CN215870201U - Heat dissipation device for semiconductor laser - Google Patents
Heat dissipation device for semiconductor laser Download PDFInfo
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- CN215870201U CN215870201U CN202121395232.3U CN202121395232U CN215870201U CN 215870201 U CN215870201 U CN 215870201U CN 202121395232 U CN202121395232 U CN 202121395232U CN 215870201 U CN215870201 U CN 215870201U
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Abstract
The utility model is suitable for the technical field of laser heat dissipation, and provides a heat dissipation device for a semiconductor laser, which comprises: a box body; the supporting mechanism is connected with the box body; the supporting mechanism comprises a supporting component and an adjusting component, and the supporting component is connected with the adjusting component and is used for supporting and fixing semiconductor lasers of different types; the heat dissipation mechanism is positioned in the box body; the heat dissipation mechanism comprises a heat conduction assembly and an auxiliary assembly matched with the heat conduction assembly for use, and is used for carrying out heat dissipation treatment on the semiconductor laser. The semiconductor laser device is novel in structure, and due to the arrangement of the supporting mechanism and the heat dissipation mechanism, the influence of high temperature on the normal use of the semiconductor laser device is avoided, and the practicability of the device is improved.
Description
Technical Field
The utility model relates to the technical field of laser heat dissipation, in particular to a heat dissipation device for a semiconductor laser.
Background
Semiconductor lasers are devices that generate laser light by using a certain semiconductor material as a working substance. The operating principle is that the population inversion of non-equilibrium carriers is realized between the energy bands (conduction band and valence band) of the semiconductor substance or between the energy bands of the semiconductor substance and the energy levels of impurities (acceptor or donor) through a certain excitation mode, and when a large number of electrons in the population inversion state are combined with holes, the stimulated emission effect is generated.
Most of the existing heat dissipation devices for the semiconductor laser have single functions, heat dissipation work of the semiconductor lasers of different models and sizes is difficult to achieve, heat accumulation generated by key devices is easy to cause, the heat accumulation cannot be released, great influence is generated on normal use of the lasers, and even the lasers are scrapped. Therefore, in view of the above situation, it is desirable to provide a heat dissipation device for a semiconductor laser to overcome the shortcomings of the current practical application.
SUMMERY OF THE UTILITY MODEL
An object of an embodiment of the present invention is to provide a heat dissipation device for a semiconductor laser, which aims to solve the following problems: most of the existing heat dissipation devices for the semiconductor laser have single functions, heat dissipation work of the semiconductor lasers in different models and sizes is difficult to achieve, heat accumulation generated by key devices is easy to cause, the heat accumulation cannot be released, great influence is generated on normal use of the lasers, and even the lasers are scrapped, so that the heat dissipation devices are difficult to widely apply.
The embodiment of the present invention is achieved by a heat dissipation device for a semiconductor laser, including:
a box body;
the supporting mechanism is connected with the box body; the supporting mechanism comprises a supporting component and an adjusting component, and the supporting component is connected with the adjusting component and is used for supporting and fixing semiconductor lasers of different types;
the heat dissipation mechanism is positioned in the box body; the heat dissipation mechanism comprises a heat conduction assembly and an auxiliary assembly matched with the heat conduction assembly for use, and is used for carrying out heat dissipation treatment on the semiconductor laser.
Compared with the prior art, the embodiment of the utility model has the following beneficial effects: the embodiment of the utility model is provided with the supporting mechanism and the heat dissipation mechanism, the supporting mechanism can support and fix the semiconductor laser and can also stably support and fix the semiconductor lasers with different types and sizes, the heat dissipation mechanism can comprehensively dissipate heat of the semiconductor laser, the influence of high temperature on the normal use of the semiconductor laser is avoided, and the practicability of the device is improved.
Drawings
Fig. 1 is a schematic front view of the present invention.
Fig. 2 is an enlarged schematic view of a portion a in fig. 1.
Fig. 3 is a partially enlarged structural view of the second supporting member according to the present invention.
Fig. 4 is a schematic perspective view of the first supporting member according to the present invention.
In the drawings: 1-box, 2-linkage, 3-fixed box, 4-first screw rod, 5-first slide block, 6-heat dissipation piece, 7-driving component, 8-vertical plate, 9-connecting piece, 10-second supporting piece, 11-telescopic rod piece, 12-supporting pad, 13-second slide block, 14-second screw rod, 15-guide groove, 16-first supporting piece, 17-third slide block, 18-ventilation hole, 19-heat conduction piece, 20-mounting piece, 21-stop block and 22-spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
Referring to fig. 1, a heat dissipation device for a semiconductor laser according to an embodiment of the present invention includes:
a box body 1;
the supporting mechanism is connected with the box body 1; the supporting mechanism comprises a supporting component and an adjusting component, and the supporting component is connected with the adjusting component and is used for supporting and fixing semiconductor lasers of different types;
the heat dissipation mechanism is positioned in the box body 1; the heat dissipation mechanism comprises a heat conduction assembly and an auxiliary assembly matched with the heat conduction assembly for use, and is used for carrying out heat dissipation treatment on the semiconductor laser.
In the embodiment of the utility model, the semiconductor laser can be supported and fixed through the supporting component during working, the device is convenient for people to use, the position of the supporting component can be adjusted through the adjusting component, the semiconductor lasers with different types and sizes can be conveniently fixed, the practicability of the device is improved, the semiconductor laser fixed on the supporting component can be subjected to heat conduction treatment through the heat conduction component, heat generated by the working of the semiconductor laser is transferred to the heat conduction component, the heat dissipation work of the semiconductor laser is realized, the heat dissipation treatment can be performed on the heat conduction component through the auxiliary component, so that the heat conduction component can be rapidly cooled, and the heat conduction performance of the heat conduction component is improved; compared with the prior art, the semiconductor laser device is provided with the supporting mechanism and the heat dissipation mechanism, the semiconductor laser devices of different types and sizes can be stably supported and fixed while the supporting mechanism is arranged, the heat dissipation mechanism is arranged to achieve comprehensive heat dissipation of the semiconductor laser devices, normal use of the semiconductor laser devices is prevented from being affected by high temperature, and the practicability of the device is improved.
In an embodiment of the present invention, referring to fig. 1, 3 and 4, the supporting assembly includes:
a first support 16 connected to the adjustment assembly;
the second supporting part 10 is matched with the first supporting part 16 for use and is used for supporting and fixing the semiconductor laser; and
at least one set of vertical plates 8 is positioned on the second support 10 and the first support 16.
In this embodiment, the first supporting member 16 is a two-section rectangular plate-shaped structure, the second supporting member 10 is a rectangular plate-shaped structure, a slot for matching with the first supporting member 16 is further formed in the second supporting member 10, a stopper 21 is slidably mounted in the slot, one end of the stopper 21 is connected to the second supporting member 10 through a spring 22, and the second supporting member 10 and the first supporting member 16 are symmetrically arranged in the box body 1; during operation, the transverse supporting force can be generated on the stop block 21 through the spring 22, the semiconductor laser can be supported through the second supporting piece 10 and the first supporting piece 16, the side face of the semiconductor laser can be fixed through the vertical plate 8, the positions of the second supporting piece 10 and the first supporting piece 16 can be adjusted through the adjusting assembly, when the second supporting piece 10 is in contact with the first supporting piece 16, a reverse acting force is formed by the supporting effect of the stop block 21 and the displacement direction of the second supporting piece 10 and the first supporting piece 16, so that the stable connection between the second supporting piece 10 and the first supporting piece 16 is realized, and the stability of the device during use is improved.
In one embodiment of the present invention, referring to fig. 1, the adjusting assembly includes:
the second screw rod 14 is connected with the box body 1;
the driving assembly 7 is used for driving the second screw rod 14 to rotate;
the moving part is connected with the second screw rod 14;
a guide groove 15 connected to the case 1; and
at least one set of telescopic rods 11 for connection between the moving member and the support assembly.
In this embodiment, the driving assembly 7 may include a servo motor and a gear transmission member, the gear transmission member is used for connecting the servo motor and the second lead screw 14, the gear transmission member includes a driven gear and a driving gear, the driven gear is connected with an output shaft of the servo motor, the driving gear is connected with the second lead screw 14, the driving gear is meshed with the driven gear, the moving member includes a third slider 17 and a second slider 13, the third slider 17 and the second slider 13 are symmetrically disposed on the second lead screw 14, the third slider 17 and the second slider 13 are in threaded connection with the second lead screw 14, and the telescopic rod 11 may adopt an electric telescopic rod or a hydraulic rod; the during operation can drive second lead screw 14 through drive assembly 7 and rotate to drive second slider 13 and third slider 17 inwards or outside motion simultaneously on second lead screw 14, and then realize the regulation to supporting component operating position, can adjust supporting component's operating height through flexible member 11, conveniently fix the convenient heat dissipation treatment to the semiconductor laser of different models, wherein third slider 17 with second slider 13 with sliding connection between the guide way 15 can realize second slider 13 and third slider 17's steady removal through guide way 15, stability when improving the device and using.
In one embodiment of the present invention, referring to fig. 1 and 2, the heat conducting assembly includes:
at least one group of heat conducting components 19, which are used for carrying out heat dissipation work on the semiconductor laser on the supporting component;
a fixing case 3 for fixing the heat conductive member 19;
at least one set of ventilation holes 18, wherein the ventilation holes 18 are arranged on the fixed box 3; and
and the connecting piece 9 is used for connecting the vertical plate 8 and the fixed box 3.
In this embodiment, the heat conducting member 19 may be a semiconductor refrigerating sheet, the fixing box 3 is further provided with a mounting member 20 for stably mounting the heat conducting member 19, the mounting member 20 is of a hollow-out type mesh structure, the mounting member 20 is connected with the hot end of the heat conducting member 19, the fixing box 3 is internally of a hollow structure, and the two groups of the vent holes 18 are symmetrically arranged on the fixing box 3; the during operation contacts with semiconductor laser through the cold junction of heat-conducting piece 19, thereby can realize heat conduction work with heat transfer to the hot junction of heat-conducting piece 19, is convenient for dispel the heat comprehensively to semiconductor laser, is convenient for realize dispelling the heat to heat-conducting piece 19 through the effect of ventilation hole 18 and installed part 20, improves the heat conductivility of heat-conducting piece 19.
In one embodiment of the present invention, referring to fig. 1, the auxiliary component includes:
the first screw rod 4 is connected with the box body 1;
the linkage 2 is used for linkage between the adjusting assembly and the first screw rod 4;
at least one group of heat dissipation members 6 for performing heat dissipation work on the heat conduction assembly; and
and the first sliding block 5 is used for connecting the heat sink 6 and the first screw rod 4.
In this embodiment, the linkage 2 may include a driven pulley and a driving pulley, the driven pulley is connected to the first lead screw 4, the driving pulley is connected to the second lead screw 14, the driving pulley and the driven pulley are connected through a transmission belt, and the first slider 5 is symmetrically provided with two sets on the first lead screw 4; during work, the adjusting assembly works to drive the first lead screw 4 to rotate through the linkage part 2, so that the two groups of first sliding blocks 5 are driven to move inwards or outwards on the first lead screw 4 simultaneously, the first sliding blocks 5 and the third sliding blocks 17 can move synchronously, heat dissipation treatment can be conveniently performed on the heat conducting part 19 through the heat dissipation part 6, and the heat dissipation part 6 can be a heat dissipation fan.
In an embodiment of the present invention, please refer to fig. 1, further comprising at least one set of supporting pads 12 connected to the box body 1, wherein the supporting pads 12 are used in the prior art, and the box body 1 can be stably supported by the supporting pads 12, so as to improve the stability of the device during use.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. A heat sink for a semiconductor laser, the heat sink comprising:
a box body;
the supporting mechanism is connected with the box body; the supporting mechanism comprises a supporting component and an adjusting component, and the supporting component is connected with the adjusting component and is used for supporting and fixing semiconductor lasers of different types;
the heat dissipation mechanism is positioned in the box body; the heat dissipation mechanism comprises a heat conduction assembly and an auxiliary assembly matched with the heat conduction assembly for use, and is used for carrying out heat dissipation treatment on the semiconductor laser.
2. The heat dissipating arrangement for a semiconductor laser of claim 1, wherein the support assembly comprises:
the first supporting piece is connected with the adjusting component;
the second supporting piece is matched with the first supporting piece for use and used for supporting and fixing the semiconductor laser; and
and the at least one group of vertical plates are positioned on the second supporting piece and the first supporting piece.
3. The heat dissipating arrangement for a semiconductor laser of claim 1, wherein the adjustment assembly comprises:
the second screw rod is connected with the box body;
the driving assembly is used for driving the second screw rod to rotate;
the moving piece is connected with the second screw rod;
the guide groove is connected with the box body; and
and the at least one group of telescopic rod pieces are used for connecting the moving piece with the supporting component.
4. A heat sink for a semiconductor laser as claimed in claim 2 wherein the thermally conductive assembly comprises:
the at least one group of heat conducting components are used for carrying out heat dissipation work on the semiconductor laser on the supporting component;
a fixing box for fixing the heat-conducting member;
the air vents are formed in the fixed box; and
and the connecting piece is used for connecting the vertical plate with the fixed box.
5. A heat sink for a semiconductor laser as claimed in claim 1 wherein the auxiliary component comprises:
the first screw rod is connected with the box body;
the linkage piece is used for linkage between the adjusting assembly and the first screw rod;
the heat dissipation component is used for dissipating heat of the heat conduction component; and
and the first sliding block is used for connecting the heat dissipation piece with the first screw rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121395232.3U CN215870201U (en) | 2021-06-23 | 2021-06-23 | Heat dissipation device for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121395232.3U CN215870201U (en) | 2021-06-23 | 2021-06-23 | Heat dissipation device for semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215870201U true CN215870201U (en) | 2022-02-18 |
Family
ID=80334948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121395232.3U Active CN215870201U (en) | 2021-06-23 | 2021-06-23 | Heat dissipation device for semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215870201U (en) |
-
2021
- 2021-06-23 CN CN202121395232.3U patent/CN215870201U/en active Active
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