CN216210386U

CN216210386U - Backlight device of mobile phone camera module

Info

Publication number: CN216210386U
Application number: CN202121720596.4U
Authority: CN
Inventors: 薛攀
Original assignee: Zhejiang Huazhou Intelligent Equipment Co ltd
Current assignee: Zhejiang Huazhou Intelligent Equipment Co ltd
Priority date: 2021-07-27
Filing date: 2021-07-27
Publication date: 2022-04-05
Anticipated expiration: 2031-07-27

Abstract

The utility model relates to a backlight device of a mobile phone camera module, which comprises a substrate and a light-emitting wafer, wherein the light-emitting wafer and the substrate are integrally formed, and the surface of the light-emitting wafer is provided with epoxy resin. According to the backlight device of the mobile phone camera module, the condition that the LED light-emitting device is welded on the substrate is avoided, the light-emitting wafer is directly etched on the substrate, the thickness of the LED light-emitting device is reduced, the occupied space of the LED light-emitting device is further reduced, and the thickness of the backlight device of the mobile phone camera module is further reduced.

Description

Backlight device of mobile phone camera module

Technical Field

The utility model relates to the technical field of mobile phone camera shooting, in particular to a backlight device of a mobile phone camera shooting module.

Background

With the development of science and technology, mobile phones are developing towards ultra-thinness, and mobile phones become thinner and thinner, wherein the thickness of a mobile phone camera module severely restricts the thickness of the mobile phone. The mobile phone camera module in the prior art generally welds a single LED light emitting device directly on a substrate, and this structure will result in a thicker thickness of the whole mobile phone camera module, so the thickness of the mobile phone will also increase.

SUMMERY OF THE UTILITY MODEL

Therefore, the technical problem to be solved by the utility model is to overcome the problem that the thickness of the mobile phone camera module is thicker due to the LED light-emitting device in the prior art, and the thickness of the LED light-emitting device can be reduced, so that the occupied space of the LED light-emitting device is reduced, and the thickness of the mobile phone camera module backlight device is reduced.

In order to solve the technical problem, the utility model provides a backlight device of a mobile phone camera module, which comprises a substrate and a light-emitting wafer, wherein the light-emitting wafer and the substrate are integrally formed, and the surface of the light-emitting wafer is provided with epoxy resin.

In one embodiment of the utility model, the thickness of the substrate is 0.8-1.2 mm.

In an embodiment of the utility model, a positive solder joint and a negative solder joint are arranged on the substrate, a positive electrode and a negative electrode are arranged on the light-emitting wafer, the positive electrode is electrically connected with the positive solder joint, and the negative electrode is electrically connected with the negative solder joint.

In an embodiment of the present invention, a housing is connected to the substrate, an avoiding groove is formed in the housing, and the positive solder joint and the negative solder joint are located in the avoiding groove.

In one embodiment of the present invention, a wire groove is disposed on the housing, and the wire groove is communicated with the avoidance groove.

In one embodiment of the utility model, the base plate is provided with a mounting hole and a screw, the shell is provided with a threaded hole, and the screw penetrates through the mounting hole and is screwed with the threaded hole.

In one embodiment of the present invention, the substrate and the housing are provided with mounting through holes.

In one embodiment of the utility model, a diffusion plate is connected to the substrate, and an area of the diffusion plate covers an area of the light emitting wafer.

In one embodiment of the present invention, the housing is provided with a positioning surface, and the positioning surface abuts against the diffusion plate.

In one embodiment of the utility model, the thickness of the backlight device is 1.8-2.2 mm.

Compared with the prior art, the technical scheme of the utility model has the following advantages:

according to the backlight device of the mobile phone camera module, the condition that the LED light-emitting device is welded on the substrate is avoided, the light-emitting wafer is directly etched on the substrate, the thickness of the LED light-emitting device is reduced, the occupied space of the LED light-emitting device is further reduced, and the thickness of the backlight device of the mobile phone camera module is further reduced.

Drawings

In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which

FIG. 1 is a schematic structural diagram of a backlight device of a mobile phone camera module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an exploded structure of a backlight device of a mobile phone camera module according to an embodiment of the present invention;

FIG. 3 is an exploded view of a substrate of a backlight device of a mobile phone camera module according to an embodiment of the present invention;

fig. 4 is a partially enlarged schematic view of a portion a in fig. 3.

The specification reference numbers indicate: 1. a substrate; 2. a light emitting wafer; 3. an epoxy resin; 4. positive welding points; 5. negative welding spots; 6. a housing; 7. an avoidance groove; 8. a wire slot; 9. mounting holes; 10. a threaded hole; 11. mounting a through hole; 12. a diffusion plate; 13. and (6) positioning the surface.

Detailed Description

The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.

Referring to fig. 1, the backlight device of the mobile phone camera module of the present invention includes a substrate 1 and a light emitting wafer 2, wherein the light emitting wafer 2 and the substrate 1 are integrally formed, and an epoxy resin 3 is disposed on the light emitting wafer 2. The substrate 1 adopts the copper substrate 1, the luminescent wafer 2 and the substrate 1 are integrally formed, and the luminescent wafer 2 is directly etched on the substrate 1, so that the structure of the light-emitting device is reduced, and the thickness of the whole backlight device can be compressed to 2 mm. The epoxy resin 3 plays a role in protecting the light-emitting wafer.

In one embodiment, the substrate 1 has a thickness of 0.8 to 1.2 mm. The thickness of the substrate 1 is preferably 1mm, so that the thickness of the substrate 1 can be reduced while ensuring the strength of the substrate 1, and at this thickness of 1mm, the process of etching the light emitting wafer 2 on the substrate 1 can be completed.

In one embodiment, the substrate 1 is provided with a positive pad 4 and a negative pad 5, the light-emitting wafer 2 is provided with a positive electrode and a negative electrode, the positive electrode is electrically connected with the positive pad 4, and the negative electrode is electrically connected with the negative pad 5. The light-emitting wafer 2 can emit light only by being electrified, a positive electrode and a negative electrode are arranged on the light-emitting wafer 2, the positive electrode is connected with a positive welding point 4, the negative electrode is connected with a negative welding point 5, the positive welding point 4 and the negative welding point 5 are respectively connected with corresponding external power leads, and the power supply function of the light-emitting wafer 2 can be realized through the external power leads so that the light-emitting wafer 2 can emit light.

In one embodiment, a housing 6 is connected to the substrate 1, an avoiding groove 7 is formed in the housing 6, and the positive solder point 4 and the negative solder point 5 are located in the avoiding groove 7. The avoiding groove 7 is used for avoiding the welding point and the power supply lead welded with the welding point, and plays a role in accommodating the welding point and the power supply lead.

In one embodiment, the housing 6 is provided with a wire groove 8, and the wire groove 8 is communicated with the avoiding groove 7. The wire casing 8 is used for placing a power line, the wire casing 8 is communicated with the avoiding groove 7, so that the power line in the avoiding groove 7 can be led out through the wire casing 8, and the power line is electrified to realize the light-emitting function of the light-emitting wafer 2.

In one embodiment, the base plate 1 is provided with mounting holes 9 and screws, the housing 6 is provided with threaded holes 10, and the screws are screwed into the threaded holes 10 through the mounting holes 9 to connect the housing 6 and the base plate 1. The screws are screwed through the mounting holes 9 and the threaded holes 10, so that the base plate 1 and the shell 6 can be fixedly connected.

In one embodiment, the substrate 1 and the housing 6 are both provided with mounting through holes 11, and the backlight device is fixed inside the mobile phone through the mounting through holes 11. The mounting through hole 11 is used for fixing the back plate device on the mobile phone. The mounting through holes 11 are long through holes, screws for fixing the device can be mounted in the long through holes, and due to the long through holes, when the back plate device is mounted, the position of the back plate device can be adjusted, so that the backlight device can be positioned at a proper position.

In one embodiment, a diffusion plate 12 is attached to the substrate 1, and an area of the diffusion plate 12 covers an area of the luminescent wafer 2. The diffusion plate 12 is bonded to the substrate 1 by UV glue so that the diffusion plate 12 is fixed to the substrate 1. The light emitted from the light emitting wafer 2 on the substrate 1 passes through the diffusion plate 12, and the diffusion plate 12 makes the light more uniform.

In one embodiment, the housing 6 is provided with a positioning surface 13, which positioning surface 13 presses the diffuser plate 12. The positioning surface 13 on the housing 6 abuts against the diffuser plate 12. The diffusion plate 12 and the substrate 1 are bonded by UV glue, and in addition, in order to prevent the diffusion plate 12 from falling off after long-term use, a positioning surface 13 is arranged on the shell 6, and the positioning surface 13 of the shell 6 presses the diffusion plate 12, so that the diffusion plate 12 is fixed by the UV glue and the shell 6 in a double way.

In one embodiment, the thickness of the backlight device is 1.8-2.2 mm. The thickness of the substrate 1 is 0.8-1.2 mm, and after the housing 6 is mounted, the thickness of the backlight device is 1.8-2.2 mm, preferably 2 mm.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the utility model may be made without departing from the spirit or scope of the utility model.

Claims

1. The utility model provides a cell-phone camera module backlight device which characterized in that: the LED packaging structure comprises a substrate (1) and a light-emitting wafer (2), wherein the light-emitting wafer (2) and the substrate (1) are integrally formed, and epoxy resin (3) is arranged on the surface of the light-emitting wafer (2).

2. The mobile phone camera module backlight device of claim 1, wherein: the thickness of the substrate (1) is 0.8-1.2 mm.

3. The mobile phone camera module backlight device of claim 1, wherein: the substrate (1) is provided with a positive welding point (4) and a negative welding point (5), the light-emitting wafer (2) is provided with a positive electrode and a negative electrode, the positive electrode is electrically connected with the positive welding point (4), and the negative electrode is electrically connected with the negative welding point (5).

4. The mobile phone camera module backlight device of claim 3, wherein: the welding device is characterized in that a shell (6) is connected onto the substrate (1), an avoiding groove (7) is formed in the shell (6), and the positive welding spot (4) and the negative welding spot (5) are located in the avoiding groove (7).

5. The backlight device of the mobile phone camera module of claim 4, wherein: be provided with wire casing (8) on shell (6), wire casing (8) with dodge groove (7) and be linked together.

6. The backlight device of the mobile phone camera module of claim 4, wherein: the base plate (1) is provided with a mounting hole (9) and a screw, the shell (6) is provided with a threaded hole (10), and the screw penetrates through the mounting hole (9) and is screwed with the threaded hole (10).

7. The backlight device of the mobile phone camera module of claim 4, wherein: the base plate (1) and the shell (6) are both provided with mounting through holes (11).

8. The backlight device of the mobile phone camera module of claim 4, wherein: the substrate (1) is connected with a diffusion plate (12), and the area of the diffusion plate (12) covers the area of the light-emitting wafer (2).

9. The mobile phone camera module backlight device of claim 8, wherein: the shell (6) is provided with a positioning surface (13), and the positioning surface (13) is abutted against the diffusion plate (12).

10. The mobile phone camera module backlight device of claim 1, wherein: the thickness of the backlight device is 1.8-2.2 mm.