CN216250712U - Pin sheet and chip diode packaging structure using same - Google Patents

Pin sheet and chip diode packaging structure using same Download PDF

Info

Publication number
CN216250712U
CN216250712U CN202122326403.3U CN202122326403U CN216250712U CN 216250712 U CN216250712 U CN 216250712U CN 202122326403 U CN202122326403 U CN 202122326403U CN 216250712 U CN216250712 U CN 216250712U
Authority
CN
China
Prior art keywords
section
pin
pin sheet
diode
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122326403.3U
Other languages
Chinese (zh)
Inventor
陈盛隆
叶敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Microelectronics Shenzhen Co ltd
Original Assignee
Parker Microelectronics Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Microelectronics Shenzhen Co ltd filed Critical Parker Microelectronics Shenzhen Co ltd
Priority to CN202122326403.3U priority Critical patent/CN216250712U/en
Application granted granted Critical
Publication of CN216250712U publication Critical patent/CN216250712U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model provides a pin sheet and a chip diode packaging structure using the pin sheet, wherein the pin sheet is of a long strip structure and is divided into a connecting section and a fixing section through a cutting area, and the connecting section is arranged at one end of the pin sheet and is used for connecting a chip diode; the fixed section is arranged at the other end of the pin sheet, and one end of the fixed section, which is far away from the shearing area, is connected with the frame structure; wherein the cutting area is provided with a first through hole. In the pin sheet and the chip diode packaging structure using the pin sheet, the cutting area of the pin sheet is reduced by adding the through hole structure in the cutting area; according to the utility model, the pin sheet frame is locally adjusted, so that the transmission of the stress of the pin cutter to the inside is effectively reduced, the fine shearing by adopting high-precision pin cutter is avoided, and the cost of the pin cutter is reduced.

Description

Pin sheet and chip diode packaging structure using same
Technical Field
The utility model relates to the technical field of diode packaging, in particular to a pin sheet and a surface mount diode packaging structure using the pin sheet.
Background
With the development of the semiconductor industry and the rise of mobile communication devices, the integration of chip memory technology is becoming the standard of high-end products.
At present, pins of the chip diode need to be cut in the packaging process, but the existing chip diode can generate large stress when cutting the pins, the pin pieces are easy to damage, the yield is low, and the production cost is high. Therefore, it is desirable to provide a lead plate and a chip diode package structure using the same to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pin sheet and a chip diode packaging structure using the pin sheet, which can reduce a cutting surface by adding a through hole structure in a cutting area so as to solve the problem that the chip diode in the prior art generates large stress when cutting pins.
In order to solve the technical problems, the technical scheme of the utility model is as follows: a pin sheet; wherein the pin sheet is of a strip structure and is divided into a connecting section and a fixing section through a cutting area,
the connecting section is arranged at one end of the pin sheet and is used for connecting the surface-mounted diode;
the fixed section is arranged at the other end of the pin sheet, and one end of the fixed section, which is far away from the shearing area, is connected with the frame structure;
wherein the cutout region is provided with a first through hole.
Preferably, still be provided with the folding line groove on the shearing area, the folding line groove is rectangular structure, the long limit place sharp of folding line groove with shearing area long limit place sharp is perpendicular, just the long limit of folding line groove with first through-hole intercommunication.
Preferably, the connection section includes:
the fixing part is positioned at one end of the connecting section and is connected with the patch diode;
one end of the extending part is connected with the fixing part, and the other end of the extending part extends in the direction away from the surface-mounted diode;
the connecting part is arranged at the other end of the connecting section and is used for connecting a circuit element, and the connecting part is connected with the cutting area; and the number of the first and second groups,
the first bending part connects the extending part and the connecting part, and a gap is formed between the first bending part and the outer side wall of the black rubber shell.
Preferably, the first bending part is a curved surface structure, and the first bending part is provided with a first reinforcing rib.
Preferably, the connecting section further includes a second bending portion, the second bending portion connects the fixing portion and the extending portion, and the second bending portion is provided with a second reinforcing rib
Preferably, one side of the fixing part, which is close to the patch diode, is provided with a welding bulge.
Preferably, the shearing area is further provided with a plurality of second shearing through holes, the cross section diameters of the second shearing through holes are smaller than the cross section diameter of the first through hole, and straight lines where the plurality of second shearing through holes are located penetrate through the first through hole.
Preferably, the second shearing through holes are arranged in the folding line grooves, and the second shearing through holes are arranged along the long side direction of the folding line grooves.
The utility model also provides a chip diode packaging structure, which comprises:
the number of the chip diodes is greater than the number of the chip diodes,
the black rubber shell is of a hollow structure, and the patch diode is accommodated in the black rubber shell; and
the pin sheet comprises a connecting section and a fixing section which are divided into a cutting area, one end of the connecting section is welded with the patch diode, the other end of the connecting section penetrates through the side wall of the black rubber shell and extends, one end of the connecting section is connected with the fixing section in a cutting mode through the cutting area, and the cutting area is provided with a first through hole.
Preferably, along the vertical upward direction, the width of black rubber shell reduces gradually, and the patch diode is eccentrically arranged in the black rubber shell.
Compared with the prior art, the utility model has the beneficial effects that: in the pin sheet and the chip diode packaging structure using the pin sheet, the cutting area of the pin sheet is reduced by adding the through hole structure in the cutting area; according to the utility model, the pin sheet frame is locally adjusted, so that the transmission of the stress of the pin cutter to the inside is effectively reduced, the fine shearing by adopting high-precision pin cutter is avoided, and the cost of the pin cutter is reduced.
In addition, the bending structure of the first bending part is added at the root part of the pin sheet, so that the pin cutting stress can be effectively relieved, and the stress resistance effect of the pin sheet is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.
Fig. 1 is a schematic structural diagram of a lead sheet according to a first embodiment of the utility model.
Fig. 2 is a schematic structural diagram of a connection segment of a first embodiment of a lead tab of the utility model.
Fig. 3 is a side view of a connector segment of a first embodiment of a pin field of the present invention.
Fig. 4 is a partial view of a cutout region of a first embodiment of a lead tab of the present invention.
Fig. 5 is a schematic structural diagram of a lead sheet according to a second embodiment of the utility model.
Fig. 6 is a side view of a connecting segment of a second embodiment of a pin field of the present invention.
Fig. 7 is a schematic structural diagram of a preferred embodiment of the chip diode package structure of the present invention.
Fig. 8 is a schematic diagram of a structure after pin cutting of a preferred embodiment of the chip diode package structure of the present invention.
Fig. 9 is a cross-sectional view of a black gel case of a preferred embodiment of a chip diode package structure of the present invention.
Fig. 10 is a top view of the internal structure of the black glue case of the preferred embodiment of the chip diode packaging structure of the utility model.
Fig. 11 is an exploded view of a lead frame structure of a preferred embodiment of the chip diode package structure of the present invention.
Reference numbers for the first embodiment of the lead tab: the connecting section 11, the fixing portion 111, the welding protrusion 111a, the extending portion 112, the first bending portion 113, the connecting portion 114, the fixing section 12, the cutting region 13, the first through hole 131, the polygonal line groove 132, and the second cutting through hole 133.
Reference numerals of the second embodiment of the lead sheet: the connecting section 21, the fixing portion 211, the welding protrusion 211a, the extending portion 212, the first bending portion 213, the connecting portion 214, the second bending portion 215, the fixing section 22, the cutting region 23, and the first through hole 231.
Embodiment reference numerals of the chip diode package structure: the chip diode comprises a chip diode 3, a black glue shell 4, a first pin piece 51, a first connecting section 511, a first fixing portion 5111, a first extending portion 5112, a first bending portion 5113, a first connecting portion 5114, a first groove 5114a, a second bending portion 5115, a first fixing section 512, a first through hole 5131, a second pin piece 52, a second connecting section 521, a second fixing portion 5211, a second extending portion 5212, a third bending portion 5213, a second connecting portion 5214, a second fixing section 522, a first solder 6 and a second solder 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
On the way, units having similar structures are denoted by the same reference numerals.
The terms "first," "second," and the like in the terms of the utility model are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.
Referring to fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a schematic structural diagram of a first embodiment of a lead tab of the present invention, fig. 2 is a schematic structural diagram of a connecting segment of the first embodiment of the lead tab of the present invention, and fig. 3 is a side view of the connecting segment of the first embodiment of the lead tab of the present invention.
The following is a preferred embodiment of the lead sheet according to the present invention that can solve the above technical problems.
A pin sheet is of a long strip structure and is divided into a connecting section 11 and a fixing section 12 through a cutting area 13, wherein the connecting section 11 is arranged at one end of the pin sheet and is used for connecting a surface mount diode; the fixed section 12 is arranged at the other end of the pin sheet, and one end of the fixed section 12, which is far away from the shearing area 13, is connected with the frame structure; wherein the cutout region 13 is provided with a first through hole 131.
The first through hole 131 in this embodiment is formed by splicing a first groove at the other end of the connecting section 11 and a second groove at one section of the fixing section 12. The pin piece other end after the shearing is provided with first recess, has promoted the anti stress that connection piece and other electrical components are connected, and the structure is used more stably.
The structure of the connection segment 11 in this embodiment is explained:
the connection segment 11 in the present embodiment includes: the connecting section 11 includes a fixing portion 111, an extending portion 112, a connecting portion 114 and a first bending portion 113, wherein the fixing portion 111 is located at one end of the connecting section 11, and the fixing portion 111 is connected to the chip diode; one end of the extending portion 112 is connected to the fixing portion 111, the other end extends away from the direction of the chip diode, and the extending portion 112 is used for extending the length of the lead piece, so that the stability of connecting the chip diode is improved. A connecting part 114 is arranged at the other end of the connecting section 11, the connecting part 114 is used for connecting a circuit element, and the connecting part 114 is connected with the cutting area 13; the first bending portion 113 connects the extending portion 112 and the connecting portion 114, so as to facilitate packaging of the chip diode, and the first bending portion 113 is configured to promote dissipation of stress of the lead structure during shearing and assembling processes, thereby promoting structural stability.
The fixing portion 111 in this embodiment is provided with a welding protrusion 111a on a side close to the chip diode, and the welding protrusion 111a improves the stability of the bonding between the lead sheet and the chip diode.
In this embodiment, the cross-sectional width of the fixing portion 111 is greater than the cross-sectional width of the bending portion 113, and the fixing portion 111 improves the contact surface between the lead sheet and the chip diode, thereby improving the stability of the lead sheet in the using process. Extension 112 reduces keeping away from fixed part 11 one end cross-sectional diameter gradually in addition, and extension 112 is provided with the structure of width gradual change, is convenient for carry on spacingly to pin piece position in the assembling process, not only has the effect of promoting stability in the pin piece use, is convenient for save the manufacturing cost of pin piece moreover, and the structure practicality is strong.
In addition, the first bending portion 113 in this embodiment can be configured as a curved surface structure, which is convenient for improving the anti-stress effect of the first bending portion 113. The first bending part 113 is provided with a first reinforcing rib, and the first reinforcing rib improves the strength of the first bending part 113 and improves the stability of the pin sheet structure.
The structure of the cutout region 13 in this embodiment will be described in detail with reference to fig. 4:
still be provided with broken line groove 132 on the shearing area 13 in this embodiment, broken line groove 132 is rectangular structure, and the long limit place straight line of broken line groove 132 is perpendicular with the long limit place straight line of shearing area 13, and the long limit of broken line groove 132 communicates with first through-hole 131. The folding line groove 132 is arranged, so that the pin pieces can be conveniently cut, and the structure is strong in practicability.
The cutting region 13 in this embodiment is further provided with a plurality of second cutting through holes 133, the diameter of the cross section of the second cutting through hole 133 is smaller than that of the first through hole 131, and the plurality of second cutting through holes 133 are located on a straight line and penetrate through the first through hole 131. The plurality of second cutting through holes 133 facilitate cutting of the lead pieces; in addition, a plurality of second shearing through holes 133 in this embodiment are evenly arranged and set up in broken line groove 132, and a plurality of second shearing through holes 133 are arranged along the long limit direction of broken line groove 132 and are further convenient for the pin of pin piece, have promoted the shearing efficiency of pin piece.
In addition, the first through hole 131, the folding line groove 132 and the second through hole 133 in the cutting region 13 of the lead sheet of this embodiment can be formed by direct injection molding, or can be formed by laser cutting by first injecting the whole sheet.
On the basis of the first embodiment, with reference to fig. 5 and fig. 6, fig. 5 is a schematic structural diagram of a second embodiment of the lead sheet of the present invention, and fig. 6 is a side view of a connecting segment of the second embodiment of the lead sheet of the present invention. A second embodiment of the pin sheet of the present invention is as follows:
a pin sheet is of a long strip structure and is divided into a connecting section 21 and a fixing section 22 through a cutting area 23, wherein the connecting section 21 is arranged at one end of the pin sheet and is used for connecting a surface mount diode; the fixed section 22 is arranged at the other end of the pin sheet, and one end of the fixed section 22, which is far away from the shearing area 23, is connected with the frame body structure; wherein the cutout region 23 is provided with a first through hole 231.
The first through hole 231 in this embodiment is formed by splicing a first groove at the other end of the connecting section 21 and a second groove at one end of the fixing section 22. The pin piece other end after the shearing is provided with first recess, has promoted the anti stress that connection piece and other electrical components are connected, and the structure is used more stably.
The connection section 21 in this embodiment includes a fixing portion 211, an extending portion 212, a connection portion 214, a first bending portion 213, and a second bending portion 215, wherein the fixing portion 211 is located at one end of the connection section 21, and the fixing portion 211 is connected to the chip diode; the second bending portion 215 connects the fixing portion 211 and one end of the extending portion 212, the other end of the extending portion 212 extends away from the patch diode, and the extending portion 212 is used for extending the length of the pin piece, so as to improve the stability of connecting the patch diode. A connecting portion 214 is provided at the other end of the connecting section 21, the connecting portion 214 is used for connecting a circuit element, and the connecting portion 214 is connected with the cutout region 23.
The first bending portion 213 connects the extending portion 212 and the connecting portion 214, so as to facilitate packaging the chip diode, and the first bending portion 213 is configured to promote dissipation of stress during the cutting and assembling processes of the lead frame structure, thereby promoting stability of the structure.
The fixing portion 211 in this embodiment is provided with a welding protrusion 211a on one side close to the chip diode, and the welding protrusion 211a improves the stability of the lead sheet and the chip diode.
In addition, the first bending portion 213 in this embodiment can be configured as a curved surface structure, so as to improve the anti-stress effect of the first bending portion 213. The first bending portion 213 is provided with a first reinforcing rib, and the first reinforcing rib improves the strength of the first bending portion 213 and improves the stability of the pin sheet structure.
The second bending portion 215 in this embodiment is provided with a second reinforcing rib, so as to enhance the strength of the lead piece.
Referring to fig. 7, 8, 9, 10 and 11, fig. 7 is a schematic structural diagram of a preferred embodiment of a chip diode package structure of the present invention, fig. 8 is a schematic structural diagram of a chip-cut structure of the preferred embodiment of the chip diode package structure of the present invention, fig. 9 is a cross-sectional view of a black glue case of the preferred embodiment of the chip diode package structure of the present invention, fig. 10 is a top view of an internal structure of the black glue case of the preferred embodiment of the chip diode package structure of the present invention, and fig. 11 is an exploded view of a lead frame structure of the preferred embodiment of the chip diode package structure of the present invention.
The following is a preferred embodiment of a lead plate and a chip diode package structure using the same according to the present invention.
The preferred embodiment of the chip diode 3 packaging structure with the free-cutting pin provided by the utility model is as follows: a chip diode 3 packaging structure with easily cut pins; the LED chip comprises a chip diode 3, a black glue shell 4 and a pin sheet; wherein the black rubber shell 4 is a hollow structure, and the patch diode 3 is accommodated in the black rubber shell 4; the two groups of pin pieces are respectively connected with the upper end and the lower end of the surface-mounted diode 3 and respectively penetrate through the side wall of the black rubber shell 4 and extend.
Wherein, the pin piece is cut apart into linkage segment and canned paragraph through shearing the region, and linkage segment one end welds with paster diode 3, and the linkage segment other end runs through 4 lateral walls of black rubber shell, cuts through shearing the regional shear connection between linkage segment one end and the canned paragraph, and shearing area is provided with first through-hole. The first through hole in this embodiment is formed by splicing a first groove at the other end of the connecting section and a second groove at one end of the fixing section. The pin piece other end after the shearing is provided with first recess, has promoted the anti stress that connection piece and other electrical components are connected, and the structure is used more stably.
The two groups of lead pieces in this embodiment are respectively a first lead piece 51 and a second lead piece 52, and two structures of the lead pieces are described in detail by the first lead piece 51 and the second lead piece 52 as follows:
in the first lead piece 51 in the present embodiment, the first lead piece 51 is divided into a first connecting section 511 and a first fixing section 512 by a first cutting region; the first connecting section 511 includes a first fixing portion 5111, a first extending portion 5112, a first connecting portion 5114, a first bending portion 5113, and a second bending portion 5115, wherein the first fixing portion 5111 is located at one end of the first connecting section 511, and the first fixing portion 5111 is connected to the top end of the patch diode 3; the second bending portion 5115 connects the first fixing portion 5111 and one end of the first extending portion 5112, the other end of the first extending portion 5112 extends away from the patch diode 3, and the first extending portion 5112 is used for extending the length of the first lead piece 51, so as to improve the stability of the first lead piece 51 connected to the patch diode 3. A first connection portion 5114 is provided at the other end of the first connection section 511, the first connection portion 5114 is used for connecting a circuit element, and the first connection portion 5114 is connected with the first cutout region.
The first bending portion 5113 connects the first extending portion 5112 and the first connecting portion 5114, so as to facilitate packaging the chip diode 3, and the first bending portion 5113 is arranged to improve the dissipation stress of the first lead piece 51 structure in the shearing and assembling processes, thereby improving the stability of the structure.
First fixed part 5111 in this implementation is provided with first welding arch near patch diode 3 one side, and first welding arch promotes first pin piece 51 and patch diode 3 welded stability.
In addition, the first bending portion 5113 in this embodiment can be configured to be a curved surface structure, so as to facilitate enhancing the anti-stress effect of the first bending portion 5113. First kink 5113 is provided with first strengthening rib, and first strengthening rib promotes the intensity of first kink 5113, promotes the stability of pin piece structure.
The second bending portion 5115 in this embodiment is provided with a second reinforcing rib to enhance the strength of the lead piece.
The structure of the cutout region in this embodiment is explained in detail:
still be provided with the broken line groove on the shearing area in this embodiment, the broken line groove is rectangular structure, and the straight line of broken line groove long limit place is perpendicular with the long limit place straight line of shearing area, and broken line groove long limit and first through-hole intercommunication. The folding line groove is arranged, so that the pin pieces can be conveniently cut, and the structure is strong in practicability.
The shearing area in this embodiment is further provided with a plurality of second shearing through holes, the diameter of the cross section of each second shearing through hole is smaller than that of the cross section of each first through hole, and the straight lines of the plurality of second shearing through holes penetrate through the first through holes. The plurality of second shearing through holes are convenient for shearing the pin pieces; in addition, a plurality of second shearing through-holes align to grid in this embodiment sets up at broken line inslot, and the pin of the pin piece of further being convenient for has promoted the shearing efficiency of pin piece.
In addition, first through-hole, broken line groove and the second on the shearing area all can be through direct injection moulding production formation in this embodiment pin piece, also can mould plastics whole lamellar body earlier and pass through laser shearing formation.
The structure of the lead sheet in this embodiment is explained:
the first lead piece 51 in this embodiment includes a first connecting section 511 and a first fixing section 512; the first connecting section 511 includes a first fixing portion 5111, a first extending portion 5112, a first connecting portion 5114, a first bending portion 5113, and a second bending portion 5115, wherein the first fixing portion 5111 is located at one end of the first connecting section 511, and the first fixing portion 5111 is connected to the top end of the patch diode 3; the first fixing portion 5111 in this embodiment is soldered to the tip electrode of the chip diode 3 by the first solder 6.
The second bending portion 5115 connects the first fixing portion 5111 and one end of the first extending portion 5112, the other end of the first extending portion 5112 extends away from the patch diode 3, and the first extending portion 5112 is used for extending the length of the first lead piece 51, so as to improve the stability of the first lead piece 51 connected to the patch diode 3. A first connection portion 5114 is provided at the other end of the first connection section 511, the first connection portion 5114 is used for connecting a circuit element, and the first connection portion 5114 is connected with the first cutout region.
The first bending portion 5113 connects the first extending portion 5112 and the first connecting portion 5114, so as to facilitate packaging the chip diode 3, and the first bending portion 5113 is arranged to improve the dissipation stress of the first lead piece 51 structure in the shearing and assembling processes, thereby improving the stability of the structure.
First fixed part 5111 in this implementation is provided with first welding arch near patch diode 3 one side, and first welding arch promotes first pin piece 51 and patch diode 3 welded stability.
In addition, the first bending portion 5113 in this embodiment can be configured to be a curved surface structure, so as to facilitate enhancing the anti-stress effect of the first bending portion 5113. First kink 5113 is provided with first strengthening rib, and first strengthening rib promotes the intensity of first kink 5113, promotes the stability of pin piece structure.
In this embodiment, the second bending portion 5115 can be provided with a second reinforcing rib to enhance the strength of the lead piece.
The second lead piece 52 in this embodiment is divided into a second connecting section 521 and a second fixing section 522 by a second cut region; the second connecting section 521 includes a second fixing portion 5211, a second extending portion 5212, a second connecting portion 5214, and a third bending portion 5213, wherein the second fixing portion 5211 is located at one end of the second connecting section 521, and the top surface of the second fixing portion 5211 is connected to the bottom end of the chip diode 3; preferably, the top surface of the second fixing portion 5211 in this embodiment is soldered to the bottom electrode of the chip diode 3 by the second solder.
The third bending portion 5213 connects the second fixing portion 5211 and one end of the second extending portion 5212, the other end of the second extending portion 5212 extends away from the patch diode 3, and the second extending portion 5212 is used for extending the length of the second lead piece 52, so as to improve the stability of the second lead piece 52 connected to the patch diode 3. A second connection portion 5214 is provided at the other end of the second connection section 521, the second connection portion 5214 being used to connect a circuit element, the second connection portion 5214 being connected with the second cutout region.
The third bending portion 5213 connects the second extending portion 5212 and the second connecting portion 5214, so as to facilitate packaging the chip diode 3, and the third bending portion 5213 is disposed to improve the dissipation stress of the second lead piece 52 structure during the cutting and assembling processes, thereby improving the stability of the structure.
In the second lead piece 52 of this embodiment, the cross-sectional width of the second fixing portion 5211 is greater than the cross-sectional width of the third bending portion 5213, and the second fixing portion 5211 improves the contact surface between the lead piece and the chip diode 3, thereby improving the stability of the lead piece in the using process. Second extension 5212 is keeping away from second fixed part 5211 one end cross-sectional diameter and is reducing gradually, and second extension 5212 is provided with the structure of width gradual change, cooperates the use of 4 structures of black rubber shell in the assembling process, is convenient for carry on spacingly to second pin piece 52 position, not only has the effect that promotes stability in the second pin piece 52 use, is convenient for save the manufacturing cost of pin piece moreover, and the structure practicality is strong.
Further, the patch diode 3 in the present embodiment is eccentrically disposed in the black matrix case 4. Keep away the position to the pin piece that is provided with second kink 5115, the structural practicality is strong.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (10)

1. A pin sheet; it is characterized in that the pin sheet is of a strip structure and is divided into a connecting section and a fixing section through a cutting area,
the connecting section is arranged at one end of the pin sheet and is used for connecting the surface-mounted diode;
the fixed section is arranged at the other end of the pin sheet, and one end of the fixed section, which is far away from the shearing area, is connected with the frame structure;
wherein the cutout region is provided with a first through hole.
2. The pin sheet according to claim 1, wherein a folding groove is further disposed on the cutting region, the folding groove has an elongated structure, a straight line of a long side of the folding groove is perpendicular to a straight line of a long side of the cutting region, and the long side of the folding groove is communicated with the first through hole.
3. The pin strip of claim 1, wherein said connection section comprises:
the fixing part is positioned at one end of the connecting section and is connected with the patch diode;
one end of the extending part is connected with the fixing part, and the other end of the extending part extends in the direction away from the surface-mounted diode;
the connecting part is arranged at the other end of the connecting section and is used for connecting a circuit element, and the connecting part is connected with the cutting area; and the number of the first and second groups,
the first bending part connects the extending part and the connecting part, and a gap is formed between the first bending part and the outer side wall of the black rubber shell.
4. The lead tab according to claim 3, wherein the first bent portion is a curved surface structure, and the first bent portion is provided with a first reinforcing rib.
5. The lead tab according to claim 3, wherein the connecting section further comprises a second bent portion connecting the fixing portion and the extending portion, and a second reinforcing rib is disposed on the second bent portion.
6. The lead tab of claim 3 wherein said anchor portion is provided with a solder bump on a side thereof adjacent said chip diode.
7. The pin sheet according to claim 2, wherein the cutout region is further provided with a plurality of second cutout through holes, the cross-sectional diameter of the second cutout through holes is smaller than that of the first through holes, and the plurality of second cutout through holes are located on a straight line which penetrates through the first through holes.
8. The lead tab of claim 7 wherein the second cutout through holes are disposed in the fold line groove, and a plurality of the second cutout through holes are arranged along a long side direction of the fold line groove.
9. A chip diode packaging structure, comprising:
the number of the chip diodes is greater than the number of the chip diodes,
the black rubber shell is of a hollow structure, and the patch diode is accommodated in the black rubber shell; and
the pin sheet according to any one of claims 1 to 8, wherein the pin sheet includes a connection section and a fixing section, the connection section is divided into the connection section and the fixing section by a cutting region, one end of the connection section is welded to the patch diode, the other end of the connection section penetrates through the side wall of the black rubber casing and extends, the connection section is in cutting connection with the fixing section by the cutting region, and the cutting region is provided with a first through hole.
10. A chip diode package structure according to claim 9, wherein the width of the black matrix case is gradually reduced in a vertically upward direction, and the chip diode is eccentrically disposed in the black matrix case.
CN202122326403.3U 2021-09-24 2021-09-24 Pin sheet and chip diode packaging structure using same Active CN216250712U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122326403.3U CN216250712U (en) 2021-09-24 2021-09-24 Pin sheet and chip diode packaging structure using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122326403.3U CN216250712U (en) 2021-09-24 2021-09-24 Pin sheet and chip diode packaging structure using same

Publications (1)

Publication Number Publication Date
CN216250712U true CN216250712U (en) 2022-04-08

Family

ID=80984067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122326403.3U Active CN216250712U (en) 2021-09-24 2021-09-24 Pin sheet and chip diode packaging structure using same

Country Status (1)

Country Link
CN (1) CN216250712U (en)

Similar Documents

Publication Publication Date Title
CN216250712U (en) Pin sheet and chip diode packaging structure using same
CN206541959U (en) Electric connector
JP4737664B2 (en) Surface mount type solid electrolytic capacitor and manufacturing method thereof
CN215955272U (en) Frame jumper wire assembly and patch packaging structure using same
CN212303986U (en) High-precision torsion type round-covered terminal
CN212114090U (en) Improved structure of square needle terminal connector
CN204088642U (en) Terminal and electric connector
CN213401185U (en) Prevent bending deformation's lead frame and encapsulation tablet
CN111081914A (en) Lithium battery
CN111540724A (en) Base frame, signal transmission plate and related chip packaging method and semiconductor packaging chip
CN213366589U (en) Connecting pin of lead frame
CN212659559U (en) Novel support, paster support and lamp pearl
CN212625543U (en) High-power double-boss patch diode
CN206640076U (en) Coaxial connector
CN212303659U (en) Light and thin minification lead frame
CN217507323U (en) IPM lead frame structure
CN201122700Y (en) Electric connector and its terminal
CN212848388U (en) Multirow lead frame suitable for DPAK
CN211529974U (en) Improved electrode plate of surface-mounted LED
CN217691205U (en) Auxiliary support for LED assembly
CN218568875U (en) Direct-insertion type LED light-emitting device
CN217588921U (en) Lead frame for packaging grid driver
CN217507698U (en) Connector fixing part structure
CN210607750U (en) Electric connector convenient to weld
CN219106188U (en) Low-current high-voltage high-brightness semiconductor

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant