CN215834716U - Multilayer structure millimeter wave antenna - Google Patents
Multilayer structure millimeter wave antenna Download PDFInfo
- Publication number
- CN215834716U CN215834716U CN202121998831.4U CN202121998831U CN215834716U CN 215834716 U CN215834716 U CN 215834716U CN 202121998831 U CN202121998831 U CN 202121998831U CN 215834716 U CN215834716 U CN 215834716U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- copper
- circuit board
- clad layer
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Waveguide Aerials (AREA)
Abstract
The utility model discloses a multilayer structure millimeter wave antenna which comprises four layers of printed circuit boards and three layers of prepreg layers, wherein the printed circuit boards and the prepreg layers are alternately stacked, copper-clad layers are respectively arranged on the upper end face and the lower end face of each printed circuit board, a plurality of rectangular horn antenna units which are arranged in a rectangular grid mode are arranged at the top of the multilayer structure millimeter wave antenna, and a rectangular quasi-coaxial feed-ground coplanar waveguide feed three-level feed structure is adopted to lead a feed line out to the back face of the multilayer structure millimeter wave antenna; the utility model provides a semi-open two-stage rectangular horn antenna structure based on a 4-layer PCB, and a rectangular quasi-coaxial feed-strip ground coplanar waveguide feed three-stage feed structure is adopted, so that the back feed of the antenna is realized.
Description
Technical Field
The utility model relates to the technical field of antenna equipment, in particular to a multilayer structure millimeter wave antenna.
Background
With the development of millimeter wave technology, the demand of multilayer structure millimeter wave antennas in engineering application is more vigorous, and low-cost, expandable and high-performance multilayer structure millimeter wave antennas are the development direction of multilayer structure millimeter wave antennas. The traditional multilayer structure millimeter wave antenna based on the PCB (printed circuit board) process adopts a series-fed patch antenna form, has the advantages of simple structure, low cost and easiness in processing, is not beneficial to expansion, forms a phased array antenna, adopts the series-fed form, is provided with a transceiver chip and an antenna on the same side, is not beneficial to the expansion of the antenna, and has adverse effects on the radiation performance of the antenna by a series-fed line and the chip.
In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical defects, the technical scheme adopted by the utility model is that the multilayer structure millimeter wave antenna comprises four layers of printed circuit boards and three layers of prepreg layers, wherein the printed circuit boards and the prepreg layers are alternately stacked, copper-clad layers are respectively arranged on the upper end face and the lower end face of each printed circuit board, a plurality of rectangular horn antenna units which are arranged in a rectangular grid mode are arranged at the top of the multilayer structure millimeter wave antenna, and a feed line is led out to the back face of the multilayer structure millimeter wave antenna by adopting a rectangular quasi-coaxial feed-ground coplanar waveguide feed three-level feed structure.
Preferably, the printed circuit board comprises a first printed circuit board, a second printed circuit board, a third printed circuit board and a fourth printed circuit board from top to bottom, a first semi-solidified sheet layer is arranged between the first printed circuit board and the second printed circuit board, a second semi-solidified sheet layer is arranged between the second printed circuit board and the third printed circuit board, and a third semi-solidified sheet layer is arranged between the third printed circuit board and the fourth printed circuit board.
The preferred, first printed circuit board be provided with the rectangle horn antenna unit of inboard feed on the second printed circuit board, rectangle horn antenna unit is including setting up upper end port on the first printed circuit board is in with the setting lower extreme port on the second printed circuit board, the upper end port runs through first printed circuit board sets up, the lower extreme port runs through the second printed circuit board sets up, the upper end port with the cross section of lower extreme port all sets up to the rectangle, just the rectangular dimension of upper end port is greater than the rectangular dimension of lower extreme port.
Preferably, four rectangular horn antenna units are arranged, and the rectangular horn antenna units are arranged in a rectangular grid on the first printed circuit board and the second printed circuit board.
Preferably, a first copper-clad layer and a second copper-clad layer are respectively arranged on two end faces of the first printed circuit board, and the second copper-clad layer is arranged between the first semi-cured sheet layer and the first printed circuit board; the first copper-clad layer and the second copper-clad layer are identical in structure, the non-copper-clad area in the first copper-clad layer and the second copper-clad layer is set to be a rectangle with the same size as the cross section of the upper end port, and the non-copper-clad area in the first copper-clad layer and the second copper-clad layer and the upper end port are correspondingly arranged.
Preferably, a third copper-clad layer is arranged on the end face of the second printed circuit board, and the third copper-clad layer is arranged between the first semi-cured sheet layer and the second printed circuit board; and the non-copper-clad area in the third copper-clad layer is set to be a rectangle with the same size as the cross section of the lower end port, and the non-copper-clad area in the third copper-clad layer is arranged corresponding to the lower end port.
Preferably, a fourth copper-clad layer is arranged on the end face of the second printed circuit board, and the fourth copper-clad layer is arranged between the second prepreg layer and the second printed circuit board; the end face of the third printed circuit board is provided with a fifth copper-clad layer, the fifth copper-clad layer is arranged between the second prepreg layer and the third printed circuit board, the non-copper-clad region in the fourth copper-clad layer is set to be T-shaped and comprises a first rectangular horn region and a first quasi-coaxial feed region, the fifth copper-clad layer is set to be of a rectangular structure which is symmetrically arranged, the non-copper-clad region in the fifth copper-clad layer is set to be T-shaped and comprises a second rectangular horn region and a second quasi-coaxial feed region, the first rectangular horn region and the second rectangular horn region are set to be rectangles with the same cross section size as the lower end port, the first rectangular horn region, the second rectangular horn region and the lower end port are correspondingly arranged, the first quasi-coaxial feed region extends out from the first rectangular horn region, and the second quasi-coaxial feed region extends out from the second rectangular horn region, the first quasi-coaxial feed area and the second quasi-coaxial feed area are correspondingly arranged; and a quasi-coaxial feed structure feed line in a straight copper-clad type is arranged in a non-copper-clad region in the fifth copper-clad layer, and the quasi-coaxial feed structure feed line is led out of the second rectangular horn region to the second quasi-coaxial feed region.
Preferably, a sixth copper-clad layer is arranged on the end face of the third printed circuit board, and the sixth copper-clad layer is arranged between the third prepreg layer and the third printed circuit board; the sixth copper-clad layer is arranged into two symmetrically arranged rectangular structures and is a reflection ground of the lower end port.
Preferably, a seventh copper-clad layer and an eighth copper-clad layer are respectively arranged on two end faces of the fourth printed circuit board, the seventh copper-clad layer is arranged between the third prepreg layer and the fourth printed circuit board, and the seventh copper-clad layer is arranged in a rectangular structure and is a ground of the ground coplanar waveguide feed structure; the eighth copper-clad layer comprises an outer metal ground of the ground coplanar waveguide feed structure and four ground coplanar waveguide feed lines, and the ground coplanar waveguide feed lines are bent to the same side, distributed at equal intervals and matched with the chip pins.
Preferably, a first metalized via hole, a second metalized via hole, a fourth metalized via hole, a fifth metalized via hole and a sixth metalized via hole are further arranged in the multilayer structure millimeter wave antenna; first metallization via hole runs through first layer microstrip board, second metallization via hole runs through first layer microstrip board with second layer microstrip board, fourth metallization via hole runs through second layer microstrip board, fifth metallization via hole runs through fourth layer microstrip board, sixth metallization via hole runs through third layer microstrip board with fourth layer microstrip board, sixth metallization via hole is used for coaxial feed structure inner conductor. And two ends of the sixth metalized through hole are respectively connected with the ground coplanar waveguide feeder line and the quasi-coaxial feeder structure feeder line.
Compared with the prior art, the utility model has the beneficial effects that: the utility model provides a semi-open two-stage rectangular horn antenna structure based on a 4-layer PCB, and a rectangular quasi-coaxial feed-strip ground coplanar waveguide feed (GCPW) three-stage feed structure is adopted, so that the feed of the back of an antenna is realized; the small rectangular horn reflection ground at the lower part of the antenna unit adopts a reflection ground with the area equivalent to that of the small rectangular horn, and the periphery of the reflection ground is not provided with a metal wall formed by adopting metallized through holes, so that the structure avoids the occurrence of interlaminar crossed metallized holes among the multi-layer microstrip plates under the condition of not influencing the performance of the antenna, the processing difficulty of the antenna is reduced, and the adoption of a secondary rectangular horn antenna structure is favorable for expanding the bandwidth of the antenna; the multilayer structure millimeter wave antenna can be used for millimeter wave automobile radars, human body security check instruments and the like, and has high engineering application value.
Drawings
Fig. 1 is a structural view of the multilayer-structured millimeter wave antenna;
FIG. 2 is a perspective view of a three-dimensional structure of the multilayer millimeter wave antenna;
FIG. 3 is a structural view of the first copper clad layer;
FIG. 4 is a structural view of the third copper-clad layer;
FIG. 5 is a structural view of the fourth copper-clad layer;
FIG. 6 is a structural view of the fifth copper-clad layer;
FIG. 7 is a structural view of the sixth copper clad layer;
FIG. 8 is a structural view of the seventh copper-clad layer;
FIG. 9 is a structural view of the eighth copper clad layer;
FIG. 10 is a structural view of the first metalized via;
FIG. 11 is a structural view of the second metalized via;
FIG. 12 is a structural view of the third metalized via;
FIG. 13 is a structural view of the fourth metalized via;
FIG. 14 is a structural view of the fifth metalized via;
FIG. 15 is a structural view of the sixth metalized via;
FIG. 16 is a vertical directional diagram of a single transmit subarray according to an embodiment;
FIG. 17 is a graph of gain in the direction of the narrow side of an antenna according to an embodiment;
fig. 18 is a diagram showing gain in the broadside direction of the antenna according to the embodiment.
The figures in the drawings represent:
11-a first printed circuit board; 12-a second printed circuit board; 13-a third printed circuit board; 14-a fourth printed circuit board; 21-a first semi-cured ply layer; 22-a second prepreg layer; 23-a third prepreg layer; 31-a first copper clad layer; 32-a second copper clad layer; 33-a third copper clad layer; 34-a fourth copper clad layer; 35-a fifth copper clad layer; 36-a sixth copper clad layer; 37-a seventh copper clad layer; 38-an eighth copper clad layer; 41-a first metallized via; 42-a second metallized via; 43-a third metallized via; 44-a fourth metallized via; 45-a fifth metalized via; 46-a sixth metalized via; 5-quasi-coaxial feed structure feed line; 6-strip ground coplanar waveguide feed lines.
Detailed Description
The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
The multilayer structure millimeter wave antenna comprises four layers of printed circuit boards and three layers of prepreg layers, wherein the printed circuit boards and the prepreg layers are alternately stacked, copper-clad layers are arranged on the upper end face and the lower end face of each printed circuit board, a plurality of rectangular horn antenna units which are arranged in a rectangular grid mode are arranged on the top of the multilayer structure millimeter wave antenna, and a feed line is led out to the back face of the multilayer structure millimeter wave antenna by adopting a rectangular quasi-coaxial feed-ground coplanar waveguide feed three-level feed structure to realize back face feed.
Specifically, as shown in fig. 1 and fig. 2, fig. 1 is a structural view of the multilayer millimeter wave antenna; FIG. 2 is a perspective view of a three-dimensional structure of the multilayer millimeter wave antenna; the printed circuit board comprises a first printed circuit board 11, a second printed circuit board 12, a third printed circuit board 13 and a fourth printed circuit board 14 from top to bottom, the first printed circuit board 11 and a first semi-solidified sheet layer 21 is arranged between the second printed circuit board 12, the second printed circuit board 12 and a second semi-solidified sheet layer 22 is arranged between the third printed circuit board 13, and the third printed circuit board 13 and a third semi-solidified sheet layer 23 is arranged between the fourth printed circuit board 14.
A first copper-clad layer 31 and a second copper-clad layer 32 are respectively arranged on two end faces of the first printed circuit board 11, and the second copper-clad layer 32 is arranged between the first semi-cured sheet layer 21 and the first printed circuit board 11;
a third copper-clad layer 33 and a fourth copper-clad layer 34 are respectively arranged on two end faces of the second printed circuit board 12, the third copper-clad layer 33 is arranged between the first prepreg layer 21 and the second printed circuit board 12, and the fourth copper-clad layer 34 is arranged between the second prepreg layer 22 and the second printed circuit board 12;
a fifth copper-clad layer 35 and a sixth copper-clad layer 36 are respectively arranged on two end faces of the third printed circuit board 13, the fifth copper-clad layer 35 is arranged between the second prepreg layer 22 and the third printed circuit board 13, and the sixth copper-clad layer 36 is arranged between the third prepreg layer 23 and the third printed circuit board 13;
a seventh copper-clad layer 37 and an eighth copper-clad layer 38 are respectively disposed on two end surfaces of the fourth printed circuit board 14, and the seventh copper-clad layer 37 is disposed between the third prepreg layer 23 and the fourth printed circuit board 14.
First printed circuit board 11 be provided with the rectangle horn antenna unit of inboard feed on the second printed circuit board 12, rectangle horn antenna unit is including setting up upper end port on the first printed circuit board 11 is in with setting up lower extreme port on the second printed circuit board 12, the upper end port runs through first printed circuit board 11 sets up, the lower extreme port runs through second printed circuit board 12 sets up, the upper end port with the cross-section of lower extreme port all sets up to the rectangle, just the rectangular dimension of upper end port is greater than the rectangular dimension of lower extreme port.
Preferably, four rectangular horn antenna units are arranged, and the rectangular horn antenna units are arranged in a rectangular grid on the first printed circuit board 11 and the second printed circuit board 12.
As shown in fig. 3 and 4, fig. 3 is a structural view of the first copper clad layer; FIG. 4 is a structural view of the third copper-clad layer; the first copper-clad layer 31 and the second copper-clad layer 32 have the same structure, non-copper-clad regions in the first copper-clad layer 31 and the second copper-clad layer 32 are arranged to be rectangular with the cross section of the upper end port in the same size, and the non-copper-clad regions in the first copper-clad layer 31 and the second copper-clad layer 32 are arranged to correspond to the upper end port. The non-copper-clad area in the third copper-clad layer 33 is set to be a rectangle with the same size as the cross section of the lower end port, and the non-copper-clad area in the third copper-clad layer 33 is set to correspond to the lower end port.
As shown in fig. 5 and 6, fig. 5 is a structural view of the fourth copper-clad layer; FIG. 6 is a structural view of the fifth copper-clad layer; the copper area is covered to the non-in the fourth copper layer 34 and is set up to the T type, including first rectangle loudspeaker district and first accurate coaxial feed area, the fifth copper layer 35 that covers sets up the rectangle structure that the bisymmetry set up, the copper area is covered to the non-in the fifth copper layer 35 that covers sets up to the T type, including second rectangle loudspeaker district and the accurate coaxial feed area of second, first rectangle loudspeaker district with second rectangle loudspeaker district set up to with the unanimous rectangle of lower extreme port cross section size, just first rectangle loudspeaker district with second rectangle loudspeaker district with the corresponding setting of lower extreme port, first accurate coaxial feed area by first rectangle loudspeaker district stretches out, the accurate coaxial feed area of second by second rectangle loudspeaker district stretches out, first accurate coaxial feed area with the accurate coaxial feed area of second corresponds the setting. A quasi-coaxial feed structure feeder 5 of a straight copper-clad type is arranged in a non-copper-clad region in the fifth copper-clad layer 35, and the quasi-coaxial feed structure feeder 5 is led out of the second rectangular horn region to be arranged in the second quasi-coaxial feed region.
As shown in fig. 7, fig. 7 is a structural view of the sixth copper clad layer; the sixth copper-clad layer 36 is configured as two symmetrically arranged rectangular structures, and is a reflective ground of the lower port.
As shown in fig. 8, fig. 8 is a structural view of the seventh copper clad layer; the seventh copper-clad layer 37 is configured as a rectangular structure, and is the ground of the strip-ground coplanar waveguide feed structure.
As shown in fig. 9, fig. 9 is a structural view of the eighth copper clad layer; the eighth copper-clad layer 38 comprises the outer metal ground of the strip-ground coplanar waveguide feed structure and four strip-ground coplanar waveguide feed lines 6, and the strip-ground coplanar waveguide feed lines 6 are bent to the same side and distributed at equal intervals to match with the chip pins.
As shown in fig. 10 to 15, fig. 10 is a structural view of the first metalized via; FIG. 11 is a structural view of the second metalized via; FIG. 12 is a structural view of the third metalized via; FIG. 13 is a structural view of the fourth metalized via; FIG. 14 is a structural view of the fifth metalized via; fig. 15 is a structural view of the sixth metalized via.
A first metalized via hole 41, a second metalized via hole 42, a third metalized via hole 43, a fourth metalized via hole 44, a fifth metalized via hole 45 and a sixth metalized via hole 46 are further arranged in the multilayer structure millimeter wave antenna;
first metallization via hole 41 runs through first layer microstrip board, second metallization via hole 42 runs through first layer microstrip board with second layer microstrip board, third metallization via hole 43 runs through first layer microstrip board second layer microstrip board third layer microstrip board fourth layer microstrip board, fourth metallization via hole 44 runs through second layer microstrip board, fifth metallization via hole 45 runs through fourth layer microstrip board, sixth metallization via hole 46 runs through third layer microstrip board with fourth layer microstrip board.
The height of the upper end port is the same as that of the first printed circuit board 11, and a metal wall effect is achieved by adopting metalized via holes around the upper end port, namely the first metalized via hole 41; the height of the lower end port is the same as the height of the second printed circuit board 12, and the periphery of the lower end port is also provided with a metallized via hole to realize a metal wall effect, namely the fourth metallized via hole 44.
The sixth metallized via 46 is for a coaxial feed structure inner conductor. And two ends of the sixth metalized via hole 46 are respectively connected with the ground coplanar waveguide feeder line 6 and the quasi-coaxial feed structure feeder line 5.
Preferably, the reflective ground of the lower port is located on the lower surface of the third pcb 13, i.e. the sixth copper-clad layer 36, and the reflective bottom is equal to the size of the lower port. And in the third layer of printed circuit board, no rectangular metallized holes are arranged around the reflecting ground to realize the metal wall effect, and the arrangement is to avoid the occurrence of interlaminar staggered metallized holes so as to avoid bringing difficulty to the antenna processing.
Preferably, the rectangular quasi-coaxial feed-strip ground coplanar waveguide feed (GCPW) tertiary feed structure has a rectangular feed line located on the upper surface of the third printed circuit board, the feed line starts from the cavity of the small rectangular horn, is led out from the long edge of the inner side of the small rectangular horn, and ends at the central metalized hole (equivalent coaxial structure inner conductor) of the coaxial feed structure, and a plurality of metalized holes (equivalent rectangular quasi-coaxial structure outer conductors), that is, the second metalized via holes 42, are arranged outside the rectangular quasi-coaxial feed structure. The central metallized hole (equivalent coaxial structure inner conductor) of the coaxial feed structure, i.e. the sixth metallized via hole 46, penetrates through the third printed circuit board and the fourth printed circuit board, and the outer conductor of the coaxial feed structure is formed by a plurality of metallized holes distributed in a circular manner, i.e. the third metallized via hole 43. The GCPW structure is located on the fourth layer of printed circuit board, the GCPW structure is located on the upper surface of the fourth layer of printed circuit board, the GCPW feeder is located on the lower surface of the fourth layer of printed circuit board, metallized holes are formed in two sides of the GCPW feeder, and therefore the metal wall effect is achieved through the fifth metallized through holes 45.
Preferably, the rectangular quasi-coaxial feed-strip ground coplanar waveguide feed (GCPW) three-stage feed structure is characterized in that the rectangular quasi-coaxial feed lines of the four antenna units are all led to the inner side from the outer side, the coaxial feed structure is positioned among the four antenna units and arranged in a rectangular grid, the four antenna feed lines are led to the same side of the lower surface of the fourth layer of PCB through the transmission of the three-stage feed structure, and are distributed at equal intervals and consistent with the pin pitch of the receiving and transmitting chip.
Preferably, a plurality of metallized holes penetrating through the first to fourth layers of PCBs are added between the 4 antenna unit coaxial feed structures to enhance the electromagnetic isolation effect among the antenna units and ensure the continuity of the antenna grounding.
Preferably, the 4 antenna units form an antenna sub-array, and the antenna sub-array is periodically extended to form an antenna array.
The utility model provides a semi-open two-stage rectangular horn antenna structure based on a 4-layer PCB, and a rectangular quasi-coaxial feed-strip ground coplanar waveguide feed (GCPW) three-stage feed structure is adopted, so that the feed of the back of an antenna is realized; the small rectangular horn reflection ground at the lower part of the antenna unit adopts a reflection ground with the area equivalent to that of the small rectangular horn, and the periphery of the reflection ground is not provided with a metal wall formed by adopting metallized through holes, so that the structure avoids the occurrence of interlaminar crossed metallized holes among the multi-layer microstrip plates under the condition of not influencing the performance of the antenna, the processing difficulty of the antenna is reduced, and the adoption of a secondary rectangular horn antenna structure is favorable for expanding the bandwidth of the antenna; the multilayer structure millimeter wave antenna can be used for millimeter wave automobile radars, human body security check instruments and the like, and has high engineering application value.
Examples
The millimeter wave antenna with the multilayer structure and working at 77-81GHz comprises 4 Rogers 3003 microstrip plates with the thickness of 0.127mm, the thickness of copper-clad layers on the upper surface and the lower surface of each microstrip plate is 17.5 mu m, and adjacent microstrip plates are bonded by adopting 0.1mm prepregs. This antenna has contained 4 antenna element, and antenna size of a dimension is long 10mm, and wide 7.6mm, antenna element loudspeaker cavity centre-to-centre spacing are long limit 5mm, broadside 3.8 mm. The 4-layer microstrip board corresponds to 8 copper-clad layers, and each copper-clad layer pattern is as shown in fig. 3 to fig. 9 when viewed from top to bottom. Correspondingly, in order to shield and isolate the antenna unit and provide continuous grounding between the upper layer and the lower layer, 6 different types of metallized holes are provided, the minimum diameter of the metallized hole is 0.2mm, and the positions of the metallized holes are shown in fig. 10-15.
The first, second, fourth, fifth, and sixth metalized vias have a diameter of 0.2 mm; the diameters of the third metallized through holes are of three types, wherein the small diameter is 0.2mm, the medium diameter is 0.3mm, and the large diameter is 0.5 mm.
The results of the standing wave and gain diagram of the multilayer millimeter wave antenna are shown in fig. 16 to 18. The antenna comprises 4 antenna units, and the standing wave ratio of the antenna units is less than 2 in the range of 77 GHz-81 GHz. The gain diagram of the antenna in the narrow side direction is shown in fig. 17, the gain diagram in the wide side direction is shown in fig. 18, the antenna can form effective lobes in two directions, particularly in the wide side direction, the antenna unit spacing is large, grating lobes appear, but the grating lobes are far away, and the azimuth direction target resolution is not affected. The large unit spacing is adopted, the number of units can be reduced under the condition of the same antenna area, and the antenna processing difficulty and cost are reduced.
The foregoing is merely a preferred embodiment of the utility model, which is intended to be illustrative and not limiting. It will be understood by those skilled in the art that various changes, modifications and equivalents may be made therein without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (10)
1. The multilayer structure millimeter wave antenna is characterized by comprising four layers of printed circuit boards and three layers of prepreg layers, wherein the printed circuit boards and the prepreg layers are alternately stacked, copper-clad layers are arranged on two end faces of each printed circuit board, a plurality of rectangular horn antenna units which are arranged in a rectangular grid mode are arranged at the top of the multilayer structure millimeter wave antenna, and a rectangular quasi-coaxial feed-ground coplanar waveguide feed three-level feed structure is adopted to lead out a feed line to the back face of the multilayer structure millimeter wave antenna.
2. The multilayer millimeter-wave antenna according to claim 1, wherein the printed circuit boards comprise a first printed circuit board, a second printed circuit board, a third printed circuit board and a fourth printed circuit board from top to bottom, a first prepreg layer is arranged between the first printed circuit board and the second printed circuit board, a second prepreg layer is arranged between the second printed circuit board and the third printed circuit board, and a third prepreg layer is arranged between the third printed circuit board and the fourth printed circuit board.
3. The multilayer structure millimeter-wave antenna according to claim 2, wherein the first printed circuit board and the second printed circuit board are provided with internally fed rectangular horn antenna elements, the rectangular horn antenna elements include upper end ports provided on the first printed circuit board and lower end ports provided on the second printed circuit board, the upper end ports are provided through the first printed circuit board, the lower end ports are provided through the second printed circuit board, the cross sections of the upper end ports and the lower end ports are both provided in a rectangular shape, and the rectangular size of the upper end ports is larger than that of the lower end ports.
4. The multilayer structure millimeter-wave antenna according to claim 3, wherein four rectangular horn antenna elements are provided, and the rectangular horn antenna elements are arranged in a rectangular grid on the first printed circuit board and the second printed circuit board.
5. The multilayer structure millimeter wave antenna according to claim 3, wherein a first copper-clad layer and a second copper-clad layer are respectively provided on both end faces of the first printed circuit board, the second copper-clad layer being provided between the first prepreg layer and the first printed circuit board; the first copper-clad layer and the second copper-clad layer are identical in structure, the non-copper-clad area in the first copper-clad layer and the second copper-clad layer is set to be a rectangle with the same size as the cross section of the upper end port, and the non-copper-clad area in the first copper-clad layer and the second copper-clad layer and the upper end port are correspondingly arranged.
6. The multilayer structure millimeter wave antenna according to claim 5, wherein the second printed circuit board end face is provided with a third copper-clad layer, the third copper-clad layer being provided between the first prepreg layer and the second printed circuit board; and the non-copper-clad area in the third copper-clad layer is set to be a rectangle with the same size as the cross section of the lower end port, and the non-copper-clad area in the third copper-clad layer is arranged corresponding to the lower end port.
7. The multilayer millimeter-wave antenna according to claim 6, wherein the second printed circuit board end face is provided with a fourth copper-clad layer, the fourth copper-clad layer being provided between the second prepreg layer and the second printed circuit board; the end face of the third printed circuit board is provided with a fifth copper-clad layer, the fifth copper-clad layer is arranged between the second prepreg layer and the third printed circuit board, the non-copper-clad region in the fourth copper-clad layer is set to be T-shaped and comprises a first rectangular horn region and a first quasi-coaxial feed region, the fifth copper-clad layer is set to be of a rectangular structure which is symmetrically arranged, the non-copper-clad region in the fifth copper-clad layer is set to be T-shaped and comprises a second rectangular horn region and a second quasi-coaxial feed region, the first rectangular horn region and the second rectangular horn region are set to be rectangles with the same cross section size as the lower end port, the first rectangular horn region, the second rectangular horn region and the lower end port are correspondingly arranged, the first quasi-coaxial feed region extends out from the first rectangular horn region, and the second quasi-coaxial feed region extends out from the second rectangular horn region, the first quasi-coaxial feed area and the second quasi-coaxial feed area are correspondingly arranged; and a quasi-coaxial feed structure feed line in a straight copper-clad type is arranged in a non-copper-clad region in the fifth copper-clad layer, and the quasi-coaxial feed structure feed line is led out of the second rectangular horn region to the second quasi-coaxial feed region.
8. The multilayer structure millimeter wave antenna according to claim 7, wherein the third printed circuit board end face is provided with a sixth copper-clad layer, the sixth copper-clad layer being provided between the third prepreg layer and the third printed circuit board; the sixth copper-clad layer is arranged into two symmetrically arranged rectangular structures and is a reflection ground of the lower end port.
9. The multilayer structure millimeter wave antenna according to claim 8, wherein a seventh copper-clad layer and an eighth copper-clad layer are respectively disposed on two end faces of the fourth printed circuit board, the seventh copper-clad layer is disposed between the third prepreg layer and the fourth printed circuit board, and the seventh copper-clad layer is disposed in a rectangular structure and is a ground of the strip-ground coplanar waveguide feed structure; the eighth copper-clad layer comprises an outer metal ground of the ground coplanar waveguide feed structure and four ground coplanar waveguide feed lines, and the ground coplanar waveguide feed lines are bent to the same side, distributed at equal intervals and matched with the chip pins.
10. The multilayer structure millimeter wave antenna according to claim 9, wherein a first metalized via, a second metalized via, a fourth metalized via, a fifth metalized via, and a sixth metalized via are further provided in the multilayer structure millimeter wave antenna; first metallization via hole runs through first printed circuit board, second metallization via hole runs through first printed circuit board with second printed circuit board, fourth metallization via hole runs through second printed circuit board, fifth metallization via hole runs through fourth printed circuit board, sixth metallization via hole runs through third printed circuit board with fourth printed circuit board, sixth metallization via hole is used for coaxial feed structure inner conductor, the both ends of sixth metallization via hole are connected respectively take ground coplane waveguide feeder with quasi-coaxial feed structure feeder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121998831.4U CN215834716U (en) | 2021-08-23 | 2021-08-23 | Multilayer structure millimeter wave antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121998831.4U CN215834716U (en) | 2021-08-23 | 2021-08-23 | Multilayer structure millimeter wave antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215834716U true CN215834716U (en) | 2022-02-15 |
Family
ID=80196673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121998831.4U Active CN215834716U (en) | 2021-08-23 | 2021-08-23 | Multilayer structure millimeter wave antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215834716U (en) |
-
2021
- 2021-08-23 CN CN202121998831.4U patent/CN215834716U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7446710B2 (en) | Integrated LTCC mm-wave planar array antenna with low loss feeding network | |
| EP3252870B1 (en) | Antenna module | |
| CN114069219B (en) | Microstrip phased array antenna unit and array thereof | |
| US20080316097A1 (en) | Radio frequency (rf) transition design for a phased array antenna system utilizing a beam forming network | |
| US7609210B2 (en) | Phased array antenna system utilizing a beam forming network | |
| CN109860990B (en) | Broadband dual polarized antenna based on integrated substrate gap waveguide | |
| WO2020142171A1 (en) | System and method with multilayer laminated waveguide antenna | |
| CN218849758U (en) | Microstrip waveguide conversion transition structure based on non-radiation side feed | |
| CN107293842B (en) | Butler matrix network structure based on medium integrated suspension line | |
| CN111262025A (en) | Integrated substrate gap waveguide beam scanning leaky-wave antenna | |
| CN116130953A (en) | Low-profile modular tile active phased array antenna | |
| CN112670704A (en) | Oblique 45-degree polarized radiation broadband tile-type phased array antenna | |
| CN113690603B (en) | Millimeter wave antenna | |
| CN111478033B (en) | Gear type slot conventional ISGW leaky-wave antenna array | |
| CN215834716U (en) | Multilayer structure millimeter wave antenna | |
| CN210111048U (en) | Microstrip array antenna | |
| EP2006956B1 (en) | System and method for a radio frequency (RF) transition design for a phased array antenna system utilizing a beam forming network | |
| CN115036701B (en) | Vehicle-mounted radar antenna unit based on non-radiation side-fed waveguide structure | |
| CN110957574A (en) | Strip line feed broadband millimeter wave antenna unit | |
| CN216529333U (en) | Circularly polarized antenna structure | |
| CN115332766A (en) | Millimeter wave radar phased array antenna | |
| CN211670320U (en) | ISGW (integrated signal ground wire) beam scanning leaky-wave antenna | |
| CN114284751A (en) | Large-space ultra-wideband tightly-coupled dipole array antenna integrated with correction network | |
| CN110867645A (en) | Microstrip array antenna | |
| Hsieh et al. | Application of a two-dimensional Butler matrix antenna array for tile-based beamforming |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |