CN216189230U - Feeding mechanism for wafer cutting machine - Google Patents
Feeding mechanism for wafer cutting machine Download PDFInfo
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- CN216189230U CN216189230U CN202122110909.0U CN202122110909U CN216189230U CN 216189230 U CN216189230 U CN 216189230U CN 202122110909 U CN202122110909 U CN 202122110909U CN 216189230 U CN216189230 U CN 216189230U
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- sucker
- feeding
- speed reducer
- servo motor
- cross arm
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Abstract
The utility model provides a feeding mechanism for a wafer cutting machine, which comprises a mounting seat, a servo motor, a speed reducer, a cross arm, a cylinder, a feeding sucker, a discharging sucker, a material waiting position and a working position, wherein the servo motor is arranged on the mounting seat; the speed reducer is fixed on the mounting seat, the servo motor is arranged on the input side of the speed reducer, the cross arm is arranged on the output side of the speed reducer, the servo motor drives the cross arm to rotate, the feeding sucker and the discharging sucker are connected together through two groups of cylinders and the cross arm, and the cylinders drive the feeding sucker and the discharging sucker to move up and down, so that the feeding and discharging movement of the wafer is completed; the cylinder is fixed the both ends of crossing arm to link together material loading sucking disc and unloading sucking disc, treat the material level and snatch the position for the wafer, the work position is the wafer cutting position. The feeding mechanism for the wafer cutting machine can not only complete the feeding process of wafers and the blanking process of products, but also overcome the defects of complicated action flow and low interaction efficiency.
Description
Technical Field
The utility model relates to the technical field of wafer cutting, in particular to a feeding mechanism for a wafer cutting machine.
Background
In the process of wafer processing, after the wafer is taken out from the bin, the wafer needs to be positioned first and then is moved to a working position.
In the material taking process, a tool is generally used for adsorbing a product, then the height of the product is increased, and then the servo lead screw guide rail shaft moves the product from a processing position to a material waiting position; after the product is processed and taken away, the wafer needs to be replaced, namely the wafer is adsorbed by the tool again, then the height of the wafer is raised, the wafer is moved to a processing position from a material waiting position by the servo screw rod guide rail shaft, and then the equipment is started again to process the wafer. The whole flow is complicated and the interaction efficiency is low.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a feeding mechanism for a wafer cutting machine, which is not only capable of completing a feeding process of a wafer and a discharging process of a product, but also capable of overcoming the defects of a complicated operation flow and low interaction efficiency.
In order to solve the technical problems, the utility model adopts the technical scheme that: a feeding mechanism for a wafer cutting machine comprises a mounting seat, a servo motor, a speed reducer, a cross arm, a cylinder, a feeding sucker, a discharging sucker, a material waiting position and a working position;
the speed reducer is fixed on the mounting seat, the servo motor is arranged on the input side of the speed reducer, the cross arm is arranged on the output side of the speed reducer, the servo motor drives the cross arm to rotate, the feeding sucker and the discharging sucker are connected with the cross arm through two groups of cylinders, and the cylinders drive the feeding sucker and the discharging sucker to move up and down, so that the feeding and discharging movement of wafers is completed;
the cylinder is fixed the both ends of crossing arm to with the material loading sucking disc with the unloading sucking disc links together, treat the material level and snatch the position for the wafer, the work position is the wafer cutting position.
Further, the servo motor is arranged on the input side of the speed reducer through a bolt.
Further, the cross arm is disposed on an output side of the speed reducer by a bolt.
Furthermore, the feeding sucker is a vacuum sucker.
Furthermore, the blanking sucker is a vacuum sucker.
Further, the cylinder controls the material taking mechanism to lift.
Furthermore, the servo motor is matched with the speed reducer to drive the material taking mechanism to rotate.
Compared with the prior art, the utility model has the beneficial effects that: overall structure drives through a set of servo motor and reduction gear for material loading sucking disc, unloading sucking disc are respectively from treating material level and work position, snatch simultaneously, rotatory aversion, transfer operations such as wafer, and possess compact structure, maintain easy, the high characteristics of operating efficiency.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a partially enlarged schematic view of the cross arm and cylinder of the present invention.
In the figure: 1. a mounting seat; 2. a servo motor; 3. a speed reducer; 4. a cross arm; 5. a cylinder; 6. a feeding sucker; 7. blanking sucker; 8. waiting for the material level; 9. and (6) a working position.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, a feeding mechanism for a wafer cutting machine comprises a mounting base 1, a servo motor 2, a speed reducer 3, a cross arm 4, a cylinder 5, a feeding sucker 6, a discharging sucker 7, a material waiting position 8 and a working position 9;
the speed reducer 3 is fixed on the mounting seat 1, the servo motor 2 is arranged on the input side of the speed reducer 3, the cross arm 4 is arranged on the output side of the speed reducer 3, the servo motor 2 drives the cross arm 4 to rotate, the feeding sucker 6 and the discharging sucker 7 are connected with the cross arm 4 through two groups of cylinders 5, and the cylinders 5 drive the feeding sucker 6 and the discharging sucker 7 to move up and down, so that the feeding and discharging movement of wafers is completed;
the air cylinder 5 is fixed at two ends of the cross arm 4, so that the feeding sucker 6 is connected with the discharging sucker 7, the material waiting position 8 is a wafer grabbing position, and the working position 9 is a wafer cutting position.
The servo motor 2 is arranged on the input side of the speed reducer 3 through a bolt.
The cross arm 4 is provided on the output side of the speed reducer 3 by a bolt.
The feeding sucker 6 is a vacuum sucker.
The blanking sucker 7 is a vacuum sucker.
And the cylinder 5 controls the material taking mechanism to lift.
The servo motor 2 is matched with the speed reducer 3 to drive the material taking mechanism to rotate.
Compared with the prior art, the utility model has the beneficial effects that: overall structure drives through a set of servo motor 2 and reduction gear 3 for material loading sucking disc 6, unloading sucking disc 7 are respectively from treating material level 8 and work position 9, snatch simultaneously, rotatory aversion, transfer operations such as wafer, and possess compact structure, maintain characteristics easy, that operating efficiency is high.
Concretely, reduction gear 3 is fixed on mount pad 1, and servo motor 2 passes through the bolt fastening in 3 power sides of reduction gear, for whole set of system provides rotary motion, and cross arm 4 is connected to the driven side of reduction gear 3, and cylinder 5 is fixed and is connected material sucking disc 6 and unloading sucking disc 7 and provide elevating movement and accomplish and get the material action at the both ends of cross arm 4, and material sucking disc 6 is from waiting that material level 8 grabs the wafer and put to workstation 9, and unloading sucking disc 7 snatchs the wafer that the processing was accomplished from workstation 9B and puts to waiting material level 8 to accomplish a manufacturing procedure.
The action flow is as follows: the rotating mechanism returns to an initial position firstly, then rotates to a program set position, one air cylinder 5 drives the feeding sucker 6 to descend to grab the wafer from the material waiting position 8 and ascend, meanwhile, the other air cylinder 5 drives the discharging sucker 7 to descend to the working position 9 to grab the product and ascend, the motor rotates to change the positions of the feeding sucker 6 and the discharging sucker 7 to change the positions of the product and the substitute processing wafer, and the air cylinder 5 descends to place the product and the wafer at a designated position to complete the feeding and discharging actions.
Overall structure drives through a set of servo motor 2 and reduction gear 3 for material loading sucking disc 6, unloading sucking disc 7 are respectively from treating material level 8 and work position 9, snatch simultaneously, rotatory aversion, transfer operations such as wafer, and possess compact structure, maintain characteristics easy, that operating efficiency is high.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (7)
1. The utility model provides a feed mechanism for wafer cutting machine which characterized in that: the automatic feeding device comprises a mounting seat (1), a servo motor (2), a speed reducer (3), a cross arm (4), a cylinder (5), a feeding sucker (6), a discharging sucker (7), a material waiting position (8) and a working position (9);
the speed reducer (3) is fixed on the mounting seat (1), the servo motor (2) is arranged on the input side of the speed reducer (3), the cross arm (4) is arranged on the output side of the speed reducer (3), the servo motor (2) drives the cross arm (4) to rotate, the feeding sucker (6) and the discharging sucker (7) are connected with the cross arm (4) through two groups of cylinders (5), and the cylinders (5) drive the feeding sucker (6) and the discharging sucker (7) to move up and down, so that the feeding and discharging movement of wafers is completed;
the cylinder (5) is fixed at the two ends of the cross arm (4), so that the feeding sucker (6) is connected with the discharging sucker (7), the position of the material to be placed (8) is grabbed by a wafer, and the working position (9) is a wafer cutting position.
2. The loading mechanism for wafer cutting machine according to claim 1, characterized in that: the servo motor (2) is arranged on the input side of the speed reducer (3) through a bolt.
3. The loading mechanism for wafer cutting machine according to claim 2, characterized in that: the cross arm (4) is arranged on the output side of the speed reducer (3) through a bolt.
4. The loading mechanism for wafer cutting machine according to claim 3, characterized in that: the feeding sucker (6) is a vacuum sucker.
5. The loading mechanism for wafer cutting machine according to claim 4, characterized in that: the blanking sucker (7) is a vacuum sucker.
6. The loading mechanism for wafer cutting machine according to claim 5, characterized in that: and the cylinder (5) controls the material taking mechanism to lift.
7. The loading mechanism for wafer cutting machine according to claim 6, characterized in that: the servo motor (2) is matched with the speed reducer (3) to drive the material taking mechanism to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122110909.0U CN216189230U (en) | 2021-09-02 | 2021-09-02 | Feeding mechanism for wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122110909.0U CN216189230U (en) | 2021-09-02 | 2021-09-02 | Feeding mechanism for wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216189230U true CN216189230U (en) | 2022-04-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122110909.0U Active CN216189230U (en) | 2021-09-02 | 2021-09-02 | Feeding mechanism for wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216189230U (en) |
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2021
- 2021-09-02 CN CN202122110909.0U patent/CN216189230U/en active Active
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