CN216243635U

CN216243635U - Decorating lamp

Info

Publication number: CN216243635U
Application number: CN202123062887.1U
Authority: CN
Inventors: 杜鹏
Original assignee: Shenzhen Goym Photoelectric Technology Co ltd
Current assignee: Shenzhen Goym Photoelectric Technology Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-04-08
Anticipated expiration: 2031-12-07

Abstract

The utility model relates to a decorative lamp.A first circuit board and a second circuit board are arranged in an up-and-down superposed manner, so that the second circuit board and the first circuit board occupy the transverse space of a shell as much as possible, the second circuit board and the first circuit board can be conveniently integrated and arranged in the limited space of the shell under the condition of reducing the transverse size of the shell as much as possible, the second circuit board is prevented from being independently arranged outside the shell and is used and installed with the decorative lamp subsequently, and the cost is reduced; the corresponding electric connection end between the first circuit board and the second circuit board is communicated through the through area, and the electric connection between the first circuit board and the second circuit board can be directly realized through the electric connection piece arranged in the through area.

Description

Decorating lamp

Technical Field

The utility model relates to the field of illumination, in particular to a decorative lamp.

Background

To better promote the popularization of LED (Light Emitting Diode) lighting products, manufacturers are beginning to trend to manufacture more standardized lighting products. In some of the push for standardization, to ensure compatibility and interchange between lighting products, a part of product specifications defined by specifications is gradually being formed. However, the size of the light emitting device used in the lighting product affects the size of the final product, and the size of the light emitting device used in the lighting product with higher power is usually larger, for example, for a down lamp or a spot lamp, in order to meet the lighting requirement with higher power without increasing the size, the current practice is to separately arrange the driving circuit of the light emitting device outside the housing and connect the driving circuit with the power supply circuit in the housing through a wire. This just leads to the structure of down lamp or shot-light to be more dispersed, and the installation of being inconvenient, and whole cost is high.

SUMMERY OF THE UTILITY MODEL

In view of the not enough of above-mentioned prior art, the utility model aims to provide a ornament lamp, solve present down lamp or shot-light structure comparison dispersion, the installation of being inconvenient for, whole higher problem that becomes.

In order to solve the above technical problem, an embodiment of the present invention provides a decorative lamp, which is a down lamp or a spotlight, and includes:

the first circuit board is provided with a first circuit and a first electric connection end electrically connected with the first circuit, the first circuit board is provided with a through area penetrating through the front surface and the back surface of the first circuit board, and the first electric connection end is arranged on the front surface of the first circuit board and positioned at the edge of the through area;

the light-emitting component is arranged on the front surface of the first circuit board and is in conductive connection with the first circuit;

the second circuit board is arranged below the first circuit board, and the back surface of the first circuit board is overlapped with the front surface of the second circuit board; the second circuit board is provided with a second circuit and a second electric connecting end electrically connected with the second circuit, and the second electric connecting end is arranged on the front surface of the second circuit board, is positioned below the through area and is communicated with the through area;

and the upper end of the electric connecting piece is electrically connected with the first electric connecting end, and the lower end of the electric connecting piece is electrically connected with the second electric connecting end.

Optionally, the second circuit board is provided with a heat dissipation area penetrating through the front surface and the back surface of the second circuit board, and a part of the back surface of the first circuit board is exposed through the heat dissipation area.

Optionally, the area of the light emitting assembly projected on the second circuit board is located in the heat dissipation area.

Optionally, the decorative lamp further comprises a heat dissipation assembly arranged below the second circuit board, and the heat dissipation assembly is in contact with the back surface of the second circuit board and the exposed back surface area of the first circuit board through the heat dissipation area.

Optionally, the decorative lamp includes two first electrical connection ends, and the two first electrical connection ends are respectively disposed at two opposite sides of the light emitting assembly, or disposed at the same side of the light emitting assembly.

Optionally, the through region has an opening communicating with an edge of the first circuit board, and the first electrical connection end includes a first electrical connection layer distributed along the edge of the through region.

Optionally, the through region is a through hole penetrating through the front surface and the back surface of the first circuit board, and the first electrical connection end includes a second electrical connection layer enclosed along an edge of the through region.

Optionally, the decorative lamp further comprises a lamp cap and a lamp shade which are arranged to enclose the light-emitting assembly, and light emitted by the light-emitting assembly is emitted through the lamp cap and the lamp shade.

Optionally, after the back surface of the first circuit board and the front surface of the second circuit board are overlapped, the upper end of the second electrical connection end penetrates into the through region.

Optionally, the size of the upper end of the second electrical connection end is matched with the through region, and the upper end of the second electrical connection end penetrates into the through region and then is clamped in the through region.

According to the decorative lamp provided by the embodiment, the first circuit board and the second circuit board are arranged in an up-and-down overlapping manner, so that the second circuit board and the first circuit board occupy the transverse space of the shell as small as possible, the second circuit board and the first circuit board can be conveniently integrated and arranged in the limited space of the shell under the condition that the transverse size of the shell is reduced as small as possible, the second circuit board is prevented from being independently arranged outside the shell and is subsequently used and installed with the decorative lamp, and the cost is reduced; the corresponding electric connection end between the first circuit board and the second circuit board is communicated through the through area, and the electric connection between the first circuit board and the second circuit board can be directly realized through the electric connection piece arranged in the through area.

Drawings

Fig. 1 is a top view of a first circuit board according to an embodiment of the utility model;

fig. 2 is a cross-sectional view of a first circuit board according to an embodiment of the utility model;

fig. 3 is a top view of a second circuit board according to an embodiment of the utility model;

fig. 4 is a cross-sectional view of a second circuit board according to an embodiment of the utility model;

fig. 5 is a schematic diagram of a first circuit board and a second circuit board stacked together according to an embodiment of the present invention;

FIG. 6 is a schematic view of an electrical connector filled in a through region according to an embodiment of the present invention;

FIG. 7 is a perspective cross-sectional view of a decorative lamp according to an embodiment of the present invention;

fig. 8 is a schematic diagram of another first circuit board and a second circuit board stacked according to an embodiment of the present invention;

fig. 9 is a top view of another second circuit board according to an embodiment of the utility model;

fig. 10 is a top view of another first circuit board according to an embodiment of the utility model;

fig. 11 is a cross-sectional view of another first circuit board according to an embodiment of the present invention;

fig. 12 is a schematic diagram of a first circuit board and a second circuit board stacked together according to another embodiment of the present invention;

fig. 13 is a schematic view of another electrical connection device filled in the through region according to the embodiment of the utility model.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The present embodiment provides a decorative lamp, which is a spotlight or a down lamp, and an exemplary decorative lamp structure is shown in fig. 1 to 7, which includes:

a first circuit board 11, the first circuit board 11 having a first circuit (not shown in the figure) and a first electrical connection terminal 14 electrically connected to the first circuit, the first circuit board having a through region 13 penetrating through a front surface and a back surface thereof, the first electrical connection terminal 14 being disposed on the front surface of the first circuit board 11 and located at an edge of the through region 13;

a light emitting component 12 arranged on the front surface of the first circuit board 11 and electrically connected with the first circuit; the first circuit in this embodiment may include, but is not limited to, various power circuits for providing power to the light emitting assembly 12;

a second circuit board 21 disposed below the first circuit board 11, wherein the back surface of the first circuit board 11 is overlapped with the front surface of the second circuit board 21; the second circuit board 21 has a second circuit (not shown in the figure), and a second electrical connection terminal 22 electrically connected to the second circuit, the second electrical connection terminal 22 is disposed on the front surface of the second circuit board 21 and located below the through region 13, and is communicated with the through region 13; the second circuit in this embodiment may comprise a driving circuit and/or a control circuit for driving and/or controlling the light emitting assembly 12;

and the electric connecting piece 3 is arranged in the through area 13, the upper end of the electric connecting piece 3 is electrically connected with the first electric connecting end 14, and the lower end of the electric connecting piece 3 is electrically connected with the second electric connecting end 22.

The ornament lamp that this embodiment provided through stack the setting from top to bottom with first circuit board 11 and second circuit board 21 to make it can assemble in the finite space of shell, for the way that current ornament lamp need locate second circuit board 21 outside the shell, the ornament lamp that this embodiment provided has the integrated level height, and is integrative good, assembles convenient and cost advantage lower. In addition, in this embodiment, the first circuit board 11 and the second circuit board 21 stacked up and down are communicated with each other through the through region 13, and the electrical connection between the electrical connection ends can be realized through the electrical connection member 3 directly disposed in the through region 13.

Specifically, referring to fig. 1 to 2, the first circuit board 11 in the embodiment may be rectangular, circular, or elongated, or may be in an irregular shape, and may be flexibly configured according to application requirements. The through regions 13 of the first circuit board 11 correspond to the first electrical connection terminals 14 one by one, and it should be understood that the number of the first electrical connection terminals 14 may be two, and correspond to the positive and negative terminals of the first circuit, respectively, or three, and correspond to the positive, negative and ground terminals of the first circuit, respectively. Of course, more than three can be set according to the requirement, and the description is not repeated here. In this embodiment, the first electrical connection terminal 14 may be disposed along the entire edge of the through region 13, or may be disposed along only a part of the edge of the through region 13. In addition, the first electrical connection terminal 14 in this embodiment can be flexibly formed, for example, it can be directly a conductive area exposed outside the first circuit board 11, or it can be various conductive layers disposed on the first circuit board 11 and electrically connected to the first circuit, and the conductive layers can be, but are not limited to, solder layers, conductive adhesive layers, etc. Accordingly, the first electrical connection terminal 14 in this embodiment may protrude from the front surface of the first circuit board 11, may be flush with the front surface of the first circuit board 11, or may be recessed from the front surface of the first circuit board 11 to the back surface of the first circuit board 11.

In this embodiment, when the number of the first electrical connection terminals 14 disposed on the front surface of the first circuit board 11 includes more than two, each of the first electrical connection terminals 14 may be disposed on the same side of the light emitting element 12, or may be disposed on different sides of the light emitting element 12. For example, referring to fig. 1 to 2, two first electrical connection terminals 14 are disposed on the front surface of the first circuit board 11 and located on different sides of the light emitting assembly 12, and the two first electrical connection terminals 14 are symmetrically disposed on two opposite sides of the light emitting assembly 12.

In the present embodiment, referring to fig. 3 to 4, the second circuit board 21 is provided with a second electrical connection end 22 corresponding to the first electrical connection end 14 and communicating with the first electrical connection end 14 through the through region 13, and the second electrical connection end 22 is located on the front surface of the second circuit board 21 and electrically connected to the second circuit. In this example, the second electrical connection terminal 22 can be formed by a material similar to that of the first electrical connection terminal 14, and thus, the description thereof is omitted.

It should be understood that, referring to fig. 5 to 6, the number and positions of the second electrical connection terminals 22, the first electrical connection terminals 14, and the through regions 13 in this example correspond one to one. After the first circuit board 11 and the second circuit board 21 are stacked up and down, the corresponding first electrical connection end 14 and the second electrical connection end 22 are communicated through the corresponding through area 13, and the electrical connection member 3 is arranged in the through area 13 to electrically connect the first electrical connection end 14 and the second electrical connection end 22. As shown in fig. 7, the electrical connector 3 in this example has a lower end covering the first electrical connection terminal 14 and an upper end covering the second electrical connection terminal 22 to electrically connect the first electrical connection terminal 14 and the second electrical connection terminal 22. And it should be understood that the electrical connector 3 in this example can fill the through region 2, and the electrical connector 3 can both perform the conductive connection function and improve the bonding strength between the second circuit board 21 and the first circuit board 11. Of course, in some application scenarios, the electrical connector 3 may be arranged to fill only a part of the through region 2, thereby saving material and reducing cost. Compared with the traditional connection mode of welding two ends by adopting wires, the connection mode can save the wire material, reduce the welding times, improve the manufacturing efficiency, further reduce the cost and improve the product integrity.

Referring to fig. 2 to 7, in the present embodiment, the second circuit board 21 has a heat dissipation area 23, and the heat dissipation area 24 penetrates through the front surface and the back surface of the second circuit board 21, and the shape and the size of the heat dissipation area 23 are not limited in this embodiment, as long as the light emitting device 12 on the first circuit board 11 corresponds to the heat dissipation area 23 in position after the first circuit board 11 and the second circuit board 21 are stacked up and down. For example, as shown in fig. 2 to 7, the second circuit board 21 in this example has a heat dissipation area 23 with a rectangular cross section, and of course, the cross section of the heat dissipation area 23 is not limited to a rectangle, and may be set to be a regular shape such as a circle, an ellipse, a triangle, a diamond, and a hexagon, or may be set to be an irregular shape as needed, which is not described again. In an application scenario, after the second circuit board 21 and the first circuit board 11 are stacked up and down, at least a part of the light emitting component 12 on the first circuit board 11 overlaps with the heat dissipation area 23, so that heat generated by the light emitting component 12 during operation is directly dissipated through the heat dissipation area 23 through the back surface of the first circuit board 11, and the heat dissipation efficiency is improved.

In some examples, referring to fig. 8, the heat dissipation area 23 may also be filled with a heat conductive layer a having a thermal conductivity greater than that of air, thereby further enhancing the heat dissipation effect. Of course, in other application scenarios, the heat dissipation area 23 may not be disposed on the second circuit board 21, as shown in fig. 9.

It should be understood that, in this embodiment, the shape of the second circuit board 21 may also be flexibly set according to application requirements, for example, as shown in fig. 3, it may be set to be rectangular, and of course, it may also be set to be regular shapes such as circular, oval, and long strip, and may also be set to be irregular shapes according to requirements, and details are not repeated here. And the shape of the first circuit board 11 and the shape of the second circuit board 21 may be the same or different.

In this example, the second circuit board 21 and the first circuit board 11 are stacked up and down, as shown in fig. 6 to 7, specifically, the back surface of the first circuit board 11 and the front surface of the second circuit board 21 are stacked up and down, after the stacking arrangement, the light emitting component 12 on the first circuit board 11 corresponds to the heat dissipation area 23 on the second circuit board 12, and at least a part of heat generated by the light emitting component 12 is dissipated through the heat dissipation area 23. The upper and lower superposition structure can reduce the occupied transverse space of the second circuit board 21 and the first circuit board 11 as much as possible, so that the second circuit board and the first circuit board can be conveniently integrated in the limited space of the shell, and the integrity of the down lamp or the spot lamp is improved; and when the installation leads to down lamp or shot-light then no longer need additionally carry out the second circuit board 21 outside the inner shell and the electricity between the first circuit board 11 in the interior outer shell and be connected, can promote the convenience of installation process, reduce cost.

In some examples of the present embodiment, in order to further improve the heat dissipation effect, the area of the light emitting device 12 projected on the second circuit board 21 is located in the heat dissipation area 23, that is, the area of the light emitting device 12 projected on the second circuit board 21 is smaller than the area of the heat dissipation area 23, and the position of the light emitting device 12 corresponds to the position of the heat dissipation area 23, so as to ensure that the heat generated by the light emitting device 12 is dissipated from the heat dissipation area 23 as much as possible.

In other examples of this embodiment, in order to further enhance the heat dissipation effect, the decorative lamp further includes a heat dissipation assembly disposed under the second circuit board, and the heat dissipation assembly may be disposed to contact at least one of the back surface of the second circuit board and the back surface region of the first circuit board exposed through the heat dissipation region 23. For example, the upper end of the heat sink may be respectively contacted with the back region of the first circuit board 11 exposed through the heat dissipation region 23 and the back of the second circuit board 21, so that the heat generated by the first circuit board 11 and the second circuit board 21 is directly conducted into the heat sink, thereby improving the heat dissipation efficiency.

Of course, in other application scenarios of the present example, it may also be possible to arrange that the upper end of the heat dissipation assembly is not in contact with at least one of the first circuit board 11 and the second circuit board 21, but a heat conduction layer is arranged between the two, and the heat generated by the first circuit board 11 and/or the second circuit board 21 is guided to the heat dissipation assembly through the heat conduction layer. In some application scenarios of the present example, in order to further improve the heat dissipation efficiency, the lower end (the end opposite to the upper end of the heat dissipation assembly) of the heat dissipation assembly may be provided with heat dissipation fins, by which the heat dissipation efficiency can be further improved.

It should be understood that the heat dissipation assembly in this example may be made of various materials with good thermal conductivity, such as ceramic, metal, graphene, etc.

In some application scenarios of the present embodiment, referring to fig. 5, after the outer diameter of the second electrical connection end 22 is smaller than or equal to the inner diameter of the through region 13, and the back surface of the first circuit board 11 and the front surface of the second circuit board 21 are overlapped up and down, the upper end of the second electrical connection end 22 is embedded into the through region 13, and at this time, there is substantially no gap between the back surface of the first circuit board 11 and the front surface of the second circuit board 21, so that the overall thickness can be reduced as much as possible. And also functions in positioning and fixing since the upper end of the second electrical connection terminal 22 is embedded in the through region 13 at the time of assembly. For example, in some examples, the size of the upper end of the second electrical connection end 22 may be adapted to the through region 23, and the upper end of the second electrical connection end 22 is engaged with the through region 23 after penetrating into the through region 23, so as to achieve positioning and fixing between the first circuit board 11 and the second circuit board 21, which is more convenient for precise assembly of the two, and improve assembly efficiency.

In some application scenarios of the present example, referring to fig. 1 to 2, the through region 13 on the first circuit board 11 may include a through hole disposed on the first circuit board 11, and the first electrical connection terminal 14 includes a second conductive layer disposed along an edge of the through hole, where the second conductive layer is enclosed to form a closed pattern, but the second conductive layer may also be enclosed along only a portion of the edge of the through hole to form a non-closed pattern. It should be understood that in the application field, the shape of the through hole may be regular shape such as circular, rectangular, oval, regular hexagon, etc., or irregular shape, and the size thereof may be flexibly set. In some application scenarios, the projected area of the second electrical connection end 22 corresponding to the through hole on the second circuit board 21 may be greater than or equal to the projected area of the through hole on the second circuit board 21, so as to ensure the reliability of the subsequent electrical connection. Of course, the projection area of the second electrical connection terminal 22 on the second circuit board 21 can be set to be smaller than the projection area of the through hole on the second circuit board 21 according to the requirement, so that the material consumption is saved, and the cost is reduced. And it should be understood that in some application scenarios, the projection shape of the second electrical connection end 22 on the second circuit board 21 may be the same as or different from the shape of the through hole, and specifically, may be flexibly set according to the requirement.

In another example of the present embodiment, referring to fig. 10 to 13, the through region 13 on the first circuit board 11 includes an opening communicating with an edge of the first circuit board 11, that is, the through region 13 includes a notch disposed on the first circuit board 11 and communicating with the edge of the first circuit board 11, and the first electrical connection end 14 includes a first conductive layer disposed around the edge of the notch. The first conductive layer may be enclosed along the entire edge of the notch to form a non-closed pattern, or the first conductive layer may be enclosed along only a portion of the edge of the notch. It should be understood that in the application field, the shape of the notch may be a regular shape notch such as a C-shaped notch, a U-shaped notch, etc., or may be an irregular shape notch, and the size of the notch may be flexibly set. In some application scenarios, the projection area of the second electrical connection end 22 corresponding to the notch on the second circuit board 21 may be greater than or equal to the area of the notch projected on the second circuit board 21, so as to ensure the reliability of the subsequent electrical connection. Of course, the projection area of the second electrical connection terminal 22 on the second circuit board 21 can be set to be smaller than the projection area of the notch on the second circuit board 21 according to the requirement, so that the material consumption is saved, and the cost is reduced. And it should be understood that, in some application scenarios, the projection shape of the second electrical connection end 22 on the second circuit board 21 may be the same as or different from the shape of the notch, and specifically, may be flexibly set according to the requirement.

It should be understood that, in the present example, when more than two through regions 13 are provided on the first circuit board 11, each through region 13 may be provided as a through hole or a notch, and the provided shape and/or size may be the same or different. Of course, a part of the through-area may be provided as a through-hole and a part may be provided as a notch.

In another example of this embodiment, in order to enhance the light emitting effect of the decorative lamp and enhance the protection performance of the light emitting element 12 in the decorative lamp, referring to fig. 7, the decorative lamp may further include a lamp cap 4 and a lamp cover (not shown) enclosing the light emitting element, and light emitted by the light emitting element 12 is emitted through the lamp cap 4 and the lamp cover. In the example shown in fig. 7, the concave part in the middle of the lamp cap 4 directly forms a reflective cup, and the bottom of the reflective cup 41 is directly communicated with the light emitting component 12, so that the light emitted by the light emitting component 12 can directly enter the reflective cup 41, thereby improving the efficiency of the light entering the reflective cup 41; in addition, in order to further enhance the reflection effect of the reflection cup 41, a reflection layer may be further disposed on the inner wall of the reflection cup 41. Of course, it should be understood that the reflective cup 41 in this example may not be formed by the housing 4 but may be separately provided, and thus, the description thereof is omitted. In some examples, a lamp cover may be provided at the rim position of the reflective cup 41.

It should be understood that at least one of the first circuit board 11 and the second circuit board 21 described above in the present embodiment may be a flexible circuit board, and may also be a rigid circuit board. The first circuit board 11 may also be a substrate base plate using, but not limited to, a conductive metal base plate and a first circuit disposed on the substrate base plate; for example, but not limited to, at least one of an aluminum substrate, a copper substrate, a silver substrate, a conductive alloy substrate, or the like may be used. It should be understood that, in the present embodiment, the substrate base plate may be replaced by a non-metal base plate; for example, in some examples, a substrate main body having an insulating main body and a composite substrate in which respective wiring lines are provided in the substrate main body may be employed as the first circuit board 11. The substrate body may be made of a rigid material, such as but not limited to a phenolic paper laminated board, an epoxy paper laminated board, a polyester glass mat laminated board, an epoxy glass cloth laminated board, a BT resin board, or a glass board; the substrate body may also be made of a flexible material, such as but not limited to a polyester film, a polyimide film, or a fluorinated ethylene propylene film.

It should be understood that the materials of the first circuit board 11 and the second circuit board 21 in the present embodiment may be the same, or may be different according to the requirement. And both can set up to be flexible, or rigidity, or one of them sets up to be flexible, and another sets up to be rigid, also can set up in a flexible way according to the application demand specifically, need not be repeated here one by one.

It should be understood that the light emitting assembly 12 in the present embodiment may include, but is not limited to, at least one of an LED lamp bead and an LED chip; when the LED lamp beads are included, the LED lamp beads can adopt but are not limited to bracket type packaged lamp beads, and also can adopt but are not limited to bracket-free LED lamp beads; when the LED Chip is included, the LED Chip may be disposed On the first circuit Board 11 through, but not limited to, a COB (Chip On Board) process. The LED chips are divided according to the pin distribution mode of the LED chips, and the LED chips in the present embodiment can comprise at least one of a forward-mounted LED chip, a flip-chip LED chip and a vertical LED chip; from the chip size division, the LED chips in this example may include, but are not limited to, a Micro-scale LED chip (e.g., at least one of a Mini LED chip and a Micro LED chip) and an LED chip larger than the Micro-scale. It should be understood that in this embodiment, the number of the light emitting assemblies 12 arranged on the first circuit board 11, and the number, the light emitting intensity, the light emitting color, and the like of the LED lamp beads and/or the LED chips included in each light emitting assembly 12 may be flexibly arranged according to application requirements, and are not described herein again.

It should be understood that the electrical connection member 3 in the present embodiment may be solder or conductive paste filled in the through region 13, and when solder is used, the solder may be filled in the through region 13 by, but not limited to, various soldering methods. The solder in this example may be, but is not limited to, a solder paste, which may be, but is not limited to, a solder alloy containing lead, such as a tin-lead-based alloy, a tin-lead-bismuth-based alloy, or a tin-lead-silver-based alloy; lead-free solder alloys such as tin-silver-based alloys, tin-bismuth-based alloys, tin-zinc-based alloys, tin-antimony, tin-silver-copper-based alloys, or tin-bismuth-silver-based alloys can also be used. When the conductive adhesive is used, the conductive adhesive has the characteristics of conductivity and adhesion, and when the conductive adhesive is classified according to conductive materials, the conductive adhesive used can include, but is not limited to, conductive silver adhesive, copper powder conductive adhesive, nickel-carbon conductive adhesive, silver-copper conductive adhesive, and the like.

It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims

1. The utility model provides a decorative lamp, its characterized in that, decorative lamp is down lamp or shot-light, and it includes:

2. The decorative lamp of claim 1, wherein the second circuit board has a heat dissipating area extending through the front and back surfaces thereof, and a portion of the back surface of the first circuit board is exposed through the heat dissipating area.

3. The decorative lamp of claim 2, wherein the area of the light emitting component projected on the second circuit board is located in the heat dissipation area.

4. The decorative lamp of claim 3, further comprising a heat sink assembly disposed below the second circuit board, the heat sink assembly being in contact with at least one of a back side of the second circuit board and a back side region of the first circuit board exposed through the heat sink region.

5. A decorative lamp according to any one of claims 1 to 4, wherein said decorative lamp comprises two said first electrical connection terminals, said two said first electrical connection terminals being respectively provided on opposite sides of said light emitting element, or on the same side of said light emitting element.

6. A decorative lamp according to any one of claims 1 to 4, wherein the through region has an opening communicating with an edge of the first circuit board, and the first electrical connection terminal comprises a first electrical connection layer distributed along the edge of the through region.

7. The decorative lamp of any one of claims 1-4, wherein the through region is a through hole passing through the front and back surfaces of the first circuit board, and the first electrical connection end includes a second electrical connection layer enclosed along an edge of the through region.

8. A decorative lamp according to any one of claims 1 to 4, further comprising a lamp cap and a lamp housing enclosing said light emitting element, light emitted by said light emitting element being emitted through said lamp cap and said lamp housing.

9. The decorative lamp of any one of claims 1-4, wherein the upper end of the second electrical connection end penetrates into the through region after the back surface of the first circuit board and the front surface of the second circuit board are overlapped.

10. The decorative lamp of claim 9, wherein the upper end of the second electrical connection end is sized to fit the through region, and the upper end of the second electrical connection end is engaged with the through region after penetrating into the through region.