CN215898073U - Three-dimensional circuit board of 3D - Google Patents
Three-dimensional circuit board of 3D Download PDFInfo
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- CN215898073U CN215898073U CN202121256107.4U CN202121256107U CN215898073U CN 215898073 U CN215898073 U CN 215898073U CN 202121256107 U CN202121256107 U CN 202121256107U CN 215898073 U CN215898073 U CN 215898073U
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Abstract
The utility model discloses a 3D (three-dimensional) circuit board which comprises a plastic support, wherein a three-dimensional circuit is arranged on the plastic support and provided with a bonding pad, the three-dimensional circuit comprises a first circuit layer and a second circuit layer, the first circuit layer covers the second circuit layer, the first circuit layer is exposed out of the plastic support, the fluidity of molten tin paste on the first circuit layer is larger than that of molten tin paste on the second circuit layer, a window for exposing the second circuit layer is arranged on the first circuit layer, and the window is arranged close to the bonding pad. The 3D three-dimensional circuit board provided by the utility model can slow down the flow of molten solder paste in the process of mounting electronic components on the 3D three-dimensional circuit board, and meanwhile, part of the solder paste is stored in the window, so that the phenomenon that the solder paste overflows, the appearance of a product is kept neat, the three-dimensional circuit is prevented from being short-circuited, and the poor welding of the electronic components and the 3D three-dimensional circuit board caused by the tin climbing phenomenon is effectively prevented.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a 3D (three-dimensional) circuit board.
Background
In order to conduct electronic components located at different spatial positions in an electronic product, a 3D (three-dimensional) circuit board with a three-dimensional circuit structure appears in the market, and the electronic components located at different spatial positions can be conveniently communicated by mounting the electronic components to the corresponding positions of the three-dimensional circuit board or communicating the electronic components with the corresponding terminals of the three-dimensional circuit.
As shown in fig. 1, in order to improve the conductivity and prevent the oxidation of the three-dimensional circuit board 2, a gold layer is usually plated on the surface of the three-dimensional circuit board 2 to ensure that the 3D three-dimensional circuit board has good contact performance. When the electronic component 8 is mounted on the 3D three-dimensional circuit board through the SMT device, since the molten solder paste has good fluidity on the surface of the gold layer, the molten solder paste flows along the three-dimensional circuit 2 and overflows to cause a solder-climbing phenomenon, which affects the appearance of the product, and if the distance between two adjacent circuits of the three-dimensional circuit 2 is small, the circuits that should not be conducted are communicated to cause a short circuit.
Referring to fig. 2 and fig. 3, in order to avoid the tin-climbing phenomenon generated in the mounting process of the electronic component 8, the following two schemes are generally adopted in the prior art: the first method is that ink is sprayed on the three-dimensional circuit 2 of the 3D three-dimensional circuit board to cover a partial area of the three-dimensional circuit 2 to form an ink area 6 so as to block the flowing of solder paste, and the method has high cost and low efficiency due to the three-dimensional structure of the 3D three-dimensional circuit board, the spraying process error is usually +/-0.2 mm, and the deviation is easily generated when the ink area 6 is sprayed on the three-dimensional circuit 2 with the line width or line distance of 0.15mm or less; the second is that attached wheat pulling-on piece 7 forms to shield the region and blocks the solder paste and flow on the three-dimensional circuit 2 of 3D three-dimensional circuit board, and skew appears easily in the position of this kind of scheme operational difficulty and attached in-process wheat pulling-on piece 7 to make the double faced adhesive tape of wheat pulling-on piece 7 attached on 3D three-dimensional circuit board not high temperature resistant usually, heat the solder paste and make its melting probably can make the double faced adhesive tape lose efficacy simultaneously and lead to wheat pulling-on piece 7 to drop at electronic components 8 subsides dress in-process, and the reliability is relatively poor.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the 3D three-dimensional circuit board can effectively avoid tin climbing when a device is pasted on the 3D three-dimensional circuit board.
In order to solve the technical problems, the utility model adopts the technical scheme that: the utility model provides a 3D stereoscopic circuit board, includes the plastic support, be equipped with stereoscopic circuit on the plastic support, stereoscopic circuit has the pad, stereoscopic circuit includes first circuit layer and second circuit layer, first circuit layer covers on the second circuit layer just first circuit layer expose outward in the plastic support, molten state's tin cream is in mobility on the first circuit layer is greater than it is in mobility on the second circuit layer, be equipped with the confession on the first circuit layer the exerted window of second circuit layer, the window is close to the pad sets up.
Furthermore, the first circuit layer is made of metal gold, and the second circuit layer is made of metal nickel.
Further, the stereoscopic circuit further comprises a third circuit layer, and the second circuit layer covers the third circuit layer.
Furthermore, the third circuit layer is made of metal copper.
Further, the thickness of the third circuit layer is 5-20 μm.
Further, the thickness of the first circuit layer is larger than 0.05 μm.
Further, the thickness of the second circuit layer is 2-6 μm.
Furthermore, the plastic support still has plane portion, the pad is located on the plane portion, just the subregion of windowing is located on the plane portion.
The utility model has the beneficial effects that: according to the 3D three-dimensional circuit board, the first circuit layer is provided with the windowing window for exposing part of the second circuit layer, the windowing window is arranged close to the bonding pad of the three-dimensional circuit, the fluidity of the molten tin paste on the second metal layer is smaller than that of the molten tin paste on the first metal layer, so that the flowing of the molten tin paste is slowed down in the process of mounting the electronic component on the 3D three-dimensional circuit board, part of the tin paste is stored in the windowing window, the overflow caused by the flowing of the tin paste is avoided, the appearance of the product is kept neat, the three-dimensional circuit is prevented from being short-circuited, the poor welding of the electronic component and the 3D three-dimensional circuit board caused by the tin climbing phenomenon is effectively prevented, and the first circuit layer can be made of materials with good oxidation resistance or contact performance so as to improve the performance of the 3D three-dimensional circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a 3D three-dimensional circuit board in the prior art;
FIG. 2 is a schematic diagram of a prior art scheme for preventing a tin-climbing phenomenon from occurring on a 3D circuit board;
FIG. 3 is a schematic diagram of another prior art scheme for preventing a tin-climbing phenomenon from occurring on a 3D circuit board;
fig. 4 is a step diagram of a method for manufacturing a 3D three-dimensional circuit board according to a first embodiment of the utility model;
fig. 5 is a schematic structural diagram of a 3D three-dimensional circuit board provided by the present invention.
Description of reference numerals:
1. a plastic bracket; 2. a three-dimensional line; 3. a pad; 4. windowing; 5. a planar portion; 6. an ink area; 7. mylar; 8. an electronic component.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 4 and 5, a 3D three-dimensional circuit board includes a plastic support 1, a three-dimensional circuit 2 is disposed on the plastic support 1, the three-dimensional circuit 2 has a pad 3, the three-dimensional circuit 2 includes a first circuit layer and a second circuit layer, the first circuit layer covers the second circuit layer, the first circuit layer is exposed out of the plastic support 1, the fluidity of molten tin paste on the first circuit layer is greater than that on the second circuit layer, a window 4 for exposing the second circuit layer is disposed on the first circuit layer, and the window 4 is disposed close to the pad 3.
The structural principle of the utility model is briefly described as follows: the 3D three-dimensional circuit board comprises a plastic support 1 and a three-dimensional circuit 2 arranged on the plastic support 1, wherein the three-dimensional circuit 2 is provided with a bonding pad 3 for connecting an electronic component 8, the three-dimensional circuit 2 specifically comprises a first circuit layer and a second circuit layer which are overlapped, the first circuit layer is exposed out of the plastic support 1, the fluidity of molten tin paste on the first circuit layer is superior to that of the molten tin paste on the second circuit layer, a windowing window 4 for exposing part of the second circuit layer is arranged on the first circuit layer, the windowing 4 is arranged close to the bonding pad 3, the molten tin paste flows into the windowing 4 when flowing along the three-dimensional circuit 2, the flowing speed of the tin paste when flowing on the surface of the second circuit layer can be reduced, and part of the tin paste can be accommodated in the windowing 4 to prevent the overflow of the tin paste, so that the tin climbing phenomenon is avoided.
From the above description, the beneficial effects of the present invention are: the 3D three-dimensional circuit board provided by the utility model can slow down the flow of molten solder paste in the process of mounting the electronic component 8 on the 3D three-dimensional circuit board, and meanwhile, part of the solder paste is stored in the window 4, so that the phenomenon that the solder paste overflows, the appearance of a product is kept clean, the three-dimensional circuit 2 is prevented from being short-circuited, and the poor welding of the electronic component 8 and the 3D three-dimensional circuit board caused by the tin climbing phenomenon is effectively prevented.
Furthermore, the first circuit layer is made of metal gold, and the second circuit layer is made of metal nickel.
As can be seen from the above description, the first circuit layer is made of a gold layer, so that the electronic component 8 can be stably contacted with the 3D three-dimensional circuit board, and the oxidation resistance of the three-dimensional circuit 2 is improved.
Further, the stereoscopic circuit 2 further includes a third circuit layer, and the second circuit layer covers the third circuit layer.
Furthermore, the third circuit layer is made of metal copper.
Further, the thickness of the third circuit layer is 5-20 μm.
As can be seen from the above description, the three-dimensional circuit 2 further includes a third circuit layer located at the innermost layer, so as to implement conduction of the 3D three-dimensional circuit board through the second circuit layer and the third circuit layer, and increase the overall thickness of the three-dimensional circuit 2, so as to improve the overall strength of the three-dimensional circuit 2.
Further, the thickness of the first circuit layer is larger than 0.05 μm.
Further, the thickness of the second circuit layer is 2-6 μm.
As can be seen from the above description, the thicknesses of the first circuit layer and the second circuit layer can be set as required, so as to process the window 4 on the first circuit layer.
Further, plastic support 1 still has plane portion 5, pad 3 is located on plane portion 5, just the subregion of windowing 4 is located on plane portion 5.
As can be seen from the above description, the planar portion 5 is disposed on the plastic support 1 for attaching the electronic component 8, so that the electronic component 8 and the 3D three-dimensional circuit board are stably connected.
Example one
Referring to fig. 4 and 5, a first embodiment of the present invention is: a manufacturing method of a 3D three-dimensional circuit board is used for manufacturing the 3D three-dimensional circuit board.
The manufacturing method of the 3D three-dimensional circuit board specifically comprises the following steps,
and S1, obtaining the plastic bracket 1.
In step S1, an injection molding machine is used to injection mold the plastic support 1 from thermoplastic plastics, and metal particles are added into the plastic as seeds, and after the plastic support 1 with a preset shape is obtained, a laser is used to perform an activation treatment on the surface of the plastic support 1, so that the seeds are activated to form metal cores, and a rough conductor layer is formed on the surface of the plastic support 1.
And S2, laser etching a circuit pattern on the plastic support 1.
In step S2, the unnecessary portion of the conductive layer on the surface of the plastic frame 1 is removed by laser, so that the conductive layer remained on the surface of the plastic frame 1 forms the circuit pattern.
Step S21 of cleaning the circuit pattern is further included after step S2. After the circuit pattern is formed on the plastic support 1 through laser etching, the circuit pattern is cleaned to remove residues remained on the plastic support 1, so that a metal layer plated on the circuit pattern in the subsequent step is tightly combined with the circuit pattern. Specifically, in step S21, the plastic bracket 1 may be washed with water, or the plastic bracket 1 may be cleaned with an acidic or alkaline solution.
S3, sequentially plating a copper plating layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit 2 on the plastic support 1, wherein the three-dimensional circuit 2 is provided with a bonding pad 3.
In step S3, the plastic support 1 subjected to laser etching is subjected to chemical plating, and a copper layer, a nickel layer and a gold layer are sequentially plated on the circuit pattern, wherein the activated surface of the circuit pattern is rough, so that the copper layer can be stably attached to the circuit pattern, the nickel layer and the gold layer are sequentially formed on the copper layer to obtain the three-dimensional circuit 2, so as to ensure that the three-dimensional circuit 2 is stably conducted, and the three-dimensional circuit 2 has good contact performance and oxidation resistance through the gold layer attached to the outermost layer of the three-dimensional circuit 2. And the three-dimensional circuit 2 formed by plating the circuit pattern is provided with the bonding pad 3 for connecting the electronic component 8, so that the electronic component 8 can be conveniently attached to the 3D three-dimensional circuit board.
Optionally, the thickness of the copper layer is 5 to 20 μm, the thickness of the nickel layer is 2 to 6 μm, and the thickness of the gold layer is greater than 0.05 μm. The thicknesses of the copper layer and the nickel layer can be selected according to actual use conditions to ensure that the three-dimensional circuit 2 has certain structural strength.
And S4, radium-carving the three-dimensional circuit 2 to strip part of the gold layer close to the bonding pad 3 to expose part of the nickel layer, and obtaining the 3D three-dimensional circuit board.
Step S31 is further included before step S4, a plurality of plastic supports 1 with the three-dimensional lines 2 formed in the same batch are selected, trial cutting is performed on the three-dimensional lines 2 on the plurality of plastic supports 1, and the thickness range of the gold layer in the three-dimensional lines 2 is measured.
In step S4, the outermost gold layer of the three-dimensional circuit 2 is peeled off by a laser engraving machine to expose the nickel layer in the three-dimensional circuit 2, the operation is simple, the feasibility is good, and the peeled gold layer is disposed close to the bonding pad 3, so that the flow of the tin paste along the three-dimensional circuit 2 in the subsequent mounting process of the electronic component 8 is slowed down by using the characteristic that the fluidity of the molten tin paste on the nickel layer is far inferior to that of the molten tin paste on the gold layer, and the tin paste is prevented from overflowing by accommodating a part of the tin paste in a space formed by peeling off the part of the gold layer, thereby avoiding the tin climbing phenomenon. Specifically, the power setting of the laser etching machine in the step S4 can be adjusted according to the thickness range of the gold layer measured in the step S31, so as to prevent the nickel layer in the gold layer from being damaged due to too high power setting of the laser etching machine, or prevent the gold layer from being completely peeled due to too low power setting of the laser etching machine, so as to ensure that part of the gold layer on the surface of the three-dimensional circuit 2 is completely peeled at one time, ensure the quality of the 3D three-dimensional circuit board, and improve the production efficiency.
Optionally, in step S4, the power of the laser engraving machine may be set to 6W, the frequency of the laser generated by the laser engraving machine is 40kHz, and the speed of the laser generated by the laser engraving machine is 2500mm/S, so as to effectively peel off the gold layer on the surface of the three-dimensional circuit 2 to expose the nickel layer, so that the processing efficiency is high and the processing precision is high, thereby ensuring the obtained 3D three-dimensional circuit board has reliable quality.
The step S41 of cleaning the 3D three-dimensional circuit board is also included after the step S4. The method comprises the steps of obtaining, cleaning and remaining impurities on the surface of the 3D three-dimensional circuit board after the 3D three-dimensional circuit board is obtained, and preventing the electronic component 8 from being attached unstably due to the fact that the electronic component is attached to the 3D three-dimensional circuit board under the influence of the impurities.
Step S42 is further included after step S41, in which solder paste is applied to the pads 3 and the electronic component 8 is mounted. This step can be accomplished through automation equipment such as solder paste printing machine, chip mounter to attach electronic components 8 to on the 3D three-dimensional circuit board.
In step S41, the used solder paste is the existing solder paste, for example, HX-670 series solder paste produced by shenzhen china Hua Xiang electronics ltd, and the connection between the electronic component 8 and the 3D three-dimensional circuit board can be achieved.
Example two
Referring to fig. 5, a second embodiment of the present invention is: A3D circuit board is manufactured by the method for manufacturing the 3D circuit board.
As shown in fig. 5, 3D three-dimensional circuit board includes plastic support 1, three-dimensional circuit 2 has on the plastic support 1, just three-dimensional circuit 2 has pad 3 that electronic components 8 are connected, three-dimensional circuit 2 specifically includes first circuit layer and the second circuit layer of range upon range of setting, first circuit layer covers on the second line layer just first circuit layer expose in outside of the layer in plastic support 1, molten state tin cream is in mobility on the first circuit layer is superior to it and is in mobility on the second circuit layer, just be equipped with windowing 4 on the first circuit layer, windowing 4 is close to pad 3 sets up just windowing 4 supplies the part the second circuit layer exposes, three-dimensional circuit 2 passes through the second circuit layer switches on.
Specifically, when the solder paste is brushed on the bonding pad 3 and heated to be melted, the molten solder paste flows along the first circuit layer and enters the area surrounded by the windowing 4, the flow of the solder paste is greatly slowed down because the fluidity of the solder paste on the second circuit layer is far inferior to that of the solder paste on the first circuit layer, and meanwhile, the windowing 4 is used for accommodating partial solder paste to prevent the solder paste from overflowing the three-dimensional circuit 2, so that the phenomenon of tin climbing is avoided to cause poor product appearance or two adjacent circuits of the three-dimensional circuit 2 are conducted by the solder paste to cause short circuit.
Optionally, the first circuit layer is made of metal gold, and the second circuit layer is made of metal nickel. The first circuit layer is arranged to be a metal gold layer and covers the second circuit layer, so that the contact performance of the three-dimensional circuit 2 and the electronic component 8 can be improved, the three-dimensional circuit 2 is prevented from being oxidized, and the performance and the service life of the 3D three-dimensional circuit board are improved. The thickness of the first circuit layer is larger than 0.5 mu m, so that the windowing 4 is formed on the first circuit layer, and the windowing 4 can be formed by peeling off part of the first circuit layer by adopting a laser etching machine.
The three-dimensional circuit 2 further comprises a third circuit layer, the second circuit layer covers the third circuit layer, and the third circuit layer is preferably made of metal copper, so that the conductivity of the three-dimensional circuit 2 is improved. The thickness of the third circuit layer is 5-20 μm, and the thickness of the second circuit layer is 2-6 μm, so that the three-dimensional circuit 2 has certain structural strength.
Referring to fig. 5, in order to facilitate the mounting of the electronic component 8 on the 3D three-dimensional circuit board, the plastic support 1 is provided with a planar portion 5 for the electronic component 8 to be placed, the pad 3 is located on the planar portion 5, and a part of the window 4 is located in an area surrounded by the planar portion 5, so that the structure of the 3D three-dimensional circuit board is adapted to automation equipment such as a solder paste printer and a chip mounter, and then the electronic component 8 can be mounted on the 3D three-dimensional circuit board through the automation equipment, so that the 3D three-dimensional circuit board is convenient to use.
In summary, the three-dimensional circuit of the 3D three-dimensional circuit board provided by the utility model adopts a stacked design of the first circuit layer and the second circuit layer, and the first circuit layer is provided with the opening window for partially exposing the second circuit layer, and the opening window is arranged close to the bonding pad of the three-dimensional circuit, so that the fluidity of the molten solder paste on the second circuit layer is inferior to that on the first circuit layer, and the solder paste brushed on the bonding pad flows into the opening window along the first circuit layer after being melted and slows down the flow of the solder paste through the exposed second circuit layer, and the opening window can also accommodate part of the solder paste to prevent the solder paste from overflowing to affect the appearance of the product, thereby preventing the phenomenon of tin climbing when the electronic component is mounted on the 3D three-dimensional circuit board; the plastic support of the 3D three-dimensional circuit board is provided with a plane part for mounting electronic components, and pads and parts of three-dimensional circuits are arranged on the plane part by windowing, so that the whole structure of the 3D three-dimensional circuit board is matched with automatic equipment, the mounting efficiency of the electronic components is improved, and the 3D three-dimensional circuit board is convenient to use.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides a three-dimensional circuit board of 3D, includes the plastic support, be equipped with three-dimensional circuit on the plastic support, three-dimensional circuit has pad, its characterized in that: the three-dimensional circuit includes first circuit layer and second circuit layer, first circuit layer covers on the second circuit layer just first circuit layer exposes in the plastic support, and molten state's tin cream is in mobility on the first circuit layer is greater than it is in mobility on the second circuit layer, be equipped with the confession on the first circuit layer the window that exposes on the second circuit layer, the window is close to the pad setting.
2. The 3D stereoscopic wiring board of claim 1, wherein: the first circuit layer is made of metal gold, and the second circuit layer is made of metal nickel.
3. The 3D stereoscopic wiring board of claim 1, wherein: the stereoscopic circuit further comprises a third circuit layer, and the second circuit layer covers the third circuit layer.
4. The 3D stereoscopic wiring board of claim 3, wherein: the third circuit layer is made of metal copper.
5. The 3D stereoscopic wiring board of claim 3, wherein: the thickness of the third circuit layer is 5-20 μm.
6. The 3D stereoscopic wiring board of claim 1, wherein: the thickness of the first circuit layer is more than 0.05 μm.
7. The 3D stereoscopic wiring board of claim 1, wherein: the thickness of the second circuit layer is 2-6 μm.
8. The 3D stereoscopic wiring board of claim 1, wherein: the plastic support still has plane portion, the pad is located on the plane portion, just the subregion of windowing is located on the plane portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121256107.4U CN215898073U (en) | 2021-06-04 | 2021-06-04 | Three-dimensional circuit board of 3D |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121256107.4U CN215898073U (en) | 2021-06-04 | 2021-06-04 | Three-dimensional circuit board of 3D |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215898073U true CN215898073U (en) | 2022-02-22 |
Family
ID=80500734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121256107.4U Active CN215898073U (en) | 2021-06-04 | 2021-06-04 | Three-dimensional circuit board of 3D |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215898073U (en) |
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2021
- 2021-06-04 CN CN202121256107.4U patent/CN215898073U/en active Active
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