CN215933546U

CN215933546U - Spacing adjusting mechanism and row silicon wafer transfer mechanism

Info

Publication number: CN215933546U
Application number: CN202121467547.4U
Authority: CN
Inventors: 许明现; 谷士斌; 蔡涔; 张杜超; 洪昀; 胡林; 马胜涛
Original assignee: Dongfang Risheng Changzhou New Energy Co ltd
Current assignee: Dongfang Risheng Changzhou New Energy Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-03-01
Anticipated expiration: 2031-06-29

Abstract

The application relates to an interval adjustment mechanism and a row of silicon wafer transfer mechanism, wherein the interval adjustment mechanism comprises a fixed plate, a guide rail bracket, a plurality of object taking assemblies and a movable plate. The guide rail bracket is fixed on one side of the fixed plate; the guide rail bracket comprises a transverse guide rail and a vertical guide rail; the fetching component is movably arranged on the guide rail bracket and can move along the transverse guide rail; the movable plate is movably arranged on the guide rail bracket and can move along the vertical guide rail; the movable plate is provided with a plurality of strip-shaped guide holes extending along the vertical direction of the movable plate, and the guide holes are distributed in a fan-shaped divergence manner; get the thing subassembly and include the guide pillar that sets up towards the fly leaf, the guide pillar inserts in the guiding hole one-to-one to can remove along the guiding hole. The spacing adjusting mechanism can adjust the spacing of the silicon wafers in the transferring process, and greatly improves the transferring efficiency.

Description

Spacing adjusting mechanism and row silicon wafer transfer mechanism

Technical Field

The utility model relates to the technical field of solar cell production equipment, in particular to a spacing adjusting mechanism and a row of silicon wafer transferring mechanism.

Background

During the production of solar cells, the silicon wafers (the basic elements of the solar cells) usually need to be circulated between different processing stations. The silicon wafer is usually placed in a flower basket for a texturing process, and after the texturing process is completed, the silicon wafer needs to be transferred to a carrier plate for a film coating process, so that the silicon wafer needs to be transferred from the flower basket to the carrier plate. Generally, the silicon wafers are taken out from the basket, placed on a belt, conveyed by the belt, and then transferred onto a carrier plate by a transfer mechanism. However, the existing transfer mechanism usually cannot adjust the distance between the silicon wafers in the transfer process, so that the spacing between the mechanisms for grabbing the silicon wafers on the transfer mechanism needs to be adjusted when the carrier plates of different specifications are replaced, and the transfer efficiency of the silicon wafers is greatly reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a pitch adjustment structure and a row of wafer transfer mechanisms, which can adjust the pitch of wafers to be transferred and improve the transfer efficiency.

The present invention provides a pitch adjustment mechanism, comprising: fixed plate, guide rail bracket, a plurality of thing subassemblies and fly leaf of getting. The guide rail bracket is fixed on one side of the fixed plate; the guide rail bracket comprises a transverse guide rail and a vertical guide rail; the plurality of fetching assemblies are movably arranged on the guide rail bracket and can move along the transverse guide rail; the movable plate is movably arranged on the guide rail bracket and can move along the vertical guide rail; the movable plate is provided with a plurality of strip-shaped guide holes extending along the vertical direction of the movable plate, and the guide holes are distributed in a fan-shaped divergence manner; the fetching assembly comprises guide posts which are arranged towards the movable plate, the guide posts are inserted into the guide holes in a one-to-one correspondence mode, and the guide posts can move in the guide holes.

In one embodiment, the spacing adjustment mechanism further comprises a driving mechanism connected to the movable plate to drive the movable plate to move along the vertical guide rail.

In one embodiment, the driving mechanism includes a pitch adjustment motor, a lead screw and a lead screw nut, an output shaft of the pitch adjustment motor is connected with the lead screw to drive the lead screw to rotate, the lead screw nut is sleeved outside the lead screw and is in threaded fit with the lead screw, and the movable plate is fixedly connected with the lead screw nut.

In one embodiment, the driving mechanism further comprises a motor bracket and a coupler, the motor bracket is fixed on the fixing plate, the distance-adjusting motor is fixed on the motor bracket, and the coupler is arranged between an output shaft of the distance-adjusting motor and the lead screw and is connected with the output shaft of the distance-adjusting motor and the lead screw.

In one embodiment, the fetching component further includes a vertical rod, a transverse slider and a suction cup component, the transverse slider is fixed on one side of the vertical rod, the transverse slider is in sliding fit with the transverse guide rail, the guide pillar is arranged on one side of the vertical rod, which is far away from the transverse slider, and the suction cup component is arranged at one end of the vertical rod, which is close to the lower side.

In one embodiment, the guide column is sleeved with a guide sleeve, and the guide sleeve is made of a metal material.

In one embodiment, the movable plate is fixedly connected with a vertical sliding block, and the vertical sliding block is in sliding fit with the vertical guide rail.

The utility model also provides a row of silicon wafer transfer mechanism which comprises a translation mechanism, a vertical movement mechanism and the distance adjusting mechanism, wherein the vertical movement mechanism is arranged on the translation mechanism, the distance adjusting mechanism is arranged on the vertical movement mechanism, the translation mechanism can drive the distance adjusting mechanism to move in the horizontal direction, and the vertical movement mechanism can drive the distance adjusting mechanism to move in the vertical direction.

In one embodiment, the translation mechanism includes a first motor, a first linear guide and a first slider, the first linear guide is disposed along a horizontal direction and is disposed at one end of the first motor, the first slider is movably disposed on the first linear guide, the first motor can control the first slider to move along the first linear guide, and the vertical movement mechanism is disposed on the first slider.

In one embodiment, the vertical movement mechanism includes a second motor, a second linear guide rail and a second slider, the second linear guide rail is disposed along a vertical direction and is disposed at one end of the second motor, the second slider is movably disposed on the second linear guide rail, the second motor can control the second slider to move along the second linear guide rail, and the distance adjustment mechanism is disposed on the second slider.

According to the spacing adjusting mechanism and the row of silicon wafer transferring mechanisms provided by the utility model, as the spacing adjusting mechanism comprises the fixed plate and the movable plate, the movable plate is provided with a plurality of strip-shaped guide holes extending along the vertical direction of the movable plate, and the guide holes are distributed in a fan-shaped dispersing manner, the guide posts can move along the guide holes by moving the movable plate along the vertical guide rail, so that the fetching assemblies can move along the transverse guide rail, and the spacing among a plurality of fetching assemblies can be adjusted, namely the spacing of the silicon wafers transferred on the fetching assemblies can be adjusted. Therefore, the distance adjusting mechanism can adjust the distance of the moved silicon wafers in the moving process, the silicon wafers can be conveniently moved to the support plates with different specifications, the operation is very convenient, and the moving efficiency of the silicon wafers is greatly improved.

Drawings

Fig. 1 is a schematic view of an application scenario of a row of silicon wafer transfer mechanisms according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a row of silicon wafer transfer mechanisms according to an embodiment of the present invention;

FIG. 3 is a schematic view of another angle of the row of silicon wafer transfer mechanisms shown in FIG. 2;

FIG. 4 is a schematic structural diagram of a spacing adjustment mechanism according to an embodiment of the present invention;

FIG. 5 is an exploded view of the spacing adjustment mechanism of FIG. 4;

FIG. 6 is a side view of the spacing adjustment mechanism of FIG. 4;

FIG. 7 is another side elevational view of the spacing adjustment mechanism illustrated in FIG. 4;

FIG. 8 is a cross-sectional view taken along line B-B of FIG. 7;

fig. 9 is a partial enlarged view of a portion a in fig. 8.

Reference numerals: 100. a translation mechanism; 110. a first motor; 120. a first linear guide rail; 130. a first slider; 200. a vertical movement mechanism; 210. a second motor; 220. a second linear guide; 230. a second slider; 300. a spacing adjustment mechanism; 310. a fixing plate; 311. hollowing out holes; 320. a movable plate; 321. a guide hole; 322. a vertical slide block; 330. a rail bracket; 331. a transverse guide rail; 332. a vertical guide rail; 340. a fetching component; 341. a guide post; 3411. a guide sleeve; 342. erecting a rod; 343. a transverse slide block; 344. a sucker component; 3441. a sucker fixing plate; 3442. a suction cup; 350. a drive mechanism; 351. a distance-adjusting motor; 352. a lead screw; 353. a lead screw nut; 3531. a connecting arm; 354. a motor bracket; 355. a coupling; 800. a platform; 900. and a carrier plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, the present invention provides a row of silicon wafer transfer mechanisms, including a translation mechanism 100, a vertical movement mechanism 200, and a spacing adjustment mechanism 300. The vertical movement mechanism 200 is disposed on the translation mechanism 100, and the interval adjustment mechanism 300 is disposed on the vertical movement mechanism 200. The translation mechanism 100 can drive the distance adjusting mechanism 300 to move in the horizontal direction, and the vertical movement mechanism 200 can drive the distance adjusting mechanism 300 to move in the vertical direction. The row of silicon wafer transfer mechanisms acquire the silicon wafers through the spacing adjusting mechanisms 300, and the silicon wafers can be moved from one station to another station by driving the spacing adjusting mechanisms 300 through the translation mechanisms 100 and the vertical movement mechanisms 200. As shown in fig. 1, the row of wafer transfer mechanisms can move the wafers from the platform 800 to the carrier plate 900.

In one embodiment, the translation mechanism 100 includes a first motor 110, a first linear guide 120, and a first slider 130. The first linear guide 120 is disposed along a horizontal direction and at one end of the first motor 110. The first slider 130 is movably disposed on the first linear guide 120. The first motor 110 can control the first slider 130 to move along the first linear guide 120. The vertical movement mechanism 200 is disposed on the first slider 130, so that the first slider 130 can move along the first linear guide 120 with the vertical movement mechanism 200 and the interval adjustment mechanism 300 disposed on the vertical movement mechanism 200. In the embodiment, the first motor 110 is used for moving the first slider 130, the moving position can be accurately controlled, and the moving efficiency is high.

The vertical movement mechanism 200 includes a second motor 210, a second linear guide 220, and a second slider 230. The second linear guide 220 is disposed along a vertical direction and is disposed at one end of the second motor 210. The second sliding block 230 is movably disposed on the second linear guide 220. The second motor 210 can control the second slider 230 to move along the second linear guide 220. The spacing adjustment mechanism 300 is disposed on the second slider 230 such that the second slider 230 can move along the second linear guide 220 with the spacing adjustment mechanism 300 as a whole. In the embodiment, the second motor 210 is used to move the second slider 230, the position of the movement can be precisely controlled, and the movement efficiency is high.

Referring to fig. 4 to 9, the spacing adjustment mechanism 300 includes a fixed plate 310, a movable plate 320, a rail bracket 330, and a plurality of picking assemblies 340. The rail housing 330 is fixed to one side of the fixing plate 310. The rail bracket 330 includes a lateral rail 331 and a vertical rail 332. The transverse rail 331 and the vertical rail 332 are perpendicular to each other, and in this embodiment, the transverse rail 331 is disposed in a horizontal direction, and the vertical rail 332 is disposed in a vertical direction. In this embodiment, the rail bracket 330 includes two vertical rails 332 and two horizontal rails 331, the two horizontal rails 331 are disposed in parallel, and two ends of the horizontal rail 331 are connected to the two vertical rails 332 respectively. In this way, the rail brackets 330 form a stable structure.

The plurality of picking assemblies 340 are movably disposed on the rail bracket 330, and the picking assemblies 340 can move along the transverse rail 331. Each of the picking assemblies 340 is configured to respectively pick up a silicon wafer, and the plurality of picking assemblies 340 can adjust the distance between the plurality of picking assemblies 340 by moving along the transverse rail 331, thereby adjusting the distance between the transferred silicon wafers.

The movable plate 320 is movably disposed on the rail bracket 330, and the movable plate 320 can move along the vertical rail 332. The movable plate 320 is provided with a plurality of strip-shaped guide holes 321 extending along the vertical direction of the movable plate 320, and the plurality of guide holes 321 are distributed in a fan-shaped manner. The fetching assembly 340 includes guide pillars 341 disposed toward the movable plate 320, and the guide pillars 341 are inserted into the guide holes 321 in a one-to-one correspondence, and can move in the guide holes 321. Thus, the movable plate 320 moves along the vertical guide rail 332, so that the guide post 341 moves along the guide hole 321, and the picking assembly 340 moves along the transverse guide rail 331, so that the distance between the picking assemblies 340, that is, the distance between the silicon wafers transferred on the picking assemblies 340, can be adjusted. Therefore, the spacing adjustment mechanism 300 can adjust the spacing of the silicon wafers to be transferred in the transferring process, so that the silicon wafers can be conveniently transferred to the carrier plates 900 with different specifications, and the transferring efficiency of the silicon wafers is greatly improved.

The spacing adjustment mechanism 300 further includes a driving mechanism 350, the driving mechanism 350 being connected to the movable plate 320 to drive the movable plate 320 to move along the vertical rail 332. The driving mechanism 350 can control the movement of the movable plate 320, so as to prevent the movable plate 320 from unnecessarily moving due to its own weight or external impact.

In one embodiment, the driving mechanism 350 includes a pitch motor 351, a lead screw 352, and a lead screw nut 353. An output shaft of the pitch motor 351 is connected to the lead screw 352 to drive the lead screw 352 to rotate. The lead screw nut 353 is sleeved outside the lead screw 352 and is in threaded fit with the lead screw 352, and the movable plate 320 is fixedly connected with the lead screw nut 353. Thus, the distance adjustment motor 351 can drive the screw 352 to rotate, and the screw 352 rotates to drive the screw nut 353 to move along the screw 352, so that the screw nut 353 drives the movable plate 320 to move along the vertical guide rail 332. Since the vertical guide rail 332 is disposed in the vertical direction, the lead screw 352 is also disposed in the vertical direction. Further, a connecting arm 3531 extends from the screw nut 353 towards one side, and the screw nut 353 is connected with the movable plate 320 through the connecting arm 3531. Further, the screw nut 353 is connected to the movable plate 320 through a screw, so that the installation and the detachment are very convenient.

The driving mechanism 350 further includes a motor bracket 354 and a coupling 355, wherein the motor bracket 354 is fixed to the fixing plate 310, and the pitch motor 351 is fixed to the motor bracket 354. The coupling 355 is provided between the output shaft of the pitch motor 351 and the screw shaft 352 and connects the output shaft of the pitch motor 351 and the screw shaft 352. The motor support 354 is arranged to support the distance adjusting motor 351, so that the distance adjusting motor 351 is convenient to mount. The arrangement of the coupling 355 facilitates the connection between the output shaft of the pitch motor 351 and the lead screw 352, and realizes the transmission of the torque force to the output shaft of the pitch motor 351.

The movable plate 320 is fixedly connected with a vertical slider 322, the vertical slider 322 is in sliding fit with the vertical guide rail 332, and thus, the movable plate 320 moves more smoothly along the vertical guide rail 332. The vertical sliding block 322 can be connected with the movable plate 320 through screws, and is very convenient to mount and dismount.

The rail bracket 330 is disposed between the fixed plate 310 and the movable plate 320, and the rail bracket 330 may be mounted on the fixed plate 310 by screws, so that it is very convenient to mount and dismount. In order to reduce the weight of the interval adjustment mechanism 300, the fixed plate 310 and the movable plate 320 may be provided with a hollow hole 311, so that the overall weight of the interval adjustment mechanism 300 may be reduced, thereby making it easier to control the movement of the interval adjustment mechanism 300.

The fetching component 340 is disposed on the rail bracket 330, and the fetching component 340 further includes a vertical rod 342, a transverse sliding block 343, and a suction cup component 344. The transverse slider 343 is fixed on one side of the upright 342, and the transverse slider 343 is slidably engaged with the transverse rail 331. In this way, the picking assembly 340 moves more smoothly along the cross rail 331. The transverse sliding block 343 can be connected with the vertical rod 342 through screws, and is very convenient to mount and dismount. In this embodiment, two transverse sliding blocks 343 are disposed on the vertical rod 342, and the two transverse sliding blocks 343 are respectively matched with the two transverse guide rails 331, so that the fetching assembly 340 can move more stably. The guide post 341 is disposed on the side of the vertical rod 342 departing from the lateral slider 343, and the suction cup assembly 344 is disposed at the lower end of the vertical rod 342, so that the suction cup assembly 344 can suck the silicon wafer conveniently. In this embodiment, the suction cup assembly 344 and the lateral slider 343 are disposed on the same side of the upright 342. The suction cup assembly 344 includes a suction cup fixing plate 3441 and a plurality of suction cups 3442 disposed on the suction cup fixing plate 3441, the suction cup fixing plate 3441 is fixed to the lower end of the upright 342. In this embodiment, four suction cups 3442 are disposed on one suction cup fixing plate 3441, so that four corners of the silicon wafer can be sucked, which is beneficial for the suction cups 3442 to suck the silicon wafer evenly and stably.

In one embodiment, as shown in fig. 9, a guide sleeve 3411 is sleeved on the guide pillar 341, and the guide sleeve 3411 is made of a metal material. Thus, the wear resistance of the guide pillar 341 is improved, so that the guide pillar 341 is not easily worn. When the guide sleeve 3411 is worn out, the guide sleeve 3411 may be replaced without replacing the entire guide post 341. Further, the guide sleeve 3411 may be made of a stainless steel material, so that the wear resistance is good, and the price is low. In this embodiment, the guide post 341 is a screw, and can be easily mounted on the upright 342, and the guide sleeve 3411 can be easily sleeved on the outer side thereof.

In summary, the row of silicon wafer transferring mechanisms provided by the present invention can adjust the distance between the transferred silicon wafers by the distance adjusting mechanism 300 during the silicon wafer transferring process, so that the silicon wafers can be moved to the carrier plates 900 with different specifications, the operation is very convenient, and the silicon wafer transferring efficiency is greatly improved.

The row of silicon wafer transfer mechanism can be used for transferring silicon wafers from the platform 800 to the carrier plate 900, the spacing of the silicon wafers can be adjusted in the moving process, and the transfer efficiency is high. In order to further improve the efficiency, two rows of silicon wafer transferring mechanisms may be provided, and the two rows of silicon wafer transferring mechanisms transfer the silicon wafers onto the same carrier board 900 from the platforms 800 on both sides, as shown in fig. 1, so that the transferring efficiency is greatly increased.

The features of the above-described embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above-described embodiments are not described, but should be construed as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Claims

1. A spacing adjustment mechanism, comprising:

a fixing plate (310);

a rail bracket (330) fixed to one side of the fixing plate (310); the rail bracket (330) comprises a transverse rail (331) and a vertical rail (332);

a plurality of fetching assemblies (340) movably arranged on the guide rail bracket (330), wherein the fetching assemblies (340) can move along the transverse guide rail (331); and

the movable plate (320) is movably arranged on the guide rail bracket (330), and the movable plate (320) can move along the vertical guide rail (332);

the movable plate (320) is provided with a plurality of strip-shaped guide holes (321) extending along the vertical direction of the movable plate (320), and the guide holes (321) are distributed in a fan-shaped divergence manner;

the fetching assembly (340) comprises guide posts (341) arranged towards the movable plate (320), and the guide posts (341) are inserted into the guide holes (321) in a one-to-one correspondence manner and can move in the guide holes (321).

2. The spacing adjustment mechanism according to claim 1, further comprising a drive mechanism (350), said drive mechanism (350) being connected to said movable plate (320) to drive said movable plate (320) to move along said vertical rail (332).

3. The spacing adjustment mechanism according to claim 2, wherein the driving mechanism (350) comprises a distance adjustment motor (351), a lead screw (352) and a lead screw nut (353), an output shaft of the distance adjustment motor (351) is connected with the lead screw (352) to drive the lead screw (352) to rotate, the lead screw nut (353) is sleeved outside the lead screw (352) and is in threaded fit with the lead screw (352), and the movable plate (320) is fixedly connected with the lead screw nut (353).

4. The spacing adjustment mechanism according to claim 3, wherein said driving mechanism (350) further comprises a motor bracket (354) and a coupling (355), said motor bracket (354) is fixed to said fixing plate (310), said distance adjustment motor (351) is fixed to said motor bracket (354), said coupling (355) is provided between and connects an output shaft of said distance adjustment motor (351) and said lead screw (352).

5. The spacing adjustment mechanism according to claim 1, wherein the picking assembly (340) further comprises a vertical rod (342), a lateral slider (343), and a suction cup assembly (344), the lateral slider (343) is fixed to one side of the vertical rod (342), the lateral slider (343) is slidably engaged with the lateral guide rail (331), the guide post (341) is disposed on one side of the vertical rod (342) facing away from the lateral slider (343), and the suction cup assembly (344) is disposed at one end of the vertical rod (342) below.

6. The spacing adjustment mechanism according to claim 1, wherein a guide sleeve (3411) is sleeved around the guide post (341), and the guide sleeve (3411) is made of a metal material.

7. The spacing adjustment mechanism according to claim 1, characterized in that a vertical slider (322) is fixedly connected to the movable plate (320), the vertical slider (322) being in sliding engagement with the vertical guide rail (332).

8. A row of silicon wafer transfer mechanism, comprising a translation mechanism (100), a vertical movement mechanism (200) and the distance adjusting mechanism (300) according to any one of claims 1 to 7, wherein the vertical movement mechanism (200) is disposed on the translation mechanism (100), the distance adjusting mechanism (300) is disposed on the vertical movement mechanism (200), the translation mechanism (100) can drive the distance adjusting mechanism (300) to move in the horizontal direction, and the vertical movement mechanism (200) can drive the distance adjusting mechanism (300) to move in the vertical direction.

9. The silicon wafer transfer mechanism of claim 8, wherein the translation mechanism (100) comprises a first motor (110), a first linear guide (120), and a first slider (130), the first linear guide (120) is disposed along a horizontal direction and is disposed at one end of the first motor (110), the first slider (130) is movably disposed on the first linear guide (120), the first motor (110) can control the first slider (130) to move along the first linear guide (120), and the vertical movement mechanism (200) is disposed on the first slider (130).

10. The silicon wafer transfer mechanism of claim 8, wherein the vertical movement mechanism (200) comprises a second motor (210), a second linear guide (220), and a second slider (230), the second linear guide (220) is disposed along a vertical direction and is disposed at one end of the second motor (210), the second slider (230) is movably disposed on the second linear guide (220), the second motor (210) can control the second slider (230) to move along the second linear guide (220), and the spacing adjustment mechanism (300) is disposed on the second slider (230).