CN215856433U - Device for improving uniformity of electroplated layer of mini LED circuit board - Google Patents
Device for improving uniformity of electroplated layer of mini LED circuit board Download PDFInfo
- Publication number
- CN215856433U CN215856433U CN202122162223.6U CN202122162223U CN215856433U CN 215856433 U CN215856433 U CN 215856433U CN 202122162223 U CN202122162223 U CN 202122162223U CN 215856433 U CN215856433 U CN 215856433U
- Authority
- CN
- China
- Prior art keywords
- titanium basket
- circuit board
- led circuit
- copper plating
- uniformity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a device for improving the uniformity of an electroplated layer of a mini LED circuit board, which comprises a copper plating groove and a titanium basket, wherein a support is arranged above the copper plating groove, and a plurality of chucks for clamping a PCB are arranged on the support; a supporting and fixing seat for fixing a titanium basket is arranged in the copper plating tank, the titanium basket is divided into an upper titanium basket, a middle titanium basket and a lower titanium basket, and the grid density of the middle titanium basket is greater than that of the upper titanium basket and that of the lower titanium basket; two detachable baffle plate assemblies are further arranged in the copper plating tank. The utility model can improve the uniformity of the electroplating coating.
Description
Technical Field
The utility model relates to the technical field of PCB (printed circuit board) processing equipment, in particular to a device for improving the uniformity of an electroplated layer of a mini LED circuit board.
Background
In the electroplating process of the mini LED circuit board, the copper balls stored in the titanium basket can generate anode mud in the production process, the anode mud is a byproduct normally consumed in the electroplating production process, and the existing anode mud can slowly store at the bottom of the titanium basket until being taken out in a staged manner.
Electroplating starts to be derived downwards by electrifying the clamp through an ASF (automatic plating Filter), wherein anode mud slowly exists at the bottom of the titanium basket in the copper plating process, so that the copper plating thickness of the PCB clamp head becomes thinner from top to bottom in the thickest direction, and the electroplating uniformity is seriously influenced.
Disclosure of Invention
The utility model aims to solve the problems that: the device for improving the uniformity of the electroplated layer of the mini LED circuit board is provided, and the uniformity of the electroplated layer can be improved.
The technical scheme provided by the utility model for solving the problems is as follows: a device for improving the uniformity of an electroplated layer of a mini LED circuit board comprises a copper plating tank and a titanium basket, wherein a support is arranged above the copper plating tank, and a plurality of chucks for clamping a PCB are arranged on the support; a supporting and fixing seat for fixing a titanium basket is arranged in the copper plating tank, the titanium basket is divided into an upper titanium basket, a middle titanium basket and a lower titanium basket, and the grid density of the middle titanium basket is greater than that of the upper titanium basket and that of the lower titanium basket; still be equipped with two baffle subassemblies of dismantling and height-adjustable in the copper facing groove.
Preferably, the chuck comprises a plurality of double-point chucks and two single-point chucks, the double-point chucks are uniformly distributed on the bracket, the double-point chucks are connected with a power supply by adopting a power line, and the two single-point chucks are respectively arranged at two ends of the bracket.
Preferably, the supporting and fixing seat is provided with an accommodating groove matched with the bottom shape of the lower titanium basket.
Preferably, the two baffle plate assemblies are respectively arranged at the upper part and the lower part of the inner part of the copper plating tank.
Preferably, the baffle plate assembly comprises a transverse plate and a positioning plate vertically arranged at one end of the transverse plate, a plurality of positioning holes are formed in the positioning plate, bolt holes are formed in the positions, corresponding to the positioning holes, of the copper plating tank, and the positioning holes are connected with the bolt holes through bolts.
Preferably, the locating hole has five and from top to bottom the equipartition be in on the locating plate.
Compared with the prior art, the utility model has the advantages that: according to the utility model, the two baffle plate assemblies which are detachable and adjustable in height are arranged in the copper plating tank, if the upper surface of the PCB is thin, the baffle plate assembly at the upper part of the copper plating tank can be adjusted upwards, if the upper surface of the PCB is thick, the baffle plate assembly at the upper part of the copper plating tank is adjusted downwards, if the lower surface of the PCB is thin, the baffle plate assembly at the lower part of the copper plating tank is adjusted downwards, and if the lower surface of the PCB is thick, the baffle plate assembly at the lower part of the copper plating tank is adjusted upwards, so that the uniformity of an electroplating coating is effectively improved; meanwhile, the mesh density of the middle titanium basket is greater than that of the upper titanium basket and that of the lower titanium basket, so that the release speed of copper ions in the 1/3 area in the middle of the titanium basket is reduced, the concentration of the whole bath solution can be basically kept consistent, and the uniformity of copper plating is further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model.
Fig. 1 is a schematic view of the overall structure of the present invention.
The attached drawings are marked as follows: 1. the device comprises a support, 2, a double-point chuck, 3, an upper titanium basket, 4, a single-point chuck, 5, a PCB, 6, a copper plating tank, 7, a positioning plate, 8, a bolt, 9, a transverse plate, 10, a lower titanium basket, 11, a supporting fixing seat, 12 and a middle titanium basket.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated without limiting the specific scope of protection of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the utility model, "a number" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The specific embodiment of the utility model is shown in FIG. 1, and the device for improving the uniformity of the electroplated layer of the mini LED circuit board comprises a copper plating groove 6 and a titanium basket, wherein a support 1 is arranged above the copper plating groove 6, and a plurality of chucks for clamping a PCB 5 are arranged on the support 1; a supporting and fixing seat 11 for fixing a titanium basket is arranged in the copper plating bath 6, the titanium basket is divided into an upper titanium basket 3, a middle titanium basket 12 and a lower titanium basket 10, and the grid density of the middle titanium basket 12 is greater than that of the upper titanium basket 3 and that of the lower titanium basket 10; and two detachable baffle plate assemblies with adjustable heights are also arranged in the copper plating tank 6.
As another embodiment of the present invention, the chuck includes a plurality of double-point chucks 2 and two single-point chucks 4, the plurality of double-point chucks 2 are uniformly distributed on the bracket 1, the plurality of double-point chucks 2 are connected to a power supply by a power line, and the two single-point chucks 4 are respectively disposed at two ends of the bracket 1.
As another embodiment of the utility model, the supporting and fixing seat 11 is provided with a receiving groove which is matched with the shape of the bottom of the lower titanium basket 10.
As another embodiment of the present invention, two baffle assemblies are provided at upper and lower portions inside the copper plating bath 6.
As another embodiment of the present invention, the baffle plate assembly includes a transverse plate 9 and a positioning plate 7 vertically disposed at one end of the transverse plate 9, the positioning plate 7 is provided with a plurality of positioning holes, the copper plating bath 6 is provided with bolt holes at positions corresponding to the positioning holes, and the positioning holes are connected to the bolt holes through bolts 8.
As another embodiment of the present invention, five positioning holes are uniformly distributed on the positioning plate 7 from top to bottom.
The copper thickness of PCB board lower extreme is relevant with baffle subassembly, anode mud, has just washed the titanium blue of copper ball, and lower extreme power line distributes greatly, so the baffle subassembly requires to set up positive deviation, and follow-up along with the increase of anode mud, the height of baffle subassembly will be adjusted, can set up negative deviation (down adjustment) the most. (the titanium blue after being cleaned or newly purchased titanium blue has larger meshes, the corresponding ionized copper ion concentration is larger, the height of a lower baffle component is increased (positive deviation is adjusted upwards), the copper ion migration rate or the electric field intensity is weakened, the uniformity of the thickness of the electroplated copper is facilitated, when the titanium blue is electroplated for a period of time, by-product anode sludge is formed at the bottom of the titanium blue, the meshes are blocked, the sludge can not enable copper balls to normally ionize copper ions or block the migration direction of the copper ions, the concentration of the copper ions at the bottom is weaker, and at the moment, the copper ion migration area or the electric field intensity is increased by reducing the lower baffle component (negative deviation), the thickness of the electroplated copper can be effectively increased, and the consistency of the thickness of the electroplated copper at the lower end and the upper end of the PCB is ensured.)
The foregoing is merely illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary. All changes which come within the scope of the utility model as defined by the independent claims are intended to be embraced therein.
Claims (6)
1. The utility model provides an improve device of mini LED circuit board plating layer homogeneity, includes copper facing groove (6), its characterized in that: the device is characterized by also comprising a titanium basket, wherein a support (1) is arranged above the copper plating bath (6), and a plurality of chucks for clamping the PCB (5) are arranged on the support (1); a supporting fixing seat (11) for fixing a titanium basket is arranged in the copper plating tank (6), the titanium basket is divided into an upper titanium basket (3), a middle titanium basket (12) and a lower titanium basket (10), and the grid density of the middle titanium basket (12) is greater than that of the upper titanium basket (3) and the lower titanium basket (10); and two detachable baffle plate assemblies with adjustable heights are also arranged in the copper plating tank (6).
2. The device for improving the uniformity of the plating layer of the mini LED circuit board as claimed in claim 1, wherein: the chuck includes a plurality of two some chucks (2) and two single-point chucks (4), and a plurality of two some chucks (2) equipartition are in on support (1), a plurality of two some chucks (2) adopt the power cord to be connected with the power, two single-point chucks (4) are established respectively the both ends of support (1).
3. The device for improving the uniformity of the plating layer of the mini LED circuit board as claimed in claim 1, wherein: and the supporting and fixing seat (11) is provided with an accommodating groove matched with the bottom shape of the lower titanium basket (10).
4. The device for improving the uniformity of the plating layer of the mini LED circuit board as claimed in claim 1, wherein: the two baffle plate assemblies are respectively arranged at the upper part and the lower part inside the copper plating tank (6).
5. The device for improving the uniformity of the plating layer of the mini LED circuit board as claimed in claim 4, wherein: the baffle plate assembly comprises a transverse plate (9) and a positioning plate (7) vertically arranged at one end of the transverse plate (9), a plurality of positioning holes are formed in the positioning plate (7), bolt holes are formed in the positions, corresponding to the positioning holes, of the copper plating tank (6), and the positioning holes are connected with the bolt holes through bolts (8).
6. The device for improving the uniformity of the plating layer of the mini LED circuit board as claimed in claim 5, wherein: five positioning holes are uniformly distributed on the positioning plate (7) from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122162223.6U CN215856433U (en) | 2021-09-08 | 2021-09-08 | Device for improving uniformity of electroplated layer of mini LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122162223.6U CN215856433U (en) | 2021-09-08 | 2021-09-08 | Device for improving uniformity of electroplated layer of mini LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215856433U true CN215856433U (en) | 2022-02-18 |
Family
ID=80257346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122162223.6U Active CN215856433U (en) | 2021-09-08 | 2021-09-08 | Device for improving uniformity of electroplated layer of mini LED circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215856433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114592232A (en) * | 2022-02-23 | 2022-06-07 | 江苏东方九天新能源材料有限公司 | Integral titanium basket for high-speed steel strip continuous nickel plating unit |
-
2021
- 2021-09-08 CN CN202122162223.6U patent/CN215856433U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114592232A (en) * | 2022-02-23 | 2022-06-07 | 江苏东方九天新能源材料有限公司 | Integral titanium basket for high-speed steel strip continuous nickel plating unit |
| CN114592232B (en) * | 2022-02-23 | 2023-10-13 | 江苏东方九天新能源材料有限公司 | Integral titanium basket for high-speed steel belt continuous nickel plating unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104862767B (en) | Copper plating tank | |
| US4534832A (en) | Arrangement and method for current density control in electroplating | |
| CN101054701B (en) | Method of increasing electroplating evenness | |
| CN215856433U (en) | Device for improving uniformity of electroplated layer of mini LED circuit board | |
| KR101613406B1 (en) | Device for vertical galvanic metal deposition on a substrate | |
| CN204874804U (en) | Copper facing groove | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| CN115613106B (en) | Device and method for electroplating copper electrode of plug-in solar cell | |
| CN115896904A (en) | Wafer electroplating cavity structure | |
| CN102605397A (en) | Electroplating system and electroplating method | |
| US5281325A (en) | Uniform electroplating of printed circuit boards | |
| CN201924097U (en) | Electroplating device | |
| CN216107306U (en) | Shape-variable electroplated titanium basket | |
| TWI649458B (en) | Plating apparatus | |
| CN208071833U (en) | A kind of Novel electric copper plating groove pontoon bridge | |
| CN214271077U (en) | Novel electroplating pool with uniform electroplating | |
| JPH05148693A (en) | Copper electroplating jig | |
| CN215440740U (en) | Insoluble anode and pulse electroplating equipment | |
| CN211420358U (en) | Electrical terminal immersion fluid device | |
| CN112126966A (en) | Electroplating device for crystalline silicon solar cell electrode | |
| CN216947259U (en) | Automatic telescopic floating frame and PCB electroplating equipment | |
| CN221720969U (en) | Configuration structure of electroplating cylinder | |
| KR20100131279A (en) | Plating rack for uniform thickness plating of l0w amperage part | |
| CN215757684U (en) | Adjustable anode shielding plate for improving uniformity of copper plating | |
| CN113106527B (en) | Insoluble anode and pulse plating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |