CN216236703U - Multi-platform laser glass cutting machine system - Google Patents
Multi-platform laser glass cutting machine system Download PDFInfo
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- CN216236703U CN216236703U CN202123116777.9U CN202123116777U CN216236703U CN 216236703 U CN216236703 U CN 216236703U CN 202123116777 U CN202123116777 U CN 202123116777U CN 216236703 U CN216236703 U CN 216236703U
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Abstract
The utility model relates to a multi-platform laser glass cutting machine system, which comprises a laser light path emission adjusting device and a laser light path receiving adjusting device arranged outside the laser light path emission adjusting device, wherein the laser light path emission adjusting device comprises a workbench, an installation platform arranged on the workbench, a laser height adjusting bracket arranged on the installation platform, a laser beam expanding lens arranged at one side of the laser, a Y-axis light path angle emission adjusting mechanism positioned at one side of the laser height adjusting bracket and an X-axis light path angle emission adjusting mechanism arranged at one side of the Y-axis light path angle emission adjusting mechanism; the laser light path receiving and adjusting device comprises a gantry machining platform, a first laser receiving reflector of the platform, a second laser receiving reflector of the platform and a laser field lens, wherein the first laser receiving reflector of the platform, the second laser receiving reflector of the platform and the laser field lens are arranged on the gantry machining platform. The design can switch the light path by switching the position of the reflector, and not only can cut large-size low-precision products, but also can efficiently cut small-size high-precision products.
Description
Technical Field
The utility model relates to the field of laser cutting processing, in particular to a multi-platform laser glass cutting machine system.
Background
With the application of high-frequency laser in the field of glass cutting, the cutting efficiency, the cutting quality effect and the cutting cleanness degree of the high-frequency laser are obviously superior to those of the cutting modes of a traditional glass cutter, a water jet cutter and a diamond grinding wheel. However, the high-frequency laser has high cost, which accounts for more than 50% of the cutting system of the whole machine, and restricts the application of the high-frequency laser in the production field.
Simultaneously because supplementary processes such as unloading and lobe of a leaf, the actual process time of high frequency laser cutting is not long, and effective cutting efficiency is not high, use single platform laser glass cutting equipment as an example, the effective live time of laser instrument can not reach 50% of total process time, and, each laser glass cutting equipment all need be equipped with independent high frequency laser emission system, high frequency laser emission system often is in idle state, consequently, how to improve laser emission system's actual use efficiency is the technical problem that this patent need solve.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provides a multi-platform laser glass cutting machine system.
In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:
a multi-platform laser glass cutting machine system comprises a laser light path emission adjusting device and a laser light path receiving adjusting device arranged on the outer side of the laser light path emission adjusting device, wherein the laser light path emission adjusting device comprises a workbench, an installation platform arranged on the workbench, a laser height adjusting support arranged on the installation platform, a laser arranged on the laser height adjusting support, a laser beam expanding lens arranged on one side of the laser, a Y-axis light path angle emission adjusting mechanism positioned on one side of the laser height adjusting support and an X-axis light path angle emission adjusting mechanism arranged on one side of the Y-axis light path angle emission adjusting mechanism;
the laser light path receiving and adjusting device comprises a gantry machining platform, a first laser receiving reflector of the platform, a second laser receiving reflector of the platform and a laser field lens, wherein the first laser receiving reflector of the platform, the second laser receiving reflector of the platform and the laser field lens are arranged on a gantry of the gantry machining platform.
Further, Y axle light path angle emission adjustment mechanism includes first cross linear motion module, sets up Y axle light path speculum motion slip table and the Y axle light path speculum of setting on Y axle light path speculum motion slip table on first cross linear motion module.
Further, X axle light path angle emission adjustment mechanism includes the second cross linear motion module, sets up X axle light path speculum motion slip table on the second cross linear motion module and installs the X axle light path speculum on X axle light path speculum motion slip table.
Further, the top of the workbench is provided with a Y-axis light path angle emission adjusting mechanism moving slide rail, and the mounting platform is in sliding fit with the Y-axis light path angle emission adjusting mechanism moving slide rail.
Furthermore, the first cross linear motion module, the second cross linear motion module and the mounting table are all connected with a horizontal driving mechanism.
Furthermore, the number of the gantry processing platforms is multiple, the gantry processing platforms are arranged on the outer side of the laser light path emission adjusting device in the circumferential direction, and the glass plate to be cut is arranged on the gantry processing platforms.
Furthermore, the moving direction of the Y-axis light path reflector on the Y-axis light path reflector moving sliding table is vertical to the moving direction of the X-axis light path reflector on the X-axis light path reflector moving sliding table.
The utility model has the beneficial effects that: this cutting system is through using a plurality of laser reflectors, and the laser light source that is transmitted by a laser emitter uses for two and above independent cutting platform (longmen processing platform) simultaneously, through effectual time allocation, when a cutting platform motion, goes up unloading or lobe of a leaf, transmits laser to other cutting platform through the laser reflector and uses, has improved the availability factor of laser, has improved equipment efficiency and productivity simultaneously.
In addition, the design can switch the light path by switching the position of the reflector, so that large-size low-precision products can be cut, small-size high-precision products can be cut efficiently, the equipment cost is reduced, different requirements of customers are met, and the flexibility is higher.
Drawings
FIG. 1 is a schematic structural diagram of a laser path emission adjusting device according to the present application;
FIG. 2 is a schematic illustration of the principle of laser reflection according to the present application;
FIG. 3 is a schematic diagram of a laser optical path receiving and adjusting device in an embodiment of the present application;
fig. 4 is a schematic diagram of a laser path direction under a first working condition in the embodiment of the present application;
fig. 5 is a schematic diagram of a laser path under a second working condition in the embodiment of the present application;
fig. 6 is a schematic diagram of a laser path under a third working condition in the embodiment of the present application;
fig. 7 is a schematic view of a laser path in a fourth condition in the embodiment of the present application.
Description of reference numerals: 1. a laser light path emission adjusting device; 11. a work table; 12. an installation table; 13. a laser height adjustment bracket; 14. a laser; 15. a laser beam expander; 16. a first cross linear motion module; 17. a Y-axis light path reflector movement sliding table; 18. a Y-axis optical path mirror; 19. a second cross linear motion module; 110. an X-axis light path reflector movement sliding table; 111. an X-axis optical path mirror; 112. the Y-axis light path angle emission adjusting mechanism moves the sliding rail;
2. a laser light path receiving and adjusting device; 21. a gantry machining platform; 22. a gantry; 23. a first laser receiving mirror of the platform; 24. a platform second laser receiving reflector; 25. a laser field lens.
Detailed Description
The present application is described in further detail below with reference to figures 1-7.
As shown in fig. 1 and fig. 2, a multi-platform laser glass cutting machine system comprises a laser light path emission adjusting device 1 and a laser light path receiving adjusting device 2 installed outside the laser light path emission adjusting device 1, wherein the laser light path emission adjusting device 1 comprises a workbench 11, a mounting table 12 arranged on the workbench 11, a laser height adjusting bracket 13 arranged on the mounting table 12, a laser 14 installed on the laser height adjusting bracket 13, a laser beam expanding lens 15 installed on one side of the laser 14, a Y-axis light path angle emission adjusting mechanism located on one side of the laser height adjusting bracket 13, and an X-axis light path angle emission adjusting mechanism installed on one side of the Y-axis light path angle emission adjusting mechanism;
the Y-axis light path angle emission adjusting mechanism comprises a first cross linear motion module 16, a Y-axis light path reflector motion sliding table 17 arranged on the first cross linear motion module 16 and a Y-axis light path reflector 18 arranged on the Y-axis light path reflector motion sliding table 17.
Further, X axle light path angle emission adjustment mechanism includes the second letter's linear motion module 19, sets up X axle light path speculum motion slip table 110 on the second letter's linear motion module 19 and installs X axle light path speculum 111 on X axle light path speculum motion slip table 110.
Further, a Y-axis light path angle emission adjusting mechanism moving slide rail 112 is installed at the top of the working table 11, and the installation table 12 is in sliding fit with the Y-axis light path angle emission adjusting mechanism moving slide rail 112.
In order to ensure that the first cross linear motion module 16, the second cross linear motion module 19 and the mounting table 12 reciprocate on corresponding tracks, the first cross linear motion module 16, the second cross linear motion module 19 and the mounting table 12 are all connected with a horizontal driving mechanism.
As shown in fig. 3, the laser optical path receiving and adjusting device 2 includes a gantry processing platform 21, a first laser receiving reflector 23, a second laser receiving reflector 24 and a laser field lens 25, which are arranged on a gantry 22 of the gantry processing platform 21.
The number of the gantry processing platforms 21 is multiple, the gantry processing platforms 21 are arranged on the outer side of the laser light path emission adjusting device 1 in the circumferential direction, and the glass plates to be cut are arranged on the gantry processing platforms 21.
The principle of laser cutting is explained below with reference to specific operating conditions:
under a first working condition, as shown in fig. 4, during laser cutting, after the laser 2 is started, the horizontal driving mechanism drives the X-axis optical path angle emission adjusting mechanism to move in the positive direction of the X-axis, after the center of the X-axis optical path negative reflector is aligned with the center of the laser beam expanding lens 15, the laser beam passes through the laser beam expanding lens 15, the beam passing through the laser beam expanding lens 15 is refracted by the X-axis optical path negative reflector in the X-axis optical path reflector 111 on the X-axis optical path angle emission adjusting mechanism, the refracted beam enters the Y-axis optical path reflector 18 on the Y-axis optical path angle emission adjusting mechanism to be refracted again, the refracted beam enters the first laser receiving reflector 23 on the platform on the gantry processing platform 21 to be refracted and then passes through the second laser receiving reflector 24 on the platform, then the glass plate enters a laser field lens 25, and the glass plate on the gantry machining platform A is driven to operate through an external tool so as to carry out corresponding cutting.
Under a second working condition, as shown in fig. 5, the horizontal driving mechanism drives the X-axis light path angle emission adjusting mechanism to move towards the negative direction of the X-axis, after the center of the X-axis light path forward reflecting mirror is aligned with the center of the laser beam expanding mirror 15, a laser beam passes through the laser beam expanding mirror 15 and enters the X-axis light path forward reflecting mirror on the X-axis light path reflecting mirror 111 on the X-axis light path angle emission adjusting mechanism to be refracted, the horizontal driving mechanism drives the Y-axis light path angle emission adjusting mechanism to move to a specified position, and the refracted beam enters the Y-axis forward reflecting mirror on the Y-axis light path reflecting mirror 18 on the Y-axis light path angle emission adjusting mechanism; refracting again, enabling the refracted light beam to enter a first platform laser receiving reflector 23 on the gantry machining platform B, refracting the light beam, then passing through a second platform laser receiving reflector 24, entering a laser field lens 25, and driving a glass plate on the gantry machining platform B to operate through an external tool so as to carry out corresponding cutting;
under a third working condition, as shown in fig. 6, the horizontal driving mechanism drives the X-axis optical path angle emission adjusting mechanism to move towards the positive direction of the X-axis, after the center of the X-axis optical path negative reflector is aligned with the center of the laser beam expander 15, a laser beam passes through the laser beam expander 15, the laser beam passing through the laser beam expander 15 is refracted by the X-axis optical path negative reflector in the X-axis optical path reflector 111 on the X-axis optical path angle emission adjusting mechanism, the horizontal driving mechanism drives the Y-axis optical path angle emission adjusting mechanism to move to a specified position, and the refracted light beam enters the negative Y reflector on the Y-axis optical path reflector 18 on the Y-axis optical path angle emission adjusting mechanism; and refracting again, wherein the refracted light beam enters a first platform laser receiving reflector 23 on the gantry machining platform C, is refracted, then passes through a second platform laser receiving reflector 24, enters a laser field lens 25, and is driven by an external tool to operate a glass plate on the gantry machining platform C, so that corresponding cutting can be carried out.
Under a fourth working condition, as shown in fig. 7, the horizontal driving mechanism drives the X-axis light path angle emission adjusting mechanism to move towards the negative direction of the X-axis, after the center of the X-axis light path positive reflector is aligned with the center of the laser beam expander 15, a laser beam passes through the laser beam expander 15 and enters the X-axis light path positive reflector on the X-axis light path reflector 111 on the X-axis light path angle emission adjusting mechanism for refraction, the horizontal driving mechanism drives the Y-axis light path angle emission adjusting mechanism to move to a specified position, and the refracted beam enters the negative reflector on the Y-axis light path reflector 18 on the Y-axis light path angle emission adjusting mechanism; and refracting again, wherein the refracted light beam enters a first platform laser receiving reflector 23 on the gantry machining platform D, is refracted, then passes through a second platform laser receiving reflector 24, enters a laser field lens 25, and is driven by an external tool to operate a glass plate on the gantry machining platform D so as to perform corresponding cutting.
To sum up, the cutting system uses a plurality of laser reflectors, the laser light source emitted by one laser emitter is used by two or more independent cutting platforms (gantry processing platforms) at the same time, and the laser is transmitted to other cutting platforms for use through the laser reflectors when one cutting platform moves, loads and unloads or splits through effective time distribution, so that the use efficiency of the laser is improved, and the equipment efficiency and the productivity are improved simultaneously.
In addition, the design can switch the light path by switching the position of the reflector, so that large-size low-precision products can be cut, small-size high-precision products can be cut efficiently, the equipment cost is reduced, different requirements of customers are met, and the flexibility is higher.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (7)
1. A multi-platform laser glass cutting machine system comprises a laser light path emission adjusting device and a laser light path receiving adjusting device arranged on the outer side of the laser light path emission adjusting device, and is characterized in that the laser light path emission adjusting device comprises a workbench, an installation platform arranged on the workbench, a laser height adjusting support arranged on the installation platform, a laser arranged on the laser height adjusting support, a laser beam expanding lens arranged on one side of the laser, a Y-axis light path angle emission adjusting mechanism arranged on one side of the laser height adjusting support and an X-axis light path angle emission adjusting mechanism arranged on one side of the Y-axis light path angle emission adjusting mechanism;
the laser light path receiving and adjusting device comprises a gantry machining platform, a first laser receiving reflector of the platform, a second laser receiving reflector of the platform and a laser field lens, wherein the first laser receiving reflector of the platform, the second laser receiving reflector of the platform and the laser field lens are arranged on a gantry of the gantry machining platform.
2. The system according to claim 1, wherein the Y-axis optical path angle emission adjustment mechanism comprises a first cross linear motion module, a Y-axis optical path mirror motion slide table disposed on the first cross linear motion module, and a Y-axis optical path mirror disposed on the Y-axis optical path mirror motion slide table.
3. The system according to claim 2, wherein the X-axis optical path angle emission adjustment mechanism comprises a second cross-shaped linear motion module, an X-axis optical path reflector motion sliding table arranged on the second cross-shaped linear motion module, and an X-axis optical path reflector mounted on the X-axis optical path reflector motion sliding table.
4. The system according to claim 2 or 3, wherein a Y-axis optical path angle emission adjustment mechanism moving slide rail is mounted on the top of the worktable, and the mounting table is in sliding fit with the Y-axis optical path angle emission adjustment mechanism moving slide rail.
5. The system according to claim 3, wherein the first cross linear motion module, the cross linear motion module, and the mounting stage are each coupled to a horizontal drive mechanism.
6. The system according to claim 3, wherein the number of the gantry processing platforms is plural, the plural gantry processing platforms are arranged in a circumferential direction at the outer side of the laser light path emission adjusting device, and the gantry processing platforms are provided with glass plates to be cut.
7. The system according to claim 3, wherein the direction of movement of said Y-axis optical path mirror on said Y-axis optical path mirror motion stage is perpendicular to the direction of movement of said X-axis optical path mirror on said X-axis optical path mirror motion stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123116777.9U CN216236703U (en) | 2021-12-10 | 2021-12-10 | Multi-platform laser glass cutting machine system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123116777.9U CN216236703U (en) | 2021-12-10 | 2021-12-10 | Multi-platform laser glass cutting machine system |
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| Publication Number | Publication Date |
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| CN216236703U true CN216236703U (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123116777.9U Active CN216236703U (en) | 2021-12-10 | 2021-12-10 | Multi-platform laser glass cutting machine system |
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| Country | Link |
|---|---|
| CN (1) | CN216236703U (en) |
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2021
- 2021-12-10 CN CN202123116777.9U patent/CN216236703U/en active Active
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