CN215935185U - SMT reflow oven heating structure - Google Patents

Abstract

The application discloses a heating structure of an SMT reflow oven, which comprises a slide rail, a sliding platform, a PCB, a soldering tin conveying mechanism and a heating module, wherein the sliding platform is connected to the slide rail in a sliding manner, the PCB is positioned on the sliding platform, and the soldering tin conveying mechanism is arranged above the PCB in a matching manner; the heating module is positioned below the sliding platform and comprises at least two adjacent heating modules which are uniformly distributed at intervals along the sliding direction of the sliding platform; the heating module comprises a coil supporting plate, a coil and a coil power supply, wherein the coil is embedded in the coil supporting plate and is electrically connected with the coil power supply. The application provides a pair of SMT reflow oven heating structure, through the setting up of a plurality of heating module realized in the reflow oven process operation of actual production after to the PCB board heating, avoided the PCB board to appear the problem that the board sticks up and discolour, improved the yield, and then improved production efficiency.

Description

SMT reflow oven heating structure

Technical Field

The application belongs to the technical field of surface mounting, concretely relates to SMT reflow oven heating structure.

Background

SMT (Surface mount Technology) refers to short names of series process flows for processing on the basis of a PCB (Printed Circuit Board), and is one of the most popular technologies in the electronic assembly industry.

At present, many of the related technologies are lead-free SMT processes, hot air type reflow soldering is the best choice of the lead-free reflow soldering process, forced hot air convection reflow soldering has the characteristics of different infrared and other reflow soldering methods closely related to physical properties, and the forced hot air convection soldering process is more concerned and rapidly widely applied due to the accelerated popularization and application of lead-free solder.

However, in the related art, the forced hot air convection welding furnace has a problem that the PCB is warped and discolored after being heated by hot air in an actual production operation.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: in order to overcome the not enough that exists among the prior art, this application provides an SMT reflow oven heating structure, and the technical problem that solve is how to avoid the PCB board to appear the board perk and the problem of discolouing after heating the PCB board in the reflow oven process operation of actual production.

The technical scheme is as follows: in order to achieve the purpose, the technical scheme adopted by the application is as follows:

a heating structure of an SMT reflow oven comprises a slide rail, a sliding platform, a PCB, a soldering tin conveying mechanism and a heating module, wherein the sliding platform is connected to the slide rail in a sliding mode, the PCB is located on the sliding platform, and the soldering tin conveying mechanism is arranged above the PCB in a matching mode;

the heating module is located below the sliding platform and comprises at least two adjacent heating modules, and the at least two heating modules are uniformly distributed at intervals along the sliding direction of the sliding platform.

The heating module comprises a coil supporting plate, a coil and a coil power supply, the coil is embedded in the coil supporting plate, and the coil is electrically connected with the coil power supply.

Optionally, the heating powers of the at least two heating modules are gradually decreased along the sliding direction of the sliding platform.

Optionally, the coil is in a spiral shape with a wide top and a narrow bottom.

Optionally, the number of turns of the coil is at least ten turns.

Optionally, the coil power supply is an alternating current power supply.

Optionally, the number of heating modules is three.

Has the advantages that: compared with the prior art, the SMT reflow oven heating structure provided by the application realizes that after the PCB is heated in the reflow oven process operation of actual production, the problems of warping and color change of the PCB are avoided, the yield is improved, and the production efficiency is further improved.

Drawings

The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiment(s) of the application and together with the description serve to explain the application and not limit the application. In the drawings:

FIG. 1 is a schematic structural diagram illustrating an SMT reflow oven heating structure provided by an exemplary embodiment of the present application;

FIG. 2 is a schematic diagram illustrating a heating module of an SMT reflow oven heating structure according to an exemplary embodiment of the present application;

FIG. 3 is a schematic diagram illustrating a coil structure of a heating structure of an SMT reflow oven according to an exemplary embodiment of the present application;

in the figure: 1. a slide rail; 2. a sliding platform; 3. a PCB board; 4. a soldering tin conveying mechanism; 5. a heating module; 501. a heating module; 5011. a coil support plate; 5012. a coil; 5013. and a coil power supply.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The present application will be further described with reference to the following drawings and examples.

Fig. 1 shows a schematic structural diagram of an SMT reflow oven heating structure provided in an exemplary embodiment of the present application, the SMT reflow oven heating structure includes a slide rail 1, a sliding platform 2, a PCB 3, a solder conveying mechanism 4, and a heating module 5, the sliding platform 2 is slidably connected to the slide rail 1, the PCB 3 is located on the sliding platform 2, and the solder conveying mechanism 4 is disposed above the PCB 3 in a matching manner;

the heating module 5 is located below the sliding platform 2, the heating module 5 includes at least two adjacent heating modules 501, and the at least two heating modules 501 are distributed along the sliding direction of the sliding platform 2 at equal intervals.

In the embodiment of the present application, the reflow oven is also called as a reflow oven, and the reflow oven process is to solder the mechanical and electrical connection between the soldering terminal or pin of the Surface mount device and the pad of the printed board by melting the paste-like solder distributed on the pad of the printed board, which is the last key process of SMT (Surface mount Technology), and is a real-time process control, the process variation of which is complex, and involves many process parameters, wherein the setting of the temperature curve is most important, and directly determines the quality of reflow soldering.

In the embodiment of the present application, the solder is melted by the heating of the heating module 5 and then bonded to the PCB 3 by the arrangement of the solder feeding mechanism 4.

In this application embodiment, replaced present widely used hot-blast technological means that comes the heating through setting up of heating module 5, heat more evenly, the temperature is more controllable, has avoided the PCB board to appear the board perk and the problem that discolours.

Fig. 2 shows a structural schematic diagram of a heating module of an SMT reflow oven heating structure provided in an exemplary embodiment of the present application, and the heating module 501 includes a coil support plate 5011, a coil 5012, and a coil power supply 5013, the coil 5012 is embedded in the coil support plate 5011, and the coil 5012 is electrically connected to the coil power supply 5013.

In the embodiment of the present application, the coil 5012 is energized to heat by the coil power supply 5013, the heating module 501 radiates heat, and the heating temperature of the coil 5012 is adjusted by controlling the output current of the coil power supply 5013.

In the embodiment of the present application, the coil support plate 5011 is used to carry the coil 5012, and optionally, the connection manner of the coil 5012 and the coil support plate 5011 includes, but is not limited to, one of welding, clamping, and gluing.

As an alternative embodiment, as shown in fig. 1, the heating powers of at least two heating modules 501 are gradually decreased along the sliding direction of the sliding platform 2.

In the embodiment of the application, the heating power of the at least two heating modules 501 is gradually decreased, so that the problems of warpage and color change of the PCB are avoided, and the PCB is more suitable for operation conditions.

Alternatively, in an example, where the heating power is adjusted to be embodied to be the same as 5012 turns, the input current of the coil power supply 5013 is sequentially decreased in the sliding direction of the sliding platform 2; in another example, adjusting the heating power is embodied such that the number of turns of the coil 5012 is sequentially increased in the sliding direction of the sliding table 2 with the same input current of the coil power supply 5013.

As an alternative embodiment, fig. 3 shows a schematic structural diagram of a coil of an SMT reflow oven heating structure provided by an exemplary embodiment of the present application, where the coil 5012 has a spiral shape with a wide top and a narrow bottom.

In the embodiment of the present application, by arranging the coil 5012 in a spiral shape with a wide top and a narrow bottom, the induction area of the coil 5012 is enlarged, and heating is more rapid and uniform.

As an alternative embodiment, the coil 5012 has at least ten turns.

In the embodiment of the present application, the number of turns of the coil 5012 is ten turns; in another example, the coil 5012 has twenty turns; in another example, the coil 5012 has thirty turns; optionally, the number of turns of the coil 5012 can be flexibly set according to the power range requirement of actual working conditions.

As an alternative embodiment, the coil power supply 5013 is an ac power supply.

As an alternative embodiment, as shown in fig. 1, the number of the heating modules 501 is three.

Alternatively, in another example, the number of heating modules 501 is four; in another example, the number of heating modules 501 is five; in another example, the number of heating modules 501 is six; alternatively, the number of the heating modules 501 may be flexibly arranged according to actual working condition requirements.

To sum up, the SMT reflow oven heating structure that this application provided has realized through setting up of a plurality of heating module that after the PCB board heating in the reflow oven process operation of actual production, has avoided the PCB board to appear the board and has perk and the problem that discolours, has improved the yield, and then has improved production efficiency.

The above is only the preferred embodiment of the present application, and it should be noted that: it will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the principles of the application, and such modifications and enhancements are intended to be included within the scope of the application.

Claims (6)

1. The heating structure of the SMT reflow oven is characterized by comprising a slide rail (1), a slide platform (2), a PCB (printed circuit board) board (3), a soldering tin conveying mechanism (4) and a heating module (5), wherein the slide platform (2) is connected to the slide rail (1) in a sliding mode, the PCB board (3) is located on the slide platform (2), and the soldering tin conveying mechanism (4) is arranged above the PCB board (3) in a matching mode;

the heating module (5) is positioned below the sliding platform (2), the heating module (5) comprises at least two adjacent heating modules (501), and the at least two heating modules (501) are uniformly distributed at intervals along the sliding direction of the sliding platform (2);

the heating module (501) comprises a coil supporting plate (5011), a coil (5012) and a coil power supply (5013), the coil (5012) is embedded in the coil supporting plate (5011), and the coil (5012) is electrically connected with the coil power supply (5013).

2. An SMT reflow oven heating structure according to claim 1, wherein heating powers of the at least two heating modules (501) are successively decreased in a sliding direction of the sliding platform (2).

3. An SMT reflow oven heating structure according to claim 1, wherein the coil (5012) is in a spiral shape with a wide top and a narrow bottom.

4. An SMT reflow oven heating structure according to claim 3, wherein the coil (5012) has at least ten turns.

5. An SMT reflow oven heating structure according to claim 1, wherein the coil power supply (5013) is an alternating current power supply.

6. An SMT reflow oven heating structure according to claim 1, wherein the number of heating modules (501) is three.

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