CN216266914U - Wafer deformation optimization device for invisible cutting machine and invisible cutting machine - Google Patents
Wafer deformation optimization device for invisible cutting machine and invisible cutting machine Download PDFInfo
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- CN216266914U CN216266914U CN202122251018.7U CN202122251018U CN216266914U CN 216266914 U CN216266914 U CN 216266914U CN 202122251018 U CN202122251018 U CN 202122251018U CN 216266914 U CN216266914 U CN 216266914U
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Abstract
The utility model provides a wafer deformation optimization device for an invisible cutting machine and the invisible cutting machine, wherein the wafer deformation optimization device comprises an auxiliary distance measuring element, the auxiliary distance measuring element is used for being fixed on the upper surface of a movable carrying platform of the invisible cutting machine, and the auxiliary distance measuring element is positioned on one side of a wafer to be processed; the distance measuring component is positioned above the auxiliary distance measuring element and used for detecting a first distance between the auxiliary distance measuring element and the distance measuring element and detecting a second distance between the auxiliary distance measuring element and a wafer to be processed; and the laser depth adjusting unit is electrically connected with the distance measuring part and used for adjusting the laser focal depth based on the difference between the first distance and the second distance. In the process of processing the wafer by the invisible cutting machine, the wafer deformation optimizing device solves the problem of inconsistent deformation amplitude caused by different wafer thickness differences.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a wafer deformation optimizing device for an invisible cutting machine and the invisible cutting machine.
Background
In semiconductor manufacturing, there is a trend toward the use of large wafers; the wafer itself is very thin and the dicing process involves a number of issues, such as how many chips can be cut from a wafer, or how to cut complex integrated circuit chips with better performance. As chip products become smaller and smaller while having more functions, the dicing process is required to work under more and more stringent conditions. Stealth dicing is a technique that satisfies this harsh condition; stealth dicing is only a part of the semiconductor fabrication process, but changes to this part can have a tremendous impact on the overall process.
At present, when the invisible cutting machine is used for processing wafers, the wafers with different thicknesses can deform to different degrees, and the deformation amplitude of each wafer is different, so that the phenomenon not only affects the quality of the wafers, but also affects the performance stability of the wafers in the same batch. Therefore, how to ensure that the deformation amplitudes of the wafers with different thicknesses are consistent after processing is an urgent technical problem to be solved.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a wafer deformation optimization device for an invisible cutting machine and an invisible cutting machine, so as to solve one or more problems of the existing video streaming method.
According to an aspect of the present invention, there is disclosed a wafer deformation optimizing apparatus for an invisible cutting machine including a frame, a laser, and a movable stage, the wafer deformation optimizing apparatus including:
the auxiliary ranging element is used for being fixed on the upper surface of a movable carrying platform of the invisible cutting machine and is positioned on one side of the wafer to be processed;
the distance measuring component is positioned above the auxiliary distance measuring element and used for detecting a first distance between the auxiliary distance measuring element and the distance measuring element and detecting a second distance between the auxiliary distance measuring element and a wafer to be processed;
and the laser depth adjusting unit is electrically connected with the distance measuring part and used for adjusting the laser focal depth based on the difference between the first distance and the second distance.
In some embodiments of the utility model, the auxiliary ranging element is an aluminum mirror.
In some embodiments of the present invention, the device further comprises an aluminum mirror pressing plate, the aluminum mirror pressing plate has an aluminum mirror through hole, the aluminum mirror is located below the aluminum mirror pressing plate, and the aluminum mirror penetrates out of the aluminum mirror through hole.
In some embodiments of the present invention, the moving stage has a groove thereon, the aluminum mirror is located in the groove, and an upper surface of the aluminum mirror is flush with an upper surface of the moving stage.
In some embodiments of the present invention, the aluminum mirror pressing plate is a rectangular pressing plate, the aluminum mirror through hole is located at a center position of the rectangular pressing plate, and the aluminum mirror pressing plate is detachably connected to the mobile carrier.
In some embodiments of the utility model, the distance measuring means is fixed below the laser.
In some embodiments of the utility model, the distance measuring component is a laser distance meter.
In some embodiments of the utility model, the distance measuring component is an acoustic range finder.
In some embodiments of the present invention, the first distance is a vertical distance between the distance measuring part and the auxiliary distance measuring element, and the second distance is a vertical distance between the distance measuring part and a center of a wafer on the moving stage.
According to another aspect of the utility model, a stealth cutter is further disclosed, and the stealth cutter comprises the wafer deformation optimizing device for the stealth cutter as described in any one of the above embodiments.
By utilizing the wafer deformation optimizing device for the invisible cutting machine and the invisible cutting machine, the beneficial effects can be obtained at least in the following steps:
this a wafer deformation optimization device for stealthy cutting machine has the range finding part, and install the supplementary range finding component on the removal microscope carrier, in the wafer course of working, the range finding part is according to the first distance between its and the supplementary range finding component that records and the second distance between the wafer, judge the thickness of wafer, and then pass through radium-shine degree of depth adjustment unit adjustment laser focal depth based on the thickness of wafer, the device has solved the problem that its deformation range size is inconsistent that the thickness difference leads to between the wafer, thereby make its deformation range size of the wafer of different thickness unanimous, and then ensured the quality of wafer and the stability of same batch wafer performance.
Additional advantages, objects, and features of the utility model will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
It will be appreciated by those skilled in the art that the objects and advantages that can be achieved with the present invention are not limited to the specific details set forth above, and that these and other objects that can be achieved with the present invention will be more clearly understood from the detailed description that follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the principles of the utility model. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the utility model. For purposes of illustrating and describing some portions of the present invention, corresponding parts of the drawings may be exaggerated, i.e., may be larger, relative to other components in an exemplary apparatus actually manufactured according to the present invention. In the drawings:
fig. 1 is a schematic structural diagram of a wafer deformation optimization device for an invisible cutting machine according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an auxiliary ranging element mounted on a moving carrier according to an embodiment of the present invention.
Fig. 3 is a laser depth contrast diagram of wafers of different thicknesses according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not closely related to the present invention are omitted.
It should be emphasized that the term "comprises/comprising/comprises/having" when used herein, is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components.
It should be noted that the terms of orientation and orientation used in the present specification are relative to the position and orientation shown in the drawings; the term "coupled" herein may mean not only directly coupled, but also indirectly coupled, in which case intermediates may be present, if not specifically stated. A direct connection is one in which two elements are connected without the aid of intermediate elements, and an indirect connection is one in which two elements are connected with the aid of other elements.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, like reference characters designate the same or similar parts throughout the several views.
Fig. 1 shows a wafer deformation optimization apparatus for an invisible cutting machine according to an embodiment of the present invention, wherein the invisible cutting machine includes a frame, a laser, and a movable stage 100. The frame is a carrier of the laser, the mobile carrier 100 and other accessories and mainly plays roles of bearing, fixing, supporting and the like; the laser is the final performing part of the apparatus, and its main function is to cut or carve the wafer 200 by laser; the movable stage 100 is used for carrying the wafer 200 to be processed, reliably fixing the wafer 200 and moving the wafer 200 relative to the laser according to requirements.
As shown in fig. 1, the wafer deformation optimizing apparatus includes an auxiliary ranging element 110, a ranging part 120, and a laser depth adjusting unit 130. The auxiliary ranging element 110 is used for being fixed on the upper surface of the movable carrying platform 100 of the invisible cutting machine, and the auxiliary ranging element 110 is located on one side of the wafer 200 to be processed; the auxiliary distance measuring element 110 may be detachably fixed or non-detachably fixed, the detachable fixing may include fixing methods such as screws and buckles, and the non-detachable fixing may include fixing methods such as gluing and welding. In addition, the auxiliary ranging element 110 may be directly fixed on the mobile carrier 100, or may be fixed on the mobile carrier 100 through other accessories. The distance measuring part 120 is located above the auxiliary distance measuring element 110, and is used for detecting a first distance between the auxiliary distance measuring element 110 and the distance measuring part and detecting a second distance between the auxiliary distance measuring element and the wafer 200 to be processed; the distance measuring unit 120 can be directly fixed on the laser or fixed on the frame of the invisible cutting machine through other accessories as long as it is located above the auxiliary distance measuring element 110. The laser depth adjusting unit 130 is configured to adjust the laser depth based on a difference between the first distance and the second distance; which is electrically connected to the distance measuring part 120 to receive the first distance and the second distance measured by the distance measuring part. The adjustment mode of the laser depth adjustment unit 130 may be a laser built-in adjustment device or a laser external adjustment device, and the laser built-in adjustment device may be a lens focal length adjustment device or a laser power adjustment device; the external laser adjusting device may be a component for adjusting the position of the laser, and adjusting the position of the laser may also be understood as adjusting the distance between the laser and the wafer.
In this embodiment, the distance measuring part 120 is used to measure the first distance and the second distance, and the laser depth is adjusted according to the difference between the measured distances, thereby reducing the problem of inconsistent deformation amplitudes of the wafers 200 due to the difference in thickness between the wafers 200 during the processing. Illustratively, the standard wafer 200 has a thickness of 715 μm, and the laser depth is 600 μm, and when the difference between the first distance and the second distance is 730 μm, that is, the thickness of the wafer 200 is 730 μm, the laser depth can be adjusted to 615 μm (formula: actual laser depth is set to be the laser depth- (actual wafer 200 thickness-standard wafer 200 thickness)).
In an embodiment, the auxiliary distance measuring element 110 is an aluminum mirror, and the shape thereof may be square or circular, and the thickness and size of the aluminum mirror may be implemented according to the actual use situation. The aluminum mirror may be fixed to the movable stage 100 in a detachable manner or in a non-detachable manner. The detachable fixing mode can comprise fixing modes such as screws, buckles and the like, and the non-detachable fixing mode can comprise fixing modes such as gluing, welding and the like. The aluminum mirror may be directly connected to the movable stage 100, or may be connected to the movable stage 100 through an attachment such as a platen.
As shown in fig. 2, the auxiliary distance measuring element 110 may further include an aluminum mirror pressing plate 111, the aluminum mirror pressing plate 111 has an aluminum mirror through hole, the aluminum mirror is located below the aluminum mirror pressing plate 111, and the aluminum mirror penetrates through the aluminum mirror through hole. The material of the aluminum mirror pressing plate 111 can be a metal material, such as a steel plate; in addition, the material of the aluminum mirror pressing plate 111 may be other non-metal materials such as plastic. The shape of the through-hole in the aluminum mirror pressing plate 111 may be similar to the shape of the aluminum mirror, and for example, when the shape of the aluminum mirror is circular, the shape of the through-hole in the aluminum mirror pressing plate 111 may also be circular; when the shape of the aluminum mirror is square, similarly, the through hole of the aluminum mirror pressing plate 111 may also be square. Specifically, the size of the through hole on the aluminum mirror pressing plate 111 may be slightly larger than the outer size of the aluminum mirror, so that when the aluminum mirror and the aluminum mirror pressing plate 111 are mounted in place, the aluminum mirror penetrates through the through hole on the aluminum mirror pressing plate 111, and the distance measuring part 120 can detect the distance between the aluminum mirror and the aluminum mirror. During specific installation, the aluminum mirror can be fixed on the aluminum mirror pressing plate 111, and then the aluminum mirror pressing plate 111 fixed with the aluminum mirror is installed on the movable stage 100, and at this time, the aluminum mirror and the aluminum mirror pressing plate 111 can be connected in a gluing mode and the like; alternatively, the aluminum mirror may be directly pressed against the corresponding position of the movable stage 100 by the aluminum mirror pressing plate 111.
Further, the shape of the aluminum mirror pressing plate 111 may be rectangular, at this time, an aluminum mirror through hole may be opened at a central position of the aluminum mirror pressing plate 111, and if it is desired to realize the connection between the aluminum mirror pressing plate 111 and the mobile carrier 130, mounting holes may be respectively opened at two sides of the aluminum mirror through hole, and further, the aluminum mirror pressing plate 111 and the mobile carrier 100 are fixed as a whole by screws or bolts. It should be understood that the aluminum mirror plate 111 and the movable stage 100 may be connected by non-detachable connection means such as bonding or welding, in addition to the connection by screws or bolts.
In another embodiment, the movable stage 100 may have a recess, and the aluminum mirror is specifically installed in the recess, and the upper surface of the aluminum mirror is flush with the upper surface of the movable stage 100. The shape of the groove can be set based on the specific shape of the aluminum mirror, and if the aluminum mirror is square, the shape of the groove is also square; and the depth of the recess may be set to coincide with the height of the aluminum mirror in order to ensure that the upper surface of the aluminum mirror is flush with the upper surface of the moving stage 100. It should be understood that the above arrangement is one of many embodiments, and the depth or shape of the groove may be changed according to the shape and size of the aluminum mirror.
Further, in order to realize the fixed connection between the aluminum mirror pressing plate 111 and the mobile carrier 100, threaded holes may be directly formed in both sides of the groove of the mobile carrier 100, at this time, mounting holes are correspondingly formed in both sides of the through hole of the aluminum mirror on the aluminum mirror pressing plate 111 for assisting in connecting the aluminum mirror, and further, screws or bolts are mounted in the mounting holes and the threaded holes, that is, the connection between the aluminum mirror pressing plate 111 and the mobile carrier 100 is realized.
In addition to the above, the movable stage 100 may be provided with an aluminum mirror platen mounting groove, and when the aluminum mirror platen 111 is rectangular, the aluminum mirror platen mounting groove may also be rectangular. In order to ensure that the upper surface of the aluminum mirror is flush with the upper surface of the movable stage 100, the depth of the aluminum mirror pressure plate mounting groove may be smaller than the depth of the aluminum mirror groove. It should be understood that the thickness, size and shape of the aluminum mirror pressing plate 111 and the aluminum mirror are not particularly limited and may be changed according to the actual application environment.
In another embodiment, the distance measuring unit 120 may be fixed below the laser, and similarly, the fixing manner between the distance measuring unit 120 and the laser may be a detachable manner, and in order to accurately obtain the first distance and the second distance detected by the distance measuring unit 120, there should not be any member that hinders the distance measurement between the distance measuring unit 120 and the movable stage 100. Wherein, the first distance is a vertical distance between the distance measuring part 120 and the auxiliary distance measuring element 110, i.e. a vertical distance between the distance measuring part 120 and the upper surface of the aluminum mirror; the second distance is a vertical distance between the distance measuring part 120 and the center of the wafer 200 on the moving stage 100, i.e., a vertical distance between the distance measuring part 120 and the upper surface of the wafer; under the condition that the upper surface of the aluminum mirror is flush with the upper surface of the moving stage 100, since the wafer 200 is placed on the upper surface of the moving stage 100, the difference between the first distance and the second distance represents the actual thickness of the wafer 200, so that the depth of focus of the laser can be adjusted by the laser depth adjusting unit based on the actual thickness of the wafer 200, and further the deformation amplitude of the wafer 200 in the processing process can be controlled. As can be seen from fig. 3, the laser depth is h1 for the thinner wafer and h2 for the thicker wafer, so that the two wafers with different thicknesses can be guaranteed to have the same deformation amplitude after being processed by the stealth cutter.
Further, the distance measuring part 120 may be a laser distance meter or an acoustic distance meter. The laser range finder is an instrument for measuring a distance to a target by using a certain parameter of modulated laser, and is classified into a phase range finder and a pulse range finder according to a range finding method. The acoustic distance meter is a test method for detecting the time, i.e., the transit time, of an ultrasonic wave emitted from an ultrasonic transmitter to a receiver through propagation of a gas medium, and calculating the distance based on the transit time. It should be understood that the various ranging components listed above are merely examples of many preferred embodiments, and that other types of ranging components may be used.
In another embodiment of the present invention, an invisible cutting machine is further disclosed, which includes a movable stage, a frame, and a laser, and further includes a wafer deformation optimization device for an invisible cutting machine disclosed in any of the above embodiments.
Through the embodiment, the wafer deformation optimizing device for the invisible cutting machine solves the problem that the deformation amplitude of the wafers is inconsistent due to the thickness difference between the wafers, so that the deformation amplitudes of the wafers with different thicknesses are consistent, and the quality of the wafers and the performance stability of the wafers in the same batch are ensured.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments and/or in combination with or instead of the features of the other embodiments in the present invention.
The above-mentioned embodiments illustrate and describe the basic principles and main features of the present invention, but the present invention is not limited to the above-mentioned embodiments, and those skilled in the art should make modifications, equivalent changes and modifications without creative efforts to the present invention within the protection scope of the technical solution of the present invention.
Claims (10)
1. A wafer deformation optimizing device for an invisible cutting machine, wherein the invisible cutting machine comprises a machine frame, a laser and a movable carrying platform, and the wafer deformation optimizing device is characterized by comprising:
the auxiliary ranging element is used for being fixed on the upper surface of a movable carrying platform of the invisible cutting machine and is positioned on one side of the wafer to be processed;
the distance measuring component is positioned above the auxiliary distance measuring element and used for detecting a first distance between the auxiliary distance measuring element and the distance measuring element and detecting a second distance between the auxiliary distance measuring element and a wafer to be processed;
and the laser depth adjusting unit is electrically connected with the distance measuring part and used for adjusting the laser focal depth based on the difference between the first distance and the second distance.
2. The wafer deformation optimizing device for the stealth cutter as claimed in claim 1, wherein the auxiliary ranging element is an aluminum mirror.
3. The wafer deformation optimizing device for the stealth cutter as claimed in claim 2, further comprising an aluminum mirror pressing plate having an aluminum mirror through hole formed therein, wherein the aluminum mirror is located below the aluminum mirror pressing plate, and the aluminum mirror penetrates through the aluminum mirror through hole.
4. The wafer deformation optimizing device for the invisible cutting machine as claimed in claim 3, wherein the movable stage is provided with a groove, the aluminum mirror is located in the groove, and the upper surface of the aluminum mirror is flush with the upper surface of the movable stage.
5. The wafer deformation optimizing device for the invisible cutting machine as claimed in claim 4, wherein the aluminum mirror pressing plate is a rectangular pressing plate, the aluminum mirror through hole is located at the center of the rectangular pressing plate, and the aluminum mirror pressing plate is detachably connected with the movable carrier.
6. The wafer deformation optimizing device for the stealth cutter as claimed in claim 1, wherein the ranging means is fixed below the laser.
7. The wafer deformation optimizing device for the stealth cutter as claimed in claim 6, wherein the distance measuring means is a laser distance measuring instrument.
8. The wafer deformation optimizing device for the stealth cutter as claimed in claim 6, wherein the distance measuring means is a sonic distance meter.
9. The wafer deformation optimizing device for an invisible cutting machine according to any one of claims 1 to 8, wherein the first distance is a vertical distance between the distance measuring means and the auxiliary distance measuring element, and the second distance is a vertical distance between the distance measuring means and a center of the wafer on the moving stage.
10. An invisible cutting machine, characterized in that the invisible cutting machine comprises the wafer deformation optimizing device for the invisible cutting machine according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122251018.7U CN216266914U (en) | 2021-09-16 | 2021-09-16 | Wafer deformation optimization device for invisible cutting machine and invisible cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122251018.7U CN216266914U (en) | 2021-09-16 | 2021-09-16 | Wafer deformation optimization device for invisible cutting machine and invisible cutting machine |
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| CN216266914U true CN216266914U (en) | 2022-04-12 |
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| CN202122251018.7U Active CN216266914U (en) | 2021-09-16 | 2021-09-16 | Wafer deformation optimization device for invisible cutting machine and invisible cutting machine |
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