CN216145510U

CN216145510U - Ceramic capacitor with wear-resisting outer seal layer

Info

Publication number: CN216145510U
Application number: CN202121611125.XU
Authority: CN
Inventors: 张永攀
Original assignee: Suzhou Qirong Electronic Technology Co ltd
Current assignee: Suzhou Qirong Electronic Technology Co ltd
Priority date: 2021-07-15
Filing date: 2021-07-15
Publication date: 2022-03-29
Anticipated expiration: 2031-07-15

Abstract

The utility model relates to the technical field of capacitors, in particular to a ceramic capacitor with a wear-resistant outer sealing layer, which comprises a capacitor core body and the wear-resistant outer sealing layer which encapsulates the capacitor core body and is made of insulating materials, wherein the capacitor core body comprises a ceramic base layer and two conductive silver electrodes clamped on two sides of the ceramic base layer, two pins which are electrically connected with the two conductive silver electrodes are arranged on the capacitor core body, semiconductor refrigerating pieces are arranged on one sides of the two conductive silver electrodes, which are far away from the ceramic base layer, the cold surfaces of the semiconductor refrigerating pieces are attached to the conductive silver electrodes, an epoxy resin layer which encapsulates the conductive silver electrodes and the ceramic base layer together is arranged outside the ceramic base layer, and the hot surfaces of the semiconductor refrigerating pieces protrude out of the epoxy resin layer. According to the utility model, the semiconductor refrigeration pieces are arranged on the two sides of the ceramic base layer, so that when the capacitor core works, the semiconductor refrigeration pieces can effectively improve the heat dissipation efficiency of the capacitor core when the capacitor core works, and the capacitor core is prevented from being punctured finally when being in a high-temperature environment when working.

Description

Ceramic capacitor with wear-resisting outer seal layer

Technical Field

The utility model relates to the technical field of capacitors, in particular to a ceramic capacitor with a wear-resistant outer sealing layer.

Background

The ceramic capacitor comprises a high-voltage capacitor and a low-voltage capacitor, the high-voltage capacitor is used as a basic high-voltage electronic element and widely applied to the fields of power equipment, pulse power, high-frequency voltage-multiplying rectification and the like, an outer sealing layer of the existing high-voltage ceramic capacitor is thin, the situation of abrasion and breakage easily occurs, and once the outer sealing layer is abraded and broken, the whole capacitor cannot be used.

The patent with the prior publication number of CN208580668U discloses an environment-friendly high-voltage ceramic capacitor, and a thickened outer sealing layer arranged outside a ceramic substrate can increase the thickness of the outer sealing layer of the whole ceramic capacitor body, so that the outer sealing layer of the ceramic capacitor body is not easy to break and damage and has long service life. However, the increase of the thickness of the outer sealing layer seriously limits the heat conduction of the high-voltage ceramic capacitor, and particularly for the high-power high-voltage ceramic capacitor, a large amount of heat is generated during working and is not easy to be conducted out through the outer sealing layer, so that the temperature of the ceramic core of the capacitor is continuously increased, the ceramic core is finally broken down, and the service life of the capacitor is shortened.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides the ceramic capacitor with the wear-resistant outer sealing layer, which can improve the heat dissipation efficiency of the capacitor core body during working and solve the problem of poor heat dissipation effect of the existing capacitor core body.

In order to achieve the purpose of improving the heat dissipation efficiency of the capacitor core during working, the utility model provides the following technical scheme: the utility model provides a ceramic capacitor with wear-resisting outer envelope, includes the electric capacity core and will the wear-resisting outer envelope that the adoption insulating material of electric capacity core encapsulation was made, the electric capacity core includes ceramic basic unit and presss from both sides and locates two electrically conductive silver poles of ceramic basic unit both sides, be equipped with on the electric capacity core with two pins that electrically conductive silver pole electricity is connected, two electrically conductive silver pole is kept away from one side of ceramic basic unit all is equipped with the semiconductor refrigeration piece, the semiconductor refrigeration piece cold side with electrically conductive silver pole laminates mutually, ceramic basic unit outside be equipped with electrically conductive silver pole with the epoxy layer that ceramic basic unit encapsulation is in the same place, semiconductor refrigeration piece hot side salient in epoxy layer outside.

Optionally, the two semiconductor refrigeration pieces are connected in parallel with the two pins of the capacitor core, and the rated voltages of the semiconductor refrigeration pieces and the capacitor core are the same.

Optionally, the whole cold surface of the semiconductor refrigeration piece is bonded and fixed with the conductive silver electrode through heat-conducting silicone grease.

Optionally, the wear-resisting outer seal layer is located including the cover the outside shell body of electric capacity core is located with the cover pin supporting part on the pin, the shell body includes semicircular lower casing and last casing, down the casing with the pin supporting part is connected, go up the casing with the block is fixed down between the casing.

Optionally, a plurality of heat dissipation holes communicating the inside of the shell with the outside are formed in the two surfaces of the shell, the heat dissipation holes are evenly distributed in the two surfaces of the shell, and the heat dissipation holes are opposite to the hot surface of the semiconductor refrigeration piece.

Optionally, two clamping blocks are integrally formed on two sides of the opening of the upper shell, and a clamping groove corresponding to the clamping block is formed in the lower shell.

Optionally, the pin supporting portion includes two hollow insertion rods fixedly disposed on the lower casing and a U-shaped sleeve seat in insertion fit with the insertion rods, two through holes capable of accommodating pins are disposed on one side of the sleeve seat away from the insertion rods and communicated with the inside of the sleeve seat, and a mounting hole is disposed on the sleeve seat between the two through holes.

Compared with the prior art, the utility model provides a ceramic capacitor with a wear-resistant outer sealing layer, which has the following beneficial effects:

1. according to the utility model, the semiconductor refrigeration pieces are arranged on the two sides of the ceramic base layer, so that when the capacitor core works, the semiconductor refrigeration pieces can effectively improve the heat dissipation efficiency of the capacitor core when the capacitor core works, and the capacitor core is prevented from being in a high-temperature environment when working and finally being broken down;

2. according to the utility model, the two semiconductor refrigeration pieces are connected in parallel with the two pins of the capacitor core body, and the rated voltages of the semiconductor refrigeration pieces and the capacitor core body are the same, so that the semiconductor refrigeration pieces can be opened and closed along with the opening and closing of the capacitor core body, and meanwhile, the timely heat dissipation of the capacitor core body is ensured;

3. according to the utility model, the wear-resistant outer sealing layer made of the insulating material is packaged outside the capacitor core, and the capacitor core and the pins of the capacitor core are completely packaged by the outer shell and the pin supporting parts, so that the capacitor core is not easily damaged by external force after being installed, and the service life of the capacitor core is prolonged.

Drawings

FIG. 1 is a schematic view of the overall split structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a schematic side sectional view of a capacitive core according to the present invention;

fig. 4 is a partial structural schematic diagram of the present invention.

In the figure: 1. a capacitor core; 11. a ceramic base layer; 12. a conductive silver electrode; 13. an epoxy resin layer; 2. a pin; 3. a semiconductor refrigeration sheet; 4. heat-conducting silicone grease; 5. an outer housing; 51. a lower housing; 52. an upper housing; 53. heat dissipation holes; 6. a clamping block; 7. a card slot; 8. a pin support part; 81. inserting a rod; 82. a sleeve seat; 83. mounting holes; 84. and (6) perforating.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b): referring to fig. 1 to 4, an embodiment of the present invention provides a technical solution: a ceramic capacitor with a wear-resistant outer sealing layer comprises a capacitor core body 1 and a wear-resistant outer sealing layer which encapsulates the capacitor core body 1 and is made of insulating materials, wherein the capacitor core body 1 comprises a ceramic base layer 11 and two conductive silver electrodes 12 which are clamped on two sides of the ceramic base layer 11, two pins 2 which are electrically connected with the two conductive silver electrodes 12 are arranged on the capacitor core body 1, semiconductor refrigerating sheets 3 are respectively arranged on one sides of the two conductive silver electrodes 12 far away from the ceramic base layer 11, the cold surfaces of the semiconductor refrigerating sheets 3 are attached to the conductive silver electrodes 12, an epoxy resin layer 13 which encapsulates the conductive silver electrodes 12 and the ceramic base layer 11 together is arranged outside the ceramic base layer 11, the hot surfaces of the semiconductor refrigerating sheets 3 protrude out of the epoxy resin layer 13, at 1 during operation of electric capacity core, start semiconductor refrigeration piece 3, semiconductor refrigeration piece 3 can the effectual radiating efficiency who improves 1 during operation of electric capacity core to avoid 1 during operation of electric capacity core to be in high temperature environment and finally lead to being punctured.

In order to facilitate the control that semiconductor refrigeration piece 3 opened and close, parallelly connected between two pins 2 of two semiconductor refrigeration pieces 3 of this embodiment and electric capacity core 1, and semiconductor refrigeration piece 3 is the same with electric capacity core 1's rated voltage, and so, semiconductor refrigeration piece 3 can open and close along with opening and close of electric capacity core 1, need not connect external power source in addition, has guaranteed electric capacity core 1's timely heat dissipation simultaneously.

In order to further improve the heat dissipation effect, the whole cold face of semiconductor refrigeration piece 3 of this embodiment is fixed with electrically conductive silver utmost point 12 between bonding through heat conduction silicone grease 4, and heat conduction silicone can avoid appearing the clearance between semiconductor refrigeration piece 3 and the electrically conductive silver utmost point 12 to more be favorable to thermal conduction, make the heat dissipation of electric capacity core 1 obtain further optimization.

In order to make electric capacity core 1 installation back not fragile, the wear-resisting outer seal of this embodiment locates electric capacity core 1 outside shell body 5 and the pin supporting part 8 on pin 2 is located to the cover, shell body 5 is including semicircular lower casing 51 and last casing 52, lower casing 51 is connected with pin supporting part 8, it is fixed to go up the block between casing 52 and the lower casing 51, the opening both sides integrated into one piece of going up casing 52 is equipped with two fixture blocks 6, seted up the draw-in groove 7 corresponding with fixture block 6 on the lower casing 51, utilize shell body 5 and pin supporting part 8 to encapsulate electric capacity core 1 and pin 2 completely, make electric capacity core 1 difficult damaged by external force after the installation.

In order to guarantee the radiating effect of electric capacity core 1, a plurality of radiating hole 53 with its inside and external intercommunication is all seted up on 5 two sides of shell body of this embodiment, and a plurality of radiating hole 53 evenly distributed is on 5 two sides of shell body, and radiating hole 53 is relative with the hot side of semiconductor refrigeration piece 3, and the setting of radiating hole 53 is favorable to the heat of refrigeration piece hot side to arrange to the inside heat effluvium of shell body 5 to guarantee the radiating effect of electric capacity core 1.

In order to improve the bending resistance of the pin 2, the pin 2 supporting portion of the embodiment includes two hollow insertion rods 81 fixedly disposed on the lower housing 51 and a U-shaped sleeve seat 82 in insertion fit with the insertion rods 81, one side of the sleeve seat 82 far away from the insertion rods 81 is provided with two through holes 84 capable of accommodating the pin 2, which are communicated with the inside of the sleeve seat, the sleeve seat 82 between the two through holes 84 is provided with a mounting hole 83, the sleeve seat 82 is mounted on the circuit board by being inserted into the mounting hole 83 through a bolt, because the pin 2 is completely encapsulated by the pin supporting portion 2, the pin 2 can be prevented from being corroded, the pin 2 can be prevented from being bent or even twisted off due to external force applied to the capacitor core 1, and the strength of the pin 2 is improved.

The working principle is as follows: firstly, one end of two pins 2 of a capacitor core 1 is inserted into an insert rod 81 in a lower shell 51, the two ends penetrate through a through hole 84 at the bottom of a sleeve seat 82 at one end of the insert rod 81 and then are welded on a circuit board, a capacitor is integrally installed on the circuit board by inserting a bolt into an installation hole 83, and finally, an upper shell 52 is fixed on the lower shell 51 by matching and clamping a clamping block 6 and a clamping groove 7, so that the capacitor core 1 and the pins 2 thereof are completely encapsulated, the capacitor core 1 is not easy to be damaged by external force after installation, when the capacitor core 1 works, a semiconductor refrigeration sheet 3 is started, the semiconductor refrigeration sheet 3 can effectively improve the working heat dissipation efficiency of the capacitor core 1, and the capacitor core 1 is prevented from being in a high-temperature environment and finally being punctured when the capacitor core 1 works, meanwhile, because the two semiconductor refrigeration sheets 3 are connected in parallel with the two pins 2 of the capacitor core 1, and the rated voltage of the semiconductor refrigeration sheets 3 is the same as that of the capacitor core 1, therefore, the semiconductor refrigeration piece 3 can be opened and closed along with the opening and closing of the capacitor core body 1, an external power supply is not needed to be connected additionally, the timely heat dissipation of the capacitor core body 1 is guaranteed, and the opening and closing of the semiconductor refrigeration piece 3 can be controlled better.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A ceramic capacitor with a wear-resistant outer sealing layer is characterized in that: comprises a capacitor core body (1) and a wear-resistant outer sealing layer which encapsulates the capacitor core body (1) and is made of insulating materials, the capacitor core body (1) comprises a ceramic base layer (11) and two conductive silver electrodes (12) clamped on two sides of the ceramic base layer (11), two pins (2) electrically connected with the two conductive silver electrodes (12) are arranged on the capacitor core body (1), semiconductor refrigerating sheets (3) are arranged on one sides of the two conductive silver electrodes (12) far away from the ceramic base layer (11), the cold surface of the semiconductor refrigeration sheet (3) is attached to the conductive silver electrode (12), an epoxy resin layer (13) which encapsulates the conductive silver electrode (12) and the ceramic substrate (11) is arranged outside the ceramic substrate (11), the hot surface of the semiconductor refrigeration sheet (3) protrudes out of the epoxy resin layer (13).

2. A ceramic capacitor having a wear resistant outer cover as claimed in claim 1, wherein: the two semiconductor refrigeration pieces (3) are connected with the two pins (2) of the capacitor core body (1) in parallel, and the rated voltage of the semiconductor refrigeration pieces (3) is the same as that of the capacitor core body (1).

3. A ceramic capacitor having a wear resistant outer cover as claimed in claim 1, wherein: the whole cold surface of the semiconductor refrigeration piece (3) is fixedly bonded with the conductive silver electrode (12) through the heat-conducting silicone grease (4).

4. A ceramic capacitor having a wear resistant outer cover as claimed in claim 1, wherein: wear-resisting outer seal is located including the cover outer shell (5) of electric capacity core (1) outside is located with the cover pin supporting part (8) on pin (2), shell body (5) are including semicircular lower casing (51) and last casing (52), lower casing (51) with pin supporting part (8) are connected, go up casing (52) with the block is fixed down between casing (51).

5. The ceramic capacitor with a wear resistant outer cover according to claim 4, wherein: the semiconductor refrigeration device is characterized in that a plurality of radiating holes (53) communicating the interior of the semiconductor refrigeration device with the outside are formed in the two surfaces of the outer shell (5), the radiating holes (53) are evenly distributed in the two surfaces of the outer shell (5), and the radiating holes (53) are opposite to the hot surface of the semiconductor refrigeration piece (3).

6. The ceramic capacitor with a wear resistant outer cover according to claim 4, wherein: two clamping blocks (6) are integrally formed on two sides of the opening of the upper shell (52), and clamping grooves (7) corresponding to the clamping blocks (6) are formed in the lower shell (51).

7. The ceramic capacitor with a wear resistant outer cover according to claim 4, wherein: the pin (2) supporting part comprises two hollow insertion rods (81) fixedly arranged on the lower shell (51) and a U-shaped sleeve seat (82) in plug-in fit with the insertion rods (81), two through holes (84) which are communicated with the inside and can accommodate the pins (2) are formed in one side, far away from the insertion rods (81), of the sleeve seat (82), and mounting holes (83) are formed in the sleeve seat (82) between the two through holes (84).