CN215838743U - Cleaning robot - Google Patents

Cleaning robot Download PDF

Info

Publication number
CN215838743U
CN215838743U CN202121476568.2U CN202121476568U CN215838743U CN 215838743 U CN215838743 U CN 215838743U CN 202121476568 U CN202121476568 U CN 202121476568U CN 215838743 U CN215838743 U CN 215838743U
Authority
CN
China
Prior art keywords
opening
cover plate
groove
cleaning robot
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202121476568.2U
Other languages
Chinese (zh)
Inventor
胡逸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Silver Star Intelligent Group Co Ltd
Original Assignee
Shenzhen Silver Star Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Silver Star Intelligent Technology Co Ltd filed Critical Shenzhen Silver Star Intelligent Technology Co Ltd
Priority to CN202121476568.2U priority Critical patent/CN215838743U/en
Application granted granted Critical
Publication of CN215838743U publication Critical patent/CN215838743U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manipulator (AREA)

Abstract

The embodiment of the utility model relates to the technical field of intelligent home furnishing, and discloses a cleaning robot, which comprises: a housing; the first cover plate is arranged in the shell, the first cover plate and the shell jointly enclose to form a sealed accommodating space, the first cover plate is provided with a first opening, and the first opening is communicated with the accommodating space; the circuit board is accommodated in the accommodating space; and the heat dissipation assembly is contacted with the heating element of the circuit board, at least part of the heat dissipation assembly is exposed out of the first cover plate through the first opening, and the heat dissipation assembly is hermetically connected with the periphery of the first opening. The first opening is formed in the first cover plate, the heat dissipation assembly is arranged at the first opening, the first opening is sealed to ensure the sealing performance in the accommodating space, meanwhile, heat generated by the heating element on the circuit board is conveniently conducted out of the accommodating space, and the working temperature of the heating element on the circuit board is stably maintained in a specific temperature range.

Description

Cleaning robot
Technical Field
The utility model relates to the technical field of intelligent home furnishing, in particular to a cleaning robot.
Background
Along with the higher requirements of people on living environment, more and more duplex houses and large-area houses are provided, and more attention is paid to intelligent household cleaning and health electric appliances represented by floor sweeping machines. The working principle of the existing sweeping robot is that the modes of brush sweeping and vacuum dust collection are mostly adopted to adsorb sundries on the ground into a garbage storage box of the robot, so that the function of sweeping the ground is completed.
In some usage scenarios, particularly in toilets or kitchens, etc., the sweeping robot will automatically determine and plan a sweeping path into the area to complete the sweeping. However, water or other liquids are easily collected in the area, and the cleaning brush of the sweeping robot can splash the water or other liquids onto the circuit control board in the robot in the rotating process, so that the moisture on the surface of the circuit board is too much, and all components on the circuit board are short-circuited or even ignited. Therefore, in order to ensure the normal operation of the internal circuit control panel of the robot, the internal part of the sweeping robot and the structural part of the internal circuit control panel are both subjected to sealing and waterproof treatment.
Most of the floor sweeping robots in the market have the functions of automation and decision making, and in order to achieve the functions, the internal circuit structure of the floor sweeping robot is more and more complex, so that the power consumption of a processor on an internal circuit control panel of the floor sweeping robot is higher, the sealing performance of the region where the internal circuit control panel is located is better after sealing and waterproof treatment, and the heat dissipation of the processor is not facilitated.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model aims to provide a cleaning robot, aiming at solving the problem that a heating element on an internal circuit control board of the cleaning robot is difficult to radiate heat.
In order to solve the above technical problem, one technical solution adopted by the embodiment of the present invention is: provided is a cleaning robot including: a housing; the first cover plate is arranged in the shell, the first cover plate and the shell jointly enclose to form a sealed accommodating space, the first cover plate is provided with a first opening, and the first opening is communicated with the accommodating space; the circuit board is accommodated in the accommodating space; and the heat dissipation assembly is in contact with the heating element of the circuit board, at least part of the heat dissipation assembly is exposed out of the first cover plate through the first opening, and the heat dissipation assembly is hermetically connected with the periphery of the first opening.
In some optional embodiments, the heat dissipation assembly includes a heat conducting member and a heat dissipation block, one surface of the heat conducting member is attached to the heat generating element on the circuit board, the other surface of the heat conducting member is attached to the heat dissipation block, the heat dissipation block is hermetically connected to the periphery of the first opening, and the heat dissipation block is exposed out of the first cover plate through the first opening.
In some optional embodiments, the cleaning robot further comprises a first seal member that is press-fitted between a periphery of the first opening and the heat dissipation assembly.
In some optional embodiments, a surface of the first cover plate facing away from the accommodating space is provided with a first accommodating groove, and a groove bottom of the first accommodating groove is provided with the first opening; the radiating block comprises a radiating block body and a protruding portion, the protruding portion is arranged on one surface of the radiating block body and integrally formed with the radiating block body, the protruding portion is inserted into the accommodating space from the first opening and abutted to the heat conducting piece, the radiating block body is connected with the periphery of the first opening in a sealing mode through the first sealing piece, part of the radiating block body is accommodated in the first accommodating groove, and the rest of the radiating block body extends out of the first accommodating groove.
In some optional embodiments, the first sealing element is accommodated in the groove bottom of the first accommodating groove, the first sealing element surrounds the first opening, the protruding portion is inserted into the first sealing element, and an end of a surface of the heat dissipation block connected with the protruding portion abuts against the first sealing element.
In some optional embodiments, the heat dissipation block further comprises a plurality of fins, and the fins are arranged on the other surface of the heat dissipation block body, which faces away from the protruding portion, at intervals.
In some optional embodiments, the first cover plate is provided with a second opening; the cleaning robot comprises a second cover plate and a second sealing element, the second cover plate is connected with the periphery of the second opening in a sealing mode, the second cover plate is provided with a wire outlet hole, the wire outlet hole is communicated with the accommodating space, and a lead of the circuit board is led out through the wire outlet hole and is sealed through the second sealing element.
In some optional embodiments, the second seal is integrally formed with the wire.
In some optional embodiments, a glue pouring groove is formed in a surface, away from the accommodating space, of the second cover plate, and the bottom of the glue pouring groove is provided with the wire outlet; the second sealing element is formed by pouring glue between the wall of the glue pouring groove and the lead.
In some optional embodiments, a surface of the first cover plate facing away from the accommodating space is provided with a second accommodating groove, and a groove bottom of the second accommodating groove is provided with the second opening; the surface of the second cover plate facing the accommodating space is provided with a clamping groove, wherein the groove wall of the second accommodating groove is inserted into the clamping groove.
In some optional embodiments, the cleaning robot further includes a third sealing member, two opposite surfaces of the third sealing member abut against an end surface of a groove wall of the second receiving groove and a groove bottom of the clamping groove, respectively, and the third sealing member surrounds the second opening.
The embodiment of the utility model has the beneficial effects that: according to the cleaning robot provided by the embodiment of the utility model, the first opening is formed in the first cover plate, the heat dissipation assembly is arranged at the first opening, the first opening is sealed to ensure the sealing property in the accommodating space, and meanwhile, the heat generated by the heating element on the circuit board is conveniently conducted to the outside of the accommodating space, so that the working temperature of the heating element on the circuit board is stably maintained in a specific temperature range, the problem that the heating element on the circuit control board in the cleaning robot is not easy to dissipate heat is solved, and the frequency reduction phenomenon of a processor caused by overhigh temperature in the prior art is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any creative effort.
Fig. 1 is a schematic structural diagram of a cleaning robot according to an embodiment of the present invention;
fig. 2 is a schematic structural view illustrating the cleaning robot shown in fig. 1, wherein the circuit board, the heat dissipation assembly and the first cover plate are mounted on the first housing;
FIG. 3 is a half-sectional view of the assembled structures of FIG. 2;
fig. 4 is an exploded view of the structures shown in fig. 2.
Detailed Description
In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It should be noted that when an element is referred to as being "fixed to" or "affixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 to 3, a cleaning robot according to an embodiment of the present invention includes a housing 10, a first cover plate 20, a circuit board 30, and a heat dissipation assembly 40. The first cover plate 20, the circuit board 30 and the heat sink assembly 40 are disposed in the housing 10. The first cover plate 20 is engaged with the housing 10, and the first cover plate 20 and the housing 10 together enclose a sealed receiving space (not shown). The first cover plate 20 is provided with a first opening 20b, and the first opening 20b is communicated with the accommodating space. The circuit board 30 is accommodated in the accommodating space, the heat dissipation assembly 40 contacts the heating element 31 on the circuit board 30, and at least part of the first cover plate 20 is exposed through the first opening 20b, and the heat dissipation assembly 40 is hermetically connected with the periphery of the first opening 20 b. The first opening 20b is opened through the first cover plate 20, and the heat dissipation assembly 40 is disposed at the first opening 20b, so that the first opening 20b is sealed to ensure the sealing property in the accommodating space, and at the same time, the heat generated by the heating element 31 on the circuit board 30 is conveniently conducted to the outside of the accommodating space, so that the operating temperature of the heating element 31 on the circuit board 30 is stably maintained in a specific temperature range.
It should be noted that the heating element 31 on the circuit board 30 in the embodiment of the present invention refers to a processor on the main control circuit board 30. Because the cleaning robot is in a working state, the processor on the main control circuit board 30 is maintained at a high power consumption due to a large workload, and further generates a large amount of geothermal energy. Of course, in other embodiments of the present invention, the heat generating component 31 on the circuit board 30 may also be a heat generating component 31 on the control circuit board 30, which is easy to generate heat, besides the processor.
Next, a description will be given of specific structures of the case 10, the first cover plate 20, the circuit board 30, and the heat dissipation assembly 40 in this order.
Referring to fig. 1, the housing 10 includes a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 cooperate to form a complete mounting support structure for mounting the above structures. The first housing 11 has a first screw hole (not shown), the second housing 12 has a second screw hole (not shown) corresponding to the first screw hole, the second screw hole penetrates through the second housing 12, and a threaded fastener (not shown) is respectively in threaded connection with the second screw hole and the first screw hole, so as to mount the first housing 11 on the second housing 12. Wherein, the first housing 11 is an upper housing 10 of the cleaning robot, and the second housing 12 is a lower housing 10 of the cleaning robot. It is understood that in other embodiments of the present invention, the first housing 11 and the second housing 12 may be connected by other types of connectors, and accordingly, only the connecting structures corresponding to the connectors need to be provided on the first housing 11 and the second housing 12. Next, a description will be given of a specific structure of the first housing 11 described above.
In the first housing 11, a mounting frame 13 is disposed on a surface of the first housing 11 facing the second housing 12, and the mounting frame 13 includes a first frame 131, a second frame 132, a third frame 133, and a fourth frame 134. The first frame 131, the second frame 132, the third frame 133 and the fourth frame 134 are sequentially connected end to form a frame structure. Wherein, any one of the frames of the mounting frame 13 is integrally formed with the first housing 11.
With reference to fig. 2 and fig. 3, the first cover plate 20 is mounted on the first housing 11, and the first cover plate 20 covers the opening of the mounting frame 13 facing the second housing 12. The first cover plate 20, the mounting frame 13, and the first housing 11 together enclose the accommodating space for accommodating the circuit board 30. Specifically, the first cover plate 20 includes a first main body portion 21, a connecting portion 22 and a first edge portion 23, which are integrally formed, the first main body portion 21 is connected to one end of the connecting portion 22, and the first edge portion 23 is connected to the other end of the connecting portion 22, wherein, along the installation direction of the circuit board 30, one end of the connecting portion 22 close to the first edge portion 23 is inclined to one end of the connecting portion 22 close to the first main body portion 21. In other words, the first body portion 21 is closer to the surface of the first housing 11 facing the second housing 12 than the first edge portion 23, that is, the volume of the accommodating space is smaller. With such arrangement, on one hand, heat generated when the main control circuit board 30 operates can be gathered, so that the temperature difference between the inside and the outside of the accommodating space is large, and heat conduction of the heat dissipation assembly 40 is facilitated; on the other hand, the occupied space of the first cover plate 20 is reduced, and the reasonable layout of the internal structure of the cleaning robot is facilitated. It is understood that the configuration of the first cover plate 20 can be adjusted according to the actual use situation, for example, in other embodiments of the present invention, the connecting portion 22 may not be disposed obliquely, i.e., the first main body portion 21 and the first edge portion 23 may be on the same horizontal plane. Next, specific configurations of the first body portion 21 and the first edge portion 23 will be explained in order.
Referring to fig. 3 and 4, the surface of the first main body 21 facing the second housing 12 is provided with a first receiving groove 20 a. The first housing groove 20a has a first opening 20b at the bottom thereof, the first opening 20b corresponds to the processor on the main control circuit board 30 at the first body 21, and the first opening 20b is used for communicating the inside of the housing space with the outside of the housing space. The opening area of the first opening 20b is smaller than the area of the first receiving groove 20 a.
Referring to fig. 4 again, the first edge 23 is provided with a sealing groove 20 c. The sealing groove 20c is circumferentially disposed on a surface of the first edge portion 23 facing the first housing 11, and the sealing groove 20c is used for inserting the mounting frame 13, so that any one of the frames of the mounting frame 13 abuts against a groove bottom of the sealing groove 20 c. The height of the groove wall of the sealing groove 20c on the side close to the connecting portion 22 is greater than the height of the groove wall of the sealing groove 20c on the side far from the connecting portion 22. Preferably, the groove wall end of the sealing groove 20c on the side away from the connecting portion 22 is chamfered, and the groove wall end of the sealing groove 20c on the side close to the connecting portion 22 is chamfered.
In order to reduce the phenomenon that water vapor passes through the gap between the mounting frame 13 and the sealing groove 20c and enters into the accommodating space to erode the circuit board 30. Further, the cleaning robot also comprises a sealing rubber ring. The sealing rubber ring is accommodated in the groove bottom of the first clamping groove, and two opposite surfaces of the sealing rubber ring respectively abut against the groove bottom of the sealing groove 20c and the end face of the mounting frame 13. With such an arrangement, the accommodating space has good sealing performance. It should be understood that in other embodiments of the present invention, the sealing may not be implemented by using a sealing rubber ring, and the first housing 11 and the first cover plate 20 may also be connected in a sealing manner by using other types of sealing members, and accordingly, only the sealing structures corresponding to the sealing members need to be provided on the first housing 11 and the first cover plate 20.
With reference to the circuit board 30, please refer to fig. 4, the circuit board 30 is accommodated in the accommodating space. The surface of the circuit board 30 facing the second housing 12 is further provided with a connection port 32, and the connection port 32 is used for connecting a wire to ensure data transmission and power supply of the circuit board 30.
Referring to fig. 4, the heat dissipating assembly 40 contacts the processor of the circuit board 30, and at least the first main portion 21 is exposed through the first opening 20b, and the heat dissipating assembly 40 is hermetically connected to the periphery of the first opening 20 b. Specifically, the heat dissipation assembly 40 includes a heat conduction member 41 and a heat dissipation block 42. The heat dissipation block 42 is disposed at the first opening 20b and hermetically connected to the peripheral edge of the first opening 20b, and the heat dissipation block 42 exposes the surface of the first main body 21 facing the second housing 12 through the first opening 20 b. The heat conducting member 41 is filled in a gap between the heat generating element 31 on the circuit board 30 and the heat dissipating block 42, one surface of the heat conducting member 41 is attached to the heat generating element 31 on the circuit board 30, and the other surface of the heat conducting member 41 is attached to the heat dissipating block 42. The heat conducting member 41 is a heat conducting gel. The heat conductive gel has good heat conductive performance, and can rapidly absorb and uniformly transfer heat generated by the heating element 31 to the heat dissipation block 42, so as to improve the heat dissipation efficiency of the heating element 31. In addition, the heat-conducting gel also has good adhesive property. The connection strength between the heat dissipation block 42 and the heat generating element 31 can also be enhanced by the heat conductive gel.
It is understood that in other embodiments of the present invention, the heat conducting member 41 may also adopt various heat conducting structures, for example, the heat conducting member 41 includes, but is not limited to, a heat pipe, and the heat pipe is filled with a heat conducting medium. The heat pipe includes but is not limited to copper pipe production, and the heat pipe is produced by using the copper pipe, so that the service life of the heat pipe can be prolonged. Heat pipes include, but are not limited to, round or square tubes. The heat-conducting medium includes, but is not limited to, water, and the use cost can be further reduced by adopting water as the heat-conducting medium. The number of the heat pipes can be adjusted according to the actual use condition, and can be one or more. Next, a specific structure of the heat radiation block 42 will be explained.
With reference to the heat slug 42, and with continued reference to fig. 4, the heat slug 42 is made of a material with better thermal conductivity. The heat slug 42 includes a heat slug body 421 and a protrusion 422. The protrusion 422 is disposed on the surface of the heat slug body 421 facing the receiving space and is integrally formed with the heat slug body 421, and the protrusion 422 is inserted into the receiving space from the first opening 20b and abuts against the heat conducting element 41. The heat slug body 421 is disposed on the first main body 21, a part of the heat slug body 421 is accommodated in the first accommodating groove 20a, and the rest of the heat dispersion block body 421 extends out of the accommodating space from the first accommodating groove 20 a. Wherein the area of the end surface of the protruding portion 422 facing the receiving space is equal to the opening area of the first opening 20 b. The area of the end surface of the heat slug body 421 facing the receiving space is equal to the area of the first receiving groove 20 a.
In order to increase the contact area between the heat slug body 421 and the air to improve the heat dissipation performance of the heat slug 42, optionally, the heat slug 42 further includes a plurality of fins 423. The plurality of fins 423 are integrally formed with the heat dissipation block body 421, and the plurality of fins 423 are disposed on the surface of the heat dissipation block body 421 facing the second housing 12 at intervals.
In order to reduce the phenomenon that moisture enters the accommodating space through the connection part of the heat dissipation block body 421 and the first accommodating groove 20a to corrode the circuit board 30, the cleaning robot further includes a first sealing element 50. The first sealing member 50 is disposed between the periphery of the first opening 20b and the heat dissipation assembly 40 in a pressing manner. Specifically, the first sealing element 50 is accommodated in the groove bottom of the first accommodating groove 20a, the first sealing element 50 surrounds the first opening 20b, the protruding portion 422 is inserted into the first sealing element 50, and the end of the surface of the heat dissipation block body 421 connected to the protruding portion 422 abuts against the first sealing element 50. Wherein the first seal 50 includes, but is not limited to, EVA hard bead. It is understood that in other embodiments of the present invention, the first sealing member 50 may not be used for sealing, and the first cover plate 20 and the heat dissipation assembly 40 may also be connected by other types of sealing members, and accordingly, only the sealing structure corresponding to the sealing member needs to be provided on the first cover plate 20 and the heat dissipation assembly 40.
To facilitate connection of the circuit board 30 to other components of the cleaning robot. Optionally, the cleaning robot further comprises a second cover plate 60. The second cover plate 60 is hermetically connected to the first cover plate 20 and covers the second opening 21 b. Specifically, the first cover plate 20 further defines a second opening 21b, and the position of the second opening 21b in the first main body 21 corresponds to the position of the connection port 32 in the circuit board 30. The lead wire can extend out of the accommodating space through the second opening 21 b. The surface of the first body 21 facing away from the receiving space is provided with a second receiving groove 21a, and the bottom of the second receiving groove 21a is provided with a second opening 21 b. The second cover plate 60 includes a second main body portion 61 and a second edge portion 62, and the second edge portion 62 is disposed on the outer periphery of the second main body portion 61 and is integrally formed with the second main body portion 61. The end face of the second main body portion 61 facing the second housing 12 is provided with a glue filling groove (not shown), a wire outlet (not shown) is formed at the bottom of the glue filling groove, the wire outlet is communicated with the accommodating space, and the wire outlet is used for a wire to pass through so that the wire extends out of the accommodating space. A slot (not shown) is disposed on a surface of the second edge 62 facing the receiving space, and the slot can be matched with a slot wall of the second receiving slot 21a, so that the slot wall of the second receiving slot 21a is inserted into the slot.
Further, the cleaning robot further includes a second sealing member 70. The second sealing member 70 is accommodated in the potting groove to seal the gap between the wire and the wire outlet hole. Specifically, the second sealing element 70 may be integrally formed with the wire to fill the potting groove. Alternatively, the second sealing member 70 is formed by potting between the walls of the potting groove and the wires.
Further, the cleaning robot further includes a third sealing member 80, the third sealing member 80 is received in the bottom of the slot, and the third sealing member 80 surrounds the second opening 21 b. The two opposite surfaces of the third sealing member 80 respectively abut against the end surface of the groove wall of the second accommodating groove 21a and the groove bottom of the locking groove. Wherein the third seal 80 includes, but is not limited to, a rubber sealing rubber ring.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (11)

1. A cleaning robot, characterized by comprising:
a housing;
the first cover plate is arranged in the shell, the first cover plate and the shell jointly enclose to form a sealed accommodating space, the first cover plate is provided with a first opening, and the first opening is communicated with the accommodating space;
the circuit board is accommodated in the accommodating space; and
the heat dissipation assembly is in contact with the heating element of the circuit board, at least part of the heat dissipation assembly is exposed out of the first cover plate through the first opening, and the heat dissipation assembly is connected with the periphery of the first opening in a sealing mode.
2. The cleaning robot according to claim 1,
the heat dissipation assembly comprises a heat conduction piece and a heat dissipation block, one surface of the heat conduction piece is attached to the heating element on the circuit board, the other surface of the heat conduction piece is attached to the heat dissipation block, the heat dissipation block is connected with the periphery of the first opening in a sealing mode, and the heat dissipation block is exposed out of the first cover plate through the first opening.
3. The cleaning robot according to claim 2,
the cleaning robot further comprises a first sealing piece, and the first sealing piece is arranged between the periphery of the first opening and the heat dissipation assembly in an extruding mode.
4. The cleaning robot according to claim 3,
a first accommodating groove is formed in the surface, deviating from the accommodating space, of the first cover plate, and a first opening is formed in the bottom of the first accommodating groove;
the radiating block comprises a radiating block body and a protruding portion, the protruding portion is arranged on one surface of the radiating block body and integrally formed with the radiating block body, the protruding portion is inserted into the accommodating space from the first opening and abutted to the heat conducting piece, the radiating block body is connected with the periphery of the first opening in a sealing mode through the first sealing piece, part of the radiating block body is accommodated in the first accommodating groove, and the rest of the radiating block body extends out of the first accommodating groove.
5. The cleaning robot according to claim 4,
the first sealing element is accommodated in the groove bottom of the first accommodating groove, the first sealing element surrounds the first opening, the protruding portion is inserted into the first sealing element, and the end portion of one surface, connected with the protruding portion, of the heat dissipation block abuts against the first sealing element.
6. The cleaning robot according to claim 4,
the radiating block further comprises a plurality of fins, and the fins are arranged on the other surface, deviating from the protruding portion, of the radiating block body at intervals.
7. The cleaning robot according to claim 1 or 2,
the first cover plate is provided with a second opening;
the cleaning robot comprises a second cover plate and a second sealing element, the second cover plate is connected with the periphery of the second opening in a sealing mode, the second cover plate is provided with a wire outlet hole, the wire outlet hole is communicated with the accommodating space, and a lead of the circuit board is led out through the wire outlet hole and is sealed through the second sealing element.
8. The cleaning robot of claim 7, wherein the second seal is integrally formed with the wire.
9. The cleaning robot according to claim 7,
a glue pouring groove is formed in the surface, deviating from the accommodating space, of the second cover plate, and the wire outlet hole is formed in the bottom of the glue pouring groove;
the second sealing element is formed by pouring glue between the wall of the glue pouring groove and the lead.
10. The cleaning robot according to claim 7,
a second accommodating groove is formed in the surface, deviating from the accommodating space, of the first cover plate, and a second opening is formed in the bottom of the second accommodating groove;
the surface of the second cover plate facing the accommodating space is provided with a clamping groove, wherein the groove wall of the second accommodating groove is inserted into the clamping groove.
11. The cleaning robot according to claim 10,
the cleaning robot further comprises a third sealing element, two opposite surfaces of the third sealing element are respectively abutted against the end face of the groove wall of the second containing groove and the groove bottom of the clamping groove, and the third sealing element surrounds the second opening.
CN202121476568.2U 2021-06-30 2021-06-30 Cleaning robot Active CN215838743U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121476568.2U CN215838743U (en) 2021-06-30 2021-06-30 Cleaning robot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121476568.2U CN215838743U (en) 2021-06-30 2021-06-30 Cleaning robot

Publications (1)

Publication Number Publication Date
CN215838743U true CN215838743U (en) 2022-02-18

Family

ID=80335669

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121476568.2U Active CN215838743U (en) 2021-06-30 2021-06-30 Cleaning robot

Country Status (1)

Country Link
CN (1) CN215838743U (en)

Similar Documents

Publication Publication Date Title
JP3126846U (en) Enclosed positive temperature coefficient thermistor heater
CN111193418A (en) Inverter with side-sliding structure
CN215838743U (en) Cleaning robot
CN110992663A (en) Network controller
CN213366693U (en) Lithium battery with waterproof function
CN105991090A (en) All-glue-pouring photovoltaic connecting box with three-side ventilation bottom and inverted and suspended internal diode
CN203278516U (en) Distributed type high protective grade frequency conversion driving integrated machine
CN212081759U (en) Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device
CN212909433U (en) Photovoltaic junction box
CN210781737U (en) Electronic information anti-interference device
CN210568871U (en) Motor fixing structure and air conditioner with same
CN216818232U (en) Ceramic housing of new energy automobile relay
CN211456383U (en) Switch cabinet with efficient heat dissipation structure
CN202335114U (en) High-power light-emitting diode (LED) power supply box
CN220639531U (en) High temperature resistant charger
CN110831366A (en) Intelligent power line carrier device
CN212961081U (en) Explosion-proof lamp
CN212085095U (en) Electricity storage device and electric vehicle
CN213394830U (en) Aquarium lamp capable of efficiently dissipating heat
CN216114393U (en) Automatically controlled box, outer machine of air conditioner and air conditioner
CN217522620U (en) Energy storage power supply and electric equipment
CN214014022U (en) Integrated synchronous servo motor
CN210601298U (en) Ceiling lamp that heat dispersion is good
CN220254332U (en) Inverter and electrical equipment
CN211579800U (en) Direct current motor with good heat dissipation effect

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 518000 1701, building 2, Yinxing Zhijie, No. 1301-72, sightseeing Road, Xinlan community, Guanlan street, Longhua District, Shenzhen, Guangdong Province

Patentee after: Shenzhen Yinxing Intelligent Group Co.,Ltd.

Address before: 518000 building A1, Yinxing hi tech Industrial Park, Guanlan street, Longhua District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Silver Star Intelligent Technology Co.,Ltd.