CN215955272U - Frame jumper wire assembly and patch packaging structure using same - Google Patents
Frame jumper wire assembly and patch packaging structure using same Download PDFInfo
- Publication number
- CN215955272U CN215955272U CN202122329455.6U CN202122329455U CN215955272U CN 215955272 U CN215955272 U CN 215955272U CN 202122329455 U CN202122329455 U CN 202122329455U CN 215955272 U CN215955272 U CN 215955272U
- Authority
- CN
- China
- Prior art keywords
- jumper
- connecting piece
- patch
- welding
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model provides a frame jumper assembly and a patch packaging structure using the same, wherein the frame jumper assembly is used for connecting a patch; the device comprises a first connecting sheet and a jumper wire; the first connecting piece sets up at the paster side, and first connecting piece one end is along keeping away from the paster direction extension. The jumper is of a sheet structure, the jumper is arranged above the patch, the bottom surface of the jumper is connected with the top end of the patch, and one end of the jumper is connected with the other end of the first connecting piece; the first connecting piece is provided with a positioning groove, one end of the jumper wire is contained in the positioning groove, and the positioning groove is used for limiting the position of one end of the jumper wire. In the frame jumper wire assembly and the patch packaging structure using the same, the frame jumper wire assembly assembles the jumper wire and the first connecting sheet to form a packaging body, so that the adaptability of the packaging frame structure is improved; the clamping structure of the jumper and the first connecting piece is optimized, the structure of the jumper frame is optimized, and the assembly convenience and the assembly precision of the jumper frame are improved.
Description
Technical Field
The utility model relates to the field of chip diode packaging, in particular to a frame jumper assembly and a chip packaging structure using the same.
Background
With the development of the semiconductor industry and the rise of mobile communication devices, the integration of chip memory technology is becoming the standard of high-end products.
At present, the packaging frame of the chip is a two-piece packaging body, and in the process of packaging a chip body, the packaging bodies stacked up and down need to be calibrated and positioned, so that the chip is inconvenient to assemble and small in applicability. Therefore, it is desirable to provide a frame jumper assembly and a patch package structure using the same to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a frame jumper assembly and a patch packaging structure using the same, and aims to solve the problems that a packaging frame of a patch chip in the prior art is inconvenient to assemble and small in applicability.
In order to solve the technical problems, the technical scheme of the utility model is as follows: a frame jumper assembly for connecting patches; it includes:
the top surface of one end of the second connecting sheet is connected with the bottom end of the patch, and the other end of the second connecting sheet is far away from the patch;
the first connecting piece is arranged on the side edge of the patch, and one end of the first connecting piece extends in the direction away from the first connecting piece; and
the jumper wire is arranged above the second connecting sheet, the bottom surface of the jumper wire is connected with the top end of the patch, and one end of the jumper wire is connected with the other end of the first connecting sheet;
the first connecting piece is provided with a positioning groove, one end of the jumper wire is contained in the positioning groove, and the positioning groove is used for limiting the position of one end of the jumper wire.
In the present invention, the jumper wire includes:
the bottom surface of the first fixing part is welded with the top end of the patch;
the first welding part is positioned on the side edge of the patch, the plane of the first welding part is flush with the plane of the first fixing part, the bottom surface of the first welding part is welded with the other end of the first connecting sheet, and the positioning hole is formed in the first welding part; and
the second bent part is arranged in the middle of the jumper wire, and one end of the first fixing part is connected with the first welding part through the second bent part.
In the utility model, the second bending part is provided with a first deformation hole.
In the present invention, a first welding projection is provided on a bottom surface of the first fixing portion.
In the present invention, the first connecting piece includes:
the first extending part is arranged at one end of the first connecting piece and extends away from the first connecting piece;
the second welding part is arranged at the other end of the first connecting piece and is welded with the bottom surface of the first welding part, the plane where the second welding part is located is parallel to the plane where the first welding part is located, and the positioning groove is formed in the top surface of the second welding part; and
the first bending part connects the first extending part with the first welding part.
According to the utility model, two sides of the first welding part are connected with limiting convex strips, and the positioning groove is formed between the limiting convex strips and the plane where the top end of the second welding part is located.
In the present invention, the second connecting piece includes:
the second fixing part is positioned at one end of the second connecting sheet and is welded with the bottom end of the patch;
the second extending part is positioned at the other end of the second connecting sheet, and the second extending part are oppositely arranged relative to the patch; and
and the second bending part is positioned in the middle of the second connecting piece and connects the second fixing part with the second extending part.
In the utility model, the top surface of the second fixing part is provided with a second welding convex part. The second welding convex part is positioned at the center of the top surface of the second fixing part, thereby promoting
The present invention also provides a chip packaging structure, which includes:
the bottom ends of two sides of the black rubber shell are provided with through holes;
the patch body is arranged in the black rubber shell; and
according to the frame jumper assembly, the top surface of one end of the second connecting sheet in the frame jumper assembly is connected with the bottom end of the patch body, and the other end of the second connecting sheet penetrates through one side of the black rubber shell and extends;
the bottom surface of a jumper wire in the frame jumper wire assembly is welded with the top end of the patch body, one end of a first connecting piece is welded with the jumper wire, and the other end of the first connecting piece penetrates through the other side of the black rubber shell and extends.
Further, along the vertical direction, the width of the section of the black rubber shell close to the top surface is gradually reduced.
Compared with the prior art, the utility model has the beneficial effects that: in the frame jumper wire assembly and the patch packaging structure using the same, the frame jumper wire assembly assembles the jumper wire and the first connecting sheet to form a packaging body, so that the adaptability of the packaging frame structure is improved; the clamping structure of the jumper and the first connecting piece is optimized, the structure of the jumper frame is optimized, and the assembly convenience and the assembly precision of the jumper frame are improved.
The position for clamping the jumper wire is limited on the first connecting sheet, and the jumper wire can be effectively prevented from moving or rotating relative to the frame structure; the gap of jumper wire assembly is also proper, and the jumper wire assembly guide device has a guide function and is convenient for automatic assembly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.
Fig. 1 is a schematic structural diagram of a preferred embodiment of the frame jumper assembly of the present invention.
Fig. 2 is an exploded view of a preferred embodiment of the frame jumper assembly of the present invention.
Fig. 3 is a top exploded view of a preferred embodiment of the frame jumper assembly of the present invention.
Fig. 4 is a side view of the structure of fig. 2.
Fig. 5 is a bottom view of a jumper structure of a preferred embodiment of the frame jumper assembly of the present invention.
Fig. 6 is a side view of a preferred embodiment of the patch package structure of the present invention.
Fig. 7 is a schematic view of the internal structure of the preferred embodiment of the patch package structure of the present invention.
Fig. 8 is a side view of a frame jumper assembly of a preferred embodiment of the patch package structure of the present invention.
Fig. 9 is a top view of a frame jumper assembly of a preferred embodiment of the patch package structure of the present invention.
Frame jumper assembly reference numerals: the wire jumper 11, the first fixing portion 111, the first welding protrusion 111a, the first bending portion 112, the first deformation hole 112a, the first welding portion 113, the first connecting piece 12, the second welding portion 121, the positioning groove 121a, the limiting convex strip 121b, the second bending portion 122, the first extending portion 123, and the first solder 14.
The patch package structure is numbered: the frame jumper assembly 2, the jumper wire 21, the first fixing portion 211, the first welding protrusion 211a, the first bending portion 212, the first deformation hole 212a, the first welding portion 213, the first connecting piece 22, the second welding portion 221, the positioning groove 221a, the limiting convex strip 221b, the second bending portion 222, the first extending portion 223, the first solder 24, the black glue shell 3, the chip body 4, the second connecting piece 5, the second fixing portion 51, the second welding protrusion 51a, the third bending portion 52, and the second extending portion 53.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The terms "first," "second," and the like in the terms of the utility model are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.
Referring to fig. 1, 2, 3, 4 and 5, fig. 1 is a schematic structural diagram of a preferred embodiment of the frame jumper assembly of the present invention, and fig. 2 is an exploded view of the preferred embodiment of the frame jumper assembly of the present invention. Fig. 3 is a top exploded view of a preferred embodiment of the frame jumper assembly of the present invention. Fig. 4 is a side view of the structure of fig. 2. Fig. 5 is a bottom view of a jumper structure of a preferred embodiment of the frame jumper assembly of the present invention.
The following is a preferred embodiment of the frame jumper assembly and the patch package structure using the same according to the present invention, which can solve the above technical problems.
The frame jumper assembly provided by the utility model is used for connecting a patch; it comprises a first connecting sheet 12 and a jumper 11; the first connecting piece 12 is arranged at the side of the patch, and one end of the first connecting piece 12 extends along the direction away from the patch. The jumper wire 11 is of a sheet structure, the jumper wire 11 is arranged above the patch, the bottom surface of the jumper wire 11 is connected with the top end of the patch, and one end of the jumper wire 11 is connected with the other end of the first connecting piece 12; the first connecting piece 12 is provided with a positioning groove 121a, one end of the jumper wire 11 is received in the positioning groove 121a, and the positioning groove 121a is used for limiting the position of one end of the jumper wire 11.
The utility model optimizes the clamping structure of the jumper wire 11 and the first connecting piece 12, limits the clamping position of the jumper wire 11 on the first connecting piece 12, and can effectively prevent the jumper wire 11 from moving or rotating relative to the frame structure. Meanwhile, the gap for assembling the jumper wire 11 is appropriate, and the jumper wire has a guiding function, so that the automatic assembling is facilitated.
The structure of the jumper wire 11 in the present invention is explained in detail as follows:
in the present invention, it is preferable that the jumper wire 11 and the first connection piece 12 are soldered by the first solder 14; and the stability of the frame jumper 11 assembly connecting structure is improved.
Further, the jumper wire 11 includes a first fixing portion 111, a first welding portion 113 and a first bending portion 112; wherein the bottom surface of the first fixing portion 111 is welded to the top end of the patch; the first welding portion 113 is located at the side of the patch, the plane of the first welding portion 113 is flush with the plane of the first fixing portion 111, and the bottom surface of the first welding portion 113 is welded to the other end of the first connecting plate 12. The first bending portion 112 is disposed in the middle of the jumper wire 11, and one end of the first fixing portion 111 is connected to the first welding portion 113 through the first bending portion 112. The first bending part 112 is arranged in the structure of the jumper wire 11, so that the stress resistance of the jumper wire 11 is improved.
In this embodiment, the first bending portion 112 is provided with a first deformation hole 112a for relieving the stress of the bending portion and improving the stability of the structure in the using process. In addition, the first welding convex part 111a is arranged on the bottom surface of the first fixing part 111, so that the stability of welding the jumper wire 11 and the chip is improved.
The structure of the first connecting piece 12 in the present invention is explained in detail as follows:
in the present invention, the first connecting piece 12 includes a first extending portion 123, a second welding portion 121 and a second bending portion 122; the first extending portion 123 is disposed at one end of the first connecting piece 12, and the first extending portion 123 extends in a direction away from the first connecting piece 12; the second welding part 121 is arranged at the other end of the first connecting piece 12, the second welding part 121 is welded with the bottom surface of the first welding part 113, the plane of the second welding part 121 is arranged in parallel with the plane of the second welding part 121, and the positioning groove 121a is arranged on the top surface of the first welding part 113; the second bending portion 122 connects the first extending portion 123 and the first soldering portion 113. The first welding part 113 is a sheet structure, which improves the stability of the welding connection between the first connection piece 12 and the jumper 11.
In this embodiment, two sides of the first welding portion 121 are connected with a limiting protruding strip 121b, a positioning groove 121a is formed between the limiting protruding strip 121b and the plane of the top end of the first welding portion 113, and the positioning grooves 121a formed by the two oppositely arranged limiting protruding strips 121b are suitable for the jumper wire 11 structure with multiple sizes. The positioning groove 121a in this embodiment is gradually increased in width along the vertical direction, which facilitates the guiding assembly of the jumper wire 11.
In addition, the two limiting convex strips 121b in this embodiment extend upward, and after the jumper wire 11 is welded and fixed to the first connecting piece 12, the stability of connection between the jumper wire 11 and the first connecting piece 12 can be further improved by bending the limiting convex strips 121 b.
In the utility model, the first connecting piece 12 may be configured such that the width of the first extending portion 123 is smaller than the width of the first welding portion 113, and the width of the second bending portion 122 at the end away from the first welding portion 113 is gradually reduced; this structure facilitates the guide fitting of the first connecting piece 12.
Referring to fig. 6, 7, 8 and 9, fig. 6 is a side view of a preferred embodiment of the chip packaging structure of the present invention. Fig. 7 is a schematic view of the internal structure of the preferred embodiment of the patch package structure of the present invention. Fig. 8 is a side view of a frame jumper assembly of a preferred embodiment of the patch package structure of the present invention. Fig. 9 is a top view of a frame jumper assembly of a preferred embodiment of the patch package structure of the present invention.
The utility model also provides a patch packaging structure, which comprises a black glue shell 3, a patch body 4, a second connecting sheet 5 and a frame jumper assembly 2; wherein, the frame jumper assembly 2 is as set forth in the above embodiment; the bottom ends of the two sides of the black rubber shell 3 in the embodiment are provided with through holes. The patch body 4 is arranged in the black rubber shell 3; the top surface of one end of the second connecting sheet 5 is connected with the bottom end of the paster body 4; the other end of the second connecting sheet 5 penetrates through one side of the black rubber shell 3 and extends for connecting other circuit elements. The bottom surface of a jumper wire 21 in the frame jumper assembly is welded with the top end of the patch body 4, one end of a first connecting sheet 22 is welded with the jumper wire 21, the other end of the first connecting sheet 22 penetrates through the other side of the black rubber shell 3 and extends, and the other end of the first connecting sheet 22 is used for connecting other circuit elements.
Preferably, the jumper wire 21 and the first connecting piece 22 in the embodiment are welded by the first solder 24; and the stability of the frame jumper assembly connecting structure is improved. The patch body 4, the jumper wire 21 and the second connecting sheet 5 are soldered by a second solder.
Further, the width of the section of the black rubber shell 3 close to the top surface is gradually reduced along the vertical direction. The compactness of the patch packaging structure is improved, the structure occupies small space, and the patch packaging structure is convenient to put into use.
The patch package structure in this embodiment is explained in detail as follows:
the jumper wire 21 in this embodiment includes a first fixing portion 211, a first welding portion 213, and a first bending portion 212; wherein the bottom surface of the first fixing portion 211 is welded to the top end of the patch; the first welding portion 213 is located at the side of the patch, the plane of the first welding portion 213 is flush with the plane of the first fixing portion 211, and the bottom surface of the first welding portion 213 is welded to the other end of the first connecting plate 22. The first bending portion 212 is disposed in the middle of the patch cord 21, and one end of the first fixing portion 211 is connected to the first welding portion 213 through the first bending portion 212. The first bending part 212 is arranged in the structure of the jumper wire 21, so that the stress resistance of the jumper wire 21 is improved.
Further, the first bending portion 212 is provided with a first deformation hole 222a for relieving stress at the bending portion, so as to improve stability of the structure in the using process. In the utility model, the first welding convex part 211a is arranged on the bottom surface of the first fixing part 211, so that the stability of welding the jumper wire 21 and the chip is improved.
The first connecting piece 22 in this embodiment includes a first extending portion 223, a second welding portion 221, and a second bending portion 222; wherein the first extension 223 is disposed at one end of the first connecting piece 22, and the first extension 223 extends in a direction away from the first connecting piece 22; the second welding part 221 is arranged at the other end of the first connecting piece 22, the second welding part 221 is welded with the bottom surface of the first welding part 213, the plane of the second welding part 221 is arranged in parallel with the plane of the second welding part 221, and the positioning groove 221a is arranged on the top surface of the first welding part 213; the second bending portion 222 connects the first extending portion 223 and the first welding portion 213. The first welding portion 213 is a sheet-shaped structure, which improves the stability of the first connection piece 22 and the jumper welding connection.
In this embodiment, the two sides of the first welding portion 213 are connected with the limiting protruding strips 221b, the positioning grooves 221a are formed between the limiting protruding strips 221b and the plane of the top end of the first welding portion 213, and the positioning grooves 221a formed by the two oppositely arranged limiting protruding strips 221b are suitable for the jumper wire 21 structure with multiple sizes. In this embodiment, the two limit protruding strips 221b extend upward, and after the jumper wire 21 is welded and fixed to the first connection piece 22, the stability of connection between the jumper wire 21 and the first connection piece 22 can be further improved by bending the limit protruding strips 221 b.
In the present invention, the first connecting piece 22 may be configured such that the width of the first extending portion 223 is smaller than the width of the first welding portion 213, and the width of the second bending portion 222 at the end away from the first welding portion 213 is gradually reduced; this structure facilitates the guide fitting of the first connecting piece 22.
In this embodiment, the second connecting piece 5 includes a second fixing portion 51, a second extending portion 53 and a third bending portion 52; the second fixing part 51 is positioned at one end of the second connecting sheet 5, and the second fixing part 51 is welded with the bottom end of the chip body 4 through a second solder; the second extension part 53 is positioned at the other end of the second connecting sheet 5, and the positions of the second extension part 53 and the second extension part 53 are opposite to each other relative to the patch; the third bending portion 52 is located in the middle of the second connecting piece 5, and the second fixing portion 51 and the second extending portion 53 are connected by the third bending portion 52.
Further, the second fixing portion 51 of the present invention is provided with a second welding projection 51a on the top surface. The second welding projection 51a is located at the center of the top surface of the second fixing portion 51, which improves the stability of welding the second connecting piece 5 with the patch.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A frame jumper assembly for connecting patches; it is characterized by comprising:
the first connecting piece is arranged on the side edge of the patch, and one end of the first connecting piece extends in the direction far away from the patch; and
the jumper wire is of a sheet structure, the bottom surface of the jumper wire is connected with the top end of the patch, and one end of the jumper wire is connected with the top end of the first connecting piece;
the first connecting piece is provided with a positioning groove, one end of the jumper wire is contained in the positioning groove, and the positioning groove is used for limiting the position of one end of the jumper wire.
2. The frame jumper assembly of claim 1, wherein the jumper includes
The bottom surface of the first fixing part is welded with the top end of the patch;
the first welding part is positioned on the side edge of the patch, the plane of the first welding part is flush with the plane of the first fixing part, and the bottom surface of the first welding part is welded with the other end of the first connecting piece; and
the first bent part is arranged in the middle of the jumper wire, and one end of the first fixing part is connected with the first welding part through the first bent part.
3. The frame jumper assembly of claim 2, wherein the first bend is provided with a first deformation hole.
4. The frame jumper assembly of claim 3, wherein the first fixing portion bottom surface is provided with a first welding projection.
5. The frame jumper assembly of claim 4, wherein the first connection tab includes:
the first extending part is arranged at one end of the first connecting piece and extends away from the first connecting piece;
the second welding part is arranged at the other end of the first connecting piece and is welded with the bottom surface of the first welding part, the plane where the second welding part is located is parallel to the plane where the first welding part is located, and the positioning groove is formed in the top surface of the second welding part; and
and the second bending part is used for connecting the first extending part with the second welding part.
6. The frame jumper assembly of claim 5, wherein limiting ribs are connected to two sides of the first welding portion, and the positioning grooves are formed between the limiting ribs and a plane where the top end of the second welding portion is located.
7. A chip package structure, comprising:
the bottom ends of two sides of the black rubber shell are provided with through holes;
the patch body is arranged in the black rubber shell; and
the frame jumper assembly of any one of claims 1-6, wherein the bottom surface of the jumper is welded to the top end of the patch body, and the first connecting piece has one end welded to the jumper and the other end extending through the other side of the black glue shell.
8. A patch package structure according to claim 7, wherein the cross-sectional width of the black matrix casing near the top surface is gradually reduced along the vertical direction.
9. A patch package structure as claimed in claim 7, further comprising a second connecting piece, wherein the top surface of one end of the second connecting piece is connected with the bottom end of the patch body, and the other end of the second connecting piece penetrates one side of the black rubber shell and extends;
the second connecting piece includes:
the second fixing part is positioned at one end of the second connecting sheet and is welded with the bottom end of the patch;
the second extending part is positioned at the other end of the second connecting sheet, and the second extending part are oppositely arranged relative to the patch; and
and the second bending part is positioned in the middle of the second connecting piece and connects the second fixing part with the second extending part.
10. A chip package structure according to claim 9, wherein the second fixing portion is provided with a second solder bump on a top surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122329455.6U CN215955272U (en) | 2021-09-24 | 2021-09-24 | Frame jumper wire assembly and patch packaging structure using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122329455.6U CN215955272U (en) | 2021-09-24 | 2021-09-24 | Frame jumper wire assembly and patch packaging structure using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215955272U true CN215955272U (en) | 2022-03-04 |
Family
ID=80427878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122329455.6U Active CN215955272U (en) | 2021-09-24 | 2021-09-24 | Frame jumper wire assembly and patch packaging structure using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215955272U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116936515A (en) * | 2023-07-28 | 2023-10-24 | 杭州道铭微电子有限公司 | Bypass diode structure and bypass diode |
-
2021
- 2021-09-24 CN CN202122329455.6U patent/CN215955272U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116936515A (en) * | 2023-07-28 | 2023-10-24 | 杭州道铭微电子有限公司 | Bypass diode structure and bypass diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6083059A (en) | Structure of a terminal | |
| CN109103646B (en) | Electrical connector | |
| CN215955272U (en) | Frame jumper wire assembly and patch packaging structure using same | |
| US9350091B2 (en) | Electrical connector and conductive terminal thereof | |
| US7484985B2 (en) | Socket connector terminals | |
| WO2018049561A1 (en) | Battery | |
| US7086904B1 (en) | Card connector | |
| CN206461121U (en) | Electric connector | |
| CN210168222U (en) | Loudspeaker box | |
| US8899997B2 (en) | Electrical connector with solder ball positioned in an insulative housing accurately | |
| CN108110451B (en) | Electrical connector | |
| CN112467438A (en) | Electrical connector | |
| WO2005098945A2 (en) | Top finger having a groove and semiconductor device having the same | |
| US20140287604A1 (en) | Terminal, terminal module and method of manufacuring the terminal module | |
| US7074055B2 (en) | Electrical contact | |
| WO2021248894A1 (en) | Socket strengthener, board-to-board socket, and board-to-board connector assembly | |
| TWI403231B (en) | Surface-mounted circuit board module and fabrication method thereof | |
| WO2022242670A1 (en) | Circuit board structure and electronic apparatus | |
| JP4241575B2 (en) | Small antenna | |
| CN216354185U (en) | Independent frame and chip packaging structure using same | |
| CN202103219U (en) | Electrical connector | |
| CN209805024U (en) | Circuit board connecting terminal and data connecting line | |
| CN208284645U (en) | A kind of flexible terminal | |
| CN111540724A (en) | Base frame, signal transmission plate and related chip packaging method and semiconductor packaging chip | |
| CN212626140U (en) | Elastic sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |