CN215837276U - Semiconductor refrigeration air conditioning suit - Google Patents
Semiconductor refrigeration air conditioning suit Download PDFInfo
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- CN215837276U CN215837276U CN202122182981.4U CN202122182981U CN215837276U CN 215837276 U CN215837276 U CN 215837276U CN 202122182981 U CN202122182981 U CN 202122182981U CN 215837276 U CN215837276 U CN 215837276U
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Abstract
The utility model discloses a semiconductor refrigeration air-conditioning suit, wherein the semiconductor refrigeration air-conditioning suit comprises a semiconductor refrigeration device and a suit, the semiconductor refrigeration device comprises a temperature adjusting component, a power supply component and an electric wire, the temperature adjusting component comprises a heat radiating piece, a semiconductor refrigeration piece and a heat conducting structure, the heat conducting structure comprises a heat insulating board and two oppositely arranged temperature equalizing boards, the heat insulating board is clamped between the two temperature equalizing boards, the heat insulating board is provided with a mounting hole, the semiconductor refrigeration piece is arranged in the mounting hole, two opposite surfaces of the semiconductor refrigeration piece are respectively abutted against the temperature equalizing boards, the heat radiating piece is connected with the power supply component through the electric wire, the semiconductor refrigeration piece is connected with the power supply component through the electric wire, the suit comprises a suit main body and a pocket, the pocket is connected with the suit main body, and the temperature adjusting component and the power supply component are positioned in the pocket and can be separated from the pocket. The technical scheme of the utility model can facilitate the disassembly and cleaning of the air-conditioning suit and improve the cooling effect of the air-conditioning suit.
Description
Technical Field
The utility model relates to the technical field of air-conditioning clothes, in particular to a semiconductor refrigeration air-conditioning clothes.
Background
For workers who work outdoors for a long time, such as building workers, duty sanitation workers, traffic police, mining workers and the like, due to the limitation and requirement of working conditions, thick special clothes need to be worn, the clothes have poor air permeability, and the external outdoor temperature is too high, so that the working efficiency and the body health of the workers cannot be influenced due to the fact that the workers cannot timely dissipate heat and cool. The existing air-conditioning clothes usually use air-cooling heat dissipation, and air is blown into the clothes by installing a fan on the clothes, so that the air in the clothes flows, and heat dissipation and cooling are realized. But when ambient temperature was higher, the fan can blow hot-blast to the human body, and the cooling effect is relatively poor. In addition, since the fan and the clothes are integrally connected, it is difficult to detach the fan to wash the clothes.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a semiconductor refrigeration air-conditioning suit, which aims to facilitate the disassembly and cleaning of the air-conditioning suit and improve the cooling effect of the air-conditioning suit.
In order to achieve the above object, the present invention provides a semiconductor-cooled air conditioning suit, comprising:
the semiconductor refrigeration device comprises a temperature regulation component, a power supply component and an electric wire, wherein the temperature regulation component comprises a heat radiation piece, a semiconductor refrigeration piece and a heat conduction structure, the heat conduction structure comprises a heat insulation plate and two oppositely arranged temperature equalization plates, the heat insulation plate is clamped between the two temperature equalization plates, the heat insulation plate is provided with a mounting hole, the semiconductor refrigeration piece is arranged in the mounting hole, two opposite surfaces of the semiconductor refrigeration piece are respectively abutted against one temperature equalization plate, the heat radiation piece is connected with the power supply component through the electric wire, and the semiconductor refrigeration piece is connected with the power supply component through the electric wire; and
a garment comprising a garment body and a pocket, the pocket being connected to the garment body, the temperature regulating component and the power component being located within the pocket and being detachable from the pocket.
Optionally, two opposite surfaces of the semiconductor refrigeration piece are respectively connected with the two temperature equalizing plates in a welding manner or in an adhesion manner.
Optionally, the heat sink comprises:
a fan, the fan and the power supply assembly being connected by the wire; and
the cooling plate, one side surface of heating plate with fan fixed connection, the opposite side surface of heating plate with one temperature-uniforming plate fixed connection, the heating plate is equipped with the wind channel, the wind channel with the fan intercommunication, the fan is used for driving the air in the wind channel flows so that one the temperature-uniforming plate cools down, the fan is along deviating from the direction of heating plate is bloied.
Optionally, there are at least two pockets, one pocket is used for placing the temperature adjusting component, the other pocket is used for placing the power supply component, the electric wire penetrates through the pocket, the electric wire is connected with the temperature adjusting component through a quick connector, and the electric wire is connected with the power supply component through a quick connector.
Optionally, the pocket has six, two liang of relative and bilateral symmetry of pocket set up, two the pocket is located the clothes main part back is placed the subassembly that adjusts the temperature, four in addition the pocket is located the clothes main part is preceding and the longitudinal symmetry sets up, wherein, the upside is two the pocket is placed the subassembly that adjusts the temperature, and the downside is two the pocket is placed power supply module.
Optionally, the pocket comprises:
an outer layer of fabric, the outer layer of fabric having mesh holes, the outer layer of fabric facing away from the garment body, an
The inner layer cloth is made of a heat-permeable material and is connected with the clothes main body, the inner layer cloth is connected with the outer layer cloth and encloses to form an accommodating space, the temperature adjusting assembly or the power supply assembly is located in the accommodating space, the inner layer cloth is provided with a through hole, the through hole is communicated with the accommodating space and the inner side of the clothes main body, and the electric wire penetrates through the through hole.
Optionally, the garment further comprises a connecting piece, the connecting piece is located on the inner surface of the garment body and is fixedly connected with the garment body, and the connecting piece detachably fixes the electric wire.
Optionally, the garment further comprises elastic bands, the elastic bands are positioned on the left side and the right side of the garment body to adjust the tightness of the garment body;
and/or the garment further comprises a magnetic zipper, and the magnetic zipper is positioned in the front of the garment body;
and/or, the clothes also comprise storage bags which are positioned at the left and right sides of the front of the clothes main body;
and/or, the clothing further comprises a connecting piece, the connecting piece is located on the inner surface of the clothing main body and is fixedly connected with the clothing main body, and the connecting piece detachably fixes the electric wire.
Optionally, the garment has an upper opening for passing through the head, a lower opening for passing through the torso, and two left and right oppositely disposed openings for passing through the hand.
Optionally, the power supply assembly comprises:
a power supply body located within the pocket; and
the power supply assembly comprises a power supply main body, a heat dissipation piece, a semiconductor refrigeration piece, a changeover switch, a power supply assembly main body, a changeover switch component and a semiconductor refrigeration piece, wherein the changeover switch is electrically connected with the power supply main body, the power supply assembly main body is electrically connected with the changeover switch, the changeover switch is electrically connected with the heat dissipation piece, the changeover switch is electrically connected with the semiconductor refrigeration piece, and the changeover switch switches the positive electrode and the negative electrode of the semiconductor refrigeration piece.
Optionally, the power supply module still includes the bluetooth mainboard, the bluetooth mainboard is located in the pocket, the bluetooth mainboard with power main part electric connection, the bluetooth mainboard with semiconductor refrigeration piece electric connection, the bluetooth mainboard is used for receiving or sending bluetooth signal and control the temperature of semiconductor refrigeration piece.
According to the technical scheme, the semiconductor refrigeration air-conditioning suit is clamped between the two temperature equalizing plates through the heat insulation plate to isolate heat transfer between the two temperature equalizing plates, the heat insulation plate is provided with the mounting hole, the semiconductor refrigeration piece is arranged in the mounting hole, two opposite surfaces of the semiconductor refrigeration piece are respectively abutted against one temperature equalizing plate, and the temperature equalizing plates can increase the heat transfer area so as to improve the heat transfer efficiency. The heat dissipation piece is electrically connected with the power supply assembly, and the semiconductor refrigeration piece is electrically connected with the power supply assembly. The electrified semiconductor refrigeration piece absorbs heat in the air conditioning suit through one temperature equalizing plate and transmits the heat to the heat radiating piece through the other temperature equalizing plate, the electrified heat radiating piece releases the heat to the external environment of the air conditioning suit, so that the heat in the air conditioning suit is transmitted to the air outside the air conditioning suit, the temperature in the air conditioning suit is reduced, and the cooling effect of the air conditioning suit can be effectively improved. The clothes comprise a clothes body and a pocket, the pocket is connected with the clothes body, the temperature adjusting component and the power supply component can be placed in the pocket and can also be taken out of the pocket, so that the temperature adjusting component and the power supply component can be separated from the pocket, the temperature adjusting component and the power supply component can be quickly detached from the clothes, the clothes are convenient to clean, and the air conditioning clothes are convenient to detach and clean.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a general schematic diagram of an embodiment of a semiconductor refrigerated air conditioning suit of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a semiconductor-cooled air conditioning suit of the present invention;
FIG. 3 is a front view of the semiconductor-refrigerated air conditioning suit according to an embodiment of the present invention;
FIG. 4 is a side view of the structure of one embodiment of the semiconductor refrigerated air conditioning suit of the present invention;
FIG. 5 is a top view of an embodiment of the semiconductor refrigerated air conditioning suit of the present invention;
FIG. 6 is a schematic view of the temperature regulating assembly of FIG. 1;
FIG. 7 is a cross-sectional view of the temperature conditioning assembly of FIG. 1;
fig. 8 is an exploded cross-sectional view of the temperature regulating assembly of fig. 1.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The working principle of the semiconductor refrigerating plate is based on the Peltier principle, namely, a circuit formed by two different semiconductors is utilized, when direct current is applied, heat is released on one side surface, and the heat is absorbed on the other side surface. The peltier effect causes a phenomenon that is reversible, in which the side surface that previously released heat becomes endothermic and the side surface that previously absorbed heat becomes exothermic when the direction of the current is changed. The heat absorbed or released by the semiconductor refrigerating sheet is proportional to the current intensity and is related to the properties of the two semiconductors and the temperature of the hot end.
The utility model provides a semiconductor refrigeration air conditioning suit.
As shown in fig. 1 to 8, in an embodiment of the present invention, the semiconductor-refrigerated air-conditioning suit 100 includes a semiconductor refrigeration device and a suit 30, the semiconductor refrigeration device includes a temperature adjustment assembly 11, a power supply assembly and an electric wire, the temperature adjustment assembly 11 includes a heat dissipation member 111, a semiconductor refrigeration sheet 113 and a heat conduction structure 115, the heat conduction structure 115 includes a heat insulation plate 1151 and two oppositely disposed temperature equalization plates 1153, the heat insulation plate 1151 is sandwiched between the two temperature equalization plates 1153, the heat insulation plate 1151 is provided with a mounting hole 1151a, the semiconductor refrigeration sheet 113 is disposed in the mounting hole 1151a, two opposite surfaces of the semiconductor refrigeration sheet 113 are respectively abutted against one temperature equalization plate 1153, the heat dissipation member 111 and the power supply assembly are connected through the electric wire, the semiconductor refrigeration sheet 113 and the power supply assembly are connected through the electric wire, the suit 30 includes a suit main body 31 and a pocket 33, the pocket 33 is connected with the suit main body 31, the temperature adjustment assembly 11 and the power supply assembly are located in the pocket 33, and may be removed from the pocket 33.
The heat insulation plate 1151 is clamped between the two temperature equalization plates 1153 to isolate heat transfer between the two temperature equalization plates 1153, the heat insulation plate 1151 is provided with a mounting hole 1151a, the semiconductor refrigeration piece 113 is arranged in the mounting hole 1151a, two opposite surfaces of the semiconductor refrigeration piece 113 are respectively abutted against one temperature equalization plate 1153, and the temperature equalization plates 1153 can increase heat transfer area to improve heat transfer efficiency. The heat dissipation member 111 is electrically connected to the power supply module, and the semiconductor cooling plate 113 is electrically connected to the power supply module. The electrified semiconductor refrigeration sheet 113 absorbs heat in the air-conditioning suit through one temperature equalizing plate 1153 and transfers the heat to the heat dissipation member 111 through the other temperature equalizing plate 1153, and the electrified heat dissipation member 111 releases the heat to the external environment of the air-conditioning suit, so that the heat in the air-conditioning suit is reduced, and the cooling effect of the semiconductor refrigeration air-conditioning suit 100 can be improved.
Specifically, the semiconductor cooling plate 113 and the power supply module are connected by an electric wire, and the semiconductor cooling plate 113 has two surfaces, namely a cold surface and a hot surface, which are oppositely arranged. When the power is on, the cold surface of the semiconductor refrigeration piece 113 can absorb heat, and the hot surface of the semiconductor refrigeration piece 113 can release heat. The cold side of semiconductor refrigeration piece 113 is with the heat of absorption to the hot side transmission of semiconductor refrigeration piece 113 to release the heat through this hot side, thereby make the cold side of semiconductor refrigeration piece 113 can continuously absorb the heat, and then the cold side of semiconductor refrigeration piece 113 can cool down. The cold surface of the semiconductor refrigeration sheet 113 is connected with the temperature equalizing plate 1153, and the temperature equalizing plate 1153 can increase the contact area and efficiently transfer heat. The side surface of the temperature equalizing plate 1153 away from the semiconductor chilling plate 113 faces the inside of the garment body 31 to absorb heat from the inside of the garment body 31. The heat is transferred to the hot side of the semiconductor chilling plate 113 through the cold side of the semiconductor chilling plate 113 that is energized. The heat radiating member 111 is connected to the hot surface of the semiconductor cooling plate 113, the heat radiating member 111 is connected to the power supply module through a wire, and the heat radiating member 111 can release heat to the air after being electrified, so that the heat in the clothes body 31 is transferred to the air outside the clothes body 31, and the temperature in the clothes body 31 is reduced. Compared with the air-conditioning suit which is cooled by blowing air into the clothes through the fan, the semiconductor-refrigerated air-conditioning suit 100 can be cooled actively and is slightly influenced by the temperature of the air, and even under the condition that the temperature of the air in the environment is high, the semiconductor-refrigerated air-conditioning suit 100 can also be cooled stably and reliably, so that the cooling effect can be effectively improved, no external air enters the semiconductor-refrigerated air-conditioning suit 100 to cool, and the feeling of a human body is more comfortable.
The garment 30 includes a garment body 31 and a pocket 33, the pocket 33 is connected to the garment body 31, the pocket 33 has an opening through which the temperature regulating assembly 11 and the power supply assembly can be placed into the pocket 33 or through which the temperature regulating assembly 11 and the power supply assembly can be removed from the pocket 33 so that the temperature regulating assembly 11 and the power supply assembly can be detached from the pocket 33, the temperature regulating assembly 11 and the power supply assembly can be quickly detached from the garment 30, thereby facilitating the cleaning of the garment 30 and, in turn, facilitating the detachment and cleaning of the semiconductor-refrigerated air-conditioning garment 100.
In addition, the heat dissipation member 111 may be a fan, a water cooling, or other effective heat dissipation methods.
The number of the pockets 33 is not limited, and the number of the pockets 33 may be 1, 2, 3, 4, 5, 6, 7, 8, or the like.
The number of the temperature adjusting components 11 can be 1, 2, 3, 4, etc., and the number of the temperature adjusting components 11 is not limited.
The number of power supply components may be 1, 2, 3, 4, etc., and the number of power supply components is not limited.
The temperature regulating assembly 11 and the power supply assembly may be placed in the same pocket 33, or the temperature regulating assembly 11 may be placed in one pocket 33 and the power supply assembly in the other pocket 33.
As shown in fig. 6 to 8, in an embodiment of the present invention, two opposite surfaces of the semiconductor chilling plate 113 are respectively connected with the two temperature equalizing plates 1153 by welding or bonding. So set up, can make semiconductor refrigeration piece 113 and two temperature-uniforming plates 1153's connection more reliable firm, and, can make two surfaces that semiconductor refrigeration piece 113 is relative closely laminate with two temperature-uniforming plates 1153's surface, the heat transfer efficiency between semiconductor refrigeration piece 113 and two temperature-uniforming plates 1153 has been improved effectively, and welding material or bonding material have higher heat conductivity, the heat transfer efficiency between semiconductor refrigeration piece 113 and two temperature-uniforming plates 1153 has further been improved effectively, thereby can improve the cooling effect of the refrigerated air conditioner clothes 100 of semiconductor.
In addition, the two opposite surfaces of the semiconductor cooling plate 113 are preferably welded to the two temperature equalization plates 1153, so that the welded connection is more reliable and firm, and the heat transfer efficiency is high. The solder material is preferably tin paste, and has high thermal conductivity. The welding mode of the two opposite surfaces of the semiconductor refrigeration sheet 113 and the two temperature equalizing plates 1153 can be low-temperature welding, brazing or other welding connection modes.
The two opposite surfaces of the semiconductor refrigeration sheet 113 are respectively connected with the two temperature equalizing plates 1153 through heat-conducting glue in a bonding mode, and the heat-conducting glue is good in heat conductivity and convenient to use.
As shown in fig. 6 to 8, in an embodiment of the present invention, the heat sink 111 includes a fan 1113 and a heat sink 1115, and the fan 1113 and the power module are connected by an electric wire. One side surface of the heat dissipation plate 1115 is fixedly connected with the fan 1113, the other side surface of the heat dissipation plate 1115 is fixedly connected with a temperature equalization plate 1153, the heat dissipation plate 1115 is provided with an air channel which is communicated with the fan 1113, the fan 1113 is used for driving air in the air channel to flow so as to cool the temperature equalization plate 1153, and the fan 1113 blows air in the direction away from the heat dissipation plate 1115.
As shown in fig. 3 to 6, in an embodiment of the present invention, there are at least two pockets 33, one pocket 33 is used for accommodating the temperature adjusting unit 11, the other pocket 33 is used for accommodating the power supply unit, the electric wires are inserted through the pockets 33, the electric wires are connected to the temperature adjusting unit 11 through a quick connector, and the electric wires are connected to the power supply unit through a quick connector.
The wire is detachably connected with the temperature adjusting component 11. One end of the wire is connected with the temperature adjusting component 11 through a quick connector, and the other end of the wire is connected with the power supply component through a quick connector. The quick connector is provided with an interface and a connector, and the quick connection of the electric wire can be realized by inserting the connector into the interface. The connector may be provided on the electric wire or on the power supply module or the temperature adjustment module 11, and when the connector is provided on the electric wire, the power supply module or the temperature adjustment module 11 is provided with the interface, and when the connector is provided on the power supply module or the temperature adjustment module 11, the electric wire is provided with the interface. With the arrangement, the power supply assembly or the temperature adjusting assembly 11 can be quickly detached from the electric wire, so that the power supply assembly, the temperature adjusting assembly 11 and the electric wire can be conveniently taken out of the garment 30, and the garment 30 can be conveniently cleaned. In addition, the power supply assembly or the temperature adjusting assembly 11 is detachably connected with the electric wire, so that the electric connection between the temperature adjusting assembly 11 and the power supply assembly can be conveniently and quickly disconnected, the emergency power failure can be realized, and the safety of the semiconductor refrigeration air conditioning suit 100 is effectively improved.
The temperature adjusting assembly 11 and the power supply assembly are placed in different pockets 33, so that the power supply assembly is prevented from being influenced by temperature change of the temperature adjusting assembly 11, the power supply assembly is protected, the weight and the volume can be balanced by separately placing the temperature adjusting assembly 11 and the power supply assembly, and the semiconductor refrigeration air-conditioning suit 100 is more convenient for human body movement after being worn.
As shown in fig. 1 to 5, in an embodiment of the present invention, there are six pockets 33, two pockets 33 are disposed opposite to each other and symmetrically disposed right and left, two pockets 33 are disposed on the back of the clothes body 31 and the temperature adjusting unit 11 is disposed thereon, and the other four pockets 33 are disposed on the front of the clothes body 31 and symmetrically disposed up and down, wherein the upper two pockets 33 are disposed on the temperature adjusting unit 11, and the lower two pockets 33 are disposed on the power supply unit.
The two pockets 33 are arranged at the front chest part of the clothes main body 31 and are arranged symmetrically left and right, and the temperature adjusting components 11 are arranged in the pockets 33, so that the temperature of the chest part of a human body can be effectively reduced after the human body wears the semiconductor refrigeration air conditioning clothes 100. The other two pockets 33 are arranged at the back part of the clothes main body 31 and are arranged symmetrically left and right, and the temperature adjusting components 11 are arranged in the pockets 33, so that the temperature of the back of a human body can be effectively reduced after the human body wears the semiconductor refrigeration air conditioning clothes 100. The remaining two pockets 33 are disposed at the abdominal portion of the garment body 31 and are disposed symmetrically left and right, power supply components are disposed in the pockets 33, the power supply components disposed in the left pocket 33 are electrically connected to the temperature adjusting component 11 in the left front chest pocket 33 and the temperature adjusting component 11 in the left back pocket 33, and the power supply components disposed in the right pocket 33 are electrically connected to the temperature adjusting component 11 in the right front chest pocket 33 and the temperature adjusting component 11 in the right back pocket 33. With the arrangement, the temperature of the back and the front chest of the human body can be effectively reduced simultaneously after the human body wears the semiconductor refrigeration air conditioning suit 100, so that the upper trunk of the human body is cooled and radiated, the weight can be balanced due to the bilateral symmetry arrangement, and the burden of the human body after wearing can be effectively reduced. In addition, the placement of the power supply assembly at the abdominal location of the garment 30 may facilitate control of the operation of the power supply assembly to control the temperature of the thermal regulating assembly 11 and, thus, the temperature of the semiconductor refrigerated air conditioning garment 100.
As shown in fig. 1 to 5, in an embodiment of the present invention, the pocket 33 includes an outer layer cloth and an inner layer cloth, the outer layer cloth is provided with a mesh hole, the outer layer cloth is away from the clothes body 31, the inner layer cloth is made of a heat-permeable material, the inner layer cloth is connected to the clothes body 31, the inner layer cloth is connected to the outer layer cloth and encloses a containing space, the temperature adjusting component 11 or the power supply component is located in the containing space, the inner layer cloth is provided with a through hole, the through hole communicates the containing space and the inside of the clothes body 31, and an electric wire passes through the through hole.
The clothes main body 31 is provided with a through hole, the periphery of the inner layer cloth is fixedly connected with the wall of the through hole so as to plug the through hole by the inner layer cloth, the inner layer cloth penetrates through the clothes main body 31, and one side surface of the inner layer cloth can be attached to a human body. The outer layer cloth is located the surface of clothes main part 31, and outer layer cloth has last periphery, lower periphery and the both sides periphery of controlling relative setting, and the lower periphery and the inlayer cloth fixed connection of outer layer cloth, the both sides periphery and the inlayer cloth fixed connection of controlling relative setting of outer layer cloth, and the last periphery and the inlayer cloth clearance of outer layer cloth set up to form the breach. The gap is positioned above the accommodating space formed by enclosing the outer layer cloth and the inner layer cloth, and the temperature adjusting component 11 or the power supply component can enter and exit the accommodating space through the gap. The inner cloth is provided with a through hole which is communicated with the accommodating space and the inside of the clothes main body 31. The electric wire is connected to the temperature adjusting unit 11 or the power supply unit through the through hole so that the electric wire is positioned on the inner side of the garment 30 to hide the electric wire, thereby effectively protecting the electric wire. The inner cloth is made of a heat-permeable material, so that the efficiency of transferring heat of a human body to the temperature adjusting component 11 can be improved, and the cooling effect can be effectively improved. The outer layer is provided with grid holes which are communicated with the accommodating space and the external environment, so that the heat emitted by the heat dissipation part 111 in the temperature adjustment component 11 can effectively pass through the grid holes to be released into the air of the external environment, and the semiconductor refrigeration air-conditioning suit 100 can effectively cool.
As shown in fig. 1 to 4, in an embodiment of the present invention, the garment 30 further includes elastic bands 35, and the elastic bands 35 are positioned at left and right sides of the garment body 31 to adjust the tightness of the garment body 31. The tightness of the garment body 31 can be conveniently adjusted through the elastic band 35, so that a human body can continuously cling to the heat absorbing surface of the temperature adjusting component 11, and the cooling effect of the semiconductor refrigeration air conditioning garment 100 can be improved. In addition, the elastic band 35 can make the semiconductor refrigeration air-conditioning suit 100 adapt to various human body shapes with different weights, thereby improving the applicability of the semiconductor refrigeration air-conditioning suit 100.
In addition, the elastic band 35 may be a japanese-letter adjustment buckle elastic band 35, an elastic band 35, or other elastic bands 35.
As shown in fig. 1-3, in one embodiment of the present invention, the garment 30 further includes a magnetically attractive zipper 37, and the magnetically attractive zipper 37 is located on the front of the garment body 31. The magnetic zipper 37 separates the front surface of the garment body 31 in the vertical direction, and the front surface of the garment body 31 can be separated by pulling the zipper to expose the inside of the garment body 31, so that the garment is convenient to wear. The conventional zipper can be operated with two hands, but the magnetic zipper 37 can be pulled up with only one hand. The magnetic zipper head can be automatically closed only by allowing the tail end of the zipper to be close to the other side of the zipper, and the action of embedding the zipper head is not needed. The magnetic zipper 37 can simplify the zipper pulling operation, thereby facilitating the wearing of the semiconductor refrigeration air conditioning suit 100.
As shown in fig. 1 to 5, in one embodiment of the present invention, the garment 30 further includes storage bags 39, and the storage bags 39 are located at the left and right sides of the front of the garment body 31. The storage bag 39 is disposed at the belly of the main body 31 of the garment to facilitate the placement of objects, thereby improving the practicability of the semiconductor-cooled air-conditioning garment 100.
As shown in fig. 1 to 5, in an embodiment of the present invention, the garment 30 further includes a connecting member, the connecting member is located on an inner surface of the garment body 31 and is fixedly connected with the garment body 31, and the connecting member detachably fixes the electric wire. The connecting piece has a fixed state and a loose state, the electric wire can be fixed on the inner surface of the clothes main body 31 when the connecting piece is in the fixed state, and the electric wire can be separated from the clothes main body 31 when the connecting piece is in the loose state, so that the electric wire and the clothes main body 31 can be conveniently disassembled and assembled, further the clothes 30 can be conveniently cleaned, and further the semiconductor refrigeration air conditioning clothes 100 can be conveniently disassembled and cleaned. .
In addition, it should be noted that the connecting member may be a hook and loop fastener, a snap fastener, or other detachable connecting members.
As shown in fig. 1 to 5, in an embodiment of the present invention, the garment 30 has an upper opening for passing through the head, a lower opening for passing through the torso, and two openings disposed opposite to each other on the left and right sides for passing through the hands. With the arrangement, the semiconductor-cooled air-conditioning suit 100 has no sleeves, so that the semiconductor-cooled air-conditioning suit 100 is convenient to wear.
As shown in fig. 1 to 6, in an embodiment of the present invention, the power supply assembly includes a power supply body and a switch, and the power supply body is located in the pocket 33. The change-over switch is electrically connected with the power supply main body, the power supply assembly main body is electrically connected with the change-over switch, the change-over switch is electrically connected with the heat dissipation member 111, the change-over switch is electrically connected with the semiconductor refrigeration piece 113, and the anode and the cathode electrically connected with the semiconductor refrigeration piece 113 are switched through the change-over switch.
When the semiconductor cooling fins 113 change the direction of current, the side surface that originally radiates heat becomes heat absorbing, and the side surface that originally absorbs heat becomes heat radiating. The semiconductor refrigeration piece 113 is switched by the change-over switch to be connected with the positive electrode and the negative electrode of the power supply main body, so that the current direction of the semiconductor refrigeration piece 113 is changed, the heat of one surface, close to a human body, of the semiconductor refrigeration piece 113 is released, the air-conditioning suit 100 for semiconductor refrigeration can be heated, and the temperature of the inner surface of the air-conditioning suit 100 for semiconductor refrigeration is increased. With the arrangement, the semiconductor refrigeration air conditioning suit 100 can be used for cooling for heat dissipation and heating for warming.
As shown in fig. 1 to 6, in an embodiment of the utility model, the power supply assembly further includes a bluetooth motherboard, the bluetooth motherboard is located in the pocket 33, the bluetooth motherboard is electrically connected to the power supply main body, the bluetooth motherboard is electrically connected to the semiconductor refrigeration piece 113, and the bluetooth motherboard is configured to receive or send a bluetooth signal and control the temperature of the semiconductor refrigeration piece 113.
The bluetooth mainboard can receive the bluetooth signal that cell-phone software sent to according to the output power of bluetooth signal control power main part, thereby change the output power of semiconductor refrigeration piece 113, with the inside temperature of adjusting the refrigerated air conditioner clothes 100 of semiconductor. With the arrangement, the internal temperature of the semiconductor refrigeration air-conditioning suit 100 can be adjusted through the mobile phone, so that the operation is simplified, and the internal temperature of the semiconductor refrigeration air-conditioning suit 100 can be conveniently adjusted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An air conditioning suit with semiconductor refrigeration, comprising:
the semiconductor refrigeration device comprises a temperature regulation component, a power supply component and an electric wire, wherein the temperature regulation component comprises a heat radiation piece, a semiconductor refrigeration piece and a heat conduction structure, the heat conduction structure comprises a heat insulation plate and two oppositely arranged temperature equalization plates, the heat insulation plate is clamped between the two temperature equalization plates, the heat insulation plate is provided with a mounting hole, the semiconductor refrigeration piece is arranged in the mounting hole, two opposite surfaces of the semiconductor refrigeration piece are respectively abutted against one temperature equalization plate, the heat radiation piece is connected with the power supply component through the electric wire, and the semiconductor refrigeration piece is connected with the power supply component through the electric wire; and
a garment comprising a garment body and a pocket, the pocket being connected to the garment body, the temperature regulating component and the power component being located within the pocket and being detachable from the pocket.
2. The semiconductor-refrigerated air conditioning suit of claim 1, wherein two opposite surfaces of the semiconductor refrigeration sheet are respectively connected with the two temperature equalizing plates by welding or bonding.
3. A semiconductor-refrigerated air conditioning suit as claimed in claim 2 wherein the heat sink comprises:
a fan, the fan and the power supply assembly being connected by the wire; and
the cooling plate, one side surface of heating plate with fan fixed connection, the opposite side surface of heating plate with one temperature-uniforming plate fixed connection, the heating plate is equipped with the wind channel, the wind channel with the fan intercommunication, the fan is used for driving the air in the wind channel flows so that one the temperature-uniforming plate cools down, the fan is along deviating from the direction of heating plate is bloied.
4. A semiconductor-refrigerated air conditioning suit according to claim 3 wherein there are at least two of said pockets, one of said pockets housing said temperature regulating components and the other of said pockets housing said power supply components, said wires passing through said pockets, said wires being connected to said temperature regulating components by quick connectors, and said wires being connected to said power supply components by quick connectors.
5. The air conditioning suit with semiconductor refrigeration of claim 4, wherein six pockets are provided, two pockets are arranged oppositely and bilaterally symmetrically, two pockets are arranged on the back of the suit body and are used for placing the temperature adjusting components, and the other four pockets are arranged in front of the suit body and are arranged symmetrically, wherein the temperature adjusting components are placed in the two pockets on the upper side, and the power supply components are placed in the two pockets on the lower side.
6. A semiconductor-refrigerated air conditioning suit as recited in claim 5 wherein said pocket comprises:
an outer layer of fabric, the outer layer of fabric having mesh holes, the outer layer of fabric facing away from the garment body, an
The inner layer cloth is made of a heat-permeable material and is connected with the clothes main body, the inner layer cloth is connected with the outer layer cloth and encloses to form an accommodating space, the temperature adjusting assembly or the power supply assembly is located in the accommodating space, the inner layer cloth is provided with a through hole, the through hole is communicated with the accommodating space and the inner side of the clothes main body, and the electric wire penetrates through the through hole.
7. A semiconductor-refrigerated air conditioning garment as recited in claim 6 further comprising elastic bands positioned on the left and right sides of the garment body to adjust the tightness of the garment body;
and/or the garment further comprises a magnetic zipper, and the magnetic zipper is positioned in the front of the garment body;
and/or, the clothes also comprise storage bags which are positioned at the left and right sides of the front of the clothes main body;
and/or, the clothing further comprises a connecting piece, the connecting piece is located on the inner surface of the clothing main body and is fixedly connected with the clothing main body, and the connecting piece detachably fixes the electric wire.
8. The semiconductor-refrigerated air conditioning suit of claim 7 wherein the suit has an upper port for passing through the head, a lower port for passing through the torso, and two left and right oppositely disposed ports for passing through the hands.
9. A semiconductor-refrigerated air conditioning suit as claimed in claim 1 wherein the power supply assembly comprises:
a power supply body located within the pocket; and
the power supply assembly comprises a power supply main body, a heat radiation piece, a semiconductor refrigeration piece and a switch, wherein the power supply main body is located in the pocket, the switch is electrically connected with the power supply main body, the power supply assembly main body is electrically connected with the switch, the switch is electrically connected with the heat radiation piece, the switch is electrically connected with the semiconductor refrigeration piece, and the switch converts the positive electrode and the negative electrode of the semiconductor refrigeration piece.
10. The semiconductor-cooled air conditioning suit of claim 9, wherein the power supply assembly further comprises a bluetooth motherboard, the bluetooth motherboard is located in the pocket, the bluetooth motherboard is electrically connected with the power supply body, the bluetooth motherboard is electrically connected with the semiconductor refrigeration sheet, and the bluetooth motherboard is used for receiving or sending bluetooth signals and controlling the temperature of the semiconductor refrigeration sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122182981.4U CN215837276U (en) | 2021-09-09 | 2021-09-09 | Semiconductor refrigeration air conditioning suit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122182981.4U CN215837276U (en) | 2021-09-09 | 2021-09-09 | Semiconductor refrigeration air conditioning suit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215837276U true CN215837276U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122182981.4U Active CN215837276U (en) | 2021-09-09 | 2021-09-09 | Semiconductor refrigeration air conditioning suit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215837276U (en) |
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2021
- 2021-09-09 CN CN202122182981.4U patent/CN215837276U/en active Active
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