CN215955278U - Lamp pearl circuit board and lamp plate - Google Patents
Lamp pearl circuit board and lamp plate Download PDFInfo
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- CN215955278U CN215955278U CN202122519333.3U CN202122519333U CN215955278U CN 215955278 U CN215955278 U CN 215955278U CN 202122519333 U CN202122519333 U CN 202122519333U CN 215955278 U CN215955278 U CN 215955278U
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Abstract
The utility model discloses a lamp bead circuit board, which comprises a substrate, a first insulating plate and a second insulating plate, wherein the substrate is an insulating plate; two positive electrode bonding pads symmetrically arranged on the same side of the front surface of the substrate; the two negative electrode bonding pads are symmetrically arranged on the front surface of the substrate and opposite to the other side edges of the two positive electrode bonding pads; the four bonding pads are symmetrically arranged in the middle of the front surface of the substrate; a connecting line connecting the two pads at opposite corners; the heat dissipation layer is arranged on the back surface of the substrate, the position of the heat dissipation layer corresponds to that of the bonding pad, and the heat dissipation layer is electrically connected with the bonding pads at two opposite corners; two positive electrode bonding pads symmetrically arranged on the same side of the back surface of the substrate; and the two negative electrode bonding pads are symmetrically arranged on the other side edge of the back surface of the substrate. The utility model also discloses a lamp panel. The utility model effectively realizes the light mixing function of the circuit board and the lamp panel, and has the characteristics of attractive appearance and high production efficiency.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a lamp bead circuit board and a lamp panel.
Background
When the lamp bead circuit board is designed in a modularized mode, in order to achieve interconnection among a plurality of circuit boards, a plurality of modules are usually arranged on a single circuit board, and different modules are directly or indirectly connected. If the function of mixed light is realized to current lamp pearl circuit board if needs, generally realizes through the mode of welding the wire jumper, if the wire jumper goes wrong will make the lamp pearl circuit board break down, has the overall arrangement of circuit board pleasing to the eye and the not high problem of production efficiency simultaneously with the mode of wire jumper. Therefore, in view of the deficiency of the above-mentioned schemes in actual manufacturing and implementation and use, the present invention provides a lamp bead circuit board and a lamp panel, which are modified and improved, and are based on the acquired spirit and concept, assisted by professional knowledge and experience, and after many kinds of ingenuity and experiments, the present invention is created, so as to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
One of the objectives of the present invention is to provide a lamp bulb circuit board and a lamp panel, so as to solve the above problems.
The lamp bead circuit board and the lamp panel can be realized by the following technical scheme:
the lamp bead circuit board comprises a substrate which is an insulating plate; the two positive electrode bonding pads are symmetrically arranged on the same side of the front surface of the substrate, and are insulated from each other; the two negative electrode bonding pads are symmetrically arranged on the front surface of the substrate and opposite to the other side edges of the two positive electrode bonding pads, and the two negative electrode bonding pads are insulated from each other; four pads symmetrically arranged in the middle of the front surface of the substrate, wherein the four pads are insulated from each other; a connecting line connecting the two pads at opposite corners; the heat dissipation layer is arranged on the back surface of the substrate, the position of the heat dissipation layer corresponds to that of the bonding pad, and the heat dissipation layer is electrically connected with the bonding pads at two opposite corners; the two positive electrode bonding pads are symmetrically arranged on the same side of the back surface of the substrate, the two positive electrode bonding pads are insulated from each other, and the two positive electrode bonding pads are respectively and electrically connected with the positive electrode bonding pads corresponding to the front surface; the two negative electrode bonding pads are symmetrically arranged on the other side edge of the back surface of the substrate, the two negative electrode bonding pads are insulated from each other, and the two negative electrode bonding pads are respectively and electrically connected with the negative electrode bonding pads corresponding to the front surface.
In one embodiment, the substrate is a ceramic plate.
In one embodiment, two positive pads, two negative pads, four pads, and the connecting wires on the front surface of the substrate, and the heat dissipation layer, two positive pads, and two negative pads on the back surface of the substrate are all copper coatings.
In one embodiment, the two positive electrode pads on the front surface of the substrate are electrically connected with the corresponding positive electrode pads on the back surface of the substrate through conductive holes.
In one embodiment, the two negative electrode pads on the front surface of the substrate are electrically connected with the corresponding negative electrode pads on the back surface of the substrate through the conductive holes.
In one embodiment, the two diagonal pads are electrically connected to the heat dissipation layer through the conductive vias, respectively.
A lamp panel comprises the lamp bead circuit board.
In one embodiment, four LED chips are symmetrically attached to the front surface of the substrate, and the LED chips at opposite corners are connected in series.
In one embodiment, a lens is arranged on the four LED chips, and the lens wraps the four LED chips.
Compared with the prior art, the lamp bead circuit board and the lamp panel have the beneficial effects that:
according to the lamp bead circuit board and the lamp panel, the four LED chips are symmetrically attached to the front surface of the substrate, and the two diagonal LED chips are connected in series through the connecting wires and the heat dissipation layer respectively, so that the two diagonal LED chips can be controlled simultaneously, and the diagonal LED chips are set to have different colors and different luminous intensities, so that the light mixing function is effectively realized, no jumper wire is required to be welded, the circuit board is attractive, and the faults of the circuit board are reduced; simultaneously, the four LED chips are symmetrically attached, and the LED chips are not required to be subjected to angle adjustment in the attaching process, so that the production efficiency is high, and the production efficiency of products is improved to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a front structure of a lamp bead circuit board of the utility model;
FIG. 2 is a schematic diagram of a reverse structure of the lamp bead circuit board shown in FIG. 1;
fig. 3 is a schematic front structure diagram of a lamp panel according to the present invention.
The following are marked in the figure: 11, a substrate; 12, a first positive electrode pad; 13, a second positive electrode pad; 14, a first negative electrode pad; 15, a second negative electrode pad; 16, a bonding pad; 17, connecting wires; 18, a heat dissipation layer; 19, a third positive electrode pad; 20, a fourth positive electrode pad; 21, a third negative electrode pad; 22, a fourth negative electrode pad; 30, a conductive via; 31, LED chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper" and "lower" are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually placed when the utility model is used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or the element which is referred to must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present invention.
Further, in the present invention, unless otherwise expressly stated or limited, the first feature may be directly contacting the second feature or may be directly contacting the first or second feature with the second feature therebetween. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-2, a lamp bead circuit board of the present invention mainly includes a substrate 11, a first positive electrode pad 12, a second positive electrode pad 13, a first negative electrode pad 14, a second negative electrode pad 15, four pads 16, a connection line 17, a heat dissipation layer 18, a third positive electrode pad 19, a fourth positive electrode pad 20, a third negative electrode pad 21, and a fourth negative electrode pad 22; the substrate 11 is an insulating plate; the first positive electrode pad 12 and the second positive electrode pad 13 are symmetrically arranged on the same side of the front surface of the substrate 11, and are insulated from each other; the first negative electrode pad 14 and the second negative electrode pad 15 are symmetrically arranged on the front surface of the substrate 11 and opposite to the other sides of the first positive electrode pad 12 and the second positive electrode pad 13, and are insulated from each other; the four bonding pads 16 are symmetrically arranged in the middle of the front surface of the substrate 11, and the four bonding pads are insulated from each other; the connecting line 17 connects two of the pads 16 at opposite corners so that the connected two of the pads 16 are electrically connected; the heat dissipation layer 18 is arranged on the back surface of the substrate 11, the position of the heat dissipation layer corresponds to the position of the bonding pad 16, the heat dissipation layer is electrically connected with the bonding pads 16 at two opposite corners, and the heat dissipation layer 18 mainly plays a role in heat dissipation and has a conductive function; the third positive pad 19 and the fourth positive pad 20 are symmetrically arranged on the side of the back surface of the substrate 11, and are electrically connected with the first positive pad 12 and the second positive pad 13 respectively, and the third positive pad 19 and the fourth positive pad 20 are insulated from each other and are electrically connected with the positive electrode of the power supply respectively; the third negative electrode pad 21 and the fourth negative electrode pad 22 are symmetrically disposed on the other side of the back surface of the substrate 11 opposite to the third positive electrode pad 19 and the fourth positive electrode pad 20, are electrically connected to the first negative electrode pad 14 and the second negative electrode pad 15, respectively, are insulated from each other, and are electrically connected to the negative electrode of the power supply, respectively.
Referring to fig. 1 and fig. 2, in the present embodiment, the substrate 11 is a ceramic plate; the first positive electrode pad 12, the second positive electrode pad 13, the first negative electrode pad 14, the second negative electrode pad 15, the four pads 16, the connection line 17, the heat dissipation layer 18, the third positive electrode pad 19, the fourth positive electrode pad 20, the third negative electrode pad 21, and the fourth negative electrode pad 22 are all made of copper plating. In this embodiment, the first positive electrode pad 12 is electrically connected to the third positive electrode pad 19 through the conductive via 30, the first positive electrode pad 12 is attached to the positive electrode of the first LED chip 31, and the third positive electrode pad 19 is connected to the positive electrode of the power supply; the second positive bonding pad 13 is electrically connected with the fourth positive bonding pad 20 through the conductive hole 30, the second positive bonding pad 12 is attached to the positive electrode of the second LED chip 31, and the fourth positive bonding pad 20 is also connected with the positive electrode of the power supply; the first negative electrode bonding pad 14 is electrically connected with the third negative electrode bonding pad 21 through the conductive hole 30, the first negative electrode bonding pad 14 is attached to the negative electrode of a third LED chip 31, and the third negative electrode bonding pad 21 is connected with the negative electrode of a power supply; the second negative electrode pad 15 is electrically connected with the fourth negative electrode pad 22 through the conductive hole 30, the second negative electrode pad 15 is attached to a negative electrode of the fourth LED chip 31, and the fourth positive electrode pad 22 is also connected with a negative electrode of a power supply. In the present embodiment, the two diagonal pads 16 are electrically connected to the heat dissipation layer 18 through the conductive vias 30, respectively.
Referring to fig. 3, in this embodiment, a first LED chip 31 in the lamp panel of the utility model is attached to the first positive bonding pad 12 and the corresponding bonding pad 16; the second LED chip 31 is attached to the second positive bonding pad 13 and the corresponding bonding pad 16; the third LED chip 31 is attached to the first negative electrode bonding pad 14 and the corresponding bonding pad 16; the fourth LED chip 31 is attached to the second negative electrode bonding pad 15 and the corresponding bonding pad 16; the first LED chip 31 and the fourth LED chip 31 are electrically connected by the connection line 17, so that the first LED chip 31 and the fourth LED chip 31 are connected in series; the second LED chip 31 and the third LED chip 31 are electrically connected through the heat dissipation layer 18 such that the second LED chip 31 and the third LED chip 31 are connected in series. In this embodiment, the four LED chips 31 are further provided with lenses, and the lenses wrap the four LED chips 31.
It should be noted that, in the lamp panel of the present invention, the anode of the first LED chip 31 is attached to the first anode pad 12, the cathode thereof is attached to the corresponding pad 16, the cathode of the fourth LED chip 31 is attached to the second cathode pad 15, the anode thereof is attached to the corresponding pad 16, and the first LED chip 31 and the fourth LED chip 31 are connected in series through the connecting wire 17, so that the first LED chip 31 and the fourth LED chip 31 can be turned on; the anode of the second LED chip 31 is attached to the second anode bonding pad 13, the cathode thereof is attached to the corresponding bonding pad 16, the cathode of the third LED chip 31 is attached to the first cathode bonding pad 14, the anode thereof is attached to the corresponding bonding pad 16, the second LED chip 31 and the third LED chip 31 are connected in series through the heat dissipation layer 18, so that the second LED chip 31 and the third LED chip 31 can be lighted, and two different groups of LED chips 31 are set to emit different colors and different light-emitting intensities, thereby effectively realizing the light mixing function.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A lamp bead circuit board is characterized by comprising a substrate which is an insulating plate; the two positive electrode bonding pads are symmetrically arranged on the same side of the front surface of the substrate, and are insulated from each other; the two negative electrode bonding pads are symmetrically arranged on the front surface of the substrate and opposite to the other side edges of the two positive electrode bonding pads, and the two negative electrode bonding pads are insulated from each other; four pads symmetrically arranged in the middle of the front surface of the substrate, wherein the four pads are insulated from each other; a connecting line connecting the two pads at opposite corners; the heat dissipation layer is arranged on the back surface of the substrate, the position of the heat dissipation layer corresponds to that of the bonding pad, and the heat dissipation layer is electrically connected with the bonding pads at two opposite corners; the two positive electrode bonding pads are symmetrically arranged on the same side of the back surface of the substrate, the two positive electrode bonding pads are insulated from each other, and the two positive electrode bonding pads are respectively and electrically connected with the positive electrode bonding pads corresponding to the front surface; the two negative electrode bonding pads are symmetrically arranged on the other side edge of the back surface of the substrate, the two negative electrode bonding pads are insulated from each other, and the two negative electrode bonding pads are respectively and electrically connected with the negative electrode bonding pads corresponding to the front surface.
2. The lamp bead circuit board of claim 1, wherein the substrate is a ceramic plate.
3. The lamp bead circuit board of claim 2, wherein two positive electrode pads, two negative electrode pads, four positive electrode pads, and the connecting wires are disposed on the front surface of the substrate, and the heat dissipation layer, two positive electrode pads, and two negative electrode pads are disposed on the back surface of the substrate and are all copper-coated.
4. The lamp bead circuit board of claim 3, wherein two positive electrode pads on the front surface of the substrate are electrically connected with corresponding positive electrode pads on the back surface of the substrate through conductive holes.
5. The lamp bead circuit board of claim 4, wherein two negative electrode pads on the front surface of the substrate are electrically connected with corresponding negative electrode pads on the back surface of the substrate through the conductive holes.
6. The lamp bead circuit board of claim 5, wherein two diagonal pads are electrically connected to the heat dissipation layer through the conductive vias, respectively.
7. A lamp panel, characterized in that, includes the lamp pearl circuit board of any one of claims 1-6.
8. The lamp panel of claim 7, wherein four LED chips are symmetrically attached to the front surface of the substrate, and the LED chips at opposite corners are connected in series.
9. The lamp panel of claim 8, wherein a lens is disposed on the four LED chips, and the four LED chips are wrapped by the lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122519333.3U CN215955278U (en) | 2021-10-19 | 2021-10-19 | Lamp pearl circuit board and lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122519333.3U CN215955278U (en) | 2021-10-19 | 2021-10-19 | Lamp pearl circuit board and lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215955278U true CN215955278U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122519333.3U Active CN215955278U (en) | 2021-10-19 | 2021-10-19 | Lamp pearl circuit board and lamp plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215955278U (en) |
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2021
- 2021-10-19 CN CN202122519333.3U patent/CN215955278U/en active Active
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