CN218001229U - LED flexible lamp strip - Google Patents
LED flexible lamp strip Download PDFInfo
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- CN218001229U CN218001229U CN202222104715.4U CN202222104715U CN218001229U CN 218001229 U CN218001229 U CN 218001229U CN 202222104715 U CN202222104715 U CN 202222104715U CN 218001229 U CN218001229 U CN 218001229U
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- integrated packaging
- circuit board
- signal transmission
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Abstract
The utility model discloses a LED flexible lamp strip, which comprises a flexible circuit board, a plurality of integrated packaging devices, a plurality of current-limiting resistors and a plurality of filter capacitors; the flexible circuit board is in a long strip shape and comprises functional areas, and the functional areas are arranged in the center of the flexible circuit board and are linearly arranged along the length direction of the flexible circuit board; the integrated packaging device comprises an LED light-emitting chip group and an IC chip, wherein the LED light-emitting chip group and the IC chip are integrated in one device through integrated packaging operation; the integrated packaging device is welded in the functional area; and signal transmission among the integrated packaging devices is connected in a series-parallel connection mode. The utility model discloses a flexible lamp area of LED, the signal transmission between each integration encapsulation device adopts the series-parallel connection mode, makes signal transmission become multipath transmission by single transmission, has reduced the influence to follow-up lamp area signal transmission after last integration encapsulation device signal transmission breaks down.
Description
Technical Field
The utility model relates to the field of lighting technology, in particular to LED flexible lamp area.
Background
LEDs are widely used as fourth generation green illumination sources. The LED flexible lamp strip has the advantages of being capable of being bent at will, mounted and the like, and the market is greatly increased in recent years. Especially, the programmable control multicolor flexible lamp strip is popular in the market due to the characteristics of good light shape, dimming and color mixing, easy design and one lamp with multiple functions, and is widely applied to places such as markets, counters, coffee houses and the like.
At present, the LED flexible lamp strip adopts single size to send out light chip and IC chip and pass through interval arrangement on the flexible circuit board through surface mounting technology more than 3.5 × 3.5mm, and the chip that arranges on the flexible circuit board of a meter length is small in quantity, and luminous for the punctiform, the light type is poor, and whole size is great.
In addition, DIN (Data Input) of the LED flexible light strip is connected in series. One problem that is prone to occur with series connections is: when the transmission of the IC signal of a certain lamp bead in the lamp strip is interrupted, the signals of all the subsequent lamp beads are interrupted and become invalid, so that the subsequent lamp beads cannot normally operate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to the above-mentioned defect among the prior art, provide a LED flexible light strip, can reduce the signal transmission of last lamp pearl and to the influence of follow-up lamp pearl, luminous chip and the IC chip of arranging are in large quantity on unit length's the flexible circuit board, and the light diffusion is even.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: an LED flexible lamp strip comprises a flexible circuit board, a plurality of integrated packaging devices, a plurality of current-limiting resistors and a plurality of filter capacitors; the flexible circuit board is in a long strip shape and comprises functional areas, and the functional areas are arranged in the center of the flexible circuit board and are linearly arranged along the length direction of the flexible circuit board; the integrated packaging device comprises an LED light-emitting chip group and an IC chip, wherein the LED light-emitting chip group and the IC chip are integrated in one device through integrated packaging operation; the integrated packaging device is welded in the functional area; and signal transmission among a plurality of integrated packaging devices is connected in a series-parallel connection mode.
Furthermore, two or more than two integrated packaging devices form a group; the signal transmission among all the integrated packaging devices in the group adopts a parallel connection mode; the signal transmission between the small groups adopts a serial connection mode.
Further, the integrated package device has four ports, which are respectively: a positive power input terminal VCC, a negative power input terminal GND, a signal input terminal DIN and a signal output terminal DOUT.
Furthermore, two or more than two integrated packaging devices form a group; the signal transmission among all the integrated packaging devices in the group adopts a parallel connection mode; the signal output end DOUT of any one integrated packaging device in the previous group of integrated packaging devices is connected with the integrated packaging devices in the next group in series.
Furthermore, the current limiting resistor comprises a signal transmission current limiting resistor and a positive input current limiting resistor; the signal transmission current-limiting resistor is connected in series with a signal input end DIN of the integrated packaging device; the positive input current-limiting resistor is connected in series with a positive power supply input end VCC of the integrated packaging device.
Further, the filter capacitor is connected in parallel with the integrated packaging device.
Further, the flexible circuit board further comprises a circuit layer; the circuit layer comprises a positive electrode circuit, a negative electrode circuit and the signal transmission line; the positive pole circuit with negative pole circuit branch establishes the both sides of flexible circuit board, signal transmission line with the negative pole circuit is located same one side of flexible circuit board.
Further, the functional region is located between the positive electrode circuit and the negative electrode circuit; the positive power supply input end VCC of the integrated packaging device is connected with the positive circuit; the cathode power supply input end GND of the integrated packaging device is communicated with the cathode circuit; and the integrated packaging devices are connected in parallel between the positive electrode line and the negative electrode line.
Further, the flexible circuit board further comprises an insulating layer; the insulating layer is arranged on the front surface and the back surface of the circuit layer.
Further, the LED flexible lamp strip is also provided with a sealing adhesive layer; the sealing adhesive layer is arranged on the upper sides of the flexible circuit board, the integrated packaging device, the current limiting resistor and the filter capacitor; the sealing glue layer is formed by silica gel mixed with nano-scale titanium dioxide white particle powder.
Compared with the prior art, the utility model has the advantages of:
the LED flexible lamp strip of the utility model integrates the luminous chip group and the IC chip in one device through integrated packaging operation, the device has small volume, the number of the luminous chip group and the IC chip distributed on the flexible circuit board with unit length is increased, so that the light diffusion is uniform, the light type is good, and no light spot exists; the light-emitting chip group and the IC chip are used as a device to be welded on the flexible circuit board, so that the connection of the lamp strip is simple and stable, the integral aesthetic property of the lamp strip is improved, the light diffusion is uniform, and no light spot exists;
the signal transmission between the integrated packaging devices formed by the optical chip groups and the IC chips adopts a series-parallel connection mode, so that the signal transmission is changed from single-path transmission into multi-path transmission, the influence on the subsequent lamp strip signal transmission after the signal transmission of the previous integrated packaging device fails is reduced, and the subsequent lamp strip signal transmission cannot be failed when the signal transmission of the previous integrated packaging device is interrupted.
Drawings
Fig. 1 is a front view of an LED flexible light strip of the present invention;
fig. 2 is a schematic diagram of the arrangement of the electric components of the present invention on the flexible circuit board;
FIG. 3 is a schematic structural diagram of the integrated package device of the present invention;
FIG. 4 is a schematic circuit diagram of an embodiment of the present invention;
fig. 5 is a schematic circuit diagram of another embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to fig. 1 to 5.
The utility model discloses a LED flexible lamp area, including flexible circuit board 1, a plurality of integration encapsulation device 2, a plurality of current-limiting resistor and a plurality of filter capacitance 5.
The flexible circuit board 1 is in a strip shape and comprises a circuit layer, an insulating layer and a functional area.
Referring to fig. 2, the circuit layer is formed by connecting a plurality of small segments of lines in parallel along the length direction of the flexible circuit board 1, and includes a positive line 10, a negative line 11 and a signal transmission line 12, wherein the positive line 10 and the negative line 11 are respectively arranged on two sides of the flexible circuit board 1, and the signal transmission line 12 and the negative line 11 are located on the same side of the flexible circuit board 1. The positive electrode line 10, the negative electrode line 11, and the signal transmission line 12 are prefabricated lines and formed by etching. The front and back surfaces of the circuit layer are coated with insulating layers.
The functional region is arranged in the center of the flexible circuit board 1, located between the positive electrode line 10 and the negative electrode line 11, and arranged in a straight line along the length direction of the flexible circuit board 1.
The flexible circuit board 1 further has a positive through via 13, a negative through via 14, a signal through via, and a connection via 17. The positive electrode via hole 13 is provided on the positive electrode line 10, and the negative electrode via hole 14 is provided on the negative electrode line 11. The signal conduction vias include an input signal conduction via 15 and an output signal conduction via 16.
Referring to fig. 3, the integrated package device 2 includes an LED light emitting chip group 22 and an IC chip 21, the LED light emitting chip group 22 and the IC chip 21 are integrated in one device through an integrated package operation, and the volume of the device is not greater than 4 square millimeters, so that more integrated package devices 2 can be arranged on the flexible circuit board 1 per unit length, and the process flow of attaching the LED light emitting chip group 22 and the IC chip 21 to the flexible circuit board 1 is simplified. The LED light emitting chip group 22 is composed of at least two light emitting chips, and each light emitting chip is electrically connected to the IC chip 21. In the present embodiment, the LED light emitting chip set 22 is composed of red, green and blue light emitting chips.
The integrated package device 2 further has four ports, which are:
the integrated packaging device 2 is connected with the positive circuit 10 through the positive power input end VCC;
the integrated packaging device 2 is connected with the positive electrode circuit 10 through the power input end GND;
a signal input terminal DIN through which the integrated package device 2 is connected to the signal transmission line 12 or the previous integrated package device 2;
the signal output terminal DOUT, the integrated package device 2 is connected with the lower integrated package device 2 through the signal input terminal DIN.
Referring to fig. 4, signal transmission between a plurality of integrated package devices 2 is connected in a series-parallel manner, specifically, two or more integrated package devices 2 are in a group, signal transmission between the integrated package devices 2 in the group is in a parallel manner, and a signal output terminal DOUT of any one integrated package device 2 in the previous group of integrated package devices 2 is connected in series with the integrated package device 2 in the next group, so that signal transmission of other integrated package devices 2 in the group, except the integrated package device 2 connected in series with the next group, fails, such as interruption, and the signal transmission of the subsequent integrated package device 2 cannot fail.
As a preferred embodiment, the signal transmission between the subgroups is in a serial manner, as shown in fig. 5, so that the signal transmission of any one integrally packaged device 2 in the previous group does not fail to make the signal transmission of the later integrally packaged device 2 fail.
In order to protect the current and voltage of the integrated packaging devices 2 during signal input and avoid damage of the chips in the integrated packaging devices 2 caused by excessive current and/or voltage, each integrated packaging device 2 is connected with a signal transmission current limiting resistor 3 in series before the signal is connected to a signal input end DIN.
The integrated packaging devices 2 are connected in parallel between the positive electrode line 10 and the negative electrode line 11. In order to ensure that the voltage input into the integrated packaging device 2 is not too large, the anode power supply input end VCC of the integrated packaging device 2 is connected in series with an anode input current limiting resistor 4, and the anode input current limiting resistor 4 is used for dividing part of the voltage input into the integrated packaging device 2 without influencing the current input into the integrated packaging device 2. The anode input current limiting resistor 4 is installed as required, each integrated packaging device 2 can be connected with an anode input current limiting resistor 4 in series, or a plurality of integrated packaging devices 2 without the anode input current limiting resistors 4 in series are arranged between the integrated packaging device 2 with the anode input current limiting resistor 4 in series and the integrated packaging device 2 with the anode input current limiting resistor 4 in series.
In order to increase the stability of the circuit, a filter capacitor 5 is connected between the positive electrode line 10 and the negative electrode line 11, and the filter capacitor 5 is connected in parallel with the integrated package device 2.
A plurality of integrated packaging devices 2, a plurality of signal transmission current-limiting resistors 3, a plurality of anode input current-limiting resistors 4 and a plurality of filter capacitors 5 are fixed in the functional area of the flexible circuit board 1 through welding. Preferably, the solder is high-precision tin-silver alloy. The tin-silver alloy is used as the solder, so that the firmness and stability of connection between each electrical element and the flexible circuit board 1 can be improved, and the electrical failure of the lamp strip caused by overheating and glue stress can be avoided.
In order to enable the light diffusion of the LED flexible lamp strip to be more uniform, form a non-speckle magical color effect and enable the whole structure of the LED flexible lamp strip to be attractive, the flexible circuit board 1 and each electrical element fixed in the functional area of the flexible circuit board 1 are coated with packaging glue. The packaging adhesive is silica gel with heat resistance higher than 260 ℃, and the silica gel is coated on the flexible circuit board 1 and the electric element and on the periphery of the flexible circuit board to form a packaging adhesive layer with a circular or oval cross section. Preferably, the silica gel is mixed with nano-scale titanium dioxide white particle powder so as to improve the refractive index of the sealing adhesive layer to increase the brightness of the lamp strip.
For the convenience of installing and wiring the LED flexible lamp strip, the flexible circuit board 1 is provided with a direction mark 6 for indicating the current trend of the LED flexible lamp strip.
Based on the LED flexible lamp strip, a manufacturing method of the LED flexible lamp strip is provided, and the manufacturing method comprises the following steps:
the method comprises the following steps: forming a circuit layer, an insulating layer and a functional area on the substrate by adopting a multi-layer printing and etching mode to manufacture the flexible circuit board 1;
step two: the LED light-emitting chip group and the IC chip are integrated into a device through integrated packaging operation to form an integrated packaging device 2;
step three: fixing a plurality of integrated packaging devices 2, a plurality of current limiting resistors and a plurality of filter capacitors 5 in a functional area of the flexible circuit board 1 by a surface mounting technology, and electrically connecting the integrated packaging devices, the current limiting resistors and the filter capacitors with a circuit layer of the flexible circuit board 1;
step four: placing the flexible circuit board 2 and the electric element fixed on the flexible circuit board 1 in the third step into a reflow soldering furnace for reflow soldering, and soldering the electric element on the flexible circuit board 1;
step five: selecting silica gel with heat resistance higher than 260 ℃, adding nano-scale titanium dioxide powder into the silica gel according to different application requirements, and preparing packaging adhesive;
step six: and coating the prepared packaging adhesive on the soldered flexible circuit board 1 and the electrical element, and baking to form the packaging adhesive layer.
Further, in the first step, the substrate of the flexible circuit board 1 is a flexible substrate with high thermal conductivity, so that the product has the property of being capable of being bent at will, and the influence of expansion of the packaging adhesive on the reliability of the product due to cold and hot changes is avoided.
Furthermore, in the fifth step, different application requirements are different for the light color brightness of the lamp strip, and the concentration of the nano-scale titanium dioxide powder in the silica gel is adjusted according to different light color brightness. The concentration of the titanium dioxide powder is low, the brightness of the lamp strip is high, and the light diffusion effect is good; the concentration of titanium dioxide powder is high, and the luminance in lamp area is low, and light gathers more.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
The present invention is not limited to the above description of the embodiments, and those skilled in the art should be able to make modifications and alterations without creative work on the basis of the present invention.
Claims (10)
1. The utility model provides a flexible lamp area of LED which characterized in that:
the integrated packaging device comprises a flexible circuit board, a plurality of integrated packaging devices, a plurality of current limiting resistors and a plurality of filter capacitors;
the flexible circuit board is in a strip shape and comprises a functional area, and the functional area is arranged at the central position of the flexible circuit board and is linearly arranged along the length direction of the flexible circuit board;
the integrated packaging device comprises an LED light-emitting chip group and an IC chip, wherein the LED light-emitting chip group and the IC chip are integrated in one device through integrated packaging operation;
the integrated packaging device is welded in the functional area;
and signal transmission among a plurality of integrated packaging devices is connected in a series-parallel connection mode.
2. The LED flexible light strip according to claim 1, wherein:
two or more integrated packaging devices form a group;
the signal transmission among all the integrated packaging devices in the group adopts a parallel connection mode;
the signal transmission between the small groups adopts a serial connection mode.
3. The LED flexible light strip according to claim 1, wherein:
the integrated packaging device is provided with four ports which are respectively as follows: a positive power input terminal VCC, a negative power input terminal GND, a signal input terminal DIN, and a signal output terminal DOUT.
4. A LED flexible light strip according to claim 3, wherein:
two or more integrated packaging devices form a group;
the signal transmission among all the integrated packaging devices in the group adopts a parallel connection mode;
and the signal output end DOUT of any one integrated packaging device in the previous group of integrated packaging devices is connected with the integrated packaging devices in the next group in series.
5. A LED flexible light strip according to claim 3, wherein:
the current limiting resistor comprises a signal transmission current limiting resistor and a positive input current limiting resistor;
the signal transmission current-limiting resistor is connected in series with a signal input end DIN of the integrated packaging device;
the positive input current-limiting resistor is connected in series with a positive power supply input end VCC of the integrated packaging device.
6. The LED flexible light strip according to claim 1, wherein:
the filter capacitor is connected with the integrated packaging device in parallel.
7. A LED flexible light strip according to claim 3, wherein:
the flexible circuit board further comprises a circuit layer;
the circuit layer comprises a positive electrode circuit, a negative electrode circuit and a signal transmission line;
the positive pole circuit with negative pole circuit branch establishes the both sides of flexible circuit board, signal transmission line with the negative pole circuit is located same one side of flexible circuit board.
8. The LED flexible light strip according to claim 7, wherein:
the functional region is positioned between the positive electrode circuit and the negative electrode circuit;
the positive power supply input end VCC of the integrated packaging device is connected with the positive circuit;
the cathode power supply input end GND of the integrated packaging device is communicated with the cathode circuit;
and the integrated packaging devices are connected in parallel between the positive electrode line and the negative electrode line.
9. The LED flexible light strip according to claim 7, wherein:
the flexible circuit board further comprises an insulating layer;
the insulating layer is arranged on the front surface and the back surface of the circuit layer.
10. A LED flexible light strip according to any one of claims 1 to 9, wherein:
the LED flexible lamp strip further comprises a sealing adhesive layer;
the sealing adhesive layer is arranged on the upper sides of the flexible circuit board, the integrated packaging device, the current-limiting resistor and the filter capacitor;
the sealing glue layer is formed by silica gel mixed with nano-scale titanium dioxide white particle powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222104715.4U CN218001229U (en) | 2022-08-10 | 2022-08-10 | LED flexible lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222104715.4U CN218001229U (en) | 2022-08-10 | 2022-08-10 | LED flexible lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218001229U true CN218001229U (en) | 2022-12-09 |
Family
ID=84320605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222104715.4U Active CN218001229U (en) | 2022-08-10 | 2022-08-10 | LED flexible lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218001229U (en) |
-
2022
- 2022-08-10 CN CN202222104715.4U patent/CN218001229U/en active Active
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