CN215856139U - Multi-temperature-zone heating device - Google Patents
Multi-temperature-zone heating device Download PDFInfo
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- CN215856139U CN215856139U CN202122251167.3U CN202122251167U CN215856139U CN 215856139 U CN215856139 U CN 215856139U CN 202122251167 U CN202122251167 U CN 202122251167U CN 215856139 U CN215856139 U CN 215856139U
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Abstract
The application provides a many temperature zone heating device, provide the platform of heating microfluid chip through setting up heating platform, and the distributing type sets up a plurality of heating regions on heating platform, set up a heating member in every heating region respectively, heating platform includes a plurality of slits that correspond respectively with every heating member, the heating platform is stretched out by the slit that corresponds to the heating member, thereby realize that a plurality of heating members are independent respectively and heat microfluid chip, with provide the required temperature of DNA amplification in satisfying the microsome chip fast, thereby improve DNA reaction efficiency.
Description
Technical Field
The application relates to the field of microfluid heating, in particular to a multi-temperature-zone heating device.
Background
PCR (polymerase chain reaction) is a molecular biology technique for amplifying and amplifying specific DNA (deoxyribonucleic acid) fragments, and can be regarded as special DNA replication in vitro, and the biggest characteristic of PCR is that trace amount of DNA can be greatly increased. PCR is carried out by using DNA to become single strand when it is denatured at 95 deg.C in vitro, combining primer and single strand at low temperature (usually 50-70 deg.C) according to base complementary pairing principle, adjusting temperature to optimum reaction temperature (about 72 deg.C) of DNA polymerase, and synthesizing complementary strand by DNA polymerase along phosphoric acid to pentose direction. The PCR platform manufactured based on polymerase is actually a temperature control device, and can be well controlled among a denaturation temperature, a renaturation temperature and an extension temperature.
Most of the existing PCR platforms realize DNA replication in three temperature regions by adjusting the temperature of the platform, but the time consumption for adjusting the temperature of the platform is long, so that the reaction efficiency of the DNA is low.
SUMMERY OF THE UTILITY MODEL
In view of this, embodiments of the present application are directed to providing a multi-temperature zone heating apparatus, which solves the problems of long time consumption and low DNA reaction efficiency of PCR platform temperature adjustment.
An embodiment of the present application provides a multi-temperature zone heating device, includes: a heating platform configured to: providing a platform for heating the microfluidic chip; and a plurality of heating zones distributed on the heating platform; wherein, each heating area is provided with a heating body; the heating platform comprises a plurality of slits corresponding to the heating bodies respectively, and the heating bodies extend out of the heating platform from the corresponding slits.
In one embodiment, the multi-temperature zone heating apparatus further comprises: the hold-down mechanism is arranged at the bottom of the heating body and is structured as follows: and pressing the microfluid chip and the heating body.
In an embodiment, the compression mechanism comprises a resilient member.
In one embodiment, the multi-temperature zone heating apparatus further comprises: the heat dissipation mechanism is arranged below the heating platform and is structured as follows: and radiating the area between the adjacent heating areas.
In one embodiment, the heating stage comprises: a platform upper layer; the lower platform layer is stacked with the upper platform layer; the first heat dissipation channel is arranged between the upper platform layer and the lower platform layer; and the second heat dissipation channel among the heating areas is communicated with the first heat dissipation channel and the heat dissipation mechanism.
In one embodiment, the heat dissipation mechanism includes a heat dissipation fan.
In one embodiment, the multi-temperature zone heating apparatus further comprises: and the airflow buffer chamber is arranged between the heat radiation fan and the second heat radiation channel.
In one embodiment, the heat dissipation mechanism includes a heat dissipation water pump and a water tank.
In one embodiment, each of the heating bodies includes: a fixed part; the extension part is arranged above the fixing part along the vertical direction and is fixedly connected with the fixing part; the heating block is inserted into the fixing part and is connected with the fixing part; wherein, the extension part is far away from one side of the fixed part and is contacted with the microfluid chip to heat the microfluid chip.
In one embodiment, the width of the extension portion on the side away from the fixing portion is smaller than the width of the surface of the fixing portion on the side close to the extension portion.
In an embodiment, the heating body further includes: the clamping plate is assembled and connected with the fixing part; wherein, the fixed part is close to splint one side is including first recess and the second recess of range upon range of setting, splint are arranged in the first recess and with fixed part fixed connection, the heating piece is arranged in the second recess just the fixed part with splint press from both sides tightly the heating piece.
In one embodiment, the depth of the second groove is less than or equal to the thickness of the heating block.
In one embodiment, the multi-temperature zone heating apparatus further comprises: a temperature probe configured to: detecting the temperature value of the heating body; the side wall of the fixing part is provided with a temperature probe hole close to one end of the extension part, and the temperature probe is arranged in the temperature probe hole.
In one embodiment, the temperature of the plurality of heating zones is set according to the temperature required for the sequence of deoxyribonucleic acid amplification in the microfluidic chip.
In one embodiment, the heated platen comprises a fiberglass composite sheet.
In one embodiment, the length of the plurality of heating zones comprises 63.5 millimeters; and/or the width of the plurality of heating zones comprises 72 millimeters.
In an embodiment, the width of each of the heating zones comprises 2 mm to 6 mm.
In an embodiment, the thickness of the heating body comprises 6 mm; and/or the width of the upper surface of the heating body comprises 2 mm-6 mm.
In one embodiment, the spacing distance between adjacent heating bodies comprises 3 mm.
The embodiment of the application provides a many temperature zone heating device, provide the platform of heating microfluid chip through setting up heating platform, and the distributing type sets up a plurality of heating regions on heating platform, set up a heating member in every heating region respectively, heating platform includes a plurality of slits that correspond respectively with every heating member, the heating platform is stretched out by the slit that corresponds to the heating member, thereby realize that a plurality of heating members are independent respectively and heat microfluid chip, with provide the required temperature of DNA amplification in satisfying the microsome chip fast, thereby improve DNA reaction efficiency.
Drawings
Fig. 1 is a schematic perspective view of a multi-temperature zone heating apparatus according to an embodiment of the present disclosure.
Fig. 2 is a schematic front view of a multi-temperature zone heating apparatus according to another embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a multi-temperature-zone heating apparatus according to another embodiment of the present disclosure.
Fig. 4 is a schematic perspective view illustrating a heating body according to an embodiment of the present disclosure.
Fig. 5 is a schematic side view of a heating body according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Further, in the exemplary embodiments, since the same reference numerals denote the same components having the same structure or the same steps of the same method, if an embodiment is exemplarily described, only a structure or a method different from the already described embodiment is described in other exemplary embodiments.
Throughout the specification and claims, when one element is described as being "connected" to another element, the one element may be "directly connected" to the other element or "electrically connected" to the other element through a third element. Furthermore, unless explicitly described to the contrary, the term "comprising" and its corresponding terms should only be taken as including the stated features, but should not be taken as excluding any other features.
Fig. 1 is a schematic perspective view of a multi-temperature zone heating apparatus according to an embodiment of the present disclosure. As shown in fig. 1, the multi-temperature zone heating apparatus includes: a heating platform 1 and a plurality of heating zones 2; wherein the heating platform 1 is configured to: providing a platform for heating a microfluid chip, and distributing a plurality of heating areas 2 on a heating platform 1; each heating area 2 is internally provided with a heating body 3, the heating platform 1 comprises a plurality of slits corresponding to each heating body 3, and the heating bodies 3 extend out of the heating platform 1 through the corresponding slits.
Polymerase Chain Reaction (PCR) is a relatively simple genetic and genomics detection method, which can amplify a trace amount of samples to a degree that can be directly analyzed. The conventional detection method is to clone a DNA sequence into a vector and then replicate in living cells, but this method usually takes several days or weeks, while amplification of a DNA sequence by PCR requires several hours, so PCR can achieve more sensitive detection and higher level of amplification of a specific sequence in a shorter time. This makes PCR play an important role not only in basic research, but also in commercial applications, including gene identification, forensic identification, industrial quality control, and in vitro diagnostics. PCR is carried out by using DNA to be changed into single strand at 95 deg.C, combining primer and single strand at low temperature (usually 50-70 deg.C) according to base complementary pairing principle, adjusting temperature to DNA polymerase optimum reaction temperature (about 72 deg.C), and synthesizing complementary strand by DNA polymerase along phosphoric acid to pentose direction, wherein the core of PCR amplification method lies in temperature control during amplification. The PCR platform manufactured based on polymerase is actually a temperature control device, and can be well controlled among a denaturation temperature, a renaturation temperature and an extension temperature. Most PCR platforms realize DNA replication in three temperature regions by adjusting the temperature of the platform, but the time for adjusting the temperature of the platform is long, thereby resulting in low reaction efficiency of the DNA.
In order to solve the above problem, the present application provides a multi-temperature-zone heating device, where a plurality of heating zones 2 are disposed on a heating platform 1, each heating zone 2 is internally provided with a heating body 3, and a slit is disposed on the heating platform 1 corresponding to each heating body 3, so that each heating body 3 extends out of the heating platform 1 through the corresponding slit. When a microfluid chip carrying DNA is arranged on the heating platform 1, the top of the heating body 3 extends out of the slit to extend to the surface of the heating platform 1, namely, the heating body 3 is in direct contact with the microfluid chip to realize heating of the microfluid chip, and a plurality of heating regions 2 with different temperatures can be obtained by respectively controlling the heating temperatures of the plurality of heating bodies 3, so that the temperature requirement for amplification of the microfluid chip is met, and the reaction efficiency is improved.
The embodiment of the application provides a many temperature zone heating device, provide the platform of heating microfluid chip through setting up heating platform 1, and the distributing type sets up a plurality of heating regions 2 on heating platform 1, set up a heating member 3 in every heating region 2 respectively, heating platform 1 includes a plurality of slits that correspond respectively with every heating member 3, heating platform 1 is stretched out by the slit that corresponds to heating member 3, thereby realize that a plurality of heating members 3 are independent respectively heats the microfluid chip, with the required temperature of DNA amplification in satisfying the microsome chip is provided fast, thereby improve DNA reaction efficiency.
Fig. 2 is a schematic front view of a multi-temperature zone heating apparatus according to another embodiment of the present disclosure. As shown in fig. 2, the multi-temperature zone heating apparatus may further include: hold-down mechanism 4, this hold-down mechanism 4 sets up in heating member 3 bottom, and the structure is: the microfluid chip and the heating body 3 are pressed tightly. In a further embodiment, the pressing mechanism 4 may comprise an elastic member, such as a spring. In an embodiment, the pressing mechanism 4 may include a plurality of elastic members corresponding to the plurality of heating bodies 3, i.e., one elastic member is disposed at the bottom of each heating body 3. When the microfluid chip is arranged on the heating platform 1 and extrudes the heating body 3, the elastic component is utilized to provide upward elasticity to compress the heating body 3 and the microfluid chip, so as to ensure that the microfluid chip is tightly attached to the surface of the heating body 3, and the heating effect of the microfluid chip is improved. It should be understood that different structures of the pressing mechanism 4 may be selected according to requirements of practical application scenarios in the embodiment of the present application, as long as the selected specific structure of the pressing mechanism 4 can realize the attaching degree between the microfluidic chip and the heating body 3, and the specific structure of the pressing mechanism 4 is not limited in the embodiment of the present application.
Fig. 3 is a schematic structural diagram of a multi-temperature-zone heating apparatus according to another embodiment of the present disclosure. As shown in fig. 3, the multi-temperature zone heating apparatus may further include: the heat dissipation mechanism 5 is arranged below the heating platform 1 and is structured as follows: the heat is dissipated in the region between the adjacent heating regions 2. Because the micro-fluid chip is smaller, the distance between the adjacent heating regions 2 is smaller, the distance (millimeter level) between the adjacent heating bodies 3 is smaller, and each heating body 3 can radiate partial heat into the adjacent heating region 2 while radiating heat, so that the temperature of the adjacent heating regions 2 is interfered, and the temperature in each heating region 2 is difficult to accurately control. In order to solve the problem, the heat dissipation mechanism 5 is arranged below the heating platform 1, the heat dissipation mechanism 5 is used for dissipating heat of the area between the adjacent heating areas 2, so that the interference of the heat radiation of the heating body 3 on the adjacent heating areas 2 is reduced, the difficulty of accurate temperature control in the heating areas 2 is reduced as much as possible, the accuracy of the temperature in each heating area 2 is high, and the reaction efficiency and the effect of the microfluidic chip are improved.
In an embodiment, as shown in fig. 2 and 3, the heating platform 1 may include: the upper platform layer 11 and the lower platform layer 12 are arranged in a stacked mode, and a gap is reserved between the upper platform layer 11 and the lower platform layer 12 to form a first heat dissipation channel 13; wherein, the second heat dissipation channel 21 among the heating areas 2 is communicated with the first heat dissipation channel 13 and the heat dissipation mechanism 5. Through set up second heat dissipation channel 21 between adjacent heating region 2, set up first heat dissipation channel 13 between platform upper strata 11 and platform lower floor 12 to heat dissipation mechanism 5, second heat dissipation channel 21, first heat dissipation channel 13 communicate in proper order, in order to form a endless heat dissipation return circuit, realize the heat dissipation to the region between adjacent heating region 2, thereby guarantee that the accuracy of the interior temperature of every heating region 2 is higher, the reaction efficiency and the effect of microfluid chip have then been improved. It should be understood that different structures of the heating platform 1 may be selected according to requirements of an actual application scenario in the embodiment of the present application, for example, the heating platform 1 may be a single-layer structure, as long as the selected specific structure of the heating platform 1 can achieve heat dissipation of a region between adjacent heating regions 2, and the specific structure of the heating platform 1 is not limited in the embodiment of the present application. It should be further understood that different structures of the heat dissipation loop may be selected according to requirements of practical application scenarios in the embodiment of the present application, for example, the first heat dissipation channel 13 may be disposed below the heating platform 1, as long as the selected specific structure of the heat dissipation loop can achieve heat dissipation of the region between the adjacent heating regions 2, and the specific structure of the heat dissipation loop is not limited in the embodiment of the present application.
In one embodiment, the heat dissipation mechanism 5 may include a heat dissipation fan. Through setting up radiator fan, realize that the air current is by the bottom of heating member 3 via second heat dissipation channel 21, first heat dissipation channel 13, the region at heating platform 1 place of discharging at last to take away the radiant heat in the region between the adjacent heating region 2, thereby guarantee that the accuracy of every heating region 2 interior temperature is higher, improved microfluid chip's reaction efficiency and effect then. In an embodiment, as shown in fig. 3, the multi-temperature zone heating apparatus may further include: and an airflow buffering chamber 6, wherein the airflow buffering chamber 6 is arranged between the heat dissipation fan and the second heat dissipation channel 21. Through set up air current surge chamber 6 between radiator fan and second heat dissipation channel 21, can be with the air current buffer in air current surge chamber 6 to alleviate gas pressure, thereby guarantee the stability of air current in the heat dissipation return circuit, guaranteed the temperature stability of heating region 2 then, improve microfluid chip's reaction efficiency and effect.
In another embodiment, the heat dissipation mechanism 5 may further include a heat dissipation water pump and a water tank. Through setting up heat dissipation water pump and water tank to set up the water route in first heat dissipation channel 13 and second heat dissipation channel 21, thereby form heat dissipation water circulation circuit, with the radiation heat in the region between the adjacent heating region 2 of dispelling, thereby guarantee that the accuracy of every heating region 2 interior temperature is higher, improved microfluid chip's reaction efficiency and effect then. It should be understood that, according to the embodiment of the present application, different structures of the heat dissipation loop may be selected according to requirements of practical application scenarios, for example, an oil pump and an oil tank are arranged to implement oil-cooled heat dissipation, or a combination of multiple heat dissipation structures, as long as the selected specific structure of the heat dissipation loop can implement heat dissipation of the region between the adjacent heating regions 2, and the specific structure of the heat dissipation loop is not limited in the embodiment of the present application.
Fig. 4 is a schematic perspective view illustrating a heating body according to an embodiment of the present disclosure. As shown in fig. 4, the heating body 3 may include: a fixing portion 31, an extension portion 32, and a heating block 33; the extending portion 32 is disposed above the fixing portion 31 along the vertical direction and is fixedly connected to the fixing portion 31, the heating block 33 is inserted into the fixing portion 31 and is connected to the fixing portion 31, and one side of the extending portion 32 away from the fixing portion 31 contacts the microfluidic chip to heat the microfluidic chip. By inserting the heating block 33 inside the fixing portion 31 to provide heat with the heating block 33, and the heat is transferred to the extending portion 32 via the fixing portion 31, the microfluidic chip is disposed on a side surface of the extending portion 32 away from the fixing portion 31 to achieve heating of the microfluidic chip. By inserting the heating block 33 inside the fixing portion 31, when the heating block 33 is damaged or broken, the heating block 33 can be simply replaced to avoid replacement of the entire heating body 3, saving costs. In one embodiment, the width of the extending portion 32 on the side away from the fixing portion 31 is smaller than the width of the fixing portion 31 on the side close to the extending portion 32. The width of keeping away from fixed part 31 one side through setting up extension 32 is less than the width that fixed part 31 is close to extension 32 side surface, and when the upper surface of fixed part 31 was hugged closely to heating platform 1 lower surface, the surface of keeping away from fixed part 31 one side of extension 32 extended to being higher than heating platform 1's upper surface to the realization is spacing to heating platform 1, thereby makes heating body 3 can stretch out heating platform 1 fixed height (for example 1 millimeter), with the heating effect of guaranteeing heating body 3.
In an embodiment, as shown in fig. 4, the heating body 3 may further include: a clamping plate 34, wherein the clamping plate 34 is assembled and connected with the fixing part 31 to clamp the heating block 33. Wherein, splint 34 and fixed part 31 can be through bolt fixed connection, utilize splint 34 and fixed part 31 fixed connection and set up heating block 33 between splint 34 and fixed part 31, not only can realize heating block 33's fixed, simultaneously also can be fine realize splint 34, fixed part 31 and heating block 33's laminating be connected to evenly transmit the heat of heating block 33 to the extension portion 32 (or integrated into one piece) that is connected with fixed part 31, thereby realize the heating to microfluid chip. Specifically, as shown in fig. 5, one side of the fixing portion 31 close to the clamping plate 34 includes a first groove 35 and a second groove 36 which are stacked, the clamping plate 34 is disposed in the first groove 35 and fixedly connected with the fixing portion 31, and the heating block 33 is disposed in the second groove 36. By providing the first groove 35, the clamping plate 34 is placed in the first groove 35 to further improve the clamping strength of the clamping plate 34 and the fixing portion 31; by arranging the second groove 36 to accommodate the heating block 33, the heating block 33 can be fixed and thermally conducted simply, and the heating block 33 is convenient to replace.
In an embodiment, the depth of the second groove 36 may be less than or equal to the thickness of the heating block 33. Through the depth that sets up second recess 36 and be less than or equal to the thickness of heating block 33, when splint 34 and fixed part 31 fixed connection, can be better step up heating block 33 in order to realize the fixed of heating block 33, simultaneously with the better laminating of heating block 33 in order to improve the heat conduction effect.
In an embodiment, as shown in fig. 5, the width of the first groove 35 in the vertical direction may be greater than the width of the second groove 36 in the vertical direction. Through setting up first recess 35 along the width of vertical direction and being greater than the width of second recess 36 along vertical direction to when realizing loosening or relieving splint 34 and fixed part 31, can be convenient take off heating block 33 with change heating block 33, thereby improve the application scope of heating body 3.
In an embodiment, the multi-temperature zone heating apparatus may further include: a temperature probe provided at the heating body 3, configured to: the temperature value of the heating body 3 is detected. Specifically, as shown in fig. 4 and 5, a temperature probe hole 37 is provided in the side wall of the fixed portion 31 near one end of the extended portion 32, the temperature probe being provided in the temperature probe hole 37. The temperature value at the extension 32 of the heating body 3 is detected in real time by disposing a temperature probe (e.g., a temperature sensor, etc.) in the temperature probe hole 37 of the heating body 3, and the detected temperature value is fed back to the control device of the heating body 3 to accurately regulate and control the temperature of each heating body 3, so as to meet the heating temperature requirement of DNA amplification.
In one embodiment, the temperature of the plurality of heating zones 2 can be set according to the temperature required for the sequence of deoxyribonucleic acid amplification in the microfluidic chip. Specifically, according to the requirement of the amplification sequence of the DNA, 9 heating regions 2 are arranged on the heating platform 1, wherein the heating temperatures of the 9 heating regions 2 are 94 degrees, 72 degrees, 55 degrees, 72 degrees, and 94 degrees, respectively, so that the denaturation temperature, the renaturation temperature, and the extension temperature of the DNA amplification are met, and the reaction efficiency and the effect of the microfluidic chip are improved.
In one embodiment, the heated platen 1 may comprise a fiberglass composite board. By utilizing the characteristics of high temperature resistance and small thermal deformation of the glass fiber, the heating platform 1 with a flat surface can be prepared by adopting a glass fiber synthetic plate so as to improve the characteristics of high temperature resistance and small deformation of the heating platform 1 and further meet the heating requirement of DNA amplification. It should be understood that, in the embodiment of the present application, different materials of the heating platform 1 may be selected according to requirements of an actual application scenario, as long as the selected specific material of the heating platform 1 can meet the heating condition for DNA amplification, and the specific material of the heating platform 1 is not limited in the embodiment of the present application.
In an embodiment, the length of the plurality of heating zones 2 may comprise 63.5 millimeters; and/or the width of the multiple heating zones may comprise 72 millimeters. By setting the length and width of the heating region 2 to provide the heating region 2 satisfying the requirement of DNA amplification, the requirement of heating temperature for DNA amplification is ensured. In an embodiment, the width of each heating zone 2 comprises 2-6 mm. The problem of heat waste can be caused when the width of the heating area 2 is too large, and the problem of unsatisfactory heating effect can be caused when the width of the heating area 2 is too small, therefore, the application ensures the heating effect of the heating area 2 by setting the width range of the heating area 2. It should be understood that, in the embodiment of the present application, different lengths and widths of the heating region 2 may be selected according to requirements of practical application scenarios, as long as the selected length and width of the heating region 2 can meet heating requirements of DNA amplification, and the specific length and width of the heating region 2 are not limited in the embodiment of the present application.
In an embodiment, the thickness of the heating body 3 may comprise 6 mm; and/or the width of the upper surface of the heating body 3 may comprise between 2 mm and 6 mm. Can cause thermal waste when the upper surface width of heating member 3 is too big, and also can cause the unsatisfactory problem of heating effect when the upper surface width of heating member 3 is too little, consequently, this application is through the upper surface width scope that sets up heating member 3 to guarantee the heating effect of heating member 3. It should be understood that, in the embodiment of the present application, different thicknesses and widths of the heating body 3 may be selected according to requirements of practical application scenarios, as long as the selected thickness and width of the heating body 3 can meet the heating requirement of DNA amplification, and the specific thickness and width of the heating body 3 are not limited in the embodiment of the present application.
In an embodiment, the spacing distance between adjacent heating bodies 3 may comprise 3 mm. The interval distance between the adjacent heating member 3 can increase the interference between the adjacent heating member 3 when too small, and the interval distance between the adjacent heating member 3 can lead to the increase of the area of heating platform 1 when too big, consequently, this application can avoid the interference between the adjacent heating member 3 through setting up the interval distance between the adjacent heating member 3 and can include 3 millimeters, also can save the area of heating platform 1, save material. It should be understood that different spacing distances between adjacent heating bodies 3 may be selected according to the requirements of practical application scenarios in the embodiments of the present application, as long as the selected spacing distance between adjacent heating bodies 3 can meet the heating requirement of DNA amplification, and the specific spacing distance between adjacent heating bodies 3 is not limited in the embodiments of the present application.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.
Claims (10)
1. A multiple temperature zone heating apparatus, comprising:
a heating platform configured to: providing a platform for heating the microfluidic chip; and
a plurality of heating zones distributed on the heating platform; wherein, each heating area is provided with a heating body;
the heating platform comprises a plurality of slits corresponding to the heating bodies respectively, and the heating bodies extend out of the heating platform from the corresponding slits.
2. The multiple temperature zone heating apparatus of claim 1, further comprising:
the hold-down mechanism is arranged at the bottom of the heating body and is structured as follows: and pressing the microfluid chip and the heating body.
3. The multi-temperature zone heating apparatus of claim 2, wherein the compression mechanism comprises a resilient member.
4. The multiple temperature zone heating apparatus of claim 1, further comprising:
the heat dissipation mechanism is arranged below the heating platform and is structured as follows: and radiating the area between the adjacent heating areas.
5. The multiple temperature zone heating apparatus of claim 4, wherein the heating platform comprises:
a platform upper layer;
the lower platform layer is stacked with the upper platform layer; and
the first heat dissipation channel is arranged between the upper platform layer and the lower platform layer;
and the second heat dissipation channel among the heating areas is communicated with the first heat dissipation channel and the heat dissipation mechanism.
6. The multi-temperature zone heating apparatus of claim 5, wherein the heat dissipation mechanism comprises a heat dissipation fan.
7. The multi-temperature zone heating apparatus of claim 6, further comprising:
and the airflow buffer chamber is arranged between the heat radiation fan and the second heat radiation channel.
8. The multi-temperature zone heating apparatus of claim 5, wherein the heat dissipation mechanism comprises a heat dissipation water pump and a water tank.
9. The multiple temperature zone heating apparatus of claim 1, wherein each of the heating bodies comprises:
a fixed part;
the extension part is arranged above the fixing part along the vertical direction and is fixedly connected with the fixing part; and
the heating block is inserted into the fixing part and is connected with the fixing part;
wherein, the extension part is far away from one side of the fixed part and is contacted with the microfluid chip to heat the microfluid chip.
10. The multiple temperature zone heating apparatus of claim 9, wherein a width of the extension portion on a side of the extension portion remote from the fixing portion is smaller than a width of a surface of the fixing portion on a side of the extension portion.
Priority Applications (1)
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| CN202122251167.3U CN215856139U (en) | 2021-09-15 | 2021-09-15 | Multi-temperature-zone heating device |
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| CN202122251167.3U CN215856139U (en) | 2021-09-15 | 2021-09-15 | Multi-temperature-zone heating device |
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| CN215856139U true CN215856139U (en) | 2022-02-18 |
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