CN216250707U - Semiconductor component easy to dissipate heat - Google Patents
Semiconductor component easy to dissipate heat Download PDFInfo
- Publication number
- CN216250707U CN216250707U CN202122191193.1U CN202122191193U CN216250707U CN 216250707 U CN216250707 U CN 216250707U CN 202122191193 U CN202122191193 U CN 202122191193U CN 216250707 U CN216250707 U CN 216250707U
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- cavity
- semiconductor component
- rectangular
- heat
- sheet
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 239000004519 grease Substances 0.000 claims abstract description 18
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 18
- 238000000926 separation method Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 description 11
- 238000003780 insertion Methods 0.000 description 11
- 230000000903 blocking effect Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of semiconductors, and particularly relates to an easily-radiating semiconductor component, which comprises a shell and a PN junction, wherein a cavity and a U-shaped cavity are formed in the shell, the cavity is positioned on the inner side below the U-shaped cavity, the U-shaped cavity is in a U shape which is inverted from top to bottom, and the upper end of the U-shaped cavity penetrates out of the upper end of the shell and is embedded with a rectangular sheet; open the gag so that add heat conduction silicone grease to U die cavity inside, come the heat absorption to the PN junction through heat conduction silicone grease, rectangular piece on the one hand can seal heat conduction silicone grease inside the U die cavity, and rectangular piece on the other hand can support the fin, and the produced heat of PN junction that can be convenient for is given dispersing away with end through-hole cooperation use to the side through-hole, has solved current semiconductor components and parts radiating problem of not being convenient for.
Description
Technical Field
The utility model belongs to the technical field of semiconductors, and particularly relates to a semiconductor component easy to dissipate heat.
Background
A semiconductor device is an electronic device having electrical conductivity between a good electrical conductor and an insulator and performing a specific function by utilizing the specific electrical characteristics of a semiconductor material, functions to generate, control, receive, convert, amplify a signal and perform energy conversion, and is one of the conventional components of an electronic circuit.
At present, the existing semiconductor components lack corresponding heat dissipation structures, the temperature rises along with the increase of the working time of the PN junction in the semiconductor components, the stability of the semiconductor components can be influenced due to overhigh temperature, and the requirements can not be met far away only by means of natural heat dissipation of the semiconductor components.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art, provides the semiconductor component easy to dissipate heat and solves the problem that the conventional semiconductor component is inconvenient to dissipate heat.
The technical scheme adopted by the utility model for solving the technical problems is as follows: an easy-heat-dissipation semiconductor component comprises a shell and a PN junction;
a cavity and a U-shaped cavity are formed in the shell, the cavity is positioned on the inner side below the U-shaped cavity, the U-shaped cavity is in a U shape with the upside down, and the upper end of the U-shaped cavity penetrates through the upper end of the shell and is embedded with a rectangular sheet;
the upper end of the rectangular sheet is provided with a concave cavity, the bottom of the concave cavity is provided with a plurality of bottom through holes which are uniformly arranged, the front end and the rear end in the concave cavity are provided with a plurality of side through holes which are distributed left and right, and mesh sheets are bonded at the lower ends of the rectangular sheet and below the bottom through holes;
every bottom through-hole inside all is provided with awl fill and toper separation blade, the toper separation blade is located awl fill top, every the circular hole has all been opened to awl fill bottom, all be fixed with a pair of connecting piece that is left right distribution between awl fill and the toper separation blade.
In a preferred technical scheme of the utility model, the PN junction is arranged in the cavity, the lower end of the shell is provided with a bottom cover, the lower end of the bottom cover is provided with a plurality of pins which are distributed left and right, and the upper end of each pin penetrates through the cavity and is integrally formed with the PN junction.
In a preferred technical scheme of the utility model, the side through holes at the front end and the rear end respectively penetrate through the front end and the rear end of the rectangular sheet, the lower end of each bottom through hole penetrates through the lower end of the rectangular sheet, and the rectangular sheet is communicated with the inside of the U-shaped cavity.
In a preferred technical scheme of the present invention, the circular hole is located between two adjacent connecting members, the outer portion of each conical hopper is fixedly connected to the inner wall of the corresponding bottom through hole, the distance between each conical hopper and the corresponding conical blocking piece is two to six millimeters, each conical hopper is in a V shape, and each conical blocking piece is in a V shape with the upside down.
In a preferred technical scheme of the utility model, the front end of the shell is provided with a plurality of insertion rods distributed left and right, the rear end of each insertion rod sequentially penetrates into the U-shaped cavity and the rectangular sheet and is inserted into the U-shaped cavity and the rectangular sheet, and the insertion rods are positioned between two adjacent bottom through holes.
In a preferred technical scheme of the utility model, through grooves are formed in the upper end of the shell and positioned on the left side and the right side of the rectangular sheet, the lower parts of the two through grooves extend into and are communicated with the U-shaped cavity, plug covers are embedded in the upper parts of the two through grooves, and heat-conducting silicone grease is filled in the U-shaped cavity.
In a preferred technical scheme of the utility model, the rectangular sheet is provided with a radiating fin above the cavity, the left side and the right side of the lower end of the radiating fin are respectively fixed with an inserting sheet, the inserting sheets are positioned on the left side and the right side of the cavity, and the lower end of the inserting sheet is inserted with the upper end of the rectangular sheet.
Compared with the prior art, the utility model has the following beneficial effects: open the gag so that add heat conduction silicone grease to U die cavity inside, come to absorb the heat to the PN junction through heat conduction silicone grease, so that heat conduction dissipates away to the fin, the plunger can be convenient for stabilize the rectangular piece in U die cavity, the rectangular piece can be sealed inside the U die cavity with heat conduction silicone grease on the one hand, rectangular piece on the other hand can support the fin, the produced heat of PN junction can be convenient for with end through-hole cooperation use and give and disperse away, the awl is fought and the cooperation of toper separation blade is used and can be prevented that heat conduction silicone grease from end through-hole and spill over, the fin can accelerate the heat effluvium simultaneously.
Drawings
FIG. 1 is a schematic view of the overall external structure of the present invention;
FIG. 2 is an enlarged view of a portion of structure A of the present invention;
FIG. 3 is an enlarged view of a portion of structure B of the present invention;
FIG. 4 is an exploded view of the overall structure of the present invention;
fig. 5 is an assembly view of the overall structure of the present invention.
In the figure: 1-shell, 2-bottom cover, 3-stitch, 4-PN junction, 5-U cavity, 6-through groove, 7-plug cover, 8-radiating fin, 9-cavity, 10-cavity, 11-side through hole, 12-rectangular sheet, 13-bottom through hole, 14-plunger, 15-cone bucket, 16-cone baffle, 17-round hole, 18-connecting piece, 19-plug sheet and 20-mesh sheet.
Detailed Description
Referring to fig. 1-5, the present invention provides a technical solution: a semiconductor component easy to dissipate heat comprises a shell 1 and a PN junction 4;
a cavity 9 and a U-shaped cavity 5 are formed in the shell 1, the cavity 9 is positioned on the inner side below the U-shaped cavity 5, the U-shaped cavity 5 is in a U shape which is inverted upside down, and the upper end of the U-shaped cavity 5 penetrates through the upper end of the shell 1 and is embedded with a rectangular sheet 12;
the upper end of the rectangular sheet 12 is provided with a concave cavity 10, the bottom of the concave cavity 10 is provided with a plurality of bottom through holes 13 which are uniformly arranged, the front end and the rear end of the interior of the concave cavity 10 are provided with a plurality of side through holes 11 which are distributed left and right, and a mesh sheet 20 is bonded at the lower end of the rectangular sheet 12 and below the bottom through holes 13;
a conical hopper 15 and a conical blocking piece 16 are arranged in each bottom through hole 13, the conical blocking piece 16 is positioned above the conical hopper 15, a round hole 17 is formed in the bottom of each conical hopper 15, and a pair of connecting pieces 18 which are distributed left and right are fixed between the conical hopper 15 and the conical blocking piece 16;
the PN junction 4 is arranged in the cavity 9, the lower end of the shell 1 is provided with the bottom cover 2, the lower end of the bottom cover 2 is provided with a plurality of pins 3 which are distributed left and right, and the upper end of each pin 3 penetrates through the cavity 9 and is integrally formed with the PN junction 4;
the side through holes 11 at the front end and the rear end respectively penetrate through the front end and the rear end of a rectangular plate 12, the lower end of each bottom through hole 13 penetrates through the lower end of the rectangular plate 12, the rectangular plate 12 is communicated with the inside of a U-shaped cavity 5, the front end of a shell 1 is provided with a plurality of insertion rods 14 distributed left and right, the rear end of each insertion rod 14 sequentially penetrates through the inside of the U-shaped cavity 5 and the rectangular plate 12 and is inserted with the insertion rods 14, the insertion rods 14 are positioned between two adjacent bottom through holes 13, when the shell is filled for the first time, the insertion rods 14 are pulled out to open the U-shaped cavity 5, the inside of the U-shaped cavity 5 is filled with heat-conducting silicone grease, the heat-conducting silicone grease is injected into the U-shaped cavity 5 to cover the rectangular plate 12 and insert the insertion rods 14, so that the insertion rods 14 penetrate through the rectangular plate 12, the insertion rods 14 can conveniently fix the rectangular plate 12 in the U-shaped cavity 5, the rectangular plate 12 is positioned above the cavity 10, the cooling fins 8 are arranged at the left side and the right side of the lower end of the cooling fins 8, the inserting pieces 19 are positioned on the left side and the right side of the cavity 10, the lower ends of the inserting pieces 19 are inserted into the upper ends of the rectangular pieces 12, so that the heat radiating fins 8 are stably installed, the rectangular pieces 12 can seal heat-conducting silicone grease in the U-shaped cavities 5 on one hand, and the rectangular pieces 12 can support the heat radiating fins 8 on the other hand;
the heat emitted by the PN junction 4 can be dissipated to the surface of the shell 1 and the surface of the rectangular sheet 12, so that the heat can be absorbed by the heat-conducting silicone grease, so that the heat can be conducted to the radiating fins 8 to be dissipated, the round hole 17 is positioned between two adjacent connecting pieces 18, the outer part of each conical hopper 15 is respectively fixedly connected with the inner wall of the corresponding bottom through hole 13, the distance between each conical hopper 15 and each conical baffle 16 is two to six millimeters, each conical hopper 15 is in a V shape, each conical baffle 16 is in a V shape which is inverted from top to bottom, each conical hopper 15 is matched with each conical baffle 16, the shapes of each conical baffle 16 and each conical hopper 15 are just opposite from top to bottom, the heat-conducting silicone grease can be prevented from overflowing from the bottom through holes 13, the side through holes 11 and the bottom through holes 13 are matched for use, the residual heat can be dissipated out through the bottom through holes 13, the round holes 17 and the side through holes 11 in sequence, so that the heat generated by the PN junction 4 can be dissipated from the through holes 11, meanwhile, the radiating fins 8 can accelerate heat dissipation, so that heat dissipation is more thorough;
the two sides all opened logical groove 6 about 1 upper end of casing just is located rectangular piece 12, two lead to 6 lower parts and all extend to U die cavity 5 inside and communicate with each other with it, two lead to 6 upper portions of groove and all inlay gag 7, open gag 7 and can follow logical groove 6 inside and pour into heat conduction silicone grease into, heat conduction silicone grease enters into U die cavity 5 inside along leading to groove 6, so that the later stage adds heat conduction silicone grease to U die cavity 5 inside, thereby need not to extract the inserted bar 14 once more and open rectangular piece 12 and come to supply heat conduction silicone grease to U die cavity 5 inside.
Claims (7)
1. The utility model provides an easy heat dissipation semiconductor components and parts, includes casing (1) and PN junction (4), its characterized in that:
a cavity (9) and a U-shaped cavity (5) are formed in the shell (1), the cavity (9) is located on the inner side below the U-shaped cavity (5), the U-shaped cavity (5) is inverted up and down, and the upper end of the U-shaped cavity (5) penetrates out of the upper end of the shell (1) and is embedded with a rectangular sheet (12);
a concave cavity (10) is formed in the upper end of the rectangular sheet (12), a plurality of bottom through holes (13) which are uniformly arranged are formed in the bottom of the concave cavity (10), a plurality of side through holes (11) which are distributed left and right are formed in the front end and the rear end of the interior of the concave cavity (10), and a mesh sheet (20) is bonded to the lower end of the rectangular sheet (12) and is positioned below the bottom through holes (13);
every bottom through-hole (13) inside all is provided with awl fill (15) and toper separation blade (16), toper separation blade (16) are located awl fill (15) top, and every awl fill (15) bottom has all opened round hole (17), all be fixed with a pair of connecting piece (18) that are left right side distribution between awl fill (15) and toper separation blade (16).
2. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: PN knot (4) are installed inside cavity (9), bottom (2) are installed to casing (1) lower extreme, stitch (3) that a plurality of roots are left right distribution are installed to bottom (2) lower extreme, every stitch (3) upper end all runs through to inside and with PN knot (4) integrated into one piece of cavity (9).
3. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: the side through holes (11) at the front end and the rear end respectively penetrate through the front end and the rear end of the rectangular sheet (12), the lower end of each bottom through hole (13) penetrates through the lower end of the rectangular sheet (12), and the rectangular sheet (12) is communicated with the inside of the U-shaped cavity (5).
4. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: the round hole (17) is positioned between two adjacent connecting pieces (18), the outer part of each conical hopper (15) is fixedly connected with the inner wall of the corresponding bottom through hole (13), the distance between each conical hopper (15) and each conical separation blade (16) is two to six millimeters, each conical hopper (15) is V-shaped, and each conical separation blade (16) is V-shaped with the upper part reversed.
5. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: the utility model discloses a casing, including casing (1), casing (1) front end, every be a plurality of inserted bars (14) that distribute about being, inserted bar (14) rear end runs through in proper order to U die cavity (5) and rectangular piece (12) inside and peg graft rather than, inserted bar (14) are located adjacent two between end through-hole (13).
6. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: casing (1) upper end just is located cuboid piece (12) and all opens logical groove (6) about both sides, two it all extends to U die cavity (5) inside and communicates with each other rather than leading to groove (6) lower part, two it has gag (7) all to inlay on leading to groove (6) upper portion, U die cavity (5) inside packing has heat conduction silicone grease.
7. An easily heat-dissipating semiconductor component as claimed in claim 1, wherein: rectangular piece (12) just are located cavity (10) top and are provided with fin (8), fin (8) lower extreme left and right sides all is fixed with inserted sheet (19), both sides about inserted sheet (19) are located cavity (10), inserted sheet (19) lower extreme is pegged graft with rectangular piece (12) upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122191193.1U CN216250707U (en) | 2021-09-10 | 2021-09-10 | Semiconductor component easy to dissipate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122191193.1U CN216250707U (en) | 2021-09-10 | 2021-09-10 | Semiconductor component easy to dissipate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216250707U true CN216250707U (en) | 2022-04-08 |
Family
ID=80986089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122191193.1U Expired - Fee Related CN216250707U (en) | 2021-09-10 | 2021-09-10 | Semiconductor component easy to dissipate heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216250707U (en) |
-
2021
- 2021-09-10 CN CN202122191193.1U patent/CN216250707U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220823 Address after: 7-30, Precision Manufacturing Industrial Park, Anfeng Town, Dongtai City, Yancheng City, Jiangsu Province, 224000 Patentee after: Yancheng Dongtai Amphenol Safety Technology Development Co.,Ltd. Address before: 717406 tanjiaying Management Committee, Ansai County, Yan'an City, Shaanxi Province Patentee before: Tan Jingjing |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220408 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |