CN215956726U - Substrate integrated semi-fin line circuit structure suitable for broadband terahertz signal - Google Patents
Substrate integrated semi-fin line circuit structure suitable for broadband terahertz signal Download PDFInfo
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- CN215956726U CN215956726U CN202121293377.2U CN202121293377U CN215956726U CN 215956726 U CN215956726 U CN 215956726U CN 202121293377 U CN202121293377 U CN 202121293377U CN 215956726 U CN215956726 U CN 215956726U
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Abstract
The utility model discloses a substrate integrated semi-fin line circuit structure suitable for broadband terahertz signals, which comprises a top layer circuit board, a middle supporting board and a bottom layer circuit board, wherein the top layer circuit board and the middle supporting board are spaced by first supporting ridges and second supporting ridges on two sides, the middle supporting board and the bottom layer circuit board are spaced by third supporting ridges and fourth supporting ridges on two sides, and gaps are formed between the first supporting ridges and the second supporting ridges and between the third supporting ridges and the fourth supporting ridges. The substrate integrated semi-fin line circuit structure is formed by pressing a plurality of printed circuit boards, a cavity is formed, and filling media are filled in the cavity, so that the requirements of the substrate integrated semi-fin line circuit structure in the fields of radar, communication and the like on large bandwidth, small volume, light weight and high quality factor are met.
Description
Technical Field
The present invention relates to the field of integrated circuit technology.
Background
When the substrate of the broadband terahertz signal is produced, a plurality of printed circuit boards are arranged, the printed circuit boards are generally assembled in a simple stacking mode, the assembling mode is simple, the assembling cost is low, the reliability is poor in the actual using process, the pressure resistance is low, and the generated broadband terahertz signal is unstable.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of realizing a substrate integrated semi-fin line circuit structure suitable for broadband terahertz signals.
In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides an integrated semi-fin line circuit structure of substrate suitable for broadband terahertz signal now comprises polylith printed circuit board, printed circuit board includes top layer circuit board and bottom circuit board, printed circuit board includes and is equipped with the intermediate junction board between top layer circuit board and the bottom circuit board, first support ridge and the second through both sides support the ridge interval between top layer circuit board and the intermediate junction board, third support ridge and the fourth support ridge interval through both sides between intermediate junction board and the bottom circuit board, first support ridge and second support between the ridge and the third support ridge and fourth support all have the clearance between the ridge interval.
The upper surface and the lower surface of the top layer circuit board and the bottom layer circuit board are both provided with conductive planes, and the conductive planes of the top layer circuit board and the bottom layer circuit board are connected through a conductor.
The upper surface and the lower surface of the middle supporting plate are both provided with conductive planes, and the conductive planes on the two surfaces of the middle supporting plate are both formed by two unconnected conductive sheets.
The conductive planes on the two sides of the middle support plate are in alternating current short circuit with the conductive plane of the top circuit board, and the conductive planes on the two sides of the middle support plate are in alternating current short circuit with the conductive plane of the bottom circuit board.
The conducting planes on the two sides of the middle supporting plate are respectively composed of a large conducting plate and a small conducting plate which are not connected, the small conducting plate and the conducting plane of the top layer circuit board jointly form an electric wall boundary, and the small conducting plate and the conducting plane of the bottom layer circuit board jointly form an electric wall boundary.
The printed circuit boards are all made of FR-4 materials.
The medium in the gap is air.
The conductive planes are parallel to each other.
The substrate integrated semi-fin line circuit structure is formed by pressing a plurality of printed circuit boards, a cavity is formed, and filling media are filled in the cavity, so that the requirements of the substrate integrated semi-fin line circuit structure in the fields of radar, communication and the like on large bandwidth, small volume, light weight and high quality factor are met.
Drawings
The following is a brief description of the contents of each figure and the symbols in the figures in the description of the utility model:
FIG. 1 is an exploded view of a substrate integrated semi-fin line circuit structure;
FIG. 2 is a schematic view of an assembly of a substrate integrated semi-fin line circuit structure;
the labels in the above figures are: 1. a top layer circuit board; 2. a middle support plate; 3. a bottom layer circuit board; 4. a first support ridge; 5. a second support ridge; 6. a third support ridge; 7. a fourth support ridge.
Detailed Description
The following description of the embodiments with reference to the drawings is provided to describe the embodiments of the present invention in further detail, such as the shapes and structures of the related components, the mutual positions and connection relationships of the components, the functions and working principles of the components, the manufacturing process and the operation and use method, etc., so as to help those skilled in the art to understand the concept and technical solutions of the present invention more completely, accurately and deeply.
The substrate integrated semi-fin line circuit structure suitable for the broadband terahertz signal is shown in figure 1 and formed by pressing a plurality of printed circuit boards, the printed circuit boards are made of FR-4 materials, each printed circuit board comprises a top circuit board 1 and a bottom circuit board 3, the top circuit board 1 and the bottom circuit board 3 are parallel to each other, an intermediate support plate 2 parallel to the top circuit board 1 and the bottom circuit board 3 is arranged between the top circuit board 1 and the bottom circuit board 3, and the intermediate support plate 2 is used for mounting components with specific functions.
The top circuit board 1 is supported between the first supporting ridges 4 and the second supporting ridges 5 provided on both sides of the upper surface of the intermediate supporting plate 2, and the bottom circuit board 3 is supported between the third supporting ridges 6 and the fourth supporting ridges 7 provided on both sides of the lower surface of the intermediate supporting plate 2. And 4, cavity gaps are formed between the first supporting ridge 4 and the second supporting ridge 5 and between the third supporting ridge 6 and the fourth supporting ridge 7, and filling media are filled in the cavity gaps to form the semi-fin line circuit structure. The addition of fins provides the advantage of a wider bandwidth compared to conventional SIW, and the advantage of parallel ridges on top of each other is easier to manufacture than another structure.
The upper surface and the lower surface of the top circuit board 1 and the bottom circuit board 3 are both provided with conductive planes, the conductive planes of the top circuit board 1 and the bottom circuit board 3 in the figure are the outermost periphery of the structure, the small holes on the conductive planes are all VIA produced by PCB technology, the conductive planes of the top circuit board 1 and the bottom circuit board 3 are connected through conductors, the upper surface and the lower surface of the middle supporting plate 2 are also provided with conductive planes, and the conductive planes on the two surfaces of the middle supporting plate 2 are formed by two non-connected conductive sheets. The conducting planes on the two sides of the middle supporting plate 2 are in alternating current short circuit with the conducting planes of the top circuit board 1 (indicating that an alternating current signal can pass through the middle supporting plate without barrier and no alternating current potential difference exists between the two), the conducting planes on the two sides of the middle supporting plate 2 are in alternating current short circuit with the conducting planes of the bottom circuit board 3, and the electric field direction of the conducting planes of the middle supporting plate 2 is parallel to the conducting planes of the top circuit board 1 and the bottom circuit board 3. Preferably, the conductive planes on both sides of the middle support plate 2 are formed by two unconnected large conductive sheets and small conductive sheets, the small conductive sheets and the conductive planes of the top circuit board 1 form an electric wall boundary (indicating that the direction of the electric field is the same as the normal direction of the boundary, and no specific physical structure exists), and the small conductive sheets and the conductive planes of the bottom circuit board 3 form an electric wall boundary.
The utility model has been described above with reference to the accompanying drawings, it is obvious that the utility model is not limited to the specific implementation in the above-described manner, and it is within the scope of the utility model to apply the inventive concept and solution to other applications without substantial modification.
Claims (8)
1. Integrated semi-fin line circuit structure of substrate suitable for broadband terahertz signal constitutes its characterized in that by the polylith printed circuit board: the printed circuit board includes top layer circuit board and bottom layer circuit board, printed circuit board includes and is equipped with the intermediate strut board between top layer circuit board and the bottom layer circuit board, first support ridge and the second through both sides support the ridge interval between top layer circuit board and the intermediate strut board, third support ridge and the fourth support ridge interval through both sides between intermediate strut board and the bottom layer circuit board, first support ridge and second support between the ridge and third support ridge and fourth support all have the clearance between the ridge interval.
2. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals according to claim 1, wherein: the upper surface and the lower surface of the top layer circuit board and the bottom layer circuit board are both provided with conductive planes, and the conductive planes of the top layer circuit board and the bottom layer circuit board are connected through a conductor.
3. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals according to claim 2, wherein: the upper surface and the lower surface of the middle supporting plate are both provided with conductive planes, and the conductive planes on the two surfaces of the middle supporting plate are both formed by two unconnected conductive sheets.
4. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals according to claim 3, wherein: the conductive planes on the two sides of the middle support plate are in alternating current short circuit with the conductive plane of the top circuit board, and the conductive planes on the two sides of the middle support plate are in alternating current short circuit with the conductive plane of the bottom circuit board.
5. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals according to claim 4, wherein: the conducting planes on the two sides of the middle supporting plate are respectively composed of a large conducting plate and a small conducting plate which are not connected, the small conducting plate and the conducting plane of the top layer circuit board jointly form an electric wall boundary, and the small conducting plate and the conducting plane of the bottom layer circuit board jointly form an electric wall boundary.
6. The substrate-integrated semi-fin line circuit structure suitable for the broadband terahertz signal according to any one of claims 2 to 5, wherein: the printed circuit boards are all made of FR-4 materials.
7. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals according to claim 6, wherein: the medium in the gap is air.
8. The substrate-integrated semi-fin line circuit structure suitable for broadband terahertz signals of claim 7, wherein: the conductive planes are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121293377.2U CN215956726U (en) | 2021-06-10 | 2021-06-10 | Substrate integrated semi-fin line circuit structure suitable for broadband terahertz signal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121293377.2U CN215956726U (en) | 2021-06-10 | 2021-06-10 | Substrate integrated semi-fin line circuit structure suitable for broadband terahertz signal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215956726U true CN215956726U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121293377.2U Active CN215956726U (en) | 2021-06-10 | 2021-06-10 | Substrate integrated semi-fin line circuit structure suitable for broadband terahertz signal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215956726U (en) |
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2021
- 2021-06-10 CN CN202121293377.2U patent/CN215956726U/en active Active
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