CN216057619U - Flexible circuit board structure and display device - Google Patents
Flexible circuit board structure and display device Download PDFInfo
- Publication number
- CN216057619U CN216057619U CN202121930790.5U CN202121930790U CN216057619U CN 216057619 U CN216057619 U CN 216057619U CN 202121930790 U CN202121930790 U CN 202121930790U CN 216057619 U CN216057619 U CN 216057619U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- electronic element
- board structure
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The present disclosure provides a flexible circuit board structure and a display device, the flexible circuit board structure includes: a flexible circuit board; the electronic element is connected to the flexible circuit board, and the peripheral sides of the electronic element comprise a first side; the shielding cover is used for electromagnetically shielding the electronic element, is covered on the electronic element and is an unsealed opening side at least at the first side of the electronic element; and the waterproof adhesive layer is at least filled in the connecting position between the electronic element and the flexible circuit board. The flexible circuit board structure and the display device provided by the embodiment of the disclosure can improve the anti-interference, waterproof and moistureproof capabilities.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a flexible circuit board structure and a display device.
Background
With the demand of display development, the thickness of a flexible circuit board is thin when a display product and a flexible display product are folded, and the anti-interference capability and the waterproof and moistureproof capability of electronic elements on the flexible circuit board are relatively weak. In order to ensure the stability of the touch function of the folding and flexible display product, the anti-interference capability of a TIC (touch control chip) needs to be improved, and the waterproof and moistureproof capabilities are ensured.
SUMMERY OF THE UTILITY MODEL
The embodiment of the disclosure provides a flexible circuit board structure and a display device, which can improve the anti-interference, waterproof and damp-proof capabilities.
The technical scheme provided by the embodiment of the disclosure is as follows:
the disclosed embodiment provides a flexible circuit board structure, including:
a flexible circuit board;
the electronic element is connected to the flexible circuit board, and the peripheral sides of the electronic element comprise a first side;
the shielding cover is used for electromagnetically shielding the electronic element, is covered on the electronic element and is an unsealed opening side at least at the first side of the electronic element;
and the waterproof adhesive layer at least fills the connecting position between the electronic element and the flexible circuit board.
Illustratively, the shielding case is a thin plate-shaped cover body with the thickness smaller than a threshold value, and comprises a top plate covering one side of the electronic element far away from the flexible circuit board; and at least two side plates arranged around at least two sides of the four sides of the electronic element.
Illustratively, the four peripheral sides of the electronic component further include a second side, a third side, and a fourth side;
the at least two side plates include a first side plate, a second side plate and a third side plate which are arranged outside the second side, the third side and the fourth side of the electronic element in a surrounding manner.
Illustratively, the thickness of the shielding case is 0.08-0.3 mm.
For example, at the open side of the shield case, the orthographic projection of the electronic component on the flexible circuit board is at least partially uncovered by the orthographic projection of the shield case on the flexible circuit board.
Illustratively, on the opening side of the shielding case, the distance between the edge of the shielding case and the first side edge of the electronic component in the direction perpendicular to the first side edge is 0-0.5 mm.
Illustratively, the clearance between the inner side wall of the shielding case and the electronic element is 0.5-1.0 mm.
Illustratively, the electronic component includes a touch chip.
Illustratively, the first side of the electronic component is a side facing the middle area of the flexible circuit board.
Illustratively, the flexible circuit board is provided with a first bonding area and a second bonding area, the electronic component is bonded to the first bonding area, and the shielding case is bonded to the second bonding area.
The shielding can is further provided with an insulating layer on an inner side wall facing the electronic component.
The embodiment of the present disclosure also provides a display device, including:
a display panel; and the flexible circuit board is connected with the display panel and adopts the flexible circuit board structure provided by the embodiment of the disclosure.
The beneficial effects brought by the embodiment of the disclosure are as follows:
the flexible circuit board structure and the display device provided by the embodiment of the disclosure have the advantages that the electronic element outer cover on the flexible circuit board is provided with the shielding cover, the shielding cover can shield the electronic element to realize the effect of shielding external interference, the anti-interference capability of the electronic element is improved, the shielding cover is not sealed on the first side of the electronic element, and a waterproof glue layer is formed by dispensing on the first side so as to improve the waterproof and moistureproof capability of the electronic element.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board structure provided in an embodiment of the present disclosure;
fig. 2 shows a top view of fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Before the detailed description of the flexible circuit board structure and the display device provided by the embodiments of the present disclosure, the following description is necessary for the related art:
in the related art, for the foldable display product and the flexible display product, the electronic components on the flexible circuit board with a thin thickness of the flexible circuit board have relatively weak interference resistance and waterproof and moisture-proof capabilities. In order to ensure the stability of the touch function of the folding and flexible display product, the anti-interference capability of a TIC (touch control chip) needs to be improved, and the waterproof and moistureproof capabilities are ensured.
In the related art, the electronic components on the flexible circuit board of the flexible display product have relatively low anti-interference capability and are easily affected by interference, and the waterproof and moistureproof capabilities of the flexible display product cannot meet the requirements of the existing flexible display.
In order to solve the above problem, the embodiment of the present disclosure provides a flexible circuit board structure and a display device, which can improve the anti-interference, waterproof and moisture-proof capabilities.
As shown in fig. 1 and 2, embodiments of the present disclosure provide a flexible circuit board structure, including: the flexible circuit board 100, the electronic component 200, the shielding case 300 and the waterproof adhesive layer 400; the electronic component 200 is connected to the flexible circuit board 100, and the peripheral sides of the electronic component 200 include a first side; the shielding case 300 is used for electromagnetically shielding the electronic component 200, the shielding case 300 is disposed on the electronic component 200, and at least a first side of the shielding case 300 of the electronic component 200 is an open side that is not closed; the waterproof adhesive layer 400 at least fills the connection position between the electronic component 200 and the flexible circuit board 100.
In the structure of the flexible circuit board 100 provided by the embodiment of the present disclosure, the shielding cover 300 is disposed outside the electronic element 200 on the flexible circuit board 100, the shielding cover 300 can shield the electronic element 200 to achieve the effect of shielding external interference, and improve the anti-interference capability of the electronic element 200, and the shielding cover 300 is not sealed at the first side of the electronic element 200, and a waterproof adhesive layer 400 is formed by dispensing at the first side, so as to improve the waterproof and moistureproof capability of the electronic element 200.
In the above solution, the shielding can 300 is a metal cover design, and covers the electronic component 200 to achieve the capability of shielding external interference. For example, the shielding case 300 may be made of SUS 304.
In some embodiments, as shown in fig. 1 and 2, the shielding case 300 is a thin plate-shaped case with a thickness less than a threshold value, and includes a top plate 310 covering a side of the electronic component 200 away from the flexible circuit board 100; and at least two side plates 320 surrounding at least two sides of the four sides of the electronic component 200.
In the above solution, the shielding case 300 is a half-shielding-case windowing design, and includes a top plate and a side wall that surrounds the electronic component 200 except for the first side, for example, the peripheral side of the electronic component 200 further includes a second side, a third side, and a fourth side; the at least two side plates include a first side plate, a second side plate, and a third side plate that are disposed outside the second side, the third side, and the fourth side of the electronic component 200.
It should be noted that in some embodiments, the shielding cover 300 covers three sides of the electronic component 200 except the first side, in other embodiments, the shielding cover 300 may only cover one side or two sides of the electronic component 200, and in this case, the waterproof glue layer 400 may be disposed on the other sides not covered by the shielding cover 300.
Further, in some exemplary embodiments, the thickness of the shield can 300 is 0.08-0.3 mm. This is to consider the whole thickness of the flexible circuit board 100 in the flexible display product, and select a preferred thickness for the thickness of the shielding case 300, which will not affect the whole thickness, but also effectively improve the anti-interference capability. It is understood, of course, that in other embodiments, the specific thickness of the shielding can 300 is not limited thereto.
Furthermore, in some embodiments, as shown in fig. 1 and 2, at the opening side of the shielding can 300, the orthographic projection of the electronic component 200 on the flexible circuit board 100 is at least partially uncovered by the orthographic projection of the shielding can 300 on the flexible circuit board 100.
With the above scheme, since the glue is dispensed on the opening side of the shielding case 300 to form the waterproof glue layer 400, in order to avoid the siphon phenomenon caused by the close distance between the waterproof glue layer 400 and the edge of the opening side of the shielding case 300, the edge of the opening side of the shielding case 300 is designed to be spaced from the edge of the first side of the electronic component 200, so that at least a part of the electronic component 200 on the first side is not covered by the shielding case 300.
Illustratively, on the opening side of the shielding case 300, a distance d between an edge of the shielding case 300 and a first side edge of the electronic component 200 in a direction perpendicular to the first side edge is 0-0.5 mm.
The above values are preferred embodiments for avoiding glue siphoning and effectively shielding the electronic component 200. Note that, when d is 0 in the above numerical values, if the gap between the inner wall of the shield case 300 and the electronic component 200 is sufficiently large, the siphon phenomenon can be avoided.
Furthermore, in some embodiments, as shown in fig. 1 and 2, the waterproof glue layer 400 is a strip-shaped glue layer extending along the first side of the electronic component 200.
In some embodiments, in order to prevent the waterproof glue layer 400 from siphoning during dispensing and extending along the shielding can 300, a sufficient gap a should be provided between the inner sidewall of the shielding can 300 and the electronic component 200, for example, the gap a is 0.5-1.0 mm. It is understood that, in practical applications, the specific value of the gap a may also vary according to parameters such as the fluidity of the waterproof glue layer 400 and the thickness of the electronic component 200, and is not limited thereto.
In addition, the waterproof glue layer 400 may be made of thermosetting glue (UF glue) or the like.
In addition, in the structure of the flexible circuit board 100 in the embodiment of the present disclosure, the electronic component 200 includes a touch chip (TIC). Of course, the present invention is not limited to TIC, and may be other electronic components 200 or IC chips.
In addition, the first side of the electronic component 200 is a side facing the middle area of the flexible circuit board 100 in consideration of wiring on the flexible circuit board 100 and the like in an actual process. That is, dispensing is performed inside the middle area of the electronic component 200 near the flexible circuit board 100.
In addition, in some exemplary embodiments, as shown in fig. 1 and 2, a first land 101 and a second land 102 are provided on the flexible circuit board 100, the electronic component 200 is soldered to the first land 101, the shield can 300 is soldered to the second land 102, and the second land 102 is designed to be grounded.
Specifically, as shown in fig. 1 and fig. 2, the flexible circuit board 100 may include a substrate 110, and a conductive layer 120 and a shielding layer 130 disposed on the substrate 110, wherein the shielding layer 130 is opened to expose a portion of the conductive layer 120 to form the first bonding pad 101 and the second bonding pad 102, and the second bonding pad 102 is designed to be grounded.
Adopt above-mentioned scheme, shield cover 300 adopts the welding mode, through add the second weld zone on flexible circuit board 100, promptly, increases welding dew copper point, comes welded connection shield cover 300, like this, can be when adopting SMT (surface mounting technology) to make a round piece, the synchronous welding electronic component 200 and shield cover 300, on the other hand, design welding dew copper point to ground design, realize shield cover 300 jam-proof ability, simultaneously, guarantee electronic component 200 and shield cover 300's relative size precision, reach and add shield cover 300 to the demand of whole quick-witted minimum influence.
It will be appreciated, of course, that the shield can could be secured to the flexible circuit board in other ways.
In addition, as shown in fig. 1 and fig. 2, in some embodiments, the shielding can is further provided with an insulating layer 500 on an inner side wall facing the electronic component, so as to prevent the electronic component from being adversely affected by the erroneous contact between the shielding can and the electronic component. Wherein the insulating layer 500 may be an insulating sticker directly attached to the shield can.
In addition, an embodiment of the present disclosure also provides a display device, including: a display panel; and a flexible circuit board 100 connected to the display panel, wherein the flexible circuit board 100 adopts the structure of the flexible circuit board 100 provided by the embodiment of the disclosure. The display device may include various display products such as a mobile phone, a tablet computer, a display, and the like.
In addition, the embodiment of the present disclosure further provides a manufacturing method of the flexible circuit board 100, for manufacturing the structure of the flexible circuit board 100 provided by the embodiment of the present disclosure, the method includes:
connecting an electronic component 200 on the flexible circuit board 100, wherein the peripheral sides of the electronic component 200 comprise a first side;
a shielding case 300 for electromagnetically shielding the electronic component 200 is disposed on the flexible circuit board 100, the shielding case 300 is disposed on the electronic component 200, and the shielding case 300 is an open side that is not closed at least at a first side of the electronic component 200;
a waterproof adhesive layer 400 is disposed on the opening side of the shield case 300, and the waterproof adhesive layer 400 at least fills a connection position between the electronic component 200 and the flexible circuit board 100.
In the method, when the flexible circuit board 100 is punched by using a surface mounting technique, the electronic component 200 is soldered to the first soldering land, and the shield can 300 is soldered to the second soldering land.
By adopting the above scheme, the shielding case 300 is welded by adding a second welding area, that is, increasing the welding copper exposing points, on the flexible circuit board 100, so that on one hand, when the SMT (surface mount technology) component is adopted, the electronic component 200 and the shielding case 300 can be synchronously welded, and the process is simplified; on the other hand, the design of the solder copper exposing points and the grounding design can realize the anti-interference capability of the shielding case 300, and simultaneously ensure the relative dimensional accuracy of the electronic element 200 and the shielding case 300, thereby meeting the requirement of the minimum influence of the additionally arranged shielding case 300 on the whole machine.
The following points need to be explained:
(1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.
(2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.
Claims (12)
1. A flexible circuit board structure, comprising:
a flexible circuit board;
the electronic element is connected to the flexible circuit board, and the peripheral sides of the electronic element comprise a first side;
the shielding cover is used for electromagnetically shielding the electronic element, is covered on the electronic element and is an unsealed opening side at least at the first side of the electronic element;
and the waterproof adhesive layer is at least filled in the connecting position between the electronic element and the flexible circuit board.
2. The flexible circuit board structure of claim 1,
the shielding case is a thin plate-shaped cover body with the thickness smaller than a threshold value, and comprises a top plate which shields one side of the electronic element far away from the flexible circuit board; and at least two side plates arranged around at least two sides of the four sides of the electronic element.
3. The flexible circuit board structure of claim 2,
the four sides of the electronic element further comprise a second side, a third side and a fourth side;
the at least two side plates include a first side plate, a second side plate and a third side plate which are arranged outside the second side, the third side and the fourth side of the electronic element in a surrounding manner.
4. The flexible circuit board structure of claim 2,
the thickness of the shielding case is 0.08-0.3 mm.
5. The flexible circuit board structure of claim 1,
at the open side of the shield case, an orthographic projection of the electronic component on the flexible circuit board is at least partially uncovered by an orthographic projection of the shield case on the flexible circuit board.
6. The flexible circuit board structure of claim 5,
the opening side of the shielding case, the distance between the edge of the shielding case and the first side edge of the electronic element in the direction perpendicular to the first side edge is 0-0.5 mm.
7. The flexible circuit board structure of claim 1,
the gap between the inner side wall of the shielding cover and the electronic element is 0.5-1.0 mm.
8. The flexible circuit board structure of claim 1,
the electronic component comprises a touch chip.
9. The flexible circuit board structure of claim 1,
the first side of the electronic component is a side facing the middle area of the flexible circuit board.
10. The flexible circuit board structure of claim 1,
the flexible circuit board is provided with a first welding area and a second welding area, the electronic element is welded on the first welding area, and the shielding case is welded on the second welding area.
11. The flexible circuit board structure of claim 1,
the shielding case is further provided with an insulating layer on an inner side wall facing the electronic component.
12. A display device, comprising:
a display panel; and a flexible circuit board connected to the display panel, the flexible circuit board having a flexible circuit board structure according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121930790.5U CN216057619U (en) | 2021-08-17 | 2021-08-17 | Flexible circuit board structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121930790.5U CN216057619U (en) | 2021-08-17 | 2021-08-17 | Flexible circuit board structure and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216057619U true CN216057619U (en) | 2022-03-15 |
Family
ID=80620306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121930790.5U Active CN216057619U (en) | 2021-08-17 | 2021-08-17 | Flexible circuit board structure and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216057619U (en) |
-
2021
- 2021-08-17 CN CN202121930790.5U patent/CN216057619U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8829667B2 (en) | Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same | |
| CN102176438B (en) | Double-side packaging structure and wireless communication system applying the structure | |
| US20110293128A1 (en) | Semiconductor device and microphone | |
| CN105321933A (en) | Semiconductor package with conformal EM shielding structure and manufacturing method of same | |
| CN105304582A (en) | Package structure and method for fabricating the same | |
| US20140226293A1 (en) | Interface device | |
| CN106470527B (en) | It is used to form the printed circuit board arrangement of enhanced identification of fingerprint module | |
| KR20160023975A (en) | A semiconductor package | |
| CN106102321A (en) | Including components therein substrate and including components therein substrate core substrate | |
| CN112740844B (en) | Module | |
| CN216057619U (en) | Flexible circuit board structure and display device | |
| US11937414B2 (en) | Display assembly and display device | |
| CN113556864A (en) | Flexible circuit board structure, manufacturing method thereof and display device | |
| US11703978B2 (en) | Touch substrate and touch display device | |
| TWM517418U (en) | Multi-chip package having compartment shielding | |
| CN105789142A (en) | Organic substrate high-density integrated three-dimensional microwave circuit structure | |
| CN103811444A (en) | Electronic apparatus, system in package module and method for manufacturing system in package module | |
| CN212628570U (en) | Sink-embedded shielding cover | |
| CN105529312A (en) | Packaging structure | |
| EP2239779B1 (en) | Flexible image-sensing module with anti-EMI function | |
| CN210639594U (en) | Touch display device | |
| US10923434B2 (en) | Semiconductor packages having EMI shielding layers | |
| CN110610906A (en) | Semiconductor electromagnetic shielding structure and manufacturing method thereof | |
| CN216292035U (en) | Circuit board welding structure and packaging structure, shielding structure and shielding substrate thereof | |
| CN205542767U (en) | Anti -electromagnetic interference SIP packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |