CN216209667U

CN216209667U - Ion migration resistant test structure

Info

Publication number: CN216209667U
Application number: CN202122558249.2U
Authority: CN
Inventors: 李军; 李俊
Original assignee: Dongguan Daysun Electronic Co Ltd
Current assignee: Dongguan Daysun Electronic Co Ltd
Priority date: 2021-10-22
Filing date: 2021-10-22
Publication date: 2022-04-05
Anticipated expiration: 2031-10-22

Abstract

The utility model relates to the technical field of circuit board testing, in particular to an ion migration resistance testing structure which comprises a plurality of testing groups, wherein the testing groups are respectively provided with a plurality of testing boards, the testing boards are provided with tool holes for fixing a clamp and L-shaped testing circuits, and two ends of each testing circuit are provided with a bonding pad and a plurality of anode circuits and cathode circuits which are distributed at intervals and communicated with the bonding pads.

Description

Ion migration resistant test structure

Technical Field

The utility model relates to the technical field of circuit board testing, in particular to an ion migration resistance testing structure.

Background

The copper-clad plate is a plate-shaped material which is prepared by impregnating insulating paper, glass fiber cloth or other fiber materials with resin, coating copper foil on one surface or two surfaces and carrying out hot pressing, and is a basic material of a PCB. Ion migration: caf (conductive inorganic additive) refers to a phenomenon in which metal ions move from one metal electrode to another along a glass fiber yarn when an electric field is applied between electrodes of a printed circuit board, and metal and compounds are precipitated, which causes deterioration of an insulating layer. With the development of consumer electronics products towards smaller, thinner and lighter, the line width spacing of printed circuit boards used in consumer electronics is developed towards dense direction, which results in the reduction of the insulation performance of the products, influences the safe use of the products and may cause personal injury or death in severe cases. Under the condition of providing better and safer products for vast consumers, the ion migration resistance control of a terminal customer on a consumer electronic product is stricter, so that a test structure for the ion migration resistance (CAF resistance) of a printed circuit board material is required to be provided.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model provides an ion migration resistance test structure which is simple in structure, reasonable in design and accurate and convenient in test.

The technical scheme adopted by the utility model is as follows:

the utility model provides a resistant ion migration test structure, includes a plurality of test groups, and is a plurality of test group is equipped with a plurality of test boards respectively, be equipped with the instrument hole that is used for anchor clamps to fix on the test board and be the test line of L type, test line both ends be equipped with pad and a plurality of interval distribution, and with anodal circuit and the negative pole circuit of pad intercommunication.

The technical scheme is further improved in that at the position where the positive electrode circuit is communicated with the bonding pad, the circuits are overlapped to form a positive electrode potential area; and at the position where the negative electrode circuit is communicated with the bonding pad, the circuits are overlapped to form a negative electrode potential area.

The technical proposal is further improved in that the length of the overlapping part of the positive electrode lines is 20-30 mm; the length of the overlapped part of the negative electrode circuit is 20-30 mm.

The technical proposal is further improved in that the anode circuit and the cathode circuit are respectively provided with 5 lines.

The technical scheme is further improved in that the line width of the positive circuit is set to be 50um, and the distance between every two adjacent positive circuits is set to be 50 um.

The technical scheme is further improved in that the line width of the negative electrode circuit is set to be 50um, and the distance between the negative electrode circuits is set to be 50 um.

The technical scheme is further improved in that the size of the opening of the bonding pad is set to be 20mm x 10 mm.

The test board is provided with an insulating layer, and the insulating layer is positioned on the test circuit.

The technical proposal is further improved in that the insulating layer is a green oil layer or a solder resist ink layer.

The technical proposal is further improved in that the insulating layers arranged on the test boards are made of the same or different materials.

The utility model has the following beneficial effects:

the utility model comprises a plurality of test groups, wherein the test groups are respectively provided with a plurality of test boards, the test boards are provided with tool holes for fixing a clamp and L-shaped test circuits, and both ends of each test circuit are provided with a bonding pad and a plurality of anode circuits and cathode circuits which are distributed at intervals and communicated with the bonding pads.

Drawings

FIG. 1 is a schematic view of a test board according to the present invention;

description of reference numerals: 1. the test board, 2, tool hole, 3, test circuit, 31, pad, 32, anode circuit, 33, cathode circuit, 34, anode potential zone, 35, cathode potential zone.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, the structure for testing ion migration resistance described in this embodiment includes a plurality of test groups, the test groups are respectively provided with a plurality of test boards 1, the test boards 1 are provided with tool holes 2 for fixing a fixture and L-shaped test lines 3, and two ends of the test lines 3 are provided with pads 31 and a plurality of anode lines 32 and cathode lines 33 which are distributed at intervals and communicated with the pads 31.

At the position where the positive electrode line 32 is communicated with the bonding pad 31, the lines are overlapped to form a positive electrode potential region 34; at the position where the negative electrode line 33 is communicated with the bonding pad 31, the lines are overlapped to form a negative electrode potential region 35, and specifically, the length of the overlapped part of the positive electrode line 32 is 20-30 mm; the length of the overlapped part of the negative electrode circuit 33 is 20-30mm, and the arrangement of the embodiment can ensure that the positive electrode circuit 32 and the negative electrode circuit 33 are well communicated with the bonding pad 31, thereby ensuring the stability and the reliability of the ion migration resistance test.

Specifically, anodal circuit 32 with negative pole circuit 33 is equipped with 5 respectively, anodal circuit 32's line width is established to 50um, and is adjacent interval between anodal circuit 32 is established to 50um, negative pole circuit 33's line width is established to 50um, and is adjacent interval between negative pole circuit 33 is established to 50um, and the intensive grade of line width interval of the printed wiring board that current consumer electronics used is accorded with in the such setting of this embodiment to effectively ensure the accuracy of test.

The size of the opening of the pad 31 is set to 20mm 10mm, and the arrangement of the present embodiment is stable in contact with an external power source, good in conduction, and capable of conveniently measuring the insulation resistance of the test board, thereby obtaining the ion migration resistance of the product.

The testing board is characterized in that an insulating layer is arranged on the testing board 1 and located on the testing circuit 3, a green oil layer or a solder resist ink layer is arranged on the insulating layer, and the insulating layer is arranged in a plurality of layers which are the same or different in material and are used for testing the ion migration resistance of the same product or different products.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a resistant ion migration test structure, its characterized in that includes a plurality of test groups, and is a plurality of the test group is equipped with a plurality of test boards respectively, be equipped with the instrument hole that is used for anchor clamps to fix on the test board and be the test line of L type, test line both ends be equipped with pad and a plurality of interval distribution, and with anodal circuit and the negative pole circuit of pad intercommunication.

2. The structure according to claim 1, wherein the positive electrode line is connected to the pad at a position where the positive electrode line overlaps with the pad to form a positive electrode potential region; and at the position where the negative electrode circuit is communicated with the bonding pad, the circuits are overlapped to form a negative electrode potential area.

3. The structure according to claim 2, wherein the length of the overlapping portion of the positive electrode lines is 20-30 mm; the length of the overlapped part of the negative electrode circuit is 20-30 mm.

4. The structure according to claim 1, wherein 5 positive electrode lines and 5 negative electrode lines are provided.

5. The structure of claim 1, wherein the line width of the positive electrode lines is set to 50um, and the distance between adjacent positive electrode lines is set to 50 um.

6. The structure of claim 5, wherein the line width of the negative electrode lines is set to 50um, and the distance between adjacent negative electrode lines is set to 50 um.

7. The structure of claim 1, wherein the opening of the pad is 20mm by 10 mm.

8. The structure of claim 1, wherein an insulating layer is disposed on the test board, and the insulating layer is disposed on the test line.

9. The structure of claim 8, wherein the insulating layer is a green oil layer or a solder resist ink layer.

10. The structure of claim 1, wherein the insulating layers disposed on the test boards are made of the same or different materials.