CN216122982U - Sandwich glue film and multilayer circuit board - Google Patents
Sandwich glue film and multilayer circuit board Download PDFInfo
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- CN216122982U CN216122982U CN202121864496.9U CN202121864496U CN216122982U CN 216122982 U CN216122982 U CN 216122982U CN 202121864496 U CN202121864496 U CN 202121864496U CN 216122982 U CN216122982 U CN 216122982U
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Abstract
The utility model discloses a sandwich adhesive layer and a multilayer circuit board, wherein the sandwich adhesive layer comprises a main body, the main body comprises a first adhesive layer, an insulating layer and a second adhesive layer which are sequentially connected in a stacking manner from top to bottom, and further comprises a conduction structure which sequentially penetrates through the first adhesive layer, the insulating layer and the second adhesive layer, the top end of the conduction structure is exposed out of the first adhesive layer, and the bottom end of the conduction structure is exposed out of the second adhesive layer. The sandwich glue layer uses the insulating layer as the intermediate layer, and even if partial areas of the first glue layer and the second glue layer in the sandwich glue layer become thin in the process of laminating the multilayer boards, the insulating layer can also well isolate the circuit layers of the two substrates connected by the sandwich glue layer, so that short circuit caused by unexpected contact in the partial areas of the multilayer circuit board is prevented, and the yield of the multilayer circuit board is effectively improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a sandwich adhesive layer and a multilayer circuit board.
Background
When a multilayer circuit board is processed, there is a processing technique that: firstly, preparing circuits on each substrate, then gluing and pressing each substrate, and finally manufacturing a conducting structure for conducting the circuits on different substrates.
In the actual production process, the applicant finds that due to the fact that the glue layer for bonding the adjacent substrates is thin and has fluidity, the circuits on the adjacent substrates are occasionally accidentally conducted in the process of pressing.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: provides a sandwich adhesive layer with good isolation performance and a multilayer circuit board with the sandwich adhesive layer.
In order to solve the technical problems, the utility model adopts the technical scheme that: the utility model provides a sandwich glue film, includes the main part, the main part is including from top to bottom consecutive first glue film, insulating layer and second glue film of stacking gradually, still including running through in proper order the conduction structure of first glue film, insulating layer and second glue film, the top of conduction structure expose in first glue film, the bottom of conduction structure expose in the second glue film.
Furthermore, the top end of the conducting structure protrudes out of the top surface of the first adhesive layer to form a first protruding portion.
Further, still including locating the first layer of leaving type of the top surface of first glue film, first leave type have on the layer with first bulge complex first hole, the height of first bulge equals with the thickness of first layer of leaving type.
Further, the thickness of the first release layer is less than or equal to 25 micrometers.
Furthermore, the bottom end of the conducting structure protrudes out of the bottom surface of the second adhesive layer to form a second protruding portion.
Further, still including locating from the type structure of the bottom surface of second glue film, from the type structure including the second from the type layer, the second has the second hole of cooperating with the second bulge from the type layer, the height of second bulge is more than or equal to the second is from the thickness on type layer.
Furthermore, the release structure further comprises a copper foil layer bonded to the bottom surface of the second release layer through a third adhesive layer, and the height of the second protruding portion is equal to the sum of the thickness of the second release layer and the thickness of the third adhesive layer.
Further, the insulating layer is a PI film.
Furthermore, the whole conducting structure is in a round table shape.
In order to solve the technical problems, the utility model also adopts the following technical scheme: multilayer circuit board, including first base plate and second base plate, first base plate is located the top of second base plate, the bottom surface of first base plate is equipped with first circuit layer, the top surface of second base plate is equipped with second circuit layer, still includes above-mentioned sandwich glue film, first glue film with first base plate is connected, the second glue film is connected with the second base plate, the conduction structure switches on first circuit layer with second circuit layer.
The utility model has the beneficial effects that: the sandwich glue layer uses the insulating layer as the intermediate layer, and even if partial areas of the first glue layer and the second glue layer in the sandwich glue layer become thin in the process of laminating the multilayer boards, the insulating layer can also well isolate the circuit layers of the two substrates connected by the sandwich glue layer, so that short circuit caused by unexpected contact in the partial areas of the multilayer circuit board is prevented, and the yield of the multilayer circuit board is effectively improved.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of a sandwich adhesive layer;
FIG. 2 is a cross-sectional view of another sandwich adhesive layer structure according to the first embodiment of the present invention;
FIG. 3 is a schematic view of a process for manufacturing a sandwich adhesive layer according to a second embodiment of the present invention;
FIG. 4 is a schematic view of a process for manufacturing a sandwich adhesive layer according to a third embodiment of the present invention;
fig. 5 is a sectional view of a multilayer wiring board of a fourth embodiment of the present invention.
Description of reference numerals:
11. a first glue layer; 12. an insulating layer; 13. a second adhesive layer; 14. a conducting structure; 141. a first projecting portion; 142. a second projection; 15. a first release layer; 16. a release structure; 161. a second release layer; 162. a third adhesive layer; 163. a copper foil layer; 171. a via hole;
2. an outer structure;
3. a first substrate; 31. a first circuit layer;
4. a second substrate; 41. and a second circuit layer.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 5, a sandwich adhesive layer includes a main body, the main body includes a first adhesive layer 11, an insulating layer 12, and a second adhesive layer 13 sequentially stacked and connected from top to bottom, and further includes a conductive structure 14 sequentially penetrating through the first adhesive layer 11, the insulating layer 12, and the second adhesive layer 13, a top end of the conductive structure 14 is exposed out of the first adhesive layer 11, and a bottom end of the conductive structure 14 is exposed out of the second adhesive layer 13.
From the above description, the beneficial effects of the present invention are: the sandwich adhesive layer uses the insulating layer 12 as the middle layer, and in the process of laminating the multilayer board, even if partial areas of the first adhesive layer 11 and the second adhesive layer 13 in the sandwich adhesive layer become thin, the insulating layer 12 can well isolate the circuit layers of the two substrates connected by the sandwich adhesive layer, thereby preventing the partial areas of the multilayer circuit board from short circuit due to unexpected contact, and effectively improving the yield of the multilayer circuit board.
Further, the top end of the conducting structure 14 protrudes out of the top surface of the first glue layer 11 to form a first protruding portion 141.
As can be seen from the above description, the presence of the first protrusion 141 enables the conductive structure 14 to be more stably conducted with the circuit layer on the external substrate.
Further, still including locating the first layer 15 of leaving type of the top surface of first glue film 11, first leave type layer 15 is last have with first bulge 141 matched with first hole, the height of first bulge 141 with the thickness of first layer 15 of leaving type equals.
As can be seen from the above description, when the user uses the adhesive tape, the first release layer 15 is removed to adhere to the external substrate by using the first adhesive layer 11.
Further, the thickness of the first release layer 15 is less than or equal to 25 micrometers.
From the above description, the height of the first protruding portion 141 can be controlled by the thickness of the first release layer 15, and the first protruding portion 141 can be prevented from being too protruded after the first release layer 15 is torn off due to the thinner thickness of the first release film, so that the pressing of the multilayer board is affected.
Further, the bottom end of the conducting structure 14 protrudes out of the bottom surface of the second glue layer 13 to form a second protruding portion 142.
As can be seen from the above description, the existence of the second protrusion 142 enables the conducting structure 14 to be more stably conducted with the circuit layer on the external substrate.
Further, still including locating from type structure 16 of the bottom surface of second glue film 13, from type structure 16 including second from type layer 161, second from type layer 161 has the second hole with second bulge 142 matched with, the height of second bulge 142 is more than or equal to the second is from the thickness of layer 161.
As can be seen from the above description, the peeling-off structure 16 can be adhered to the external substrate by the second adhesive layer 13 when the user uses the adhesive tape.
Further, the release structure 16 further includes a copper foil layer 163 adhered to the bottom surface of the second release layer 161 through a third glue layer 162, and the height of the second protruding portion 142 is equal to the sum of the thickness of the second release layer 161 and the thickness of the third glue layer 162.
As can be seen from the above description, the presence of the copper foil layer 163 can facilitate the fabrication of the vias 171 for accommodating the via structures 14 on the sandwich glue layer.
Further, the insulating layer 12 is a PI film.
Further, the conducting structure 14 is in a circular truncated cone shape as a whole.
Multilayer circuit board, including first base plate 3 and second base plate 4, first base plate 3 is located the top of second base plate 4, the bottom surface of first base plate 3 is equipped with first circuit layer 31, the top surface of second base plate 4 is equipped with second circuit layer 41, still includes above-mentioned sandwich glue film, first glue film 11 with first base plate 3 is connected, second glue film 13 is connected with second base plate 4, conduction structure 14 switches on first circuit layer 31 with second circuit layer 41.
As can be seen from the above description, the multilayer circuit board has a stable structure and a high yield.
Example one
Referring to fig. 1 and fig. 2, a first embodiment of the present invention is: a sandwich adhesive layer is used for bonding and conducting a first circuit layer on a first substrate and a second circuit layer on a second substrate in a multilayer circuit board.
Sandwich glue film includes the main part, the main part is including from top to bottom consecutive first glue film 11, insulating layer 12 and second glue film 13 of range upon range of, still including running through in proper order the conduction structure 14 of first glue film 11, insulating layer 12 and second glue film 13, the top of conduction structure 14 expose in first glue film 11, the bottom of conduction structure 14 expose in second glue film 13. Optionally, the conducting structure 14 is integrally in a circular truncated cone shape.
Specifically, the top end of the conducting structure 14 protrudes out of the top surface of the first adhesive layer 11 to form a first protruding portion 141. Further, still including locating the first layer 15 of leaving type of the top surface of first glue film 11, first leave type have on the layer 15 with first bulge 141 matched with first hole, first bulge 141's height with first layer 15's thickness equals, first optional PET membrane of leaving type 15. Preferably, the thickness of the first release layer 15 is less than or equal to 25 micrometers; the thickness of the insulating layer 12 is less than or equal to 5 micrometers.
The bottom end of the conducting structure 14 protrudes out of the bottom surface of the second glue layer 13 to form a second protruding portion 142. Further, still including locating from type structure 16 of the bottom surface of second glue film 13, from type structure 16 including second from type layer 161, second from type layer 161 has the second hole with second bulge 142 matched with, the height of second bulge 142 is more than or equal to the second is from the thickness of layer 161.
Note that, as shown in fig. 1, when the release structure 16 only includes the second release layer 161, the height of the second protrusion 142 is equal to the thickness of the second release layer 161; as shown in fig. 2, when the release structure 16 further includes a copper foil layer 163 adhered to the bottom surface of the second release layer 161 through a third adhesive layer 162 in addition to the second release layer 161, the height of the second protruding portion 142 is equal to the sum of the thickness of the second release layer 161 and the thickness of the third adhesive layer 162, that is, the height of the second protruding portion 142 is greater than the thickness of the second release layer 161. As can be easily understood, the main body of the sandwich adhesive layer is formed by removing the first release layer 15 and the release structure 16.
Optionally, the second release layer 161 is a PET film; the insulating layer 12 is a PI film. Of course, the material of the first release layer 15, the material of the second release layer 161, and the material of the insulating layer 12 may be other materials.
Example two
Referring to fig. 3, the second embodiment of the present invention is: a method for preparing a sandwich adhesive layer comprises the following steps,
obtaining a laminated structure, wherein the laminated structure comprises a first release layer 15, a first adhesive layer 11, an insulating layer 12, a second adhesive layer 13 and a release structure 16 which are sequentially connected from top to bottom;
a via hole 171 sequentially penetrating through the first release layer 15, the first adhesive layer 11, the insulating layer 12, the second adhesive layer 13 and the release structure 16 is formed in the laminated structure;
forming the via hole 171 into a blind hole by using the outer structure 2, and injecting conductive paste for subsequently forming the via structure 14 into the blind hole;
and removing the external structure 2 to obtain the sandwich glue layer.
The release structure 16 includes a second release layer 161, and when the via hole 171 is provided on the laminated structure, the via hole 171 penetrates through the whole laminated structure; when the via hole 171 is formed as a blind hole by using the external structure 2, the external structure 2 is padded under the second release layer 161 to plug one end of the via hole 171 away from the first release layer 15.
When the conductive paste is injected into the blind hole, the injection amount of the conductive paste is equal to the capacity of the blind hole, and the whole conducting hole 171 is in a circular truncated cone shape.
EXAMPLE III
Referring to fig. 4, a third embodiment of the present invention is: a method for preparing a sandwich adhesive layer comprises the following steps,
obtaining a laminated structure, wherein the laminated structure comprises a first release layer 15, a first adhesive layer 11, an insulating layer 12, a second adhesive layer 13 and a release structure 16 which are sequentially connected from top to bottom;
a via hole 171 sequentially penetrating through the first release layer 15, the first adhesive layer 11, the insulating layer 12, the second adhesive layer 13 and a partial area of the release structure 16 is formed in the laminated structure;
forming a blind hole in the via hole 171 by using the release structure 16 corresponding to the remaining portion of the via hole 171, and injecting conductive paste for forming the via structure 14 later into the blind hole.
From type structure 16 including from top to bottom stack gradually continuous second from type layer 161, third glue film 162 and copper foil layer 163, set up on laminated structure during via hole 171, utilize radium-shine mode to form via hole 171, it is optional, use the radium-shine formation of carbon dioxide laser via hole 171. Due to the existence of the copper foil layer 163, the copper foil layer 163 is not broken down when the via hole 171 is irradiated, so that only the area of the second release layer 161 corresponding to the via hole 171 and the area of the third glue layer 162 corresponding to the via hole 171 of the release structure 16 are eliminated, and the area of the copper foil layer 163 corresponding to the via hole 171 forms the aforementioned "remaining portion of the release structure 16 corresponding to the via hole 171".
When the conductive paste is injected into the blind hole, the injection amount of the conductive paste is equal to the capacity of the blind hole, and the whole conducting hole 171 is in a circular truncated cone shape.
Example four
Referring to fig. 5, a fourth embodiment of the present invention is: the multilayer circuit board can be applied to electronic equipment such as mobile phones, smart watches, base stations, computers and the like.
The multilayer circuit board comprises a first substrate 3 and a second substrate 4, wherein the first substrate 3 is located above the second substrate 4, a first circuit layer 31 is arranged on the bottom surface of the first substrate 3, a second circuit layer 41 is arranged on the top surface of the second substrate 4, the multilayer circuit board further comprises an embodiment I sandwich adhesive layer, the first adhesive layer 11 is connected with the first substrate 3, the second adhesive layer 13 is connected with the second substrate 4, and the conduction structure 14 is conducted between the first circuit layer 31 and the second circuit layer 41.
The embodiment also provides a method for preparing a multilayer circuit board corresponding to the multilayer circuit board, which comprises the following steps: obtaining a sandwich adhesive layer and a first substrate 3 and a second substrate 4 for completing circuit manufacturing, wherein a first circuit layer 31 is formed on the bottom surface of the first substrate 3, a second circuit layer 41 is formed on the top surface of the second substrate 4, and the sandwich adhesive layer is manufactured by the preparation method of the sandwich adhesive layer described in the second embodiment or the third embodiment;
tearing off the first release layer 15 and the release structure 16 of the sandwich adhesive layer, bonding the first substrate 3 and the second substrate 4 by using the sandwich adhesive layer, and making the conductive paste contact with the first circuit layer 31 and the second circuit layer 41 respectively;
and pressing the first substrate 3, the sandwich adhesive layer and the second substrate 4 to form a stacked structure, thereby obtaining the multilayer circuit board. Optionally, the conductive paste is conductive paste of TATSUTA, and the conductive paste contains sn-cu/sn-bi alloy powder and resin components, the metal powder can make the conductive paste and the copper (i.e., the first circuit layer 31/the second circuit layer 41) generate alloy conduction at 130 ℃ and under pressure, and the resin components are completely cured at 170 ℃.
In summary, in the sandwich adhesive layer and the multilayer circuit board provided by the utility model, the insulating layer serves as the middle layer, and in the process of laminating the multilayer board, even if partial areas of the first adhesive layer and the second adhesive layer in the sandwich adhesive layer become thin, the insulating layer can well isolate the circuit layers of the two substrates connected by the sandwich adhesive layer, so that short circuit caused by unexpected contact in the partial areas of the multilayer circuit board is prevented, and the yield of the multilayer circuit board is effectively improved. In the preparation method of the sandwich adhesive layer and the multilayer circuit board, the sandwich adhesive layer and the substrate circuit are synchronously manufactured, only one-time pressing is needed, the manufacturing period is short, and the product size stability is good.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a sandwich glue film, includes the main part, its characterized in that: the main part is including from top to bottom consecutive first glue film, insulating layer and the second glue film of range upon range of, still including running through in proper order the conduction structure of first glue film, insulating layer and second glue film, the top of conduction structure expose in first glue film, the bottom of conduction structure expose in the second glue film.
2. The layer of sandwich adhesive of claim 1 wherein: the top end of the conducting structure protrudes out of the top surface of the first adhesive layer to form a first protruding portion.
3. The layer of sandwich adhesive of claim 2 wherein: still including locating the first layer of leaving type of the top surface of first glue film, first leave the layer on have with first bulge complex first hole, the height of first bulge with the first thickness of leaving the layer equals.
4. The layer of sandwich adhesive of claim 3 wherein: the thickness of the first release layer is less than or equal to 25 micrometers.
5. The layer of sandwich adhesive of claim 1 wherein: the bottom end of the conducting structure protrudes out of the bottom surface of the second adhesive layer to form a second protruding portion.
6. The layer of sandwich adhesive of claim 5 wherein: still including locating what the bottom surface of second glue film is from the type structure, from the type structure including the second from the type layer, the second has with second bulge complex second hole from the type layer, the height of second bulge is more than or equal to the second is from the thickness on type layer.
7. The layer of sandwich adhesive of claim 6 wherein: the release structure further comprises a copper foil layer which is bonded with the bottom surface of the second release layer through a third adhesive layer, and the height of the second protruding portion is equal to the sum of the thickness of the second release layer and the thickness of the third adhesive layer.
8. The layer of sandwich adhesive of claim 1 wherein: the insulating layer is a PI film.
9. The layer of sandwich adhesive of claim 1 wherein: the whole conducting structure is in a round table shape.
10. Multilayer circuit board, including first base plate and second base plate, first base plate is located the top of second base plate, the bottom surface of first base plate is equipped with first circuit layer, the top surface of second base plate is equipped with second circuit layer, its characterized in that: the sandwich adhesive layer of any one of claims 1-9, wherein the first adhesive layer is connected to the first substrate, the second adhesive layer is connected to the second substrate, and the conductive structure connects the first circuit layer and the second circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121864496.9U CN216122982U (en) | 2021-08-10 | 2021-08-10 | Sandwich glue film and multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121864496.9U CN216122982U (en) | 2021-08-10 | 2021-08-10 | Sandwich glue film and multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216122982U true CN216122982U (en) | 2022-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121864496.9U Active CN216122982U (en) | 2021-08-10 | 2021-08-10 | Sandwich glue film and multilayer circuit board |
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| CN (1) | CN216122982U (en) |
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2021
- 2021-08-10 CN CN202121864496.9U patent/CN216122982U/en active Active
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