CN216120829U - Circuit board and socket - Google Patents
Circuit board and socket Download PDFInfo
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- CN216120829U CN216120829U CN202122841852.1U CN202122841852U CN216120829U CN 216120829 U CN216120829 U CN 216120829U CN 202122841852 U CN202122841852 U CN 202122841852U CN 216120829 U CN216120829 U CN 216120829U
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- pad
- circuit board
- holes
- bonding pad
- pads
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Abstract
The utility model discloses a circuit board and a socket, wherein the circuit board comprises a substrate and a bonding pad layer, the substrate is provided with at least two first through holes, at least two second through holes and at least one third through hole which are sequentially arranged along a first direction at intervals, the bonding pad layer comprises a first bonding pad, a second bonding pad and a third bonding pad which are all attached to the substrate, the first bonding pad is arranged on the periphery of the first through holes, extends along the first direction and is far away from the second through holes, the third bonding pad is arranged on the periphery of the third through holes, extends along the first direction and is far away from the second through holes, the number of the second bonding pads is consistent with that of the second through holes, and is arranged on the periphery of the corresponding second through holes, and at least one second bonding pad extends along a second direction. The solder pad on the circuit board is not easy to generate short circuit of the circuit board caused by tin dragging phenomenon.
Description
Technical Field
The utility model relates to the technical field of electronics, in particular to a circuit board and a socket.
Background
In the soldering of the straight plug-in, the straight plug-in is soldered on the circuit board, usually in the form of wave soldering. Wave soldering is to make the soldering surface of the circuit board directly contact with high-temperature liquid tin, the high-temperature liquid tin contacts with the soldering pad on the circuit board inserted into the straight plug-in unit, and after cooling, the pins of the straight plug-in unit are respectively fixed on the corresponding soldering pads by the high-temperature liquid tin. However, because the number of pins of the USB straight plug-in the USB socket is large and dense, and the number of pads on the corresponding circuit board is dense, the phenomenon of tin dragging is likely to occur during wave soldering, so that the circuit board is short-circuited.
In view of the above-mentioned drawbacks, it is desirable to provide a new circuit board and socket.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board and a socket, and aims to solve the problem that the existing circuit board is short-circuited due to the fact that tin dragging is easily generated due to dense welding pads during wave soldering.
In order to achieve the above object, the circuit board provided by the present invention comprises a substrate and a pad layer, wherein the substrate is provided with a first via hole, a second via hole and a third via hole which are sequentially arranged at intervals along a first direction, the number of the second via holes is at least two, the at least two second via holes are arranged at intervals along the first direction, the bonding pad layer comprises a first bonding pad, a second bonding pad and a third bonding pad which are attached to the substrate, the first bonding pad is arranged on the periphery of the first through hole, and extends along the first direction and is far away from the second via hole, the third pad is arranged at the periphery of the third via hole, and extending along the first direction and away from the second via holes, the number of the second pads being the same as the number of the second via holes, and the second through holes are correspondingly arranged on the periphery of the second through holes, and at least one second pad extends along a second direction.
Preferably, the first direction and the second direction are perpendicular to each other.
Preferably, the second pad adjacent to the first pad extends in the second direction; and/or the second bonding pad adjacent to the third bonding pad extends along the second direction
Preferably, both ends of at least one of the second pads along the second direction are far away from the second via.
Preferably, at least one of the second pads is an elliptical pad; or at least one second bonding pad is a diamond-shaped bonding pad.
Preferably, the first pad is an oval pad; and/or the third pad is an oval pad.
Preferably, the first pad is a diamond pad; and/or the third bonding pad is a diamond bonding pad.
Preferably, the substrate is further provided with a plurality of pairs of fourth via holes arranged at intervals in the first direction, each pair of fourth via holes are arranged at intervals, the first via hole, the second via hole and the third via hole are all located between each pair of fourth via holes, the pad layer further comprises a plurality of fourth pads attached to the substrate, and one fourth pad is arranged on the periphery of each fourth via hole.
Preferably, the fourth via passes through a middle portion of the corresponding fourth pad.
In addition, the utility model also provides a socket, which comprises the USB plug-in and the circuit board.
In the technical scheme, the circuit board comprises a substrate and a pad layer, wherein the substrate is provided with at least two first via holes, at least two second via holes and at least one third via hole which are sequentially arranged along a first direction at intervals, the pad layer comprises a first pad, a second pad and a third pad which are attached to the substrate, the first pad is arranged on the periphery of the first via hole, the third pad is arranged on the periphery of the third via hole, the first pad and the third pad extend along the first direction and are far away from the second via hole, the number of the second pads is consistent with that of the second via holes and are arranged on the periphery of the corresponding second via holes, and at least one second pad extends along a second direction. When the circuit board is subjected to wave soldering, the extending part of the first bonding pad attracts the liquid tin on the part of the first bonding pad close to the second bonding pad so that the liquid tin flows towards the direction far away from the second bonding pad along the first direction, and the extending part of the third bonding pad attracts the liquid tin on the part of the third bonding pad close to the second bonding pad so that the liquid tin flows towards the direction far away from the second bonding pad along the first direction, so that gaps are reserved between the liquid tin on the first bonding pad and the liquid tin on the third bonding pad and the liquid tin on the second bonding pad respectively, and after the liquid tin on the circuit board is solidified, the first bonding pad, the second bonding pad, the third bonding pad and the upper solidified tin are independent and do not interfere with each other. The solder pad on the circuit board is not easy to generate short circuit of the circuit board caused by tin dragging phenomenon.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the utility model.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2 | Pad layer |
| 11 | A |
21 | |
| 12 | Second via |
22 | |
| 13 | |
23 | Third bonding pad |
| 14 | A |
24 | Fourth bonding pad |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a circuit board and a socket, and aims to solve the problem that the circuit board is short-circuited due to the fact that tin dragging is easily generated due to the fact that welding pads are dense when the existing circuit board is subjected to wave soldering.
Referring to fig. 1, the circuit board includes a substrate 1 and a pad layer 2, the substrate 1 is provided with a first via hole 11, a second via hole 12 and a third via hole 13 which are sequentially arranged along a first direction (Y direction in fig. 1) at intervals, the number of the second via holes 12 is at least two, the at least two second via holes 12 are arranged along the first direction at intervals, the pad layer 2 includes a first pad 21, a second pad 22 and a third pad 23 which are all attached to the substrate 1, the first pad 21 is arranged at the periphery of the first via hole 11, and extends in the first direction and away from the second via 12, the third pad 23 is provided at the outer circumference of the third via 13, and extends in the first direction and away from the second vias 12, the number of the second pads 22 corresponds to the number of the second vias 12, and is provided at the outer periphery of the corresponding second via 12, and the at least one second pad 22 extends in the second direction (X direction in fig. 1).
The circuit board comprises a substrate 1 and a pad layer 2, wherein the substrate 1 is provided with a first via hole 11, a second via hole 12 and a third via hole 13 which are sequentially arranged at intervals along a first direction, the pad layer 2 comprises a first pad 21, a second pad 22 and a third pad 23 which are all attached to the substrate 1, the first pad 21 is arranged on the periphery of the first via hole 11, the second pad 22 is arranged on the periphery of the second via hole 12, the third pad 23 is arranged on the periphery of the third via hole 13, in addition, the first pad 21 extends along the first direction and is far away from the second via hole 12, so that the surface area of the extended portion on the first pad 21 is greater than the surface area of the portion of the first pad 21 near the second via 12, the third pad 23 extends in the first direction and away from the second via 12, and the larger the surface area of the pad, the greater the surface tension and thus the force on the liquid tin. Therefore, when the circuit board is subjected to wave soldering, the extending portion of the first pad 21 attracts the liquid tin on the portion close to the second pad 22, so that the liquid tin flows in the first direction in the direction away from the second pad 22, and the extending portion of the third pad 23 attracts the liquid tin on the portion close to the second pad 22, so that the liquid tin flows in the first direction in the direction away from the second pad 22, so that gaps are respectively formed between the liquid tin on the first pad 21 and the liquid tin on the third pad 23 and the liquid tin on the second pad 22, and after the liquid tin on the circuit board is solidified, the first pad 21, the second pad 22, the third pad 23 and the upper solidified tin are respectively independent and do not interfere with each other. The solder pad on the circuit board is not easy to generate short circuit of the circuit board caused by tin dragging phenomenon.
As an embodiment, referring to fig. 2, in order to adapt to different connectors, the number of the second vias 12 may be set to be multiple, the number of the second pads 22 is the same as the number of the second vias 12 and is set at the periphery of the corresponding second vias 12, and at least one second pad 22 extends along the second direction. In an embodiment, the number of the second vias 12 is two, the two second vias 12 are disposed at intervals along the first direction and are both located between the first via 11 and the third via 13, the two second pads 22 are disposed at the peripheries of the two second vias 12 in a one-to-one correspondence, and the second pads 22 adjacent to the first pads 21 and the third pads 23 extend along the second direction, so that the liquid tin on the second pads 22 can flow along the second direction, and thus interference with the liquid tin on the first pads 21 and the third pads 23 can be further avoided.
Further, the first direction and the second direction are perpendicular to each other. In this embodiment, in order to avoid short circuit after tin coating between the two second pads 22, the two second pads 22 or one of the second pads 22 may extend along the second direction, and the first direction forms an included angle with the second direction. When the circuit board is coated with tin, the liquid tin is attracted by the extending part of the second bonding pad 22, so that the liquid tin at the part of the second bonding pad 22 close to other bonding pads is separated from the liquid tin on other bonding pads, wherein the other bonding pads can be the first bonding pad 21, the second bonding pad 22 and the third bonding pad 23. And the first direction and the second direction are perpendicular to each other in order to better separate the solder on the second pad 22 from the solder on the first pad 21 or the third pad 23.
In addition, in an embodiment, the second pad 22 adjacent to the first pad 21 extends in the second direction. In order to prevent the first pad 21 and the second pad 22 from interfering with each other, the first pad 21 extends in a direction away from the second pad 22 along a first direction, so that the liquid tin on the first pad 21 is pulled in the direction away from the second pad 22 along the first direction, the second pad 22 adjacent to the first pad 21 extends in a second direction, and the liquid tin on the second pad 22 adjacent to the first pad 21 is pulled in the second direction, so that a gap is formed between the liquid tin on the adjacent first pad 21 and the liquid tin on the second pad 22, and the gap does not interfere with each other. Similarly, in another embodiment, the second pad 22 adjacent to the third pad 23 extends in the second direction, and the second pad 22 adjacent to the third pad 23 pulls the liquid tin on the second pad 22 in the second direction, thereby preventing the liquid tin on the second pad 22 from interfering with the liquid tin on the third pad 23.
In addition, in one embodiment, both ends of the at least one second pad 22 in the second direction are distant from the second via 12. Both ends of at least one second pad 22 in the second direction are far away from the second via 12, so that both ends of the second pad 22 in the second direction attract the liquid tin on both ends of the second pad 22 in the first direction, and the solder on the second pad 22 is separated from the solder on the first pad 21 or the third pad 23 adjacent to each other in the first direction and the solder on the other second pad 22 adjacent to each other in the first direction.
Wherein at least one second pad 22 is an oval pad. In order to obtain a better pad surface tension and thus a better force on the liquid tin, the at least one second pad 22 is provided as an oval pad. In another embodiment, at least one of the second pads 22 is a diamond-shaped pad, again to allow the second pad 22 to achieve better pad surface tension to better solidify the liquid tin on the second pad 22 without interfering with adjacent pads.
Further, in order to realize various functions, the first pad 21 is an elliptical pad; and/or the third pad 23 is an oval pad. In order to obtain better pad surface tension and thus better force on the liquid tin, the first pad 21 and the third pad 23 are both provided as oval pads, and the first pad 21 or the third pad 23 may also be provided as oval pads according to the design of the circuit board.
In addition, in the above-described embodiment, the first pads 21 are diamond-shaped pads; and/or the third pad 23 is a diamond pad. In order to obtain better pad surface tension and thus better force on the liquid tin, the first pad 21 and the third pad 23 are both designed as diamond pads, and the first pad 21 or the third pad 23 may also be designed as diamond pads according to the design of the circuit board.
In one embodiment, the substrate 1 is further provided with a plurality of pairs of fourth via holes 14 arranged at intervals along the first direction, each pair of fourth via holes 14 are arranged at intervals, the first via hole 11, the second via hole 12 and the third via hole 13 are all located between each pair of fourth via holes 14, the pad layer 2 further includes a plurality of fourth pads 24 attached to the substrate 1, and a fourth pad 24 is arranged on the periphery of each fourth via hole 14. In order to enable the circuit board to be suitable for different connectors, the substrate 1 is provided with a plurality of pairs of fourth vias 14, four, six, or eight pairs of fourth vias 14 may be correspondingly adopted to match the connectors, the plurality of pairs of fourth vias 14 are sequentially arranged along the first direction at intervals, in one embodiment, any pair of fourth vias 14 is arranged along the second direction at intervals, the first via 11, the second via 12, and the third via 13 are located between any pair of fourth vias 14, the pad layer 2 is provided with a plurality of fourth pads 24, and the periphery of each fourth via 14 is provided with one fourth pad 24.
Further, the fourth via 14 passes through the middle of the corresponding fourth pad 24. In order to obtain a uniform soldering surface and thus a uniform distribution of soldering stress, the fourth via 14 is located at the middle of the corresponding fourth pad 24.
In addition, the utility model further provides a socket, the socket comprises the USB plug-in and the circuit board, and the socket comprises all technical features of the circuit board and has corresponding beneficial effects, which are not described in detail herein.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board, comprising:
the substrate is provided with first via holes, second via holes and third via holes which are sequentially arranged at intervals along a first direction, the number of the second via holes is at least two, and the at least two second via holes are arranged at intervals along the first direction;
the pad layer, the pad layer including all with the first pad, second pad and the third pad of base plate laminating, first pad is located the periphery of first via hole, and follow first direction extends and keeps away from the second via hole, the third pad is located the periphery of third via hole, and follows first direction extends and keeps away from the second via hole, the quantity of second pad with the quantity of second via hole is unanimous, and locates and correspond the periphery of second via hole, at least one the second pad extends along the second direction.
2. The circuit board of claim 1, wherein the first direction and the second direction are perpendicular to each other.
3. The circuit board of claim 1, wherein the second pad adjacent to the first pad extends in the second direction; and/or the second pad adjacent to the third pad extends in the second direction.
4. The circuit board of claim 1, wherein both ends of at least one of the second pads in the second direction are distal from the second via.
5. The circuit board of claim 1, wherein at least one of the second pads is an oval pad; or at least one second bonding pad is a diamond-shaped bonding pad.
6. The circuit board of any of claims 1-5, wherein the first pad is an oval pad; and/or the third pad is an oval pad.
7. The circuit board of any of claims 1-5, wherein the first pad is a diamond pad; and/or the third bonding pad is a diamond bonding pad.
8. The circuit board according to any one of claims 1 to 5, wherein the substrate further defines a plurality of pairs of fourth vias spaced apart from each other along the first direction, each pair of fourth vias is spaced apart from each other, the first via, the second via, and the third via are located between each pair of fourth vias, the pad layer further includes a plurality of fourth pads attached to the substrate, and one fourth pad is disposed on an outer periphery of each fourth via.
9. The circuit board of claim 8, wherein the fourth via passes through a middle portion of the corresponding fourth pad.
10. A socket, characterized in that the socket comprises a USB plug and a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122841852.1U CN216120829U (en) | 2021-11-18 | 2021-11-18 | Circuit board and socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122841852.1U CN216120829U (en) | 2021-11-18 | 2021-11-18 | Circuit board and socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216120829U true CN216120829U (en) | 2022-03-22 |
Family
ID=80717888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122841852.1U Active CN216120829U (en) | 2021-11-18 | 2021-11-18 | Circuit board and socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216120829U (en) |
-
2021
- 2021-11-18 CN CN202122841852.1U patent/CN216120829U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |