CN216154124U - Pad pasting adsorption structure, mask version pad pasting structure and system - Google Patents

Abstract

The application provides a pad pasting adsorption structure, mask version pad pasting structure and system, relates to mask version protection technical field. This application is through the top surface of attached base and the pad pasting frame fixed connection who installs the protection film, and the bottom surface and the target mask plate surface contact through this attached base, the recess has been seted up on the bottom surface of this attached base, and install the check valve on the lateral wall surface of attached base, make the cavity space intercommunication that this check valve and this recess cooperation mask plate formed, with provide the air extraction way to this cavity space to evacuation equipment through this check valve, and avoid this cavity space and external air exchange to carry out after evacuation equipment accomplishes the air extraction, adsorb the pad pasting frame on the target mask plate, thereby realize the quick dress that can dismantle between pad pasting frame and the mask plate based on the vacuum adsorption principle, reduce the cost of semiconductor manufacture and the contaminated risk of mask plate.

Description

Pad pasting adsorption structure, mask version pad pasting structure and system

Technical Field

The application relates to the technical field of mask plate protection, in particular to a film pasting adsorption structure, a mask plate film pasting structure and a system.

Background

In the process of manufacturing a semiconductor device, a mask pattern of a mask needs to be mapped onto a substrate by means of exposure, development, and the like to form a corresponding exposure pattern, so as to manufacture a desired semiconductor device.

Currently, the mainstream in the industry is to adhere the film frame to the mask plate through a primer (e.g., silica gel, acrylic adhesive, etc.) to protect the mask plate, but it should be noted that the bonding force of the primer to the surface of the mask plate after being irradiated by a large amount of laser light in the exposure process is greatly increased, so that a large amount of primer remains on the mask plate when the film frame is subsequently removed, manpower is consumed to remove the residual primer by using an organic solvent, the semiconductor manufacturing cost (including the manpower cost and the solvent loss) is increased, and the risk of the mask plate being contaminated by organic matters is also increased.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present application is to provide a film pasting adsorption structure, a mask pasting structure and a system, which can realize fast detachable mounting between a film pasting frame and a mask based on a vacuum adsorption principle, and reduce the manufacturing cost of a semiconductor and the risk of the mask being contaminated.

In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:

in a first aspect, the present application provides a film attachment structure comprising an attachment base and a check valve;

the top end surface of the attachment base is fixedly connected with an attachment film frame provided with a protective film;

the bottom end surface of the attaching base is provided with a groove, and the bottom end surface of the attaching base is contacted with the surface of the target mask plate;

the check valve is installed on the outer surface of the side wall of the attaching base and is communicated with a hollow space formed by the groove matched with the target mask, wherein the check valve is used for providing an air extraction path for the hollow space for the vacuumizing equipment, and the air exchange between the hollow space and the outside is avoided after the vacuumizing equipment finishes air extraction, so that the film pasting frame is adsorbed on the target mask.

In an optional embodiment, the film-attached adsorption structure further comprises a flexible connector, wherein the flexible connector comprises a first connector surface and a second connector surface which are opposite in position;

the surface of the bottom end of the attaching base is in contact with the surface of the target mask plate through the surface of a second connecting piece of the flexible connecting piece;

and the flexible connecting piece is provided with a connecting piece through hole which penetrates through the surface of the first connecting piece and the surface of the second connecting piece, wherein the connecting piece through hole is communicated with the groove.

In an alternative embodiment, the number of said connector through holes communicating with the same said recess is at least one.

In an alternative embodiment, the number of said grooves is at least one, and the number of said non-return valves communicating with the same said groove is at least one.

In a second aspect, the present application provides a mask pasting structure, comprising a pasting frame with a protection film, and the pasting adsorption structure of any one of the foregoing embodiments;

the top surface of the attached base that the pad pasting adsorption structure includes with pad pasting frame fixed connection, the bottom surface of the attached base that the pad pasting adsorption structure includes contacts with target mask version surface for will under the air extraction effect of evacuation equipment the pad pasting frame adsorbs on the target mask version.

In an optional embodiment, the number of the film adhering and absorbing structures is one, an adhering base included in each film adhering and absorbing structure is a frame-shaped structure matched with the size of the film adhering frame, a groove distributed in a frame shape is formed in each film adhering and absorbing structure, and the number of the check valves included in each film adhering and absorbing structure is even;

any one check valve group in the even number of check valves is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single check valve group comprises two check valves which are arranged on the sticking base and are opposite in mounting position.

In an optional embodiment, the number of the film attaching adsorption structures is one, an attaching base included in the film attaching adsorption structures is a frame-shaped structure matched with the size of the film attaching frame, and an even number of grooves are formed in the film attaching adsorption structures;

any one of the even number of the groove groups is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single groove group comprises two grooves which are arranged on the sticking base and are opposite in position.

In an alternative embodiment, any one of the check valve sets in all the check valves communicated with the same groove group is symmetrical about the center line of the long frame or the center line of the short frame of the film sticking frame, wherein a single check valve set comprises two check valves which are arranged on the sticking base in opposite positions.

In an alternative embodiment, the number of the film attaching adsorption structures is an even number;

any one adsorption structure group in the even number of the film sticking adsorption structures is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single adsorption structure group comprises two film sticking adsorption structures which are opposite in position.

In a third aspect, the present application provides a reticle film pasting system comprising a vacuum pumping device and a reticle film pasting structure according to any one of the preceding embodiments;

the mask pasting structure is in contact with the surface of a target mask and is adsorbed on the target mask under the air extraction action of the vacuum-pumping equipment.

In this case, the beneficial effects of the embodiments of the present application include the following:

this application is through the top surface of attached base and the pad pasting frame fixed connection who installs the protection film, and the bottom surface and the target mask plate surface contact through this attached base, the recess has been seted up on the bottom surface of this attached base, and install the check valve on the lateral wall surface of attached base, make the cavity space intercommunication that this check valve and this recess cooperation mask plate formed, with provide the air extraction way to this cavity space to evacuation equipment through this check valve, and avoid this cavity space and external air exchange to carry out after evacuation equipment accomplishes the air extraction, adsorb the pad pasting frame on the target mask plate, thereby realize the quick dress that can dismantle between pad pasting frame and the mask plate based on the vacuum adsorption principle, reduce the cost of semiconductor manufacture and the contaminated risk of mask plate.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a film attachment adsorption structure provided in an embodiment of the present application;

fig. 2 is a second schematic structural view of a film attaching adsorption structure provided in the embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a reticle pasting structure provided by an embodiment of the present application;

FIG. 4 is a second schematic cross-sectional view of a mask blank pasting structure provided in the present application;

fig. 5 is a third schematic cross-sectional view of a mask blank film structure provided in the embodiment of the present application.

Icon: 10-a film sticking frame; 20-target mask; 100-a film-attached adsorption structure; 110-attaching a base; 111-grooves; 120-a check valve; 130-a flexible connection; 131-connector through holes; 200-mask pasting structure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used in an orientation or positional relationship as indicated in the drawings, or as would be ordinarily understood by those skilled in the art, simply for convenience in describing and simplifying the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present application.

Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a film attaching adsorption structure 100 according to an embodiment of the present disclosure. In the embodiment of the present application, the film attaching structure 100 may be used to implement a fast detachable mounting between the film attaching frame 10 and the target mask 20, so as to reduce the manufacturing cost of the semiconductor and the risk of contamination of the mask. Wherein, pad pasting adsorption structure 100 can be including attached base 110 and check valve 120, attached base 110 with check valve 120 mutually supports and realizes aforementioned dress function of can dismantling fast based on the vacuum adsorption principle.

In this embodiment, the top surface of the attaching base 110 is fixedly connected to the film attaching frame 10 with a protection film, wherein the attaching base 110 and the film attaching frame 10 are fixed by adhesion, fastening, integral molding, or the like.

In this embodiment, the bottom surface of the attachment base 110 and the surface of the target reticle 20 are detachably contacted, and the bottom surface and the top surface of the attachment base 110 face away from each other. The bottom end surface of the attachment base 110 is provided with a groove 111, and the groove 111 cooperates with the surface of the target mask 20 to form a hollow space of the attachment base 110 when the bottom end surface contacts with the surface of the target mask 20. The number of the grooves 111 that can be opened on a single attachment base 110 is at least one, and each groove 111 correspondingly cooperates with the surface of the target reticle 20 to form a hollow space. The attaching base 110 may be made of hard metal, hard plastic, or the like.

In this embodiment, for a single attachment base 110, the check valve 120 may be installed on an outer surface of a sidewall of the attachment base 110, and the check valve 120 and the corresponding groove 111 are communicated with a hollow space formed by matching the surface of the target mask 20, so as to provide an air extraction path for the hollow space communicated with the check valve 120 to a vacuum-pumping device through the check valve 120, and the vacuum-pumping device extracts air in the hollow space through the check valve 120, so that after the air extraction is completed by the vacuum-pumping device, air exchange between the corresponding hollow space and the outside is avoided based on a characteristic of the check valve 120, so that the attachment base 110 can maintain a vacuum adsorption state, and the film attachment frame 10 is adsorbed on the target mask 20. Each check valve 120 is correspondingly communicated with a hollow space, that is, the number of the check valves 120 communicated with the same groove 111 is at least one, and the outer surface of the side wall of the attachment base 110 is located between the plane where the top end surface is located and the plane where the bottom end surface is located.

Therefore, the pasting film adsorption structure 100 can be used for realizing the quick detachable mounting between the pasting film frame 10 and the target mask plate 20 based on the vacuum adsorption principle, the phenomenon that a large amount of primer is remained when the pasting film frame 10 is detached in the prior art is avoided, and the manufacturing cost of a semiconductor and the risk that the mask plate is polluted are reduced.

Optionally, referring to fig. 2, fig. 2 is a second schematic structural view of the film attaching adsorption structure 100 provided in the embodiment of the present application. In this embodiment, compared with the film-attached adsorption structure 100 shown in fig. 1, in the film-attached adsorption structure 100 shown in fig. 2, the film-attached adsorption structure 100 shown in fig. 2 may further include a flexible connecting member 130, so that when the film-attached frame 10 is attached to the target mask 20, the flexible connecting member 130 prevents the surface of the target mask 20 from being damaged.

In this embodiment, the flexible connecting member 130 includes a first connecting member surface and a second connecting member surface opposite to each other, wherein the first connecting member surface of the flexible connecting member 130 is fixedly connected to the bottom end surface of the attaching base 110, and the bottom end surface of the attaching base 110 is in surface contact with the target mask 20 through the second connecting member surface of the flexible connecting member 130, so that the flexible connecting member 130 is used as a cushion pad for the attaching base 110 and the target mask 20, and the hard attaching base 110 is prevented from being damaged when pressing the surface of the target mask 20 under the vacuum adsorption effect. The flexible connecting element 130 may be formed in the form of a flexible rubber mat.

In this embodiment, in order to ensure that the film-attached adsorption structure 100 shown in fig. 2 can be effectively adsorbed on the target mask 20 under the action of the vacuum-pumping device, the flexible connecting member 130 fixedly connected to the attachment base 110 is provided with a connecting member through hole 131 penetrating through the surfaces of the first connecting member and the second connecting member, so that the provided connecting member through hole 131 is communicated with at least one groove 111 provided on the attachment base 110, and the connecting member through hole 131 is used as a communication channel corresponding to the groove 111 and the surface of the target mask 20, thereby ensuring the formation of a corresponding hollow space.

The projection range of the single connector through hole 131 on the surface of the target mask 20 is partially overlapped with the projection range of one or more grooves 111 on the surface of the target mask 20, which are formed in the attachment base 110. In one embodiment of the present embodiment, a single groove 111 may communicate with only one connector through-hole 131. In another embodiment of this embodiment, a single groove 111 may simultaneously communicate with a plurality of connector through-holes 131, and the same connector through-hole 131 may simultaneously communicate with a plurality of grooves 111.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of a reticle pasting structure 200 according to an embodiment of the present application. In this application embodiment, mask version pad pasting structure 200 can be including the above-mentioned pad pasting frame 10 and the above-mentioned arbitrary pad pasting adsorption structure 100 that install the protection film, the top surface of the attached base 110 that pad pasting adsorption structure 100 included with pad pasting frame 10 fixed connection, the bottom surface of the attached base 110 that pad pasting adsorption structure 100 included with target mask version 20 surface detachable contact for will under the air extraction effect of evacuation equipment pad pasting frame 10 adsorbs on target mask version 20.

Optionally, as shown in fig. 3, the number of the film attaching structures 100 included in the mask attaching structure 200 and fixed to the film attaching frame 10 may be only one, and at this time, in order to ensure the stable connection between the film attaching structures 100 and the film attaching frame 10, the attaching base 110 included in the film attaching structures 100 may be set to be a frame-shaped structure matched with the size of the film attaching frame 10, so that the top end surface of the attaching base 110 and the single-side frame surface of the film attaching frame 10 are fixed, and the protective film mounted on the film attaching frame 10 is surrounded by the top end of the attaching base 110. At this time, as shown in fig. 3, the number of the grooves 111 in the attachment base 110 may be only one by arranging the grooves 111 in the attachment base 110 in a frame-shaped distribution (i.e., a square distribution).

Then, in order to ensure that the adsorption force applied to the target mask 20 by the mask pasting structure 200 shown in fig. 3 under the action of the vacuum pumping equipment is uniformly distributed, so that the mask pasting structure 200 can be stably adsorbed on the target mask 20, the number of the check valves 120 in the mask pasting structure 200, which are communicated with the grooves 111 of the attaching base 110, is set to be an even number not less than 2, and the check valves 120 are grouped according to the distribution condition of the even number of the check valves 120 on the attaching base 110, so that the even number of the check valves 120 are divided into at least one check valve group, wherein a single check valve group comprises two check valves 120 which are installed on the attaching base 110 at opposite positions.

In this process, two check valves 120 included in any one of the divided at least one check valve group are symmetrical with respect to the long-frame central line or the short-frame central line of the mask frame 10 (as shown in fig. 3, two check valves 120 included in the check valve group located above the short-frame central line are symmetrical with respect to the long-frame central line, and two check valves 120 included in the check valve group located below the short-frame central line are symmetrical with respect to the long-frame central line), so that the adsorption force applied to the target mask 20 by the mask pasting structure 200 under the action of the vacuum pumping device is uniformly distributed. Wherein, long frame central line is for running through simultaneously the straight line of two respective central points of longer frame in the pad pasting frame 10, short frame central line is for running through simultaneously the straight line of two respective central points of shorter frame in the pad pasting frame 10.

Optionally, referring to fig. 4, fig. 4 is a second schematic cross-sectional view of a reticle pasting structure 200 provided in the embodiment of the present application. In the embodiment of the present application, the mask pasting structure 200 includes and the pasting adsorption structure 100 fixed to the pasting frame 10 may only have one number, and at this time, for ensuring the pasting adsorption structure 100 and the firm connection of the pasting frame 10, the pasting adsorption structure 100 includes the attached base 110 which can be set to the frame-shaped structure matched with the pasting frame 10 in size, so that the top surface of the attached base 110 and the single-side frame surface of the pasting frame 10 are fixed, and the top of the attached base 110 is right to surround the protection film installed on the pasting frame 10. At this time, as shown in fig. 4, a plurality of grooves 111 may be provided in the attachment base 110.

Then, in order to ensure that the distribution of the adsorption force exerted on the target mask 20 by the mask pasting structure 200 shown in fig. 4 under the action of the vacuum-pumping equipment is uniform, so that the mask pasting structure 200 can be stably adsorbed on the target mask 20, the number of the grooves 111 in the mask pasting structure 200 can be set to be an even number not less than 2, and the grooves 111 can be grouped according to the distribution condition of the even number of the grooves 111 on the attaching base 110, so that the even number of the grooves 111 are divided into at least one groove group, wherein a single groove group comprises two grooves 111 which are arranged on the attaching base 110 and have opposite positions.

In this process, two grooves 111 included in any one of the at least one divided groove group are symmetrical with respect to the long frame center line or the short frame center line of the mask frame 10 (as shown in fig. 4, two grooves 111 included in the groove group located above the short frame center line are symmetrical with respect to the long frame center line, and two grooves 111 included in the groove group located below the short frame center line are symmetrical with respect to the long frame center line), so that the plurality of grooves 111 included in the mask film pasting structure 200 are uniformly distributed in the suction force applied to the target mask 20 by the vacuum pumping device.

In an embodiment of this embodiment, in order to ensure that the overall structure of the mask pasting structure 200 shown in fig. 4 is stable when the mask pasting structure 200 is attached to the surface of the target mask 20, all the check valves 120 (i.e., at least one check valve 120 in which two grooves 111 included in the same groove group are respectively communicated) in the mask pasting structure 200 shown in fig. 4 that are communicated with each other in the same groove group may be grouped according to the distribution of their positions on the attachment base 110, so that the check valves 120 are divided into at least one check valve group, where a single check valve group includes two check valves 120 installed on the attachment base 110 at opposite positions, and the number of the check valves 120 in which two grooves 111 included in the same groove group are respectively communicated is the same. Meanwhile, two check valves 120 included in any one of the divided at least one check valve group are symmetrical with respect to the long-frame central line or the short-frame central line of the mask frame 10 (as shown in fig. 4, two check valves 120 included in the check valve group located above the short-frame central line are symmetrical with respect to the long-frame central line, and two check valves 120 included in the check valve group located below the short-frame central line are symmetrical with respect to the long-frame central line), so that the mask pasting structure 200 can be maintained in a stable structure under the action of the vacuum pumping device.

Optionally, referring to fig. 5, fig. 5 is a third schematic cross-sectional view of a reticle pasting structure 200 according to an embodiment of the present application. In the embodiment of the present application, the number of the film attaching structures 100 included in the mask attaching structure 200 and fixed to the film attaching frame 10 may be plural, and plural top surfaces of the attaching bases 110 included in the film attaching structures 100 are simultaneously fixed to the surface of the single-side frame of the film attaching frame 10, and the protective films installed on the film attaching frame 10 are surrounded and surrounded by the mutual cooperation of the respective tops of the plural attaching bases 110.

In order to ensure that the adsorption force exerted on the target mask 20 by the mask pasting structure 200 shown in fig. 5 under the action of the vacuum-pumping device is uniformly distributed, so that the mask pasting structure 200 can be stably adsorbed on the target mask 20, the pasting adsorption structures 100 in the mask pasting structure 200 may be set to be an even number not less than 2, and the even number of the pasting adsorption structures 100 may be grouped according to the distribution condition of the even number of the pasting adsorption structures 100 on the pasting frame 10, so that the even number of the pasting adsorption structures 100 are divided into at least one adsorption structure group, wherein a single adsorption structure group includes two pasting adsorption structures 100 with opposite positions on the pasting frame 10.

Meanwhile, the two film attachment adsorption structures 100 included in any one of the at least one partitioned adsorption structure group are symmetrical with respect to the long frame central line or the short frame central line of the film attachment frame 10 (as shown in fig. 5, the two film attachment adsorption structures 100 included in the adsorption structure group located above the short frame central line are symmetrical with respect to the long frame central line, and the two film attachment adsorption structures 100 included in the adsorption structure group located below the short frame central line are symmetrical with respect to the long frame central line), so that the film attachment structure 200 can also be stably adsorbed on the target mask 20 under the action of the vacuum pumping device.

Therefore, the mask pasting structure 200 shown in fig. 3, 4 or 5 can be used for realizing the quick detachable pasting between the pasting frame 10 and the target mask 20 based on the vacuum adsorption principle, so that the phenomenon that a large amount of primer is remained when the pasting frame 10 is detached in the prior art is avoided, and the manufacturing cost of semiconductors and the risk of mask pollution are reduced.

In this application, this application embodiment still provides a mask version pad pasting system, mask version pad pasting system includes evacuation equipment and above-mentioned arbitrary mask version pad pasting structure 200, mask version pad pasting structure 200 and the surperficial detachable contact of target mask version 20, and the air extraction effect of evacuation equipment is down adsorbed on target mask version 20, it is right to realize the dustproof guard action of target mask version 20.

In summary, in the film-attached adsorption structure, the mask film-attached structure and the system provided in the embodiments of the present application, the application is fixedly connected with the film sticking frame provided with the protective film through the top end surface of the sticking base and is contacted with the surface of the target mask plate through the bottom end surface of the sticking base, the bottom surface of the attaching base is provided with a groove, then a check valve is arranged on the outer surface of the side wall of the attaching base, so that the check valve is communicated with a hollow space formed by the groove and the mask plate, so as to provide an air extraction path aiming at the hollow space for the vacuum-pumping equipment through the check valve, and prevent the hollow space from exchanging air with the outside after the vacuum-pumping equipment finishes air extraction, and the film-sticking frame is adsorbed on the target mask plate, therefore, the fast detachable mounting between the film pasting frame and the mask plate is realized based on the vacuum adsorption principle, and the manufacturing cost of the semiconductor and the risk of the pollution of the mask plate are reduced.

The above description is only for various embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present application, and all such changes or substitutions are included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A film adsorption structure is characterized by comprising an attachment base and a check valve;

the top end surface of the attachment base is fixedly connected with an attachment film frame provided with a protective film;

the bottom end surface of the attaching base is provided with a groove, and the bottom end surface of the attaching base is contacted with the surface of the target mask plate;

the check valve is installed on the outer surface of the side wall of the attaching base and is communicated with a hollow space formed by the groove matched with the target mask, wherein the check valve is used for providing an air extraction path for the hollow space for the vacuumizing equipment, and the air exchange between the hollow space and the outside is avoided after the vacuumizing equipment finishes air extraction, so that the film pasting frame is adsorbed on the target mask.

2. The decal suction structure according to claim 1, further comprising a flexible connecting member, said flexible connecting member comprising a first connecting member surface and a second connecting member surface located opposite to each other;

the surface of the bottom end of the attaching base is in contact with the surface of the target mask plate through the surface of a second connecting piece of the flexible connecting piece;

and the flexible connecting piece is provided with a connecting piece through hole which penetrates through the surface of the first connecting piece and the surface of the second connecting piece, wherein the connecting piece through hole is communicated with the groove.

3. The film attaching suction structure as set forth in claim 2, wherein the number of the connector through holes communicating with the same groove is at least one.

4. The film attaching suction structure as set forth in any one of claims 1 to 3, wherein the number of said grooves is at least one, and the number of said check valves communicating with the same said groove is at least one.

5. A mask pasting structure is characterized by comprising a pasting frame provided with a protective film and the pasting adsorption structure of any one of claims 1-4;

the top surface of the attached base that the pad pasting adsorption structure includes with pad pasting frame fixed connection, the bottom surface of the attached base that the pad pasting adsorption structure includes contacts with target mask version surface for will under the air extraction effect of evacuation equipment the pad pasting frame adsorbs on the target mask version.

6. The mask pasting structure of claim 5, wherein the number of the pasting adsorption structures is one, the pasting adsorption structures comprise pasting bases which are frame-shaped structures matched with the pasting frame in size, a frame-shaped distribution groove is formed in the pasting adsorption structures, and the number of the check valves comprised by the pasting adsorption structures is even;

any one check valve group in the even number of check valves is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single check valve group comprises two check valves which are arranged on the sticking base and are opposite in mounting position.

7. The mask pasting structure of claim 6, wherein the number of the pasting adsorption structures is one, the pasting adsorption structures comprise pasting bases which are frame-shaped structures matched with the pasting frame in size, and an even number of grooves are formed in the pasting adsorption structures;

any one of the even number of the groove groups is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single groove group comprises two grooves which are arranged on the sticking base and are opposite in position.

8. The mask pasting structure of claim 7, wherein any one of the check valve sets of all the check valves communicated with the same groove set is symmetrical with respect to the center line of the long frame or the center line of the short frame of the pasting frame, and wherein a single check valve set comprises two check valves installed on the pasting base at opposite positions.

9. The mask pasting structure according to claim 5, wherein the number of pasting adsorption structures is even;

any one adsorption structure group in the even number of the film sticking adsorption structures is symmetrical about the central line of the long frame or the central line of the short frame of the film sticking frame, wherein the single adsorption structure group comprises two film sticking adsorption structures which are opposite in position.

10. A reticle film pasting system, characterized in that the reticle film pasting system comprises a vacuum pumping device and a reticle film pasting structure according to any one of claims 5 to 9;

the mask pasting structure is in contact with the surface of a target mask and is adsorbed on the target mask under the air extraction action of the vacuum-pumping equipment.

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