CN216144225U - Heat pipe and radiator structure - Google Patents
Heat pipe and radiator structure Download PDFInfo
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- CN216144225U CN216144225U CN202121885602.1U CN202121885602U CN216144225U CN 216144225 U CN216144225 U CN 216144225U CN 202121885602 U CN202121885602 U CN 202121885602U CN 216144225 U CN216144225 U CN 216144225U
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Abstract
The embodiment of the application provides a heat pipe and a heat sink structure, and the heat pipe comprises: the ladder comprises at least one ladder section, wherein the ladder section comprises a first horizontal part, a first bent part formed by bending and extending one end of the first horizontal part, and a second horizontal part formed by extending the first bent part, and the height of the first horizontal part is higher than that of the second horizontal part. The embodiment of the application solves the problem that the heat pipe in the prior art cannot solve the heat dissipation problem under the condition of buckling and installing the double-plate card or the multi-plate card in a laminated mode, the heat pipe with the step-shaped structure can conduct heat from top to bottom, the heat conduction efficiency of the heat pipe is enhanced, the heat radiator structure is enabled to have higher soaking performance, and therefore the heat dissipation efficiency of the heat radiator structure is improved.
Description
Technical Field
The application relates to the technical field of heat dissipation devices, in particular to a heat pipe and a heat radiator structure.
Background
The unable board problem altogether of high frequency board and intermediate frequency board is solved to the design that all needs to use a plurality of integrated circuit boards under the many situations, and two integrated circuit boards adopt the mode installation that the connector is detained to be connected, can lead to producing a difference in height, and this difference in height is by the connector height decision between two integrated circuit boards.
The existing heat pipe can only be bent in the X-Y axis direction, so that the main heat dissipation chip conducts and dissipates heat around on a two-dimensional plane. Under the condition of double-plate card or multi-plate card laminated buckling installation, the heat dissipation problem under the working condition cannot be solved by a common heat pipe.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a heat pipe and a radiator structure, which are used for solving the problem that the heat pipe in the prior art cannot solve the heat dissipation problem under the condition of double-plate card or multi-plate card lamination buckling installation.
In a first aspect, an embodiment of the present application provides a heat pipe, including: the ladder comprises at least one ladder section and a plurality of ladder sections, wherein the ladder section comprises a first horizontal part, a first bent part formed by bending and extending from one end of the first horizontal part, and a second horizontal part formed by extending from the first bent part;
wherein the first horizontal portion has a height higher than that of the second horizontal portion.
Optionally, according to the heat pipe of an embodiment of the present application, the heat pipe further includes a horizontal section, and the horizontal section includes a second bent portion bent and extended from another end of the first horizontal portion, and a third horizontal portion extended and extended from the second bent portion;
wherein a height of the first horizontal portion is equal to a height of the third horizontal portion.
Optionally, according to the heat pipe of an embodiment of the present application, the horizontal section and the step section are an integrally formed structure.
Optionally, according to the heat pipe of an embodiment of the present application, the heat pipe further includes a vertical section, and the vertical section includes a third bending portion extending from the second horizontal portion and a vertical portion extending from the third bending portion;
wherein the vertical portion extends toward a direction away from the first horizontal portion.
Optionally, according to the heat pipe of an embodiment of the present application, the heat pipe further includes a hook section, and the hook section includes a fourth bent portion extending from the second bent portion and a fourth horizontal portion extending from the fourth bent portion;
wherein the height of the fourth horizontal portion is less than the height of the second horizontal portion.
Optionally, according to the heat pipe of an embodiment of the present application, the heat pipe further includes a protruding section, the protruding section includes a fifth bending portion formed by bending and extending from the second horizontal portion, an inverted "U" shaped portion formed by extending from the fifth bending portion, a sixth bending portion formed by extending from the inverted "U" shaped portion, and a fifth horizontal portion formed by extending from the sixth bending portion;
wherein a height of the fifth horizontal portion is equal to a height of the second horizontal portion.
Optionally, according to the heat pipe of an embodiment of the present application, the heat pipe further includes a heat dissipation working medium, a hollow cavity is disposed inside the heat pipe, and the heat dissipation working medium is filled in the hollow cavity.
In a second aspect, an embodiment of the present application further provides a heat sink structure, including: a case and the heat pipe of any one of the above;
the chassis is provided with a plurality of mounting surfaces, the mounting surfaces are used for mounting functional devices, the mounting surfaces are located at different heights, and the first horizontal part and the second horizontal part are respectively embedded in two adjacent mounting surfaces.
Optionally, according to the heat sink structure of an embodiment of the present application, the heat sink structure further includes a blocking piece, two adjacent junction portions of the mounting surfaces are provided with a lattice baffle, the lattice baffle is provided with an opening through which the first bending portion passes, and the blocking piece is connected to the opening in a sealing manner.
Optionally, according to the heat sink structure in an embodiment of the present application, the functional device includes a high-frequency board, an intermediate-frequency board, and a wave control board, where the high-frequency board and the intermediate-frequency board are respectively disposed on two adjacent mounting surfaces, and the wave control board is connected above the high-frequency board;
the heat pipe also comprises the convex section, and the inverted U-shaped part is abutted against one side of the wave control plate, which faces the mounting surface.
The heat pipe and the heat sink structure provided by the embodiment of the application are characterized in that the heat pipe is arranged to comprise at least one step section, the step section comprises a first horizontal part, a first bent part and a second horizontal part, wherein the first bent part is formed by bending and extending one end of the first horizontal part, the second horizontal part is formed by extending the first bent part, moreover, the height of the first horizontal part is higher than that of the second horizontal part, so that the heat pipe is in a step-shaped structure from top to bottom, the heat pipe with the step-shaped structure can conduct heat from top to bottom, the heat conduction efficiency of the heat pipe is enhanced, the heat sink structure has higher heat uniformity, and the heat dissipation efficiency of the heat sink structure is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a heat pipe structure provided in an embodiment of the present application;
FIG. 2 is a view of the direction A of one of the schematic structural diagrams of the heat pipe provided by the embodiment of the present application;
FIG. 3 is a second schematic view of a heat pipe structure provided in the present application;
FIG. 4 is a second view of the heat pipe structure provided in the embodiment of the present application;
FIG. 5 is a third schematic view of a heat pipe structure provided in an embodiment of the present application;
FIG. 6 is a third view of a heat pipe structure according to an embodiment of the present invention;
FIG. 7 is a fourth schematic view of a heat pipe structure provided in the present application;
FIG. 8 is a view of the fourth embodiment of the present application showing the structure of a heat pipe;
fig. 9 is a schematic structural diagram of a heat sink structure provided in an embodiment of the present application;
FIG. 10 is a schematic structural diagram of a functional device provided in an embodiment of the present application;
reference numerals:
1: a stepped section; 11: a first horizontal portion; 12: a first bent portion;
13: a second horizontal portion; 2: a horizontal segment; 21: a second bent portion;
22: a third horizontal portion; 3: a vertical section; 31: a third bent portion;
32: a vertical portion; 4: a hook section; 41: a fourth bent portion;
42: a fourth horizontal section; 5: a convex section; 51: a fifth bent portion;
52: an inverted "U" shaped portion; 53: a sixth bent portion; 54: a fifth horizontal portion;
6: a chassis; 7: a baffle plate; 8: a high-frequency board;
9: an intermediate frequency plate; 10: and a wave control board.
Detailed Description
In the embodiments of the present application, the term "plurality" means two or more, and other terms are similar thereto.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a heat pipe and radiator structure for when solving among the prior art double plate card or the stromatolite of many integrated circuit boards or buckle installation to when the upper end integrated circuit board need down conduct heat, the unable from the top down of general heat pipe conducts heat, the poor defect of radiator soaking nature.
The heat pipe and heat sink structure according to the embodiment of the present application will be described with reference to fig. 1 to 10.
As shown in fig. 1 and 2, a heat pipe provided in an embodiment of the present application includes: at least one step section 1, the step section includes a first horizontal portion 11, a first bent portion 12 formed by bending and extending from one end of the first horizontal portion 11, and a second horizontal portion 13 formed by extending from the first bent portion 12, wherein the height of the first horizontal portion 11 is higher than the height of the second horizontal portion 13.
Specifically, the heat pipe is made of one or more metals selected from copper, iron, silver, aluminum, and zinc, and is configured to have a stepped structure, wherein the stepped section 1 includes a first horizontal portion 11, a first bent portion 12, and a second horizontal portion 13, wherein the first bent portion 12 is formed by bending and extending one end of the first horizontal portion 11, the second horizontal portion 13 is formed by extending the first bent portion 12, and the height of the first horizontal portion 11 is higher than that of the second horizontal portion 13, so that the heat pipe has a stepped structure from top to bottom.
Wherein, the ladder section 1 can be a set of, also can be multiunit, and specific quantity sets up the adaptation according to the concrete structure of radiator.
It should be noted that the length of the heat pipe needs to be calculated according to the heat dissipation requirement of the main chip, the length required by the heat dissipation chip plus the minimum bending radius allowed by the heating pipe with the length required by downward heat dissipation is the required length of the heat pipe, after the length of the heat pipe is selected, the single heat pipe is bent by a specific tool for secondary processing, a required specific shape is made, then gel or silicone grease heat conduction materials are added in a groove processed on the case to enhance heat conduction, and finally the heat pipe is embedded into the case of the heat sink.
When the double-board card or the multi-board card is installed in a buckling mode in a laminated mode, heat is mainly concentrated on the upper end plate, heat needs to be conducted downwards by the upper end plate, the heat pipe is made into a step-shaped structure from top to bottom, the heat pipe with the step-shaped structure is located in the radiator, heat conduction can be conducted from top to bottom, heat conduction efficiency of the heat pipe is improved, the radiator structure is enabled to have high soaking performance, and therefore heat dissipation efficiency of the radiator structure is improved.
In an alternative embodiment, the heat pipe further includes a horizontal section 2, and the horizontal section 2 includes a second bent portion 21 bent and extended from the other end of the first horizontal portion 11 and a third horizontal portion 22 extended from the second bent portion 21, wherein the height of the first horizontal portion 11 is equal to the height of the third horizontal portion 22.
Specifically, a second bent portion 21 is formed by extending the other end of the first horizontal portion 11, a third horizontal portion 22 is formed by extending the second bent portion 21, the first horizontal portion 11 and the third horizontal portion 22 have the same height and are in contact with the upper end plate to dissipate heat from the upper end plate, the second bent portion 21 and the third horizontal portion 22 jointly form the first horizontal portion 11 of the heat pipe, the cross section of the first horizontal portion 11 is increased between the heat pipe and the upper end plate, and the heat conduction efficiency of the heat pipe can be further enhanced.
Wherein, an included angle of 90 degrees is formed between the first horizontal portion 11 and the third horizontal portion 22.
In an alternative embodiment, the horizontal section 2 and the stepped section 1 are of an integrally formed structure.
Specifically, because two integrated circuit boards or many integrated circuit boards stromatolite or when the opposite joint installation, general heat pipe is the straight tube, so the heat pipe commonly used at present, in the face of two integrated circuit board stromatolite installations and when having the heat conduction demand from the top down, often adopt the mode conduction of many heat pipe concatenations, this kind of mode heat conduction efficiency is not high and cause heat pipe model and quantity to increase easily, the cost has been increased in the change mutually, in this application embodiment, the horizontal segment 2 and the ladder section 1 of heat pipe are the integrated into one piece structure, can overcome as before the defect, the integrated into one piece structure has not only improved the radiating efficiency, still practiced thrift the cost, reduced the fault rate of heat pipe.
As shown in fig. 3 and 4, in an alternative embodiment, the heat pipe further includes a vertical section 3, and the vertical section includes a third bent portion 31 formed by extending from the second horizontal portion 13 and a vertical portion 32 formed by extending from the third bent portion, wherein the vertical portion 32 extends toward a direction away from the first horizontal portion 11.
Specifically, according to actual need, the heat pipe can penetrate through the machine case through the bending design, direct leading-in of inside heat outside the machine case, set up vertical section 3 promptly, vertical section includes third kink 31 and vertical portion 32, wherein, third kink 31 is formed by the bending extension from second horizontal part 13, vertical portion 32 is formed by the extension of third kink, vertical portion 32 extends downwards towards the direction that deviates from first horizontal part 11, that is to say, at the position of lower end plate, be equipped with the through-hole that can allow the heat pipe to penetrate, the heat pipe extends downwards and extends the radiator bottom, and stretch out the fuselage, outside giving off the machine case with the heat, reinforcing radiating efficiency.
As shown in fig. 5 and 6, in an alternative embodiment, the heat pipe further includes a hook section 4, and the hook section 4 includes a fourth bent portion 41 formed by extending from the second horizontal portion 13 and a fourth horizontal portion 42 formed by extending from the fourth bent portion 41, wherein a height of the fourth horizontal portion 42 is less than a height of the second horizontal portion 13.
Specifically, process the heat pipe according to heat pipe groove shape, then put into the recess of quick-witted case to the heat pipe, it is sealed with sealed glue to pierce through quick-witted case position, at last will pierce through the partial heat pipe that quick-witted case perpendicularly and press into the level again, form crotch section 4 promptly, crotch section 4 comprises fourth kink 41 and fourth horizontal part 42, this design is applicable to inside high-power consumption quick-witted case that can't effective thermal cycle, can be leading-in to the outside to inside integrated circuit board heat, strengthen the radiating efficiency, and establish to crotch section 4 structure, can save space, in order to avoid the radiator to occupy too much space and bulky, thereby cause the material waste of other parts on every side.
As shown in fig. 7 and 8, in an alternative embodiment, the heat pipe further includes a protruding section 5, the protruding section 5 includes a fifth bending portion 51 formed by bending and extending from the second horizontal portion, an inverted "U" shaped portion 52 formed by extending from the fifth bending portion 51, a sixth bending portion 53 formed by extending from the inverted "U" shaped portion, and a fifth horizontal portion 54 formed by extending from the sixth bending portion, wherein the height of the fifth horizontal portion 54 is equal to the height of the second horizontal portion 13.
Specifically, when three board cards are installed in a laminated mode (in a non-stepped mode), the heat pipe can extend upwards firstly and is conducted downwards to the case (bent in an inverted U shape), heat of a device, which is difficult to dissipate heat, of the top wave control board is soaked, and therefore the overall heat dissipation efficiency is improved.
As shown in fig. 10, the high power consumption device on the uppermost wave control plate cannot be attached to the chassis for heat dissipation by a common method, and the heat pipe may extend from the upper end plate to the wave control plate, and then be bent and conducted downward to the lower end plate. The corresponding specific implementation process comprises the steps of processing the heat pipe into a required shape, installing the heat pipe, and then sequentially installing the upper end plate and the wave control plate.
In an optional embodiment, the heat pipe further includes a heat dissipation working medium, a hollow cavity is disposed inside the heat pipe, and the heat dissipation working medium is filled in the hollow cavity.
Specifically, the heat pipe is filled with a heat dissipation working medium, and the heat dissipation working medium is preferably deionized water, but may also be an aqueous solution containing nano metal particles, freon, a suspension of carbon nanotubes, a suspension of graphene, or other solutions with better thermal conductivity. The heat of the upper end plate is taken out by the heat pipe through the flowing heat dissipation working medium, so that the heat dissipation efficiency of the heat pipe is further improved.
As shown in fig. 9, an embodiment of the present application further provides a heat sink structure, including: the case 6 and the heat pipe are provided with a plurality of mounting surfaces, the mounting surfaces are used for mounting functional devices, the mounting surfaces are located at different heights, and the first horizontal part and the second horizontal part are respectively embedded in the two adjacent mounting surfaces.
Specifically, because the heat sink structure of the embodiment of the present application includes the chassis 6 and the heat pipe, the content of the heat pipe is not described in detail herein, and the specific structure refers to the above embodiment, in addition, according to actual needs, the chassis 6 may have a plurality of mounting surfaces, the plurality of mounting surfaces are in a step shape with different heights, the mounting functional device is mounted on the mounting surface, the mounting surface is provided with a groove as needed, the first horizontal portion 11 and the second horizontal portion 13 are respectively embedded in the grooves of the two adjacent mounting surfaces, the first horizontal portion 11 and the second horizontal portion 13 of the heat pipe are respectively in contact with the upper end plate and the lower end plate with high heat, the heat of the upper end plate is brought into the lower end plate from top to bottom through the heat pipe, the chassis cooperates with the heat pipe, the thermal uniformity is achieved, and the heat dissipation efficiency of the heat sink structure is improved.
In an optional embodiment, the heat sink structure further includes a blocking piece 7, a grid baffle is disposed at a junction of two adjacent mounting surfaces, the grid baffle is provided with an opening through which the first bending portion 12 passes, and the blocking piece 7 is connected to the opening in a sealing manner.
Specifically, when the heat pipe is installed due to the problem of height difference, the heat pipe often needs to penetrate through the case spacer rib, so that signal leakage can be caused, and at the moment, the blocking piece 7 needs to be designed independently according to actual needs to be pressed on the heat pipe to enhance the shielding capacity. The junction of two installation faces is equipped with check baffle, and the check baffle is equipped with the opening that supplies first kink to pass, and separation blade 7 can sealing connection at the opening part, and the separation blade has two kinds of basic design forms, and first, the separation blade of design alone utilizes screw movable mounting at the opening part, and second, directly weld the separation blade at the opening part.
As shown in fig. 10, in an alternative embodiment, the functional device includes a high-frequency plate 8, a medium-frequency plate 9, and a wave control plate 10, the high-frequency plate 8 and the medium-frequency plate 9 are respectively disposed on two adjacent mounting surfaces, and in the case that the wave control plate 10 is connected above the high-frequency plate 8, the heat pipe further includes a convex section, and the inverted "U" shaped portion abuts against a side of the wave control plate 10 facing the mounting surfaces.
Specifically, when a three-board card shown in fig. 10 is mounted in a stacked manner (in a non-stepped manner), the heat pipe may extend upward to be connected to the wave control board 10, and then be connected to the intermediate frequency board 9 in a downward conduction manner, and the heat pipe forms a protruding section 5 at a corresponding position to uniformly heat the wave control board 10, the top of which is not easy to dissipate heat, so as to improve the overall heat dissipation efficiency of the heat sink structure.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A heat pipe, comprising: the ladder comprises at least one ladder section and a plurality of ladder sections, wherein the ladder section comprises a first horizontal part, a first bent part formed by bending and extending from one end of the first horizontal part, and a second horizontal part formed by extending from the first bent part;
wherein the first horizontal portion has a height higher than that of the second horizontal portion.
2. A heat pipe according to claim 1, further comprising a horizontal section, wherein the horizontal section comprises a second bent portion bent and extended from the other end of the first horizontal portion, and a third horizontal portion extended from the second bent portion;
wherein a height of the first horizontal portion is equal to a height of the third horizontal portion.
3. A heat pipe as claimed in claim 2 wherein said horizontal section and said stepped section are of unitary construction.
4. A heat pipe according to claim 1, further comprising a vertical section, wherein the vertical section comprises a third bending portion extending from the second horizontal portion and a vertical portion extending from the third bending portion;
wherein the vertical portion extends toward a direction away from the first horizontal portion.
5. A heat pipe according to claim 1, further comprising a hook section, wherein the hook section comprises a fourth bent portion extending from the second bent portion and a fourth horizontal portion extending from the fourth bent portion;
wherein the height of the fourth horizontal portion is less than the height of the second horizontal portion.
6. A heat pipe according to claim 1, further comprising a protruding section, wherein the protruding section comprises a fifth bending portion bent and extended from the second horizontal portion, an inverted "U" shaped portion extended from the fifth bending portion, a sixth bending portion extended from the inverted "U" shaped portion, and a fifth horizontal portion extended from the sixth bending portion;
wherein a height of the fifth horizontal portion is equal to a height of the second horizontal portion.
7. A heat pipe as claimed in claim 1 further comprising a heat dissipation working medium, wherein a hollow chamber is disposed inside the heat pipe, and the heat dissipation working medium is filled in the hollow chamber.
8. A heat sink structure, comprising: a cabinet and a heat pipe according to any one of claims 1 to 7;
the chassis is provided with a plurality of mounting surfaces, the mounting surfaces are used for mounting functional devices, the mounting surfaces are located at different heights, and the first horizontal part and the second horizontal part are respectively embedded in two adjacent mounting surfaces.
9. The heat sink structure as claimed in claim 8, wherein the heat sink structure further comprises a blocking plate, a grid baffle is disposed at a junction between two adjacent mounting surfaces, the grid baffle has an opening for the first bending portion to pass through, and the blocking plate is connected to the opening in a sealing manner.
10. The heat sink structure according to claim 8, wherein the functional device comprises a high-frequency board, a medium-frequency board, and a wave control board, the high-frequency board and the medium-frequency board are respectively provided on two adjacent mounting surfaces, and the wave control board is connected above the high-frequency board;
the heat pipe also comprises the convex section, and the inverted U-shaped part is abutted against one side of the wave control plate, which faces the mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121885602.1U CN216144225U (en) | 2021-08-12 | 2021-08-12 | Heat pipe and radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121885602.1U CN216144225U (en) | 2021-08-12 | 2021-08-12 | Heat pipe and radiator structure |
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| Publication Number | Publication Date |
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| CN216144225U true CN216144225U (en) | 2022-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121885602.1U Active CN216144225U (en) | 2021-08-12 | 2021-08-12 | Heat pipe and radiator structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117286025A (en) * | 2023-09-13 | 2023-12-26 | 艾普拜生物科技(苏州)有限公司 | Temperature control unit for PCR instrument |
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2021
- 2021-08-12 CN CN202121885602.1U patent/CN216144225U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117286025A (en) * | 2023-09-13 | 2023-12-26 | 艾普拜生物科技(苏州)有限公司 | Temperature control unit for PCR instrument |
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