CN215956849U - Electronic control unit and motor vehicle - Google Patents
Electronic control unit and motor vehicle Download PDFInfo
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- CN215956849U CN215956849U CN202122345833.XU CN202122345833U CN215956849U CN 215956849 U CN215956849 U CN 215956849U CN 202122345833 U CN202122345833 U CN 202122345833U CN 215956849 U CN215956849 U CN 215956849U
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- circuit board
- control unit
- electronic control
- base plate
- pressure
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Abstract
The utility model relates to an electronic control unit and a motor vehicle. The electronic control unit includes: a base plate (1); a circuit board (2), the circuit board (2) being connected to the base plate (1) at a fixed position; and the electronic component (3) is arranged on the circuit board (2). According to the utility model, a heat-conducting glue (4) is arranged between the circuit board (2) and the base plate (1), and the electronic control unit further comprises a continuous pressurization device which makes the pressure between the circuit board (2) and the base plate (1) uniform and keeps the pressure continuously during the use of the electronic control unit, so that the heat-conducting glue (4) is uniformly distributed between the circuit board (2) and the base plate (1). By utilizing the scheme of the utility model, the uniform distribution of the heat dissipation glue is realized to the greatest extent in a simple and low-cost mode, and the integral heat dissipation performance of the electronic control unit is improved.
Description
Technical Field
The present invention relates to an electronic control unit and a motor vehicle, in particular for components of a motor vehicle, in particular an engine electronic control unit, a driving-assistance electronic control unit, an autopilot electronic control unit, etc.
Background
In current motor vehicles, Electronic Control Units (ECUs) are used in large numbers to implement electronic control functions. Generally, an electronic control unit is applied not only to an engine but also to many other components such as a driving assist function and the like. With the improvement of electronic automation for vehicles and the development of automatic driving technology, the electronic control units are increasingly applied and the structures are increasingly complex.
CN204335206U discloses an electronic control unit for an engine, which comprises a housing connector made of plastic, a printed circuit board and a bottom plate made of metal; the shell connector is provided with a buckle structure and is used for being fixed with the bottom plate; sealant is arranged between the shell connector and the bottom plate; the heat conducting glue is arranged between the printed circuit board and the bottom plate.
CN202935424U discloses a heat dissipation structure of an electronic control unit in an electric power steering system, in which a power circuit, a sensor input circuit, a signal processing circuit, an external communication circuit and a pre-driving circuit of the electronic control unit are disposed on a circuit board, a full-bridge circuit is disposed on an aluminum substrate, the aluminum substrate is fixed in a metal bottom plate of the electronic control unit, and a copper alloy jumper wire is disposed on the aluminum substrate, the circuit board is located above the aluminum substrate and fixed on the metal bottom plate, and the copper alloy jumper wire is welded with the circuit board. Wherein, undercurrent circuit and heavy current circuit divide two boards to range upon range of and place, have reduced electronic control unit's volume, not only reduced undercurrent circuit and received the influence that heavy current circuit generates heat, guaranteed undercurrent circuit's temperature stability, the heat that heavy current circuit produced can be passed away through aluminium base board and heat conducting resin fast moreover, is showing and is reducing the temperature rise, has improved electronic control unit's reliability, can reduce the radiation intensity of full-bridge circuit low-frequency channel simultaneously.
In order to solve the problem of heat generation of electronic components, a heat conducting adhesive is generally filled between the circuit board and the metal shell of the electronic component for heat conduction. Generally, the thermal conductive paste is applied to a partial area in the form of a thermal conductive paste strip, and it is necessary to apply pressure at a specific position to spread the filled thermal conductive paste strip into a thermal conductive paste surface having a relatively uniform thickness. In the prior art, this pressure is usually provided by means of a fixed connection between the circuit board and the backplane. In this solution, due to the limited number of fixing positions, the area farther from the fixing positions is subjected to a smaller force, and the thickness of the heat-conducting glue is larger. The uneven thickness of the heat-conducting glue can seriously affect the heat dissipation effect.
In order to improve the thickness uniformity of the thermal conductive paste, the number of fixing positions may be increased, which may cause an increase in cost, for example, due to an increase in the number of screws, an increase in the area of the circuit board, and the like. Another way is to provide temporary pressure points to even out the thickness of the thermal paste. The problem with this solution is that after the temporary pressure points are removed, the rebound of the circuit board can cause voids (void) in the thermal paste. This also affects heat dissipation and affects insulation.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problem that the uniform distribution of the heat dissipation glue is realized to the greatest extent in a simple and low-cost mode, so that the overall heat dissipation performance of the electronic control unit is improved.
The electronic control unit according to the present invention comprises: a base plate; a circuit board connected with the base plate at a fixed position; an electronic component disposed on the circuit board;
the electronic control unit further comprises a continuous pressurizing device which enables the pressure between the circuit board and the bottom plate to be uniformly distributed and keeps the pressure continuously during the use period of the electronic control unit, so that the heat-conducting glue is uniformly distributed between the circuit board and the bottom plate.
According to the utility model, the pressure of the continuous pressurizing device is continuous, so that the hollow phenomenon of the heat dissipation glue can be avoided. The cost of the continuous pressurizing device is lower relative to the increase of the fixed position, and the area of the circuit board is saved.
According to a preferred embodiment, the electronic control unit further comprises a cover cap connected with the base plate to form an enclosure for the circuit board.
According to a preferred embodiment, the continuous pressurization device comprises one or more than two pressure springs between the cover and the circuit board, and the elastic force of the pressure springs enables the circuit board to be pressed towards the bottom plate.
According to a preferred embodiment, the contact position of the compression spring with the circuit board is spaced apart from the fastening position for connecting the circuit board to the base plate.
According to a preferred embodiment, the distance between the contact position and the fixing position is greater than 50 mm.
According to a preferred embodiment, the circuit board is arranged on the base plate in a plurality of fastening points, only one pressure spring being provided, the contact point of which with the circuit board is maximally spaced from the plurality of fastening points.
According to a preferred embodiment, the compression spring is soldered to the circuit board.
According to a preferred embodiment, an abutment for receiving the pressure spring is provided on the cover, said abutment having the form of a stamped-out recess.
According to a preferred embodiment, the electronic control unit is used to control a component of a motor vehicle.
The utility model also relates to a motor vehicle having the electronic control unit.
Drawings
Fig. 1 is a schematic configuration diagram of an electronic control unit according to the present invention.
List of reference numerals
1. Base plate
2. Circuit board
3. Electronic component
4. Heat-conducting glue
5. Cover cap
6. Spring
7. Thread device
8. Abutting part
Detailed Description
An electronic control unit and a motor vehicle according to the utility model will be described below by way of specific embodiments with reference to the accompanying drawings. The exemplary embodiments, however, may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Fig. 1 is a schematic configuration diagram of an electronic control unit according to the present invention. The electronic control unit may be, in particular, an engine electronic control unit, a driving-assist electronic control unit, an automatic driving electronic control unit, or the like. As shown, the electronic control unit includes a chassis 1 for supporting a circuit board 2. The circuit board 2 is typically a printed circuit board, i.e. a PCB. Other forms of electronic component carriers are of course also conceivable. The circuit board 2 is fixed to the base plate 1 at a fixed position. Generally, the circuit board 2 may be fixed to the base plate 1 at a plurality of fixing positions. Preferably, an opening is formed at said fixing position of the circuit board 2, so that the circuit board 2 is fixed to the base plate 1 by means of a screw means 7, such as a screw or a bolt, passing through the opening. Of course, other fastening or connecting means, such as riveting or welding arrangements or the like, are also conceivable.
A plurality of electronic components 3 required for functionality are arranged on the circuit board 2, and these electronic components 3 are preferably soldered, in particular soldered, to the circuit board 2. The heat generated by the electronic components 3 during operation is generally conducted via the circuit board 2 to the base plate 1 and is dissipated via the base plate 1 to the environment. For better conduction and dissipation of heat, the base plate 1 is usually made of a heat-conducting metal material, for example aluminum or copper.
The electronic control unit further comprises a cover lid 5, said cover lid 5 being connected with said base plate 1 to form an enclosure for a circuit board 2. The cover 5 may be connected to the base plate 1 using various connection structures, such as a snap connection, a threaded connection, or other suitable connection means. Preferably, the cover 5 may be made of a plastic material.
In order to achieve better heat conduction from the circuit board 2 to the base plate 1, a heat-conducting material, in particular a heat-conducting glue 4, is arranged between the circuit board 2 and the base plate 1. During production, the thermally conductive glue 4 is applied in the form of a strip, in particular, in a partial region. Then, the heat conductive adhesive 4 is spread into a heat conductive adhesive surface under the action of the pressure between the circuit board 2 and the base plate 1.
In order to distribute the heat conducting glue 4 evenly between the circuit board 2 and the base plate 1, the electronic control unit further comprises a continuous pressurization device. The continuous pressurization device is configured to make the pressure distribution between the circuit board 2 and the base plate 1 uniform and to continuously maintain the pressure during the use of the electronic control unit.
As shown in fig. 1, the continuous pressurization device may include a pressure spring 6 disposed between the cover 5 and the circuit board 2, and the elastic force of the pressure spring 6 causes the circuit board 2 to be pressed toward the bottom plate 1, thereby homogenizing the pressure applied to the heat conductive adhesive 4. Of course, the number of the pressure springs 6 is not limited to one shown in the drawings, and two or more pressure springs 6 may be provided. The pressure spring 6 may have a cylindrical shape, a conical shape, a convex shape, a concave shape, or the like. One end of the pressure spring 6 abuts against the circuit board 2 and the other end of the pressure spring 6 abuts against the inside of the cover 5.
As shown in fig. 1, an abutment 8 dedicated to the pressure spring 6 may be provided on the cover 5, which abutment 8 forms a structure for receiving an end of the pressure spring 6, for example in the form of a stamped recess. The other end of the pressure spring 6 may be soldered to the circuit board 2. Of course, the pressure spring 6 can also be fastened to the circuit board 2 in other ways.
Preferably, the contact position of the pressure spring 6 with the circuit board 2 is spaced apart from the fixing position of the circuit board 2 on the base plate 1. Therefore, the contact position provides a plurality of pressure application points together with the fixing position to make the distribution of the heat conductive paste 4 uniform.
Generally, the circuit board 2 is disposed on the base plate 1 at a plurality of fixed positions. In the case where only one pressure spring 6 is provided, the distance between the contact position of the one pressure spring 6 with the circuit board 2 and the plurality of fixing positions can be maximized. For example, for two fixed positions, the contact position of one pressure spring 6 may be set at the midpoint of the line connecting the two fixed positions. For three fixed positions, the contact position of one pressure spring 6 may be set at the center of a circle passing through the three positions. In the case of two or more pressure springs 6, the contact positions of the pressure springs 6 can be distributed together with the fixing positions, so that uniform pressure distribution is achieved, and the pressure rubber is stressed as uniformly as possible. For example, it can be provided that the contact position of the pressure spring 6 is more than 50mm from the fastening position.
According to the structure of the present invention, since the pressure spring 6 can be soldered on the circuit board 2 together with the electronic component, an additional process is not required. In addition, the pressure of the pressure spring 6 can assist the diffusion of the heat dissipation glue, and the phenomenon of over-thickness or non-uniformity of the heat dissipation glue is obviously improved. Since the pressure of the pressure spring 6 is continuous, the hollow phenomenon of the heat dissipation glue can be avoided. The cost of the pressure spring 6 is lower with respect to the increase of the fixing position, and the circuit board area is saved.
Other embodiments of the present invention will readily suggest themselves to such skilled persons having the benefit of this disclosure. This application is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
Claims (10)
1. An electronic control unit comprising:
a base plate (1);
a circuit board (2), the circuit board (2) being connected to the base plate (1) at a fixed position;
the electronic component (3), the said electronic component (3) is set up on the said circuit board (2);
it is characterized in that the preparation method is characterized in that,
a heat-conducting glue (4) is arranged between the circuit board (2) and the base plate (1), and the electronic control unit further comprises a continuous pressurizing device which makes the pressure between the circuit board (2) and the base plate (1) be uniformly distributed and keeps the pressure continuously during the use of the electronic control unit, so that the heat-conducting glue (4) is uniformly distributed between the circuit board (2) and the base plate (1).
2. Electronic control unit according to claim 1, characterized in that it further comprises a cover (5) connected with the base plate (1) to form an enclosure for a circuit board (2).
3. An electronic control unit according to claim 2, characterized in that the continuous pressure boosting means comprise one or more pressure springs (6) between the cover (5) and the circuit board (2), the spring force of the pressure springs (6) causing the circuit board (2) to be pressed towards the base plate (1).
4. Electronic control unit according to claim 3, characterized in that the contact position of the pressure spring (6) with the circuit board (2) is spaced apart from the fixing position in which the circuit board (2) is connected to the base plate (1).
5. The electronic control unit of claim 4, wherein the distance between the contact position and the fixed position is greater than 50 mm.
6. Electronic control unit according to claim 3, characterized in that the circuit board (2) is arranged on the base plate (1) at a plurality of fixed positions, only one pressure spring (6) being provided, the contact position of which pressure spring (6) with the circuit board (2) being maximally distanced from said plurality of fixed positions.
7. Electronic control unit according to claim 3, characterized in that the pressure spring (6) is soldered on the circuit board (2).
8. An electronic control unit according to claim 3, characterized in that an abutment (8) for receiving the pressure spring (6) is provided on the cover (5), said abutment (8) having the form of a stamped recess.
9. The electronic control unit according to claim 1 or 2, characterized in that it is used for controlling a component of a motor vehicle.
10. A motor vehicle having an electronic control unit according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122345833.XU CN215956849U (en) | 2021-09-27 | 2021-09-27 | Electronic control unit and motor vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122345833.XU CN215956849U (en) | 2021-09-27 | 2021-09-27 | Electronic control unit and motor vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215956849U true CN215956849U (en) | 2022-03-04 |
Family
ID=80425609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122345833.XU Active CN215956849U (en) | 2021-09-27 | 2021-09-27 | Electronic control unit and motor vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215956849U (en) |
-
2021
- 2021-09-27 CN CN202122345833.XU patent/CN215956849U/en active Active
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