in the horizontal direction is smaller than that of the second capacitor 3 in the horizontal direction, and the first capacitor 2 with the smaller cross sectional area in the horizontal direction is arranged in the avoiding hole 11, so that the opening area of the avoiding hole 11 on the circuit board 1 is reduced; under the condition of meeting the requirement of the structural thinness of the circuit board 1, the second capacitor 3 is stacked right above the first capacitor 2, so that the area of the circuit board 1 occupied by the second capacitor 3 is effectively reduced, and the limited space of the circuit board 1 is fully utilized.
The implementation principle of the embodiment 1 is as follows: the first capacitor 2 is horizontally arranged in a position avoiding hole 11 formed in the circuit board 1, and the second capacitor 3 is stacked right above the first capacitor 2, so that the height of the capacitor on the circuit board 1 is reduced, and the overall structure of the power module is thinned; meanwhile, the area of the circuit board 1 occupied by the second capacitor 3 is effectively reduced, so that the limited space of the circuit board 1 is fully utilized.
Example 2
Referring to fig. 3, the present embodiment is different from embodiment 1 in that the first capacitor 2 is vertically disposed in the avoiding hole 11; the circuit board 1 is further provided with a third capacitor 4, the third capacitor 4 is parallel to the first capacitor 2, the third capacitor 4 is arranged in the avoiding hole 11, and a pin of the third capacitor 4 is electrically connected with the circuit board 1. Specifically, the first capacitor 2 and the third capacitor 4 are vertically arranged in the avoiding hole 11, pins of the first capacitor 2 and the third capacitor 4 are bent and welded on the circuit board 1, and the pin connection part of the first capacitor 2 and the pin connection part of the third capacitor 4 on the circuit board 1 are respectively located on two opposite sides of the avoiding hole 11.
The implementation principle of the embodiment 2 is as follows: the first capacitor 2 and the third capacitor 4 are vertically arranged in a position avoiding hole 11 formed in the circuit board 1, so that the vertical capacitor sinks, the height of the capacitor on the circuit board 1 is reduced, and the overall structure of the power module is thinned.
Example 3
Referring to fig. 4 and 5, the present embodiment is different from embodiment 1 in that one side of the avoiding hole 11 is communicated with the outside. Specifically, when mounting, the first capacitor 2 is placed in the clearance hole 11, and the height of the first capacitor 2 on the circuit board 1 is reduced; wherein a part of the first capacitor 2 is disposed outside the circuit board 1, thereby reducing the opening area of the avoiding hole 11 and making the opening of the circuit board 1 simpler.
The implementation principle of the embodiment 3 is as follows: the first capacitor 2 is arranged in the avoiding hole 11, so that the height of the first capacitor 2 on the circuit board 1 is reduced, and the overall structure of the power module is thinned; the avoiding hole 11 is communicated with the outside, so that a part of the first capacitor 2 is suspended outside the circuit board 1, the opening area of the avoiding hole 11 is reduced, and the opening on the circuit board 1 is simpler.
The embodiment of the application also discloses a power supply module.
Referring to fig. 6, the difference between this embodiment and embodiment 1 is that the circuit board 1 is not provided with a clearance hole 11 for placing the first capacitor 2, the first capacitor 2 is disposed on the peripheral side of the circuit board 1, the pin of the first capacitor 2 is disposed on a side surface of the first capacitor 2 close to the circuit board 1, and the pin of the first capacitor 2 is soldered to the circuit board 1. On one hand, the height of the first capacitor 2 on the circuit board 1 is reduced, so that the overall structure of the power supply module is thinned; on the other hand, the steps are simplified, the position avoiding hole 11 for placing the first capacitor 2 is not required to be formed in the circuit board 1, and the area of the circuit board 1 occupied by the first capacitor 2 is reduced.
The implementation principle of the power module in the embodiment of the application is as follows: the first capacitor 2 is arranged on the peripheral side of the circuit board 1, and the height of the first capacitor 2 on the circuit board 1 can be reduced without forming a hole on the circuit board 1, so that the overall structure of the power module is thinned; meanwhile, the area of the circuit board 1 occupied by the first capacitor 2 is effectively reduced, so that the limited space of the circuit board 1 is fully utilized.
The embodiment of the application also discloses an LED display module.
An LED display module comprises a shell and the power supply module. Specifically, the power module is installed in the casing, and the thinner power module of casing adaptation for the casing is thinner, and then LED display module assembly also can the attenuation correspondingly.
The implementation principle of the LED display module is as follows: the thinner power module is arranged in the matched shell, so that the LED module becomes thinner.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application. Moreover, all possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
Claims (8)
1. A power module, characterized by: the circuit board comprises a circuit board (1) and a first capacitor (2), wherein a pin of the first capacitor (2) is connected to the circuit board (1), a position avoiding hole (11) is formed in the circuit board (1), and the first capacitor (2) is arranged in the position avoiding hole (11).
2. The power supply module of claim 1, wherein: the first capacitor (2) is horizontally arranged in the avoiding hole (11).
3. The power supply module of claim 2, wherein: one side, far away from circuit board (1), of first condenser (2) is provided with second condenser (3), second condenser (3) are on a parallel with first condenser (2), and second condenser (3) set up in first condenser (2) deviate from one side of circuit board (1), the pin of second condenser (3) with circuit board (1) electricity is connected.
4. The power supply module of claim 3, wherein: the position avoiding hole (11) is matched with the first capacitor (2), and the cross sectional area of the first capacitor (2) in the horizontal direction is smaller than that of the second capacitor (3).
5. The power supply module of claim 1, wherein: the first capacitor (2) is vertically arranged in the avoiding hole (11).
6. The power supply module of claim 5, wherein: the circuit board (1) is provided with a third capacitor (4), the third capacitor (4) is parallel to the first capacitor (2), the third capacitor (4) is arranged in the avoiding hole (11), and a pin of the third capacitor (4) is electrically connected with the circuit board (1).
7. A power supply module comprising a circuit board (1) and a first capacitor (2), characterized in that: the first capacitor (2) is arranged on the peripheral side of the circuit board (1), and pins of the first capacitor (2) are electrically connected with the circuit board (1).
8. The utility model provides a LED display module assembly which characterized in that: comprising a power supply module according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122984488.4U CN216291607U (en) | 2021-11-29 | 2021-11-29 | Power module and LED display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122984488.4U CN216291607U (en) | 2021-11-29 | 2021-11-29 | Power module and LED display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216291607U true CN216291607U (en) | 2022-04-12 |
Family
ID=81041443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122984488.4U Active CN216291607U (en) | 2021-11-29 | 2021-11-29 | Power module and LED display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216291607U (en) |
-
2021
- 2021-11-29 CN CN202122984488.4U patent/CN216291607U/en active Active
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