CN216128812U

CN216128812U - Device for chip adsorption and transposition

Info

Publication number: CN216128812U
Application number: CN202121825096.7U
Authority: CN
Inventors: 庞凯尹; 宋斌杰; 梁祖荣; 罗昌凌; 翁巨贤
Original assignee: Intelligent Automation Equipment Zhuhai Co Ltd
Current assignee: Intelligent Automation Equipment Zhuhai Co Ltd
Priority date: 2021-08-06
Filing date: 2021-08-06
Publication date: 2022-03-25
Anticipated expiration: 2031-08-06

Abstract

The utility model aims to provide a device for adsorbing and transposing chips. The vacuum chip packaging device comprises a vacuum block, a fixed block and a transposition block, wherein the fixed block is matched with the transposition block, a first groove matched with the fixed block is arranged on the vacuum block, a second groove matched with a chip product is arranged on the fixed block, corresponding air holes are formed in the bottoms of the first groove and the second groove, a fourth groove matched with the second groove is formed in the bottom of the transposition block, the chip product is placed in the second groove, an external vacuum source is turned on, the chip product is adsorbed in the second groove, so that a protective film of the chip product is convenient to tear off, after the film is torn off, the transposition block is covered on the fixed plate, then the transposition block and the fixed block are taken up and turned over for transposition, the chip product in the second groove completely falls into the fourth groove, and the adsorption and transposition of the chip product are achieved. The utility model is applied to the technical field of chip film tearing and transposition.

Description

Device for chip adsorption and transposition

Technical Field

The utility model relates to a device for adsorbing and transposing chips.

Background

The chip surface is attached one deck protection film when the supplied materials, mainly has the dust to adsorb on the chip surface in order to prevent at the in-process of packing with unsealing, can prevent simultaneously that the chip from being scraped flower and dirty, need tear the protection film on the chip before the link of testing the chip function.

At present, the film tearing and the transposition of the chip are usually finished by manually and directly contacting the chip with hands, when the device works, an operator holds the bottom of the chip with one hand and holds tweezers to tear the film with the other hand, however, the chip is possibly dirtied by directly contacting the chip with the hands, and meanwhile, the chip is possibly damaged by static electricity on the operator, the operator puts the chip by wearing a finger sleeve, the fingers are uncomfortable after long-term working time, the transposition of the chip is generally finished by hands, if the hand is not in place, the chip needs to be sucked repeatedly by a vacuum suction pen, because the specification of the chip is small, the operator can not guarantee success once by manually transposing the chip, sometimes the chip needs to be successfully transposed repeatedly for many times, therefore, the mode of directly tearing and transposing the chip by hands undoubtedly increases the working strength of the operator, the working efficiency is greatly reduced.

Chinese patent publication No. CN112123915A discloses a full-automatic film tearing machine applied to FPC boards, which realizes automatic film tearing of chips and reduces labor intensity of operators, but has complex structure, complex operation, high equipment cost and defects. The device has the advantages of simple structure, low manufacturing cost, difficult chip damage and capability of realizing semi-automatic film tearing and transposition by adsorbing the chip.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a chip adsorption and transposition device with simple structure, low cost and high efficiency.

The technical scheme adopted by the utility model is as follows: the vacuum chip comprises a vacuum block, a fixed block and a transposition block, wherein the fixed block is matched with the transposition block, a first groove matched with the fixed block is formed in the vacuum block, a first air hole communicated with an external vacuum source is formed in the bottom of the first groove, a second groove matched with a chip product is formed in the fixed block, a second air hole is formed in the bottom of the second groove, and when the fixed block is placed in the first groove, the first air hole is communicated with the second air hole.

According to the scheme, when a chip product is placed in the second groove, an external vacuum source is turned on, gas in the first air hole and the second air hole is sucked, the chip product is adsorbed in the second groove, so that the protective film of the chip product is convenient to tear, the situation that the film is torn by directly holding the chip product with hands is avoided, after the film is torn is completed, the transposition block is covered on the fixing plate, then the transposition block and the fixing block are taken up and turned over for transposition, the chip product in the second groove completely falls into the fourth groove, the transposition of the top and the bottom of the chip product is achieved, and finally the next process is carried out.

According to a preferable scheme, a third groove is formed in the fixing block, and one side of the second groove is communicated with one side of the third groove.

According to the scheme, the third groove is communicated with the second groove, so that the protective film of the chip product in the second groove can be conveniently torn off, the situation that the protective film is difficult to tear off quickly due to too small space is avoided, and the working efficiency is further improved.

A preferred embodiment is that a fourth groove adapted to the second groove is formed in the bottom of the transposing block, and when the transposing block is placed on the fixed block, the second groove corresponds to the fourth groove.

According to the scheme, the second groove corresponds to the fourth groove and is matched with the fourth groove, the chip products in the second groove can be completely transposed into the fourth groove in the overturning process, and the success rate of transposition is improved.

According to a preferable scheme, the fixed block is fixedly provided with a plurality of magnets, the bottom of the transposition block is fixedly provided with an iron sheet matched with the magnets, and when the transposition block is placed on the fixed block, the magnets are matched with the iron sheet in a magnetic attraction mode.

According to the scheme, after the film is torn, the transposition block covers the fixing plate, the magnet and the iron sheet are adsorbed together, the transposition plate is basically matched with the fixing plate, the phenomenon that when transposition is carried out on the top and the bottom of a chip product, the transposition plate and the fixing plate are loosened to enable the chip product to fall off is avoided, the chip product is damaged or dirtied, transposition of the top and the bottom of the chip product can be achieved by using the magnet adsorption method and turning over once, and the success rate of transposition is further improved.

According to a preferable scheme, a plurality of first positioning columns are arranged on the fixing block, and first through holes matched with the first positioning columns are formed in the bottom of the transposition block.

According to the scheme, the first positioning column is used for limiting and fixing the transposition block, and displacement is avoided when the transposition block covers the fixing block, so that a chip product falls off, and the chip product is damaged or dirtied.

According to a preferable scheme, the vacuum block is provided with a plurality of second positioning columns, and the fixing block is provided with second through holes matched with the second positioning columns.

According to the scheme, the second positioning column is used for limiting and fixing the fixing block, the fixing block is prevented from shifting when covering the first groove, and the first air hole and the second air hole are not located at the same position, so that chip products in the second groove cannot be adsorbed.

Preferably, the device further comprises a base, and the vacuum block is fixedly arranged on the base.

According to the scheme, the base is used for fixing the device and preventing the device from shifting in the adsorption process, so that the external chip cannot be adsorbed successfully.

One preferable scheme is that the device for chip adsorption and transposition further comprises a suction pen, and the suction pen is arranged on one side of the base.

According to the scheme, the suction pen is used for sucking the chip of the external material box and transferring the chip into the second groove, so that the chip product is prevented from being directly transferred by hands or tweezers, and the chip product is possibly damaged or dirtied.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic perspective view of the vacuum block;

fig. 3 is a schematic perspective view of the fixing block;

fig. 4 is a schematic perspective view of a bottom view of the transposed block.

Detailed Description

As shown in fig. 1 to 4, in this embodiment, the present invention includes a vacuum block 1, a fixed block 2, and a transposing block 3, wherein the fixed block 2 is adapted to the transposing block 3, the vacuum block 1 is provided with a first groove 4 adapted to the fixed block 2, a first air hole 5 communicated with an external vacuum source is provided at the bottom of the first groove 4, the fixed block 2 is provided with a second groove 6 adapted to a chip product, the bottom of the second groove 6 is provided with a second air hole 7, and when the fixed block 2 is placed in the first groove 4, the first air hole 5 is communicated with the second air hole 7.

In this embodiment, a third groove 8 is formed in the fixing block 2, and one side of the second groove 6 is communicated with one side of the third groove 8.

In this embodiment, a fourth groove 9 adapted to the second groove 6 is disposed at the bottom of the transposing block 3, and when the transposing block 3 is placed on the fixed block 2, the second groove 6 corresponds to the fourth groove 9.

In this embodiment, the fixed block 2 is fixedly provided with a plurality of magnets 10, the bottom of the transposing block 3 is fixedly provided with an iron sheet 11 adapted to the magnets 10, and when the transposing block 3 is placed on the fixed block 2, the magnets 10 and the iron sheet 11 are matched in a magnetic attraction manner.

In this embodiment, the fixed block 2 is provided with a plurality of first positioning posts 12, and the bottom of the transposing block 3 is provided with first through holes 13 adapted to the first positioning posts 12.

In this embodiment, the vacuum block 1 is provided with a plurality of second positioning pillars 14, and the fixed block 2 is provided with second through holes 15 adapted to the second positioning pillars 14.

In this embodiment, the apparatus further includes a base 16, and the vacuum block 1 is fixedly disposed on the base 16.

In this embodiment, the device for chip adsorption and transposition further includes a suction pen 17, and the suction pen 17 is disposed on one side of the base 16.

The working principle of the utility model is as follows: placing a chip product in the second groove, opening an external vacuum source, sucking gas in the first air hole and the second air hole, adsorbing the chip product in the second groove, so that a protective film of the chip product is convenient to tear off, covering the transposition block on the fixing plate after the film tearing is completed, then taking up and overturning the transposition block and the fixing block together, and completely dropping the chip product in the second groove into the fourth groove, thereby realizing the adsorption and transposition of the chip product.

Claims

1. A device that chip adsorbs and transpose which characterized in that: the vacuum device comprises a vacuum block (1), a fixing block (2) and a transposition block (3), wherein the fixing block (2) is matched with the transposition block (3), a first groove (4) matched with the fixing block (2) is formed in the vacuum block (1), a first air hole (5) communicated with an external vacuum source is formed in the bottom of the first groove (4), a second groove (6) matched with a chip product is formed in the fixing block (2), a second air hole (7) is formed in the bottom of the second groove (6), the fixing block (2) is placed in the first groove (4), and the first air hole (5) is communicated with the second air hole (7).

2. The apparatus of claim 1, wherein: and a third groove (8) is formed in the fixing block (2), and one side of the second groove (6) is communicated with one side of the third groove (8).

3. The apparatus of claim 2, wherein: a fourth groove (9) matched with the second groove (6) is formed in the bottom of the transposition block (3), and when the transposition block (3) is placed on the fixed block (2), the second groove (6) corresponds to the fourth groove (9).

4. The apparatus of claim 3, wherein: the fixed block (2) is fixedly provided with a plurality of magnets (10), the bottom of the transposition block (3) is fixedly provided with an iron sheet (11) matched with the magnets (10), and when the transposition block (3) is placed on the fixed block (2), the magnets (10) and the iron sheet (11) are matched in a magnetic attraction mode.

5. The apparatus of claim 3, wherein: the fixed block (2) is provided with a plurality of first positioning columns (12), and the bottom of the transposition block (3) is provided with first through holes (13) matched with the first positioning columns (12).

6. The apparatus of claim 1, wherein: the vacuum block (1) is provided with a plurality of second positioning columns (14), and the fixing block (2) is provided with second through holes (15) matched with the second positioning columns (14).

7. The apparatus of claim 1, wherein: the device also comprises a base (16), and the vacuum block (1) is fixedly arranged on the base (16).

8. The apparatus of claim 7, wherein: the device for chip adsorption and transposition further comprises a suction pen (17), and the suction pen (17) is arranged on one side of the base (16).