CN211240253U - Flexible circuit board, chip module and electronic equipment - Google Patents
Flexible circuit board, chip module and electronic equipment Download PDFInfo
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- CN211240253U CN211240253U CN201922059665.0U CN201922059665U CN211240253U CN 211240253 U CN211240253 U CN 211240253U CN 201922059665 U CN201922059665 U CN 201922059665U CN 211240253 U CN211240253 U CN 211240253U
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- circuit board
- flexible circuit
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Abstract
The utility model discloses a flexible circuit board, chip module and electronic equipment, flexible circuit board includes: the printing ink comprises a substrate, a copper foil layer and an ink layer, wherein one side surface of the copper foil layer is arranged on the surface of the substrate, the ink layer is arranged on one side surface of the copper foil layer far away from the substrate, the copper foil layer comprises a main body and a grounding end which are connected, and the grounding end is provided with a hollow area which is communicated from the substrate towards the direction of the ink layer. At least part of the grounding end of the copper foil layer of the flexible circuit board is hollowed, so that the area of ink attached to the copper foil layer can be reduced, and part of the ink can be attached to the substrate through hollowed copper. Therefore, the heat at the bottom of the chip can not expand and bubble the ink as fast as solid copper when the SMT is performed at a high temperature, so that the bubbling of the ink layer can be effectively avoided, and the problem of chip cold joint can be avoided.
Description
Technical Field
The utility model belongs to the technical field of the circuit technique and specifically relates to a flexible circuit board, chip module and electronic equipment are related to.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of light weight, thin thickness and good bending property.
In the related art, the grounding copper at the bottom of the LGA (land grid array package) is the solid copper, and when the copper foil of the solid copper passes through the SMT (surface mount technology), if the ink in the FPC (flexible circuit board) factory is not processed, the ink bubbles, and the LGA is jacked up to cause the cold joint, resulting in poor performance of the manufactured flexible circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a flexible circuit board, which can avoid ink bubbling when the SMT is passed, and can ensure the connection reliability of the chip.
The utility model discloses a chip module is further provided.
The utility model discloses an electronic equipment is still further provided.
According to the utility model discloses flexible circuit board of first aspect embodiment, include: the printing ink comprises a substrate, a copper foil layer and an ink layer, wherein one side surface of the copper foil layer is arranged on the surface of the substrate, the ink layer is arranged on one side surface of the copper foil layer far away from the substrate, the copper foil layer comprises a main body and a grounding end which are connected, and the grounding end is provided with a hollow area which is communicated from the substrate towards the direction of the ink layer.
According to the utility model discloses a flexible circuit board sets the copper of at least part fretwork to through the copper foil layer with the flexible circuit board earthing terminal, can reduce the area that the printing ink layer adheres to on the copper foil layer. In addition, the specific heat capacity of the copper foil is smaller than that of the substrate material, the adhesion force is not the same as that of the substrate material, and in the hollowed-out copper part, a part of the printing ink is adhered to the substrate of the FPC (flexible printed circuit board) through the hollowed-out copper. Thus, the heat at the bottom of the LGA during SMT high temperature oven does not swell the ink into bubbles as fast as solid copper.
According to some embodiments of the invention, the ground terminal is latticed. The grounding terminal is in a grid shape, so that the heat at the bottom of the LGA can not expand and bubble ink as fast as solid copper when the SMT is processed by a high-temperature furnace.
According to some embodiments of the invention, the grid is rectangular or diamond shaped. The grid is arranged to be rectangular or rhombic, so that the production efficiency of the grounding terminal can be improved.
According to some embodiments of the invention, the body is solid copper. The solid copper is convenient for the flexible circuit board to be electrically connected with an external circuit.
According to the utility model discloses some embodiments, the earthing terminal is interweaved by many copper lines and forms, every the width of copper line is a, adjacent two that the extending direction is the same the interval of copper line is b, and wherein, a and b satisfy the relational expression: 0.2 < a/b < 1. When a/b is more than 0.2 and less than 1, the expansion amplitude of the ink layer sprayed on the grounding terminal is less than that of the ink layer directly sprayed on the solid copper.
According to some embodiments of the invention, a/b is 0.25. When a/b is 0.25, the expansion amplitude of the ink layer is minimum when the flexible circuit board is subjected to an SMT high-temperature furnace.
According to the utility model discloses some embodiments, the whole region of earthing terminal is first shape, the shape that forms after the design of radius angle is done with the rectangle four corners to first shape is the same. The grounding end and four corners of the rectangle are designed to be rounded to form the same shape, so that the pressure resistance of the grounding end can be improved.
According to the utility model discloses chip module of second aspect embodiment, chip module includes: the flexible circuit board and the chip are arranged on the surface of one side, far away from the substrate, of the ink layer, and the chip corresponds to the grounding end. The chip is arranged on the flexible circuit board, so that the assembled chip module has certain functions, and a user can achieve corresponding purposes through the chip module.
According to some embodiments of the present invention, the chip is a fingerprint identification chip. The fingerprint identification chip can make the chip module have fingerprint identification's function.
According to the utility model discloses electronic equipment of third aspect embodiment, include chip module. Through installing the chip module on electronic equipment to make electronic equipment have the fingerprint identification function, make the user control electronic equipment through fingerprint identification.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a chip module according to an embodiment of the present invention.
Fig. 2 is a schematic view of a partial structure of a ground terminal according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chip module according to another embodiment of the present invention;
fig. 4 is a simplified diagram of an electronic device according to an embodiment of the present invention, in which the chip module and the flexible circuit board are simplified.
Reference numerals:
t: an electronic device;
s: a chip module;
100: a flexible circuit board;
10: a substrate;
20: a copper foil layer; 21: a ground terminal; 22: main body
200: and (3) a chip.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
A flexible circuit board 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 4.
As shown in fig. 1, the flexible circuit board 100 includes: base plate 10, copper foil layer 20 and printing ink layer, 20 side surfaces of copper foil layer set up in the surface of base plate 10, the printing ink layer set up in 20 a side surface of keeping away from base plate 10 of copper foil layer, the printing ink layer can be attached to 20 a side surface of keeping away from base plate 10 of copper foil layer through the mode of spraying, the printing ink layer can play the effect that covers copper foil layer 20.
In addition, as shown in fig. 1, the copper foil layer 20 includes a main body 22 and a ground terminal 21 connected to each other, the ground terminal 21 has a hollow area penetrating from the substrate toward the ink layer, and the ground terminal 21 is configured to correspond to the chip 200. In some embodiments, the main body 22 is solid copper, that is, the bottom of the flexible circuit board 100 is the substrate 10, the upper surface of the substrate 10 is the copper foil layer 20, the copper foil layer 20 is divided into the main body 22 of solid copper and the grounding terminal 21 with a part of hollow, and the ink layer is sprayed on the surface of the copper foil layer 20 away from the substrate 10. The partially hollowed-out ground terminal 21 is used to correspond to the chip 200, that is, the chip 200 is disposed on the ink layer corresponding to the ground terminal 21, for example, the chip 200 may be fixed on the ink layer by using an SMT technique.
By providing the copper foil layer 20 of the ground terminal 21 of the flexible circuit board 100 as at least partially hollow copper, the area of the ink layer attached to the copper foil layer 20 can be reduced. And, because the specific heat capacity of copper foil is less than the material specific heat capacity of base plate 10, and the adsorption affinity of copper foil is also less than the material of base plate 10, in the part of non-entity copper, the printing ink layer has partly through non-entity copper attached to the base plate 10 of flexible circuit board 100, thereby can increase the adhesion reliability of printing ink layer in base plate 10 and earthing terminal 21 department, can reduce the risk that the printing ink layer bubble breaks away from, especially the heat of chip 200 bottom does not make the expansion range of printing ink layer too big when SMT overhigh temperature stove, can avoid appearing the problem of chip 200 rosin joint like this, can guarantee the connection reliability of chip 200 on flexible circuit board 100.
Optionally, as shown in fig. 1, the grounding terminal 21 is in a grid shape, and the grounding terminal 21 is set to be in a grid shape, so that when the ink layer is sprayed, a part of ink is sprayed on the substrate 10 through the grid on the grounding terminal 21, because the specific heat capacity of the material of the substrate 10 is higher than that of the solid copper, that is, when the furnace is over-heated, the temperature of the raised temperature of the substrate 10 is lower than that of the grounding terminal 21 at the same time, so that the expansion amplitude of the ink layer can be ensured to be small, the excessive expansion of the ink layer can be avoided, and the performance of the flexible circuit board 100 can be.
Specifically, as shown in fig. 1, the main body 22 of the copper foil layer is a solid copper structure, and the solid copper facilitates electrical connection between the flexible circuit board and an external circuit.
Specifically, as shown in fig. 1, the grid may be rectangular or rhombic, because the rectangular or rhombic structure is simple and easy to produce, and the grid is set to be rectangular or rhombic, the production efficiency of the ground terminal 21 can be improved under the condition of ensuring the performance of the flexible circuit board 100, and further the production efficiency of the flexible circuit board 100 can be improved. Wherein, the grid can be formed by digging holes on the surface of the solid copper.
As can be seen from fig. 2, the ground terminal 21 may be formed by interweaving a plurality of copper wires, the plurality of copper wires are sequentially arranged in sequence to form a grid, and each copper wire has a width a, that is, the width of the copper wire is a. The distance between two adjacent copper wires with the same extending direction is b, wherein a and b satisfy the relation: 0.2 < a/b < 1. When a/b is more than 0.2 and less than 1, the expansion amplitude of the ink layer sprayed on the hollowed-out area is less than that of the ink layer directly sprayed on the solid copper, so that the working performance of the flexible circuit board 100 can be improved.
For example, when a/b is 0.25, and when a/b is 0.25, the flexible circuit board 100 has a reasonable expansion range of the ink layer when the SMT is over-high temperature oven, and the performance of the ground terminal 21 of the flexible circuit board 100 is not affected, so that the performance of the flexible circuit board 100 can be ensured.
In addition, referring to fig. 1 and 3, the entire region of the ground terminal has a first shape, which is the same as a shape formed by rounding four corners of a rectangle. The shape of the grounding end is designed to be the same as that of the rectangular four corners after the four corners are rounded, so that the pressure resistance of the grounding end 21 can be improved, and when the flexible circuit board 100 is impacted, the rectangular grounding end with the rounded corner can bear larger pressure, so that the flexible circuit board 100 is prevented from being damaged.
As shown in fig. 1, the utility model also provides a chip module S, chip module S includes: the chip 200 is arranged on one side surface of the ink layer, which is far away from the substrate, the chip 200 corresponds to the grounding end 21, the chip 200 is arranged on the flexible circuit board 100, so that the assembled chip module S has a certain function, and a user can achieve a corresponding using effect through the function of the chip module S. And the chip module S that so sets up can avoid appearing the problem of chip rosin joint.
Optionally, a side of the chip 200 away from the ink layer may be provided with a grid array package structure, called LGA package structure for short, and the LGA package structure may effectively protect the chip 220. The LGA package structure can fix the chip 200 by a mounting bracket, so that the flexible circuit board 100 after LGA packaging can be disconnected from the mounting bracket at any time to replace the chip 200.
Specifically, the chip 200 is a fingerprint identification chip 200, and the fingerprint identification chip 200 can enable the chip module S to have a fingerprint identification function.
The utility model discloses further provide an electronic equipment T, as shown in FIG. 4, chip module S that electronic equipment T includes is through installing chip module S on electronic equipment T to make electronic equipment T have the fingerprint identification function, make the user control electronic equipment T through fingerprint identification.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A flexible circuit board, comprising: the printing ink comprises a substrate, a copper foil layer and an ink layer, wherein one side surface of the copper foil layer is arranged on the surface of the substrate, the ink layer is arranged on one side surface of the copper foil layer far away from the substrate, the copper foil layer comprises a main body and a grounding end which are connected, and the grounding end is provided with a hollow area which is communicated from the substrate towards the direction of the ink layer.
2. The flexible circuit board of claim 1, wherein the ground terminals are in a grid pattern.
3. The flexible circuit board of claim 2, wherein the grid is rectangular or diamond shaped.
4. The flexible circuit board of claim 1, wherein the body is solid copper.
5. The flexible circuit board of claim 2, wherein the ground terminal is formed by a plurality of copper wires, each copper wire has a width a, and a distance b between two adjacent copper wires extending in the same direction, wherein a and b satisfy the following relation: 0.2 < a/b < 1.
6. The flexible circuit board of claim 5, wherein a/b is 0.25.
7. The flexible circuit board of claim 2, wherein the ground terminal has a first shape, and the first shape is the same as a shape formed by rounding four corners of a rectangle.
8. A chip module, comprising:
the flexible circuit board of any one of claims 1-7;
the chip is arranged on the surface of one side, far away from the substrate, of the ink layer, and corresponds to the grounding end.
9. The chip module according to claim 8, wherein the chip is a fingerprint identification chip.
10. An electronic device comprising the chip module according to any one of claims 8 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922059665.0U CN211240253U (en) | 2019-11-25 | 2019-11-25 | Flexible circuit board, chip module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922059665.0U CN211240253U (en) | 2019-11-25 | 2019-11-25 | Flexible circuit board, chip module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211240253U true CN211240253U (en) | 2020-08-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922059665.0U Active CN211240253U (en) | 2019-11-25 | 2019-11-25 | Flexible circuit board, chip module and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN211240253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490327A (en) * | 2021-06-24 | 2021-10-08 | 浙江清华柔性电子技术研究院 | Flexible circuit structure |
-
2019
- 2019-11-25 CN CN201922059665.0U patent/CN211240253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490327A (en) * | 2021-06-24 | 2021-10-08 | 浙江清华柔性电子技术研究院 | Flexible circuit structure |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |