CN216054627U

CN216054627U - Vacuum finger and wafer transfer system

Info

Publication number: CN216054627U
Application number: CN202122760135.6U
Authority: CN
Inventors: 戴建波
Original assignee: Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd
Priority date: 2021-11-11
Filing date: 2021-11-11
Publication date: 2022-03-15
Anticipated expiration: 2031-11-11

Abstract

The utility model relates to the field of semiconductors, in particular to a vacuum finger and wafer conveying system. The vacuum finger includes first support piece, second support piece and mark piece, first support piece and second support piece set up relatively, and be connected with the relative both ends of mark piece respectively, the one end that first support piece kept away from the mark piece relatively is provided with first annular mill flour arch, the one end that second support piece kept away from the mark piece relatively all is provided with second annular mill flour arch, it is protruding to be provided with third annular mill flour on the mark piece, and first annular mill flour arch, second annular mill flour arch and third annular mill flour arch are triangle-shaped and set up, in order to realize fixing the wafer. The vacuum finger can improve the stability of wafer transmission, reduce the contact area of the wafer in the wafer transmission process, reduce the stress on the wafer and improve the quality of the wafer.

Description

Vacuum finger and wafer transfer system

Technical Field

The utility model relates to the field of semiconductors, in particular to a vacuum finger and wafer conveying system.

Background

Semiconductor transfer wafers require a finger that can be transferred in vacuum, that is not contaminated, that has a long life cycle, and that satisfies multiple process flows. However, the existing wafer transfer mechanical fingers have the following problems: (1) the materials adopted at present generally adopt aluminum materials and stainless steel materials at low temperature; adopting molybdenum and ceramic materials at high temperature; the materials limit the application conditions of mechanical fingers and cannot be applied in a broad spectrum. (2) The contact surface of the wafer and the manipulator is generally an O-shaped ring or a ceramic pad, so that a pollution source is easily introduced, and the manipulator is used in a life cycle section; (3) the existing mechanical arm is complex in structure and manufacturing process, a single finger corresponds to a single product, frequent calibration or replacement is needed in the aspects of strength and life cycle, and a transported wafer cannot be stably fixed, or the wafer is subjected to large stress in the wafer transmission process, so that the quality or quality of the wafer is changed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a vacuum finger and a wafer transmission system, which can improve the stable transmission of wafers, reduce the contact area of the wafers in the wafer transmission process, reduce the stress on the wafers and improve the quality of the wafers.

The embodiment of the utility model is realized by the following steps:

in a first aspect, the present invention provides a vacuum finger, which includes a first supporting member, a second supporting member and a mark member, wherein the first supporting member and the second supporting member are oppositely disposed and respectively connected to two opposite ends of the mark member;

the utility model discloses a wafer fixing device, including mark piece, first support piece, second support piece, first ring-shaped mill face arch, second ring-shaped mill face arch, first support piece is kept away from relatively the one end of mark piece is provided with first ring-shaped mill face arch, second support piece is kept away from relatively the one end of mark piece all is provided with second ring-shaped mill face arch, it is protruding to be provided with third ring-shaped mill face on the mark piece, just first ring-shaped mill face arch second ring-shaped mill face arch with third ring-shaped mill face arch is triangle-shaped and sets up to the realization can be fixed the wafer.

In an alternative embodiment, the first annular grinding surface embossment, the second annular grinding surface embossment and the third annular grinding surface embossment are arranged in an isosceles triangle.

In an optional embodiment, the first annular grinding surface bulge, the second annular grinding surface bulge and the third annular grinding surface bulge are all hollow hemispheroids with rough surfaces.

In an optional embodiment, a plurality of annular gaps are arranged along the diameter direction of the hollow hemisphere, and projections of the annular gaps and the hollow hemisphere on a horizontal plane are concentric rings.

In an optional embodiment, one end of the marking member, which is relatively far away from the first support member and the second support member, is provided with at least one wafer marking line, and the third annular grinding surface protrusion is relatively close to the side, connected with the marking member, of the first support member and the second support member.

In an alternative embodiment, an arc-shaped notch is formed in one side of the marking piece, which is relatively close to the first supporting piece and the second supporting piece, and the arc center of the arc-shaped notch and the protrusion of the third annular grinding surface are on the same horizontal line.

In an alternative embodiment, a hollow structure is provided between the first support and the second support.

In an alternative embodiment, the vacuum finger further comprises a finger member, wherein one end of the finger member, which is relatively far away from the first support member and the second support member, is connected with the marking member through a connecting member, and the width of the connecting member is gradually reduced along the direction from the marking member to the finger member.

In an alternative embodiment, the surface of the vacuum finger is provided with a micro-arc oxidation layer.

In a second aspect, the present invention provides a wafer transfer system comprising the vacuum finger of any one of the previous embodiments.

The embodiment of the utility model has the beneficial effects that: the vacuum finger provided by the embodiment of the utility model is provided with 3 annular grinding surface bulges, and the 3 annular grinding surface bulges are triangular, so that a wafer can be fixed and can be stably transmitted, meanwhile, the annular grinding surface bulges can reduce the contact area of the wafer, so that the stress applied to the wafer in the transmission process is reduced, and the quality of the wafer is further ensured.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic diagram of a vacuum finger according to an embodiment of the present invention;

FIG. 2 is a schematic view of a vacuum finger provided in accordance with an embodiment of the present invention;

fig. 3 is a schematic structural view of a protrusion of a ring-shaped grinding surface according to an embodiment of the present invention.

Icon 100-vacuum finger; 110-a first support; 120-a second support; 130-a marker; 140-first annular wear face protrusions; 141-second annular grinding surface protrusions; 142-a third annular wear surface projection; 143-annular gap; 150-wafer mark line; 160-arc incision; 161-square cut; 162-a connector; 170-finger pieces; 171-a clamping portion.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1 and 2, the present embodiment provides a vacuum finger 100, and in the embodiment of the present invention, the vacuum finger 100 is mainly used for wafer transfer, but it should be understood that the present invention can be used for transfer of other devices, and is not limited to wafer transfer.

The vacuum finger 100 is prepared from TA2 titanium alloy, aluminum, stainless steel, molybdenum and ceramic are generally adopted in the prior art, the materials are easy to damage and not recoverable when the finger is debugged, and the TA2 titanium alloy is high in strength, impact-resistant and not easy to damage. Secondly, the TA2 titanium alloy has the following advantages that the TA2 titanium alloy has certain memory capacity and is easy to recover after collision is increased; the TA2 titanium alloy has the density of 4.5, is suitable for processing and is also suitable for the transmission of wafers; the TA2 titanium alloy has good temperature resistance and is suitable for high-temperature technology; the TA2 titanium alloy has stable components and does not introduce a pollution source; the TA2 titanium alloy has better corrosion resistance and is suitable for corrosive process; from the view of processing and shaping, the TA2 titanium alloy has high plasticity and is stable after shaping and stress removal.

Further, TA2 titanium alloy may be TA2 titanium alloy of the following composition: the balance of titanium (Ti), iron (Fe) is less than or equal to 0.30, carbon (C) is less than or equal to 0.10, nitrogen (N) is less than or equal to 0.05, hydrogen (H) is less than or equal to 0.01, and oxygen (O) is less than or equal to 0.25 percent.

Further, the vacuum finger 100 includes a first support 110, a second support 120, and a marker 130, wherein the first support 110 and the second support 120 are disposed opposite to each other and are connected to opposite ends of the marker 130, respectively.

In the present embodiment, the first support 110 and the second support 120 are both rod-shaped structures, the widths of the first support 110 and the second support 120 are both 9 mm, the distance between the inner side (the side relatively close to the second support 120) of the first support 110 and the inner side (the side relatively close to the first support 110) of the second support 120 is 99.18 mm, and the distance between the outer side (the side relatively far from the second support 120) of the first support 110 and the outer side (the side relatively far from the second support 120) of the second support 120 is 117.10 mm. The above dimensions are the optimal dimensions that can be produced using TA2 titanium alloy to facilitate the transfer of wafers of different sizes and thus increase the range of use of the vacuum finger 100, although it will be appreciated that other dimensions may be used.

Further, a first annular grinding surface protrusion 140 is arranged at one end of the first support 110, which is relatively far away from the marker 130, a second annular grinding surface protrusion 141 is arranged at one end of the second support 120, which is relatively far away from the marker 130, a third annular grinding surface protrusion 142 is arranged on the marker 130, the first annular grinding surface protrusion 140, the second annular grinding surface protrusion 141 and the third annular grinding surface protrusion 142 are arranged in a triangular shape, so that a wafer can be placed on the 3 annular grinding surface protrusions, and the wafer can be fixed. The annular grinding surface protrusion is arranged, so that the contact area of the wafer can be reduced, the stress on the wafer is reduced, and the quality of the wafer is ensured.

Further, the first annular grinding surface protrusion 140, the second annular grinding surface protrusion 141 and the third annular grinding surface protrusion 142 are arranged in an isosceles triangle.

Further, the first annular grinding surface protrusion 140, the second annular grinding surface protrusion 141, and the third annular grinding surface protrusion 142 are all hollow hemispheroids with rough surfaces, that is, the first annular grinding surface protrusion 140, the second annular grinding surface protrusion 141, and the third annular grinding surface protrusion 142 are parts of the same structure. The annular grinding surface protrusion is of a hollow structure, so that the transportation of the wafer in a vacuum environment can be facilitated, the gas distribution in the transportation environment is facilitated, and the stress on the wafer is further reduced.

Further, referring to fig. 3, a plurality of annular slits 143 are arranged along a diameter direction of the hollow hemisphere, and projections of the plurality of annular slits 143 and the hollow hemisphere on a horizontal plane are concentric circles. The plurality of annular gaps 143 can further reduce the contact surface of the wafer, reduce the stress on the wafer, and further improve the quality of the wafer.

Further, at least one wafer marking line 150 is disposed at an end of the marking member 130 relatively far from the first support member 110 and the second support member 120, and the wafer marking line 150 can mark the position of the wafer, which is beneficial to stable placement of the wafer. The at least one wafer marking line 150 is configured to meet the placement requirements of wafers of different sizes.

In the present embodiment, 2 wafer mark lines 150 are disposed on the mark member 130, but it is understood that more wafer mark lines 150 may be disposed.

The side of the marker 130, which is relatively close to the first support 110 and the second support 120, is provided with an arc-shaped cut 160, and the arc center of the arc-shaped cut 160 is on the same horizontal line with the third annular grinding surface protrusion 142 on the marker 130. The two ends of the arc-shaped cut 160 are respectively connected with the first support 110 and the second support 120, and are connected through the square cut 161, the arc-shaped cut 160 and the square cut 161 are arranged, the occupied middle part and the occupied external space are less, and various working conditions can be used. Meanwhile, under the condition of ensuring the strength, the wafer packaging structure occupies less internal and external sizes and can be applied to wafers with multiple sizes.

Further, a hollow structure is formed between the first support 110 and the second support 120, that is, a spatial structure formed by the inner side of the first support 110, the inner side of the second support 120, the square notch 161 and the arc notch 160 is a hollow structure, and the above structure is favorable for stable placement of the wafer.

Further, the vacuum finger 100 further comprises a finger member 170, the finger member 170 is used for clamping the vacuum finger 100, so as to achieve the transfer of the wafer, and the like, the finger member 170 and the marker 130 are connected by a connecting member 162 at the end relatively far from the first support 110 and the second support 120, and the width of the connecting member 162 is gradually reduced along the direction from the marker 130 to the finger member 170.

Further, the width of the connecting member 162 gradually decreases along the direction from the mark member 130 to the finger member 170, that is, the connecting member 162 has a trapezoidal structure, and the adoption of the above structure of the connecting member 162 is beneficial to ensuring the structural stability of the vacuum finger 100 and ensuring that the finger member 170 is prevented from being separated from the mark member 130 during the clamping process.

Further, the finger member 170 is provided with a plurality of clamping portions 171, and the plurality of clamping portions 171 are arranged along the width direction of the finger member 170.

Further, the first support member 110, the second support member 120, the marking member 130, the connecting member 162 and the finger member 170 are integrally formed, thereby ensuring structural stability of the vacuum finger 100.

Further, the surface of the vacuum finger 100 is provided with a micro-arc oxidation layer, and the micro-arc oxidation layer enables the surface of the vacuum finger 100 to be more compact, thereby being beneficial to use under high temperature and corrosion conditions.

Embodiments of the present invention further provide a wafer transfer system (not shown), which includes the vacuum finger provided in the embodiments, and further includes various semiconductor devices such as CVD or ALD, and the vacuum finger is connected to the various semiconductor devices such as CVD or ALD.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A vacuum finger is characterized by comprising a first supporting piece, a second supporting piece and a mark piece, wherein the first supporting piece and the second supporting piece are oppositely arranged and are respectively connected with two opposite ends of the mark piece,

one end of the first supporting piece, which is relatively far away from the marking piece, is provided with a first annular grinding surface bulge,

the second support piece is kept away from relatively the one end of mark piece all is provided with the second annular and grinds the face arch, it is protruding to be provided with the third annular on the mark piece and grinds the face, just first annular grind the face arch the second annular grind the face arch with the protruding triangle-shaped setting that is of third annular grind the face to the realization can be fixed the wafer.

2. The vacuum finger of claim 1 wherein the first, second and third annular wear surface projections are arranged in an isosceles triangle.

3. The vacuum finger of claim 1 wherein the first, second and third annular wear surface protrusions are hollow hemispheres with a roughened surface.

4. The vacuum finger as claimed in claim 3, wherein a plurality of annular slits are arranged along the diameter direction of the hollow hemisphere, and the projections of the annular slits and the hollow hemisphere on the horizontal plane are concentric circles.

5. The vacuum finger as claimed in claim 1, wherein the marker is provided with at least one wafer marking line at one end of the marker which is relatively far away from the first support member and the second support member, and the third annular grinding surface protrusion is relatively close to the side of the first support member and the second support member connected with the marker.

6. The vacuum finger as claimed in claim 5, wherein the marker member is provided with an arc-shaped cut-out on a side thereof relatively close to both the first support member and the second support member, and an arc center of the arc-shaped cut-out is on the same horizontal line as the protrusion of the third annular grinding surface.

7. The vacuum finger of claim 1, wherein a hollow structure is between the first support and the second support.

8. The vacuum finger as claimed in claim 1, further comprising a finger member, wherein the finger member and the marker member are connected by a connecting member at an end thereof relatively distant from the first and second support members, and the width of the connecting member is gradually decreased in a direction from the marker member to the finger member.

9. The vacuum finger of claim 1, wherein the surface of the vacuum finger is provided with a micro-arc oxidation layer.

10. A wafer transfer system comprising the vacuum finger of any of claims 1-9.