CN215911169U

CN215911169U - Display panel, display screen and electronic equipment

Info

Publication number: CN215911169U
Application number: CN202121481222.1U
Authority: CN
Inventors: 李灵芝; 韩钢峰; 贾卫波; 李杰威
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2022-02-25
Anticipated expiration: 2031-06-30
Also published as: WO2023273470A1

Abstract

The embodiment of the application provides a display panel, a display screen and electronic equipment, relates to the electronic equipment field, can reduce the module thickness of display screen, simplifies the structural industrial design of product. The display panel includes: the display device comprises a display area and a non-display area positioned around the display area, wherein the non-display area is provided with a peripheral circuit, and the display area is provided with pixel units distributed in an array; wherein, on the non-display area, a light sensor is arranged between the display area and the peripheral circuit; the light sensor includes a plurality of first light sensing devices extending along a boundary between the display area and the peripheral circuit.

Description

Display panel, display screen and electronic equipment

Technical Field

The application relates to the field of electronic equipment, in particular to a display panel, a display screen and electronic equipment.

Background

At present, electronic equipment such as intelligent wrist-watch, intelligent bracelet, cell-phone have the ambient light detection function usually, and wherein one of the main applications of ambient light detection function is through detecting ambient light brightness, realizes the automatically regulated to screen brightness, lets the user have fine experience. The ambient light detection function is also used in light intensity detection, touch control, and other scenarios.

While ambient light detection relies primarily on placing a light sensor (e.g., an ambient light sensor, ALS) below the display panel of the electronic device. Generally, the ALS is placed below the display panel, and light in the environment can be received by the ALS through a View Area (VA) of a cover plate on the display panel and a display area (active area, AA) of the display panel, thereby performing ambient light detection.

However, the ALS needs to be disposed below the display panel, which results in a high thickness of the module.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a display panel, a display screen and electronic equipment, can reduce the module thickness of display screen, simplify the structural industrial design of product.

In a first aspect, a display panel is provided. The display panel includes: a display area AA and a non-display area NA located around the display area; the display panel can be circular, and can also be other specially-shaped display panels such as a polygon and an ellipse; the non-display area NA is provided with a peripheral circuit, and the display area AA is provided with pixel units distributed in an array manner; wherein, on the non-display area NA, a light sensor is arranged between the display area AA and the peripheral circuit; the light sensor includes a plurality of first light sensing devices extending along a boundary between the display area and the peripheral circuit. In this scheme, owing to integrated on display panel with light sensor, consequently when this display panel is assembled for the display screen, can reduce the module thickness of display screen, and then reduce the product thickness of the electronic equipment who uses this display screen. In addition, the light can directly reach the optical sensor on the display panel after passing through the cover plate of the display screen, and does not reach the optical sensor after passing through the display panel, so the requirement on the sensitivity of the optical sensor is reduced, and because a plurality of photosensitive devices of the optical sensor are arranged on the display panel in a manner of extending and distributing along the boundary line between the display area AA and the peripheral circuit, no special requirement is made on the industrial design of the cover plate for protecting the display panel and the shading ink layer, for example, the cover plate for protecting the display panel is usually arranged on the display panel, and the shading ink layer for shading the non-display area of the display panel is usually arranged between the display panel and the cover plate for the sake of beautiful appearance, and the optical sensor cannot be arranged in the display area in order to reduce the influence of the optical sensor on the aperture ratio of the display panel, however, if the optical sensor is arranged in the non-display area, the shape of the shading ink layer is generally required to be correspondingly coupled and designed so as to remove the shading ink layer of the optical sensor or design the shading ink layer as an ink material for filtering specified light wave bands, so that the requirement of coupling alignment precision of the shading ink layer and the optical sensor is improved, and the appearance industrial design of a product is influenced. However, there is a gap between the shading ink layer and the display area of the display panel, so that when the cover plate is disposed, only a plurality of photosensitive devices extending and distributed along the boundary between the display area AA and the peripheral circuit need to be exposed from the gap, and a special shape for disposing the shading ink layer is not needed.

In a possible implementation manner, a cover plate is arranged on the display panel, wherein a shading ink layer is arranged between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the first photosensitive devices are distributed between the projection area and the display area of the shading ink layer on the display panel. Like this, because a plurality of first photosensitive devices distribute in visual zone VA, visual zone VA is not sheltered from by the shading printing ink layer, therefore ambient light can shine a plurality of first photosensitive devices through the apron to realize the detection of ambient light.

In one possible implementation manner, a cover plate is arranged on the display panel, wherein a filtering ink layer is arranged between the cover plate and the display panel; the filtering ink layer covers the area between the display area and the peripheral circuit, and absorbs light rays in an ultraviolet light wave band. Because the filtering ink layer absorbs the light in the ultraviolet light band, the light in the ultraviolet light band in the ambient light will be absorbed, and the light penetrating through the filtering ink layer may include the light in the visible light band (for example, the wavelength range of 400nm to 700 nm) and the light in other light bands (for example, the infrared light band), so that the detection of the light in the visible light band and the light in other light bands in the ambient light can be realized. The filtering ink layer can be arranged for a circle along the area between the display area AA and the peripheral circuit, so that the influence of the filtering ink layer on the appearance industrial design of a product can be reduced as much as possible, coupling alignment with a plurality of first photosensitive devices is not required to be considered, and the assembly difficulty is reduced.

In a possible implementation manner, a cover plate is disposed on the display panel, wherein a light-shielding ink layer is included between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the first photosensitive devices are distributed in a projection area of the shading ink layer on the display panel, wherein the shading ink layer transmits light rays of ultraviolet light wave bands. Because the light filtering ink layer transmits the light of the ultraviolet light wave band, the detection of the light of the ultraviolet light wave band in the environment light can be realized.

In a possible implementation manner, the plurality of first photosensitive devices are distributed on one side of the shading ink layer, which is close to the display area, in the projection area on the display panel.

In a possible implementation manner, the optical sensor further includes a plurality of second light sensing devices, a cover plate is disposed on the display panel, and a light-shielding ink layer is disposed between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the plurality of second photosensitive devices are distributed in the projection area of the shading ink layer on the display panel. When the filtering ink layer can transmit light rays of an ultraviolet light waveband, the plurality of second photosensitive devices can detect the light rays of the ultraviolet light waveband in the environment light. In addition, the plurality of second photo sensors may detect the light intensity of the dark environment under the light-shielding ink layer to provide a comparison reference for the detection results of the first photo sensors distributed along the boundary line between the display area AA and the peripheral circuit.

In one possible implementation manner, the plurality of second photosensitive devices are distributed along the boundary of the non-display area far away from the display area in a strip-shaped extending manner.

In one possible implementation, the plurality of first photosensitive devices are connected in parallel, and the plurality of first photosensitive devices form at least one row in the direction of the extending distribution.

In one possible implementation, the plurality of second photosensitive devices are connected in parallel, and the plurality of second photosensitive devices form at least one row in the direction of the extending distribution.

In a second aspect, a display screen is provided, which includes the display panel of the first aspect, and a cover plate disposed on the display panel.

In a third aspect, an electronic device is provided, comprising the display screen of the second aspect, and a PCB connected to the display screen.

For technical effects brought by any possible implementation manner of the second aspect and the third aspect, reference may be made to technical effects brought by different implementation manners of the first aspect, and details are not described here.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a smart watch according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a display screen according to an embodiment of the present application;

FIG. 4 is a schematic view of an assembly structure of the display screen shown in FIG. 3 according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a display screen according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a display screen according to another embodiment of the present application;

FIG. 7 is a schematic cross-sectional view AA' of the display screen shown in FIG. 6 according to an embodiment of the present application;

FIG. 8 is a schematic cross-sectional view AA' of the display screen shown in FIG. 6 according to another embodiment of the present application;

fig. 9 is a schematic structural diagram of a display screen according to another embodiment of the present application;

FIG. 10 is a schematic cross-sectional view AA' of the display screen shown in FIG. 9 according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a display screen according to another embodiment of the present application;

fig. 12 is a schematic structural diagram of a display screen according to still another embodiment of the present application;

FIG. 13 is a schematic cross-sectional view AA' of the display screen shown in FIG. 12 according to an embodiment of the present application;

fig. 14 is a schematic structural diagram of a display screen according to another embodiment of the present application;

FIG. 15 is a schematic cross-sectional view AA' of the display screen shown in FIG. 14 according to an embodiment of the present application;

FIG. 16 is a schematic diagram of an arrangement of photo-sensing devices according to an embodiment of the present application;

FIG. 17 is a schematic diagram illustrating an arrangement of photo-sensing devices according to another embodiment of the present application;

FIG. 18 is a schematic structural diagram of a photosensitive device according to an embodiment of the present application;

FIG. 19 is a schematic diagram of a circuit including a photosensitive device according to an embodiment of the present application;

FIG. 20 is a schematic diagram of a circuit including a photosensitive device according to another embodiment of the present application;

fig. 21 is a schematic structural diagram of a photosensitive device according to another embodiment of the present application;

fig. 22 is a schematic structural diagram of an LCD panel according to an embodiment of the present application;

fig. 23 is a schematic structural diagram of an AMOLED display panel according to an embodiment of the present disclosure;

fig. 24 is a schematic structural view of a photosensitive device according to still another embodiment of the present application;

FIG. 25 is a schematic diagram of a photosensitive device provided by an embodiment of the present application;

fig. 26 is an equivalent circuit schematic diagram of a photosensitive device provided in an embodiment of the present application;

fig. 27 is a schematic connection diagram of a photosensitive device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Hereinafter, the terms "first", "second", and the like are used for descriptive convenience only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "at least one" means one or more, and "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

In addition, in the embodiments of the present application, "upper", "lower", "left", and "right" are not limited to being defined with respect to the schematically-placed orientations of the components in the drawings, and it should be understood that these directional terms may be relative concepts that are used for descriptive and clarifying purposes with respect to the components, and that may be changed accordingly depending on the orientation in which the components in the drawings are placed.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. In addition, the term "electrically connected" may be directly electrically connected or indirectly electrically connected through an intermediate.

Embodiments of the present embodiment will be described in detail below with reference to the accompanying drawings.

The display panel and the display screen provided in the embodiment of the present application can be applied to electronic devices such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a netbook, a Personal Digital Assistant (PDA), a wearable electronic device, and a virtual reality device, and the embodiment of the present application does not limit the electronic devices.

Fig. 1 shows a schematic structural diagram of an electronic device 100.

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a camera 190, a display 191, and the like.

It is to be understood that the illustrated structure of the embodiment of the present invention does not specifically limit the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), etc. The different processing units may be separate devices or may be integrated into one or more processors.

A memory may also be provided in processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Avoiding repeated accesses reduces the latency of the processor 110, thereby increasing the efficiency of the system.

In some embodiments, processor 110 may include one or more interfaces. The interface may include an integrated circuit (I2C) interface, an integrated circuit built-in audio (I2S) interface, a Pulse Code Modulation (PCM) interface, a universal asynchronous receiver/transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a general-purpose input/output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and/or a Universal Serial Bus (USB) interface, etc.

The charging management module 140 is configured to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 may receive a wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142.

The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives an input of the battery 142 and/or the charge management module 140, and supplies power to the processor 110, the internal memory 121, the display 191, the camera 190, the wireless communication module 160, and the like. The power management module 141 may also be used to monitor parameters such as battery capacity, battery cycle count, battery state of health (leakage, impedance), etc. In some other embodiments, the power management module 141 may also be disposed in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be disposed in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like.

The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. Each antenna in the electronic device 100 may be used to cover a single or multiple communication bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example: the antenna 1 may be multiplexed as a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide a solution including 2G/3G/4G/5G wireless communication applied to the electronic device 100. The mobile communication module 150 may include one or more filters, switches, power amplifiers, Low Noise Amplifiers (LNAs), and the like. The mobile communication module 150 may receive the electromagnetic wave from the antenna 1, filter, amplify, etc. the received electromagnetic wave, and transmit the electromagnetic wave to the modem processor for demodulation. The mobile communication module 150 may also amplify the signal modulated by the modem processor, and convert the signal into electromagnetic wave through the antenna 1 to radiate the electromagnetic wave. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the same device as at least some of the modules of the processor 110.

The modem processor may include a modulator and a demodulator. The modulator is used for modulating a low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then passes the demodulated low frequency baseband signal to a baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transferred to the application processor. The application processor outputs a sound signal through an audio device (not limited to the speaker 170A, the receiver 170B, etc.) or displays an image or video through the display screen 191. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional modules, independent of the processor 110.

The wireless communication module 160 may provide a solution for wireless communication applied to the electronic device 100, including Wireless Local Area Networks (WLANs) (e.g., wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), Infrared (IR), and the like. The wireless communication module 160 may be one or more devices that integrate one or more communication processing modules. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on electromagnetic wave signals, and transmits the processed signals to the processor 110. The wireless communication module 160 may also receive a signal to be transmitted from the processor 110, perform frequency modulation and amplification on the signal, and convert the signal into electromagnetic waves through the antenna 2 to radiate the electromagnetic waves.

In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150 and antenna 2 is coupled to wireless communication module 160 so that electronic device 100 can communicate with networks and other devices through wireless communication techniques. The wireless communication technology may include global system for mobile communications (GSM), General Packet Radio Service (GPRS), code division multiple access (code division multiple access, CDMA), Wideband Code Division Multiple Access (WCDMA), time-division code division multiple access (time-division code division multiple access, TD-SCDMA), Long Term Evolution (LTE), LTE, BT, GNSS, WLAN, NFC, FM, and/or IR technologies, etc. The GNSS may include a Global Positioning System (GPS), a global navigation satellite system (GLONASS), a beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS), and/or a Satellite Based Augmentation System (SBAS).

The electronic device 100 implements display functions via the GPU, the display screen 191, and the application processor, etc. The GPU is a microprocessor for image processing, and is connected to the display screen 191 and an application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

The display screen 191 is used to display images, videos, and the like. The display screen 191 includes a display panel. The display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED), a flexible light-emitting diode (FLED), a miniature, a Micro-oeld, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the electronic device 100 may include 1 or N display screens 191, N being a positive integer greater than 1.

The electronic device 100 may implement a shooting function through the ISP, the camera 190, the video codec, the GPU, the display screen 191, the application processor, and the like.

The ISP is used to process the data fed back by the camera 190. For example, when a photo is taken, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converting into an image visible to naked eyes. The ISP can also carry out algorithm optimization on the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene. In some embodiments, the ISP may be provided in camera 190.

The camera 190 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image to the photosensitive element. The photosensitive element may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The light sensing element converts the optical signal into an electrical signal, which is then passed to the ISP where it is converted into a digital image signal. And the ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into image signal in standard RGB, YUV and other formats. In some embodiments, electronic device 100 may include 1 or N cameras 190, N being a positive integer greater than 1.

The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to extend the memory capability of the electronic device 100. The external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. For example, files such as music, video, etc. are saved in an external memory card.

Internal memory 121 may be used to store one or more computer programs, including instructions. The processor 110 may implement various functional applications, data processing, and the like by executing the above-described instructions stored in the internal memory 121. The internal memory 121 may include a program storage area and a data storage area. Wherein, the storage program area can store an operating system; the storage area may also store one or more application programs (e.g., gallery, contacts, etc.), etc. The storage data area may store data (such as photos, contacts, etc.) created during use of the electronic device 101, and the like. In addition, the internal memory 121 may include a high-speed random access memory, and may also include a nonvolatile memory, such as one or more magnetic disk storage devices, flash memory devices, Universal Flash Storage (UFS), and the like. In other embodiments, processor 110 causes electronic device 100 to perform various functional applications and data processing by executing instructions stored in internal memory 121 and/or instructions stored in a memory disposed in the processor.

The electronic device 100 may implement audio functions via the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone interface 170D, and the application processor. Such as music playing, recording, etc.

The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or some functional modules of the audio module 170 may be disposed in the processor 110.

The speaker 170A, also called a "horn", is used to convert the audio electrical signal into an acoustic signal. The electronic apparatus 100 can listen to music through the speaker 170A or listen to a handsfree call.

The receiver 170B, also called "earpiece", is used to convert the electrical audio signal into an acoustic signal. When the electronic apparatus 100 receives a call or voice information, it can receive voice by placing the receiver 170B close to the ear of the person.

The microphone 170C, also referred to as a "microphone," is used to convert sound signals into electrical signals. When making a call or transmitting voice information, the user can input a voice signal to the microphone 170C by speaking the user's mouth near the microphone 170C. The electronic device 100 may be provided with one or more microphones 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C in addition to collecting sound signals. A noise reduction function may also be implemented. In other embodiments, the electronic device 100 may further include three, four or more microphones 170C to collect sound signals, reduce noise, identify sound sources, perform directional recording, and so on.

The headphone interface 170D is used to connect a wired headphone. The headset interface 170D may be the USB interface 130, or may be a 3.5mm open mobile electronic device platform (OMTP) standard interface, a cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.

The sensor module 180 may include a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor (i.e., a light sensor provided by embodiments of the present application), a bone conduction sensor, and the like.

Touch sensors, also known as "touch devices". The touch sensor may be disposed on the display screen 191, and the touch sensor and the display screen 191 form a touch screen, which is also called a "touch screen". The touch sensor is used to detect a touch operation applied thereto or nearby. The touch sensor can communicate the detected touch operation to the application processor to determine the touch event type. Visual output related to the touch operation may be provided through the display screen. In other embodiments, a touch panel provided with a touch sensor array formed by a plurality of touch sensors may be disposed on the surface of the display panel in a hanging manner. In other embodiments, the touch sensor may be located in a different location than the display screen 191. In the embodiments of the present application, the form of the touch sensor is not limited, and the touch sensor may be, for example, a capacitor or a varistor.

In addition, the electronic device may further include one or more components such as a key, a motor, an indicator, and a Subscriber Identity Module (SIM) card interface, which is not limited in this embodiment of the present application.

Referring to fig. 2, taking the display of a circular smart watch as an example, the display 191 is typically disposed between the outer frame 21 and the bottom cover (not shown in fig. 2) of the watch. As shown in fig. 3 and 4, the display panel includes a display panel 31, and the display panel 31 includes a display area (AA) and a non-display area NA (also referred to as a frame) located around the display area AA. Usually, a cover plate is further disposed in the light emitting direction of the display panel 31, wherein a light shielding ink layer is included between the cover plate and the display panel 31, and a projection of the light shielding ink layer on the display panel 31 is located in the non-display area NA; thus, when viewed from the outside of the cover plate, the light-shielding ink layer shields the non-display area, the cover plate includes a Visible Area (VA) and an ink area (i.e., an area where the light-shielding ink layer corresponds to the cover plate) where the display area AA can be seen, and since the cover plate and the display panel have alignment accuracy and the visible area VA needs to expose the whole display area AA, the visible area VA is usually larger than the display area AA, i.e., a gap exists between the ink area and the display area AA, such as the visible area VA and the display area AA shown in fig. 3. The display area AA is provided with a pixel array composed of a plurality of pixel units distributed in an array. In addition, the display area AA includes driving lines arranged crosswise, the driving lines including SCAN lines SCAN and DATA lines DATA, wherein pixel units are arranged at positions where the SCAN lines SCAN and the DATA lines DATA cross, and one pixel unit is connected to one DATA line DATA and at least one SCAN line SCAN. The display screen further includes a Chip On Film (COF), which is a flexible circuit film with a chip, referred to as a Chip On Film (COF), 32 and a Flexible Printed Circuit (FPC) 33.

One driving circuit of any pixel unit in the pixel array is connected with one fan-out circuit of the display panel 31; the display panel 31 is provided with a connection terminal 311, the connection terminal 311 includes terminals (pins) of a plurality of fan-out lines of the display panel 31, wherein the COF32 and the FPC33 are provided on the back surface of the display panel 31, and the connection terminal 311 of the display panel 31 is bent to the back surface of the display panel 31 and correspondingly connected to the connection terminal 321 of the COF 32. The terminals of the connection terminals 311 and the terminals of the connection terminals 321 may be bonded one by using a FOF (film to film) process, and the connection terminals 311 and the connection terminals 321 are sequentially bonded together in a one-to-one manner, so that the anisotropic conductive film bonding (bonding) connection between the connection terminals 311 of the display panel 31 and the connection terminals 321 of the COF32 is realized.

In addition, the COF32 is provided with a display driving circuit 322, and the display driving circuit 322 may be a Display Driver Integrated Circuit (DDIC). In this case, the terminals in the connection 321 of the COF32 are electrically connected to the pins of the DDIC through the traces on the COF 32. The connection terminal 323 of the COF32 is connected to the connection terminal 331bonding of the FPC33, the terminal of the connection terminal 323 of the COF32 is electrically connected to the pin of the DDIC, the other connection terminal 332 of the FPC33 is connected to a Printed Circuit Board (PCB) of the electronic device through a connector, and the terminal of the connection terminal 331 of the FPC33 is connected to the terminal of the other connection terminal 332 through a wire on the FPC 33. An Application Processor (AP) (e.g., a CPU), a power management chip (power IC), and the like are mounted on a Printed Circuit Board (PCB) (or a driver board, a driver board). The printed circuit board, the COF32 and the FPC32 are all arranged between the outer frame 21 of the watch on the back of the display panel and the bottom cover. In some examples, the display driving circuit 322 may also be integrated on the frame (NA area) of the display panel, which is not favorable to reduce the frame width of the display panel.

In this way, the AP provides display data for the DDIC and the display panel 31 to present actual image information; the power IC supplies an operating voltage to the DDIC and the display panel 31. The FPC33 provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving signals transmitted from the PCB and controlling the signals to be transmitted to the display panel 31 according to a specific timing. For example, after the display data output by the AP passes through the DDIC, the display data is converted into a scan signal and a data voltage Vdata, and the scan signal and the data voltage Vdata are transmitted to the pixel units coupled to the driving lines to drive the pixel units to emit light.

At present, electronic devices such as the above-mentioned smart watch, smart bracelet, cell-phone etc. usually have an ambient light detection function, and wherein one of the main applications of ambient light detection function is through detecting ambient light brightness, realizes the automatically regulated to screen brightness, lets the user have fine experience. The ambient light detection function is also used in light intensity detection, touch control, and other scenarios. Whereas ambient light detection mainly relies on placing an Ambient Light Sensor (ALS) below the display panel of the electronic device. As shown in fig. 5, the display screen includes a display panel and a cover plate, an ink area is disposed below the display panel, and a projection position of the ink area on the display panel just covers the driving circuit on the display panel. Normally, the ALS is placed below the display panel, and light in the environment can reach a photosensitive area of the ALS through a Visible Area (VA) of a cover plate on the display panel and a display area (AA, an operable area or a display area) of the display panel to be received by the ALS, so as to perform ambient light detection, but in this structure, the ALS needs to be disposed below the display panel, so that the thickness of the module is high; in addition, since the blocking of the display panel greatly reduces the light transmittance, a more sensitive light sensor is required.

To solve the above problem, referring to fig. 6 and 7 (a cross-sectional view at AA' in fig. 6), a display panel is provided, wherein the display panel 41 includes a display area AA and a non-display area NA (or a bezel) in which a light sensor is integrated. The non-display area NA is located around the display area AA (in fig. 6, a circular display panel is taken as an example, and other irregular display panels such as a polygon and an ellipse may be used). A peripheral circuit 411 (which may include the fan-out lines and the display driving circuit, and of course, in some narrow frame products, the display driving circuit may be disposed on the COF) is disposed in the non-display area NA, and pixel units are disposed in an array in the display area AA. A photosensor 412 is provided between the display area AA and the peripheral circuit in the non-display area NA; the photo sensor 412 includes a plurality of photo sensing devices 412-n extending along a boundary between the display area AA and the peripheral circuit 411. It should be noted that the photo sensors 412-n are connected to the PCB through the fan-out lines of the non-display area NA (a specific fan-out line may be connected through the flexible substrate between the display panel 41 and the PCB), wherein the PCB is provided with a chip or a circuit for processing signals of the photo sensors or providing signals to the photo sensors. Wherein, in this scheme, owing to integrated on display panel 41 with light sensor 412, when this display panel 41 was assembled as the display screen, can reduce the module thickness of display screen, and then reduce the product thickness of the electronic equipment who uses this display screen. In addition, the light can directly reach the optical sensor 412 on the display panel 41 after passing through the cover plate, and does not reach the optical sensor 412 after passing through the display panel 41, so the requirement on the sensitivity of the optical sensor 412 is reduced, and because the plurality of photosensitive devices 412-n of the optical sensor 412 are arranged on the display panel 41 in a manner of extending and distributing along the boundary line between the display area AA and the peripheral circuit 411, there is no special requirement on the industrial design of the cover plate 42 for protecting the display panel 41 and the shading ink layer 43, for example, the cover plate 42 for protecting the display panel is usually arranged on the display panel 41, and the shading ink layer 43 for shading the non-display area NA of the display panel 41 is usually arranged between the display panel 41 and the cover plate 42 for the sake of aesthetic appearance, and in order to reduce the influence of the optical sensor 412 on the aperture ratio of the display panel 41, the optical sensor 412 cannot be arranged on the display area AA in general, however, if the light sensor 412 is disposed in the non-display area NA, the shape of the light-shielding ink layer 43 generally needs to be correspondingly coupled and designed, so as to remove or design the light-shielding ink layer 43 of the light sensor 412 as an ink material for filtering a specified light wave band, which increases the requirement of coupling and aligning the light-shielding ink layer 43 and the light sensor 412, and affects the industrial design of the appearance of the product. However, as described above, there is a gap between the light-shielding ink layer 43 and the display area AA of the display panel 41. Thus, when the cover plate 42 is disposed, it is only necessary to leak the plurality of photosensitive devices 412-n extending along the boundary between the display area AA and the peripheral circuit 411 from the gap, and there is no need to provide a special shape of the light-shielding ink layer 43, so that the industrial design of the product is simple and the design of the cover plate 42 and the light-shielding ink layer 43 can be directly compatible with the existing design.

In an embodiment, a cover plate 42 is further disposed on the display panel 41, and a light-shielding ink layer 43 is disposed between the cover plate 42 and the display panel 41, as shown in fig. 6 and fig. 7, wherein the display panel 41 includes a display area AA and a non-display area NA, and the non-display area NA is provided with a peripheral circuit 411 and a light sensor 412 (including a plurality of photo sensors 412-n). The projection of the light-shielding ink layer 43 on the display panel 41 is located in the non-display area NA. On the cover plate 42, the region of the light-shielding ink layer 43 outside the projection region of the cover plate 42 is a visible region VA. The plurality of photo sensors 412-n are distributed between the projection area of the black-out ink layer 43 on the display panel 41 and the display area AA. Thus, because the plurality of photosensitive devices 412-n are distributed in the visible area VA, and the visible area VA is not shielded by the shading ink layer 43, the ambient light can irradiate the plurality of photosensitive devices 412-n through the cover plate 42, thereby realizing the detection of the ambient light.

Further, as shown in fig. 8, a cover plate 42 is disposed on the display panel 41, wherein a filtering ink layer 44 is further included between the cover plate 42 and the display panel 41, the filtering ink layer 44 absorbs light in an ultraviolet band, and the filtering ink layer 44 covers an area between the display area AA and the peripheral circuit 411, that is, an area where the plurality of photo sensors 412-n are located. Since the filtering ink layer 44 absorbs the light in the ultraviolet light band, the light in the ultraviolet light band in the ambient light will be absorbed, and the light passing through the filtering ink layer 44 may include the light in the visible light band (for example, the wavelength range of 400nm to 700 nm) and the light in other light bands (for example, the infrared light band), so that the detection of the light in the visible light band and the light in other light bands in the ambient light can be realized. The filtering ink layer 44 may be disposed around the area between the display area AA and the peripheral circuit 411, so as to reduce the influence of the filtering ink layer 44 on the industrial design of the product appearance as much as possible, and reduce the assembly difficulty without considering the coupling alignment with the multiple photo sensors 412-n.

In another example, as shown in fig. 9 and 10, where fig. 10 is a cross-sectional view at AA' in fig. 9. A cover plate 42 is disposed on the display panel 41, wherein a light-shielding ink layer 43 is disposed between the cover plate 42 and the display panel 41, and a projection of the light-shielding ink layer 43 on the display panel 41 is located in the non-display area NA; the plurality of photo sensors 412-n of the photo sensor 412 are distributed in a projection area of the light shielding ink layer 43 on the display panel 41, wherein the light shielding ink layer 43 transmits light in an ultraviolet band. Because the light filtering ink layer transmits the light of the ultraviolet light wave band, the detection of the light of the ultraviolet light wave band in the environment light can be realized. Of course, as shown in fig. 9 and 10, the plurality of photo sensors 412-n may be distributed on a side of the light-shielding ink layer 43 near the display area AA in the projection area of the display panel 41. As shown in fig. 11, the display panel 41 may be distributed with a photo sensor 412-n for detecting visible light in the ambient light and light in other light bands and a photo sensor 412-n for detecting light in ultraviolet light bands.

Further, as shown in fig. 12 and 13, wherein fig. 13 is a sectional view at AA' in fig. 12. The plurality of photo sensors 412-n may also be distributed on a side of the projection area of the black-out ink layer 43 on the display panel 41 away from the display area AA.

To detect the light intensity of the dark environment under the light-shielding ink layer 43, a comparison reference is provided for the detection results of the photo sensors 412-n extending along the boundary between the display area AA and the peripheral circuit 411. Referring to fig. 14 and 15, in which the optical sensor 412 further includes a plurality of photo sensing devices 412-i, a cover plate 42 is disposed on the display panel 41, wherein a light-shielding ink layer 43 is included between the cover plate 42 and the display panel 41, and a projection of the light-shielding ink layer 43 on the display panel 41 is located in the non-display area NA; the plurality of photo sensors 412-i are distributed on the projection area of the black-out ink layer 43 on the display panel 41. In addition, the plurality of photo-sensing devices 412-i shown in fig. 14 and 15 are extended in a band shape in the non-display area NA away from the boundary of the display area AA. Of course, the plurality of photo sensors 412-i are not limited to the illustrated structure, and may be more or less, or may be close to the display area AA, and any arrangement of the plurality of photo sensors 412-i at any position of the non-display area NA is within the scope of the present application. Since the plurality of photo sensors 412-i are shielded by the black ink layer 43, they cannot be observed from the cover plate 42, and thus do not affect the industrial design of the product. The plurality of photo sensors 412-i extend along the non-display area NA away from the display area AA.

Fig. 16 and 17 provide an arrangement of a plurality of photosensitive devices of the embodiment of the present application, which are connected in parallel, and form at least one row in the direction of the extending distribution. Fig. 16 shows that the plurality of photosensitive devices in the embodiment of the present application may be arranged in one row in the direction of the extended distribution, and fig. 17 shows that the plurality of photosensitive devices in the embodiment of the present application may be arranged in two rows in the direction of the extended distribution. The parallel connection mode can directly superpose the photocurrents detected by the photosensitive devices, so that the precision of light intensity detection is improved, and the number of the photosensitive devices can be designed according to the detection precision of actual setting requirements without limitation. In fig. 16 and 17, a two-port device is taken as an example of a photo sensor, where an input terminal of the photo sensor is connected to the fan-out line 1, and an output terminal of the photo sensor is connected to the fan-out line 2.

The photosensitive device may be any one of photosensitive devices such as a photoresistor and a photodiode.

Wherein, the photosensitive device can be a photoresistor, as shown in the structural schematic diagram of the photoresistor shown in fig. 18, the photoresistor comprises a photoconductor and two electrodes arranged at two ends of the photoconductor, the two electrodes have no polarity difference, namely, the electrodes at the left side and the right side of the photoresistor are positively and reversely connected, and can normally work, so that the fan-out line 1 and the fan-out line 2 are respectively connected with the two electrodes of the photoresistor. The photoresistor, also called a light pipe, is a pure resistive element whose working principle is based on the photoconductive effect, and when there is no light, the resistance through the photoconductor is large and the reverse current is small, called dark current. When light is irradiated, photons carrying energy enter the photoconductor, electrons in the valence band absorb the energy of the photons and then jump to the conduction band to become free electrons, and holes are generated at the same time, and the occurrence of electron-hole pairs reduces the resistivity. The stronger the illumination, the more photo-generated electron-hole pairs, the lower the resistance. When a voltage is applied across the photoresistor, the current through the photoresistor increases as the illumination increases. The incident light disappears, the electron-hole pairs are gradually recombined, the resistance is gradually restored to the original value, and the current is gradually reduced. FIG. 19 and FIG. 20 provide two types of photo-sensitive resistors for detecting the output voltage U after illumination₀A change in (c). In the two figuresE_iIs an initial voltage, R_aIs a photoresistor, R_bCommon resistance, U₀Representing the voltage level of the detected electrical signal, wherein FIG. 19 provides the illumination intensity versus voltage level U₀Proportional circuit connection, i.e. the resistance R of the photoresistor_aThe smaller, the greater the current I in the circuit, the voltage U₀The larger the value; illumination intensity and voltage value U provided in FIG. 20₀In a circuit connection mode in which the ratio of resistance R of the photoresistor is inversely proportional, i.e. the stronger the illumination, the higher the resistance R_aThe smaller, the greater the current I in the circuit, the voltage U₀The smaller the value.

The photosensitive device may be a photodiode, which is also called a photodiode, and is shown in fig. 21 as a schematic diagram of the structure of the photodiode. The core component of the photosensitive diode is a PN junction, when no light irradiates, the reverse resistance of the photosensitive diode is large, the reverse current is small, and the photosensitive diode is in a cut-off state. The reverse current is also called dark current. When the light is irradiated, photons are bombarded near the PN junction to absorb the energy of the photons to generate electron-hole pairs, so that the minority carrier concentration of the P region and the N region is greatly increased, therefore, under the action of an external reverse bias voltage and an internal electric field, the minority carrier transition blocking layer of the P region enters the N region, the minority carrier transition blocking layer of the N region enters the P region, and the reverse current passing through the PN junction is greatly increased, so that the photocurrent is formed.

In order to reduce the manufacturing process, the manufacturing process of the TFT in the conventional display panel may be multiplexed to form the photosensitive device, wherein the display panel mainly includes a display substrate and an opposite substrate, and the display substrate mainly includes a substrate and a display function film layer disposed on the substrate. Wherein the display function film layer is composed of a plurality of film layers. The display panels with different types and different functions have different display function film layers. The display panel is a liquid crystal display (liquid crystal display,

LCD) panel or Active Matrix Organic Light Emitting Diode (AMOLED) display panel is exemplified for explanation.

Fig. 22 is a schematic structural diagram of an LCD panel according to an embodiment of the present application. In the LCD panel, a substrate 61, a circuit film 62, a pixel electrode layer 63, a lower alignment film 64, a liquid crystal layer 65, an upper alignment film 66, a common electrode layer 67, a color filter layer 68, a counter substrate 69, and the like are mainly included. The substrate base 61 and the counter base 62 may be formed of a transparent material such as glass. The circuit film layer 62, the pixel electrode layer 63, the lower alignment film layer 64, the liquid crystal layer 65, the upper alignment film layer 66, the common electrode layer 67, and the color filter layer 68 may be collectively referred to as a display function film layer. It should be noted that the structures of the display functional film layers in different types of LCD panels may be different, and fig. 22 is only an example of one of the LCD panels.

In the LCD panel, a Thin Film Transistor (TFT) and various wirings are mainly disposed in the circuit film layer 62. For example, as shown in fig. 22, the circuit film layer 62 may include a semiconductor layer 621, a first insulating layer 622, a gate electrode 623, a second insulating layer 624, a source electrode 625, and a drain electrode 626; the material of the semiconductor layer 621 may be amorphous silicon/polysilicon/oxide. The electrode contact region and the channel region of the TFT can be formed by doping the semiconductor layer 621 with different materials and different concentrations, wherein the electrode contact region is typically a P-type heavily doped region (P +), and the channel region is typically a P-type lightly doped region (P-). The source electrode 625 and the drain electrode 626 of the TFT are electrically connected to the electrode contact regions, respectively.

Referring to fig. 23, fig. 23 is a schematic structural diagram of an AMOLED display panel according to an embodiment of the present disclosure. In the AMOLED display panel, a substrate 71, a circuit film layer 72, an anode layer 73, a pixel defining layer 74, a light emitting layer 75, a cathode layer 76, an opposite substrate 77, and the like are mainly included. The substrate 71 and the opposite substrate 72 may be formed of a transparent material, and may be a rigid substrate such as glass, or may be a flexible substrate such as Polyimide (PI) or Polycarbonate (PC), which is not limited herein. Among them, the circuit film layer 72, the anode layer 73, the pixel defining layer 74, the light emitting layer 75, and the cathode layer 76 may be collectively referred to as a display function film layer. It should be noted that the structures of the display function film layers in different types of AMOLED display panels may be different, and fig. 23 is only an example of an AMOLED display panel with one OLED spontaneous color light, for example, in some AMOLED display panels, if the light emitted by the light emitting layer is white light, a color filter layer is generally further disposed above the light emitting layer, which is not described herein again.

In the AMOLED display panel, the circuit film layer 72 is also mainly provided with TFTs and various traces. For example, as shown in fig. 23, the circuit film layer 72 may include a semiconductor layer 721, a first insulating layer 722, a gate electrode 723, a second insulating layer 724, a source electrode 725, and a drain electrode 726; the material of the semiconductor layer 721 may be amorphous silicon/polysilicon/oxide. The electrode contact region and the channel region of the TFT may be formed by doping the semiconductor layer 721 with different materials and different concentrations, wherein the electrode contact region is typically a heavily P-doped region (P +), and the channel region is typically a lightly P-doped region (P-). The source electrode 725 and the drain electrode 726 of the TFT are electrically connected to the electrode contact regions, respectively.

The LCD panel and the AMOLED display panel are both provided with the circuit film layers with the TFTs, and just based on the fact that the display panel is provided with the semiconductor layers and the different doping regions located in the semiconductor layers, the LCD panel and the AMOLED display panel can be formed by adopting a mask (mask) process of the existing display panel as far as possible when the optical sensor is integrated in the display panel, and therefore the number of the increased mask process is reduced.

As shown in fig. 22 and 23, the input electrode and the output electrode of the photosensitive device may be formed by a one-time mask process using a first metal layer on the same layer as the source electrode 625 and the drain electrode 626 (the source electrode 725 and the drain electrode 726); when the photosensitive device includes a gate, the gate may be formed by a mask process using a second metal layer on the same layer as the gate electrode 623 (or the gate electrode 723); the channel of the photosensitive device may be formed using a material layer on the same layer as the semiconductor layer 621 (or the semiconductor layer 721), and when an electrode contact region is included under the input electrode and the output electrode, the semiconductor layer under the input electrode and the output electrode may be doped using a process for forming an electrode contact region of the source electrode 625 and the drain electrode 626 (the source electrode 725 and the drain electrode 726). Specifically, referring to fig. 24, a light sensing device is provided, which includes a channel, an input electrode and an output electrode disposed at two ends of the channel; wherein the input electrode may be connected to Vcc through a fan-out line, and the output electrode may be connected to Vout through a fan-out line. Referring to fig. 25, the operating principle of the photosensitive device (also referred to as a photodiode) provided by the present application is as follows: when there is no illumination, the reverse current of the channel region is small (typically less than 0.1 microampere), referred to as dark current. When light is irradiated, photons carrying energy enter a channel region, and then the energy is transferred to bound electrons on covalent bonds, so that part of electrons break free from the covalent bonds, and electron-hole pairs are generated and called photogenerated carriers. They undergo a drift motion under the action of a reverse voltage, so that the reverse current becomes significantly larger, and the greater the intensity of light, the greater the reverse current. In addition, to further adjust the magnitude of the dark current, one or more gates may be disposed over the channel, typically with an insulating layer disposed between the gate and the channel, and the gate may be connected to Vg through a fan-out line to provide a voltage to the gate. Thus, when the photosensitive device operates, mainly electron-hole pairs are formed in a region (depletion region) where the channel region is not shielded by the gate, the absorbed light intensity is different, the concentration of the formed electron-hole pairs is also different, and an equivalent circuit diagram is shown in fig. 26. The photosensitive device provided by the embodiment of the application has the characteristic of high sensitivity because the depletion region has larger resistance (equivalent resistance) and the dark current (leakage current) is small especially when light is not irradiated. And the magnitude of the dark current can be further adjusted by adjusting the voltage of the gate and the magnitude of the cross voltage across the input electrode and the output electrode. In addition, as shown in fig. 27, when the photo sensing devices are three-port devices including an input electrode, an output electrode, and a gate, the input electrodes of the photo sensing devices (1-n) are connected to Vcc through the same fan-out line, the output electrodes of the photo sensing devices (1-n) are connected to Vout through the same fan-out line, and the gates of the photo sensing devices (1-n) are connected to Vg through the same fan-out line. In addition, as shown in fig. 24, the width of the plurality of photosensitive devices arranged in a single row is about 30um, which substantially meets the error requirement of the gap design of the boundary between the viewing area VA and the display area AA, and does not affect the industrial appearance design of the product.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

Although the present application has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the application. Accordingly, the specification and figures are merely exemplary of the present application as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the present application. It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A display panel, comprising: the display device comprises a display area and a non-display area positioned around the display area, wherein the non-display area is provided with a peripheral circuit, and the display area is provided with pixel units distributed in an array;

wherein a light sensor is provided between the display area and the peripheral circuit on the non-display area; the light sensor includes a plurality of first light sensing devices extending along a boundary between the display area and the peripheral circuit.

2. The display panel according to claim 1, wherein a cover plate is disposed on the display panel, and a light-blocking ink layer is disposed between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the plurality of first photosensitive devices are distributed between the projection area of the shading ink layer on the display panel and the display area.

3. The display panel of claim 1, wherein a cover plate is disposed on the display panel, wherein a layer of filtering ink is disposed between the cover plate and the display panel; the filtering ink layer covers the area between the display area and the peripheral circuit, and absorbs light in an ultraviolet light band.

4. The display panel according to claim 1, wherein a cover plate is disposed on the display panel, and a light-blocking ink layer is disposed between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the plurality of first photosensitive devices are distributed in a projection area of the shading ink layer on the display panel, wherein the shading ink layer transmits light rays of ultraviolet light wave bands.

5. The display panel of claim 4, wherein the plurality of first photo sensors are distributed on a side of the shading ink layer near the display area within a projection area of the display panel.

6. The display panel according to claim 1, wherein the optical sensor further comprises a plurality of second photo sensing devices, and a cover plate is disposed on the display panel, wherein a light-shielding ink layer is disposed between the cover plate and the display panel; the projection of the shading ink layer on the display panel is positioned in the non-display area; the plurality of second photosensitive devices are distributed in the projection area of the shading ink layer on the display panel.

7. The display panel according to claim 6, wherein the plurality of second photo-sensing devices extend in a band shape along a boundary of the non-display region away from the display region.

8. The display panel according to claim 1, wherein the plurality of first light sensing devices are connected in parallel, and the plurality of first light sensing devices form at least one row in a direction of the extended distribution.

9. The display panel according to claim 6, wherein the plurality of second light sensing devices are connected in parallel, and the plurality of second light sensing devices form at least one row in a direction of the extended distribution.

10. A display screen comprising the display panel according to any one of claims 1 to 9, and a cover plate provided on the display panel.

11. An electronic device, characterized in that it comprises a display screen as claimed in claim 10, and a printed circuit board PCB connected to the display screen.