CN215920954U

CN215920954U - Cutting disc device

Info

Publication number: CN215920954U
Application number: CN202121369189.3U
Authority: CN
Inventors: 方欣
Original assignee: Wuxi China Resources Micro Assembly Tech Ltd
Current assignee: Wuxi China Resources Micro Assembly Tech Ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2022-03-01
Anticipated expiration: 2031-06-18

Abstract

The application provides a cutting disk device. The cutting disc device comprises a cutting disc base and a flexible cutting disc arranged on the cutting disc base; the surface of the cutting disc base, which is far away from the flexible cutting disc, is provided with an inwards concave air storage chamber, and the flexible cutting disc is provided with an air flow channel which is communicated with the air storage chamber. In the cutting disc device, the air storage chamber is arranged in the cutting disc base, so that the vacuum air storage capacity of the cutting disc device is improved, the uniformity and stability of the vacuum suction force of the cutting disc device are improved, and the cutting quality is improved.

Description

Cutting disc device

Technical Field

The application relates to the technical field of semiconductors, in particular to a cutting disc device.

Background

In the semiconductor product manufacturing process, a semiconductor package structure formed by a plurality of semiconductor units needs to be cut to form individual semiconductor products. The semiconductor packaging structure is cut by a special cutting disc and corresponding cutting equipment. The performance of the cutting disc directly affects the cutting effect.

SUMMERY OF THE UTILITY MODEL

The application provides a cutting disc device which comprises a cutting disc base and a flexible cutting disc arranged on the cutting disc base; the surface of the cutting disc base, which is far away from the flexible cutting disc, is provided with an inwards concave air storage chamber, and the flexible cutting disc is provided with an air flow channel which is communicated with the air storage chamber.

In some embodiments, the flexible cutting disk has a plurality of spaced adsorption units, each adsorption unit includes a plurality of airflow channels, and a plurality of spaced air reservoirs corresponding to the adsorption units are formed on a surface of the cutting disk base away from the flexible cutting disk.

In some embodiments, the cutting disc device further includes a cover plate, the cover plate has a plurality of abdicating areas, the cover plate covers the flexible cutting disc, and the adsorption unit of the flexible cutting disc protrudes from the abdicating areas to one side of the cover plate far away from the base of the cutting disc.

In some embodiments, the cover plate is detachably assembled to the cutting disk base.

In some embodiments, the cover plate includes a cover plate main body and a first connecting portion extending from the cover plate main body to a side of the cutting disk base, the cutting disk base is provided with a second connecting portion for cooperating with the first connecting portion, and the cover plate is fixed to the cutting disk base by cooperation of the first connecting portion and the second connecting portion.

In some embodiments, the first connection portion comprises a boss structure and the second connection portion comprises a recess structure capable of mating with the boss structure.

In some embodiments, a first mounting hole is formed in one side of the boss structure facing the cutting disc base, a second mounting hole penetrating through the cutting disc base is formed in the bottom of the recessed structure, and the cutting disc device includes a connecting piece which is arranged in the first mounting hole and the second mounting hole in a penetrating mode.

In some embodiments, the cross-section of the boss structure is rectangular, and the shape of the recess structure is consistent with the shape of the boss structure.

In some embodiments, a plurality of first connecting portions are uniformly arranged on two opposite sides of the cover plate main body, and a plurality of corresponding second connecting portions are uniformly arranged on two opposite sides of the cutting disk base.

In some embodiments, the cutting disc apparatus further comprises an evacuation device in communication with the air reservoir from a side of the air reservoir remote from the flexible cutting disc.

The above-mentioned cutting dish device that this application embodiment provided, through set up the gas receiver in the cutting dish base, be favorable to promoting the vacuum gas storage ability of cutting dish device, improve the homogeneity and the stability of cutting dish device vacuum suction, improve the cutting quality.

Drawings

Fig. 1 is an exploded perspective view of a cutting disk apparatus according to an exemplary embodiment of the present application;

FIG. 2 is a schematic structural diagram of a base of a cutting disk in accordance with an exemplary embodiment of the present application;

FIG. 3 is a schematic structural diagram of a flexible cutting disk in accordance with an exemplary embodiment of the present application;

fig. 4 is a schematic structural diagram of a cover plate according to an exemplary embodiment of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" means two or more. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper" and/or "lower," and the like, are used for convenience of description and are not limited to a single position or orientation in space. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

The application provides a cutting disk device is favorable to improving cutting disk device's performance, improves the cutting quality of semiconductor product. The cutting disc device can be used for cutting a semiconductor package body to form an independent semiconductor package product, such as cutting a Quad Flat No-lead package (QFN) structure. During cutting, the semiconductor packaging structure is placed and fixed on the cutting disc device.

Fig. 1 is an exploded perspective view of a cutting disk device according to an exemplary embodiment of the present application. Fig. 2 is a schematic structural diagram of a cutting disk base 10 according to an exemplary embodiment of the present application. Fig. 3 is a schematic structural diagram of a flexible cutting disk according to an exemplary embodiment of the present application. Fig. 4 is a schematic structural diagram of a cover plate according to an exemplary embodiment of the present application.

Referring to fig. 1, and as necessary with reference to fig. 2 to 4, the cutting disc device includes a cutting disc base 10 and a flexible cutting disc 20 disposed on the cutting disc base 10. The surface of the cutting disk base 10 far away from the flexible cutting disk 20 is formed with an inwards concave air storage chamber 101, and the flexible cutting disk 20 is provided with an air flow channel which is communicated with the air storage chamber 101.

The material of the flexible cutting disc may be rubber or other flexible materials capable of providing an air flow channel, which is not limited in the present application.

According to the cutting disc device, the air storage chamber is arranged in the cutting disc base, so that the vacuum air storage capacity of the cutting disc device is improved, the uniformity and stability of the vacuum suction force of the cutting disc device are improved, and the cutting quality is improved.

The cutting disc device further comprises a vacuumizing device, and the vacuumizing device is communicated with the air storage chamber from one side, far away from the flexible cutting disc, of the air storage chamber 101.

Specifically, in the use process of the cutting disc device, the semiconductor packaging structure is placed on the flexible cutting disc 20, and the lower surface of the semiconductor packaging structure is vacuumized through the vacuumizing device, so that the semiconductor packaging structure is adsorbed on the flexible cutting disc 20.

In some embodiments, the flexible cutting disk 20 includes a cutting disk body 201, the cutting disk body 201 has a plurality of spaced apart suction units 202 formed thereon, and each suction unit 202 includes a plurality of airflow channels. Adjacent two adsorption units 202 have a lateral spacing region 2011 therebetween. The spaced area 2011 may be a portion of the cutting disk body 201. The outer end of the duct forming the air flow channel (i.e. the end far away from the cutting disk base 10) protrudes from the surface of the cutting disk main body 201 so as to adsorb the semiconductor package structure. In specific implementation, each semiconductor unit included in the semiconductor package structure is correspondingly attached to one of the attaching units 202.

In some embodiments, the lower surface of the cutting disk base 10 is formed with a plurality of spaced air reservoirs 101 corresponding to the plurality of adsorption units 202 one to one, respectively, so as to facilitate vacuum pumping and make the vacuum suction force more uniform.

It should be noted that, in some other embodiments, there may be one air storage chamber, which is not limited in this application and may be set according to specific situations.

Further, in some embodiments, the cutting disk apparatus also includes a cover plate 30. The cover plate 30 has a plurality of relief areas 300. The cover plate 30 covers the flexible dicing sheet 20, each of the suction units 202 of the flexible dicing sheet 20 corresponds to one of the abdicating areas 300, and the suction units 202 can protrude from the abdicating areas 300 at a side of the cover plate 30 far away from the dicing sheet base 10 so as to suck the semiconductor package structure.

Optionally, in some embodiments, the cover plate 30 is made of stainless steel.

The cover plate 30 includes a cover plate main body. The cover main body has a frame 301 and a plurality of cross members 302 disposed within the frame 301. The frame 301 and the beam 302 together form a plurality of yield areas 300. When the cover plate 30 covers the flexible cutting disc 20, each beam 302 covers the spacing area 2011 correspondingly, the frame 301 covers other areas of the cutting disc main body 201, and the flexible suction unit 202 protrudes from the abdicating area 300 at a side of the cover plate 30 away from the cutting disc base 10.

In some embodiments, the cover plate 30 is detachably assembled to the cutting disc base 10, so as to fix the flexible cutting disc 20 on the cutting disc base 10, which facilitates the detachment, maintenance, replacement, and the like of the cover plate 30 and the flexible cutting disc 20, and is beneficial to improving the service life of the cutting disc device and saving the cost. And for fixed cutting disk device, be favorable to improving the condition that the cut mark is more because long-term the use leads to, be favorable to improving the accuracy of cutting effect and height finding.

It should be noted that the size of the flexible cutting disk 20 is smaller than the cutting disk base 10 and smaller than the cover 30. The cover plate 30 is sized slightly larger than the cutting disk base 10 or is sized to correspond to the cutting disk base 10. So, when apron 30 assembles on cutting disc base 10, apron 30 can cover completely on the surface of cutting disc base 10, and the cutting disc main part 201 of flexible cutting disc can be fixed in between apron 30 and the cutting disc base 10 for apron 30 can play better height finding electrically conductive effect, improves the accuracy of height finding. And the provision of the cover plate 30 facilitates protection of the flexible cutting disc.

In some embodiments, the cover plate 30 includes a first connection portion extending from the cover plate body to a side of the cutting disk base 10. Correspondingly, the cutting disk base 10 is provided with a second connecting portion for matching with the first connecting portion, and the cover plate 30 is fixed on the cutting disk base 10 through the matching of the first connecting portion and the second connecting portion.

Referring to fig. 2 and 4, in some embodiments, the first connecting portion includes a boss structure 303, and the second connecting portion includes a recess structure 103 capable of cooperating with the boss structure 303.

The side of the boss structure 303 facing the cutting disk base 10 is provided with a first mounting hole 304. The bottom of the concave structure 103 is provided with a second mounting hole 104 penetrating through the cutting disk base 10. The cutting disk device further comprises a connecting piece 40, wherein the connecting piece 40 is arranged in the first mounting hole 304 and the second mounting hole 104 in a penetrating mode so as to fixedly assemble the cover plate 30 and the cutting disk base 10. The opening of the first mounting hole 304 faces the cutting disc base 10, so that the cutting waste is conveniently washed away, the problems that the cutting waste is rolled on a cutter of cutting equipment due to the fact that the cutting waste is clamped to the mounting hole, the cutter of a cutting blade is broken, the surface of a product is scratched and the like are solved, and the quality of a semiconductor product is improved.

In some embodiments, the cross section of the protruding structure 303 is rectangular, the shape of the recessed structure 103 is consistent with the shape of the protruding structure 303, and in the side wall forming the recessed structure 103, every two adjacent side edges are perpendicular to each other, such as the recessed structure 103 shown in fig. 1, so as to facilitate the matching and assembly of the protruding structure 303 and the recessed structure 103, and facilitate the position limitation between the two, prevent the cover plate 30 from moving relative to the cutting disc base 10, and ensure the position fixation of the cutting disc 20, thereby ensuring the accuracy of the cutting of the semiconductor package structure.

Further, in some embodiments, two opposite sides of the cover plate main body are uniformly provided with a plurality of first connecting portions, and two opposite sides of the cutting disc base 10 are uniformly provided with a plurality of corresponding second connecting portions, so that the cover plate 30 and the cutting disc base 10 are more stable and firmer to be matched. Referring to fig. 2 and 4, a plurality of boss structures 303 are uniformly disposed on two opposite sides of the cover plate main body, and a plurality of corresponding recess structures 103 are uniformly disposed on two opposite sides of the cutting disc base 10. Specifically, the boss structure 303 is disposed on the frame 301.

It should be noted that, in other embodiments, the flexible cutting disk may also be fixed on the cutting disk base through other fixing structures or adhesive materials, which is not limited in this application and may be set according to specific situations.

In the present application, the structural embodiments and the method embodiments may be complementary to each other without conflict.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A cutting disc device is characterized by comprising a cutting disc base and a flexible cutting disc arranged on the cutting disc base; the surface of the cutting disc base, which is far away from the flexible cutting disc, is provided with an inwards concave air storage chamber, and the flexible cutting disc is provided with an air flow channel which is communicated with the air storage chamber.

2. The cutting disk apparatus as claimed in claim 1, wherein said flexible cutting disk has a plurality of spaced suction units, each of said suction units including a plurality of air flow passages, and a surface of said cutting disk base remote from said flexible cutting disk is formed with a plurality of spaced air reservoirs corresponding to a respective one of said plurality of suction units.

3. The cutting disk apparatus of claim 2, further comprising a cover plate, the cover plate having a plurality of relief areas, the cover plate overlying the flexible cutting disk, and the suction units of the flexible cutting disk protruding from the relief areas to a side of the cover plate away from the base of the cutting disk.

4. The cutting disk apparatus of claim 3 wherein said cover is removably assembled to said cutting disk base.

5. The cutting disk apparatus as claimed in claim 4, wherein said cover plate includes a cover plate main body and a first connecting portion extending from said cover plate main body to a side of said cutting disk base, said cutting disk base is provided with a second connecting portion for engaging with said first connecting portion, and said cover plate is fixed to said cutting disk base by engaging with said first connecting portion and said second connecting portion.

6. The cutting disk apparatus of claim 5 wherein said first connection portion includes a boss formation and said second connection portion includes a recess formation engageable with said boss formation.

7. The cutting disk apparatus as claimed in claim 6, wherein a first mounting hole is opened on a side of said boss structure facing said cutting disk base, a second mounting hole is opened on a bottom of said recess structure, and said cutting disk apparatus includes a connecting member inserted into said first mounting hole and said second mounting hole.

8. The cutting disk apparatus of claim 6 wherein said raised formation is rectangular in cross-section and said recessed formation conforms to the shape of said raised formation.

9. The cutting disk assembly of claim 5 wherein said cover body has a plurality of first attachment portions disposed uniformly on opposite sides thereof and said cutting disk base has a plurality of corresponding second attachment portions disposed uniformly on opposite sides thereof.

10. The cutting disk assembly of claim 1 further comprising an evacuation assembly in communication with said air reservoir from a side of said air reservoir remote from said flexible cutting disk.