CN215771142U - Integrated high-voltage power supply type LED lamp - Google Patents
Integrated high-voltage power supply type LED lamp Download PDFInfo
- Publication number
- CN215771142U CN215771142U CN202122305870.8U CN202122305870U CN215771142U CN 215771142 U CN215771142 U CN 215771142U CN 202122305870 U CN202122305870 U CN 202122305870U CN 215771142 U CN215771142 U CN 215771142U
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- cathode
- anode
- led lamp
- integrated high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
An integrated high-voltage power supply type LED lamp is characterized in that an anode bonding pad (2), a cathode bonding pad (3) and an electrodeless bonding pad (4) are arranged on a bottom plate (1), a light-emitting wafer (5) is arranged on the anode bonding pad (2), the anode and the cathode of the light-emitting wafer (5) are respectively connected with the anode bonding pad (2) and the cathode bonding pad (3), a rectifier diode (6) is arranged on the cathode bonding pad (3), the anode and the cathode of the cathode bonding pad (3) are respectively connected with the anode bonding pad (2) and the cathode bonding pad (3), and a wafer resistor (7) is connected in series on the cathode bonding pad (3) and the electrodeless bonding pad (4). The utility model has the advantages that: the positive pole of the light-emitting chip is connected with the negative pole of the rectifier diode, and then the chip resistor on the string forms a circuit which can be directly lightened at 220V alternating current.
Description
Technical Field
The utility model relates to the field of LEDs, in particular to an integrated high-voltage power supply type LED lamp.
Background
At present, the existing LED lamp is generally lighted by 3V voltage, and can be used on 220V only by an external controller, so that the use cost is increased, and the use area is also increased.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an integrated high voltage power supply LED lamp, which overcomes the above-mentioned shortcomings.
The utility model comprises a bottom plate, an anode bonding pad, a cathode bonding pad and an electrodeless bonding pad,
the anode bonding pad, the cathode bonding pad and the electrodeless bonding pad are all arranged on the bottom plate,
the light emitting chip is arranged on the positive electrode bonding pad, the positive electrode and the negative electrode of the light emitting chip are respectively connected with the positive electrode bonding pad and the negative electrode bonding pad,
the rectifier diode is arranged on the negative electrode bonding pad, the anode and the cathode of the negative electrode bonding pad are respectively connected with the anode bonding pad and the negative electrode bonding pad,
the chip resistor is connected in series on the negative electrode bonding pad and the electrodeless bonding pad.
The light emitting chip is one or more.
A groove is formed in the positive bonding pad, and the light-emitting wafer is located in the groove.
The fluorescent powder covers the light-emitting chip through dispensing respectively, and is positioned in the groove.
The base plate is a transparent base plate.
The utility model has the advantages that: the positive pole of the light-emitting chip is connected with the negative pole of the rectifier diode, and then the chip resistor on the string forms a circuit which can be directly lightened at 220V alternating current.
Drawings
FIG. 1 is a schematic diagram of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention usually place when using, the present invention is only used for convenience of description and simplification of the description, but does not indicate or imply that the devices or elements indicated must have specific orientations, be constructed in specific orientations, and operate, and thus, the present invention should not be construed as being limited. Furthermore, the appearances of the terms "first," "second," and the like in the description of the present invention are only used for distinguishing between the descriptions and are not intended to indicate or imply relative importance.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in the figure, the utility model comprises a bottom plate 1, a positive electrode bonding pad 2, a negative electrode bonding pad 3 and an electrodeless bonding pad 4,
the anode bonding pad 2, the cathode bonding pad 3 and the electrodeless bonding pad 4 are all arranged on the bottom plate 1,
the light emitting chip 5 is disposed on the positive electrode pad 2, and the positive and negative electrodes of the light emitting chip 5 are connected to the positive electrode pad 2 and the negative electrode pad 3, respectively,
the rectifier diode 6 is arranged on the cathode bonding pad 3, the anode and the cathode of the cathode bonding pad 3 are respectively connected with the anode bonding pad 2 and the cathode bonding pad 3,
the chip resistor 7 is connected in series on the cathode bonding pad 3 and the electrodeless bonding pad 4.
The light emitting chip 5 is one or more.
The positive electrode bonding pad 2 is provided with a groove, and the light-emitting wafer 5 is positioned in the groove.
The phosphor is respectively coated on the light emitting chip 5 by dispensing and is positioned in the groove. The fluorescent powder is covered on the light-emitting chip to realize the purpose of changing color, such as: the blue light and the fluorescent powder can be changed into other colors, such as white light, pink, ice blue and the like. Dispensing mode: fluorescent powder adopts the graininess to sneak into glue and forms the liquid state, in the recess on the pad with the fluorescent powder of liquid state and glue point, the fluorescent powder of liquid state and glue just can be in the recess, can not flow, and the solidification can after the heating.
The base plate 1 is a transparent base plate.
The principle is as follows: the positive pole of the light-emitting chip 5 is connected with the negative pole of the rectifier diode 6, and then is connected with the chip resistor 7 in series to form a circuit which can be directly lightened at 220V alternating current.
Claims (5)
1. An integrated high-voltage power supply type LED lamp is characterized by comprising a bottom plate (1), an anode bonding pad (2), a cathode bonding pad (3) and an electrodeless bonding pad (4),
the anode bonding pad (2), the cathode bonding pad (3) and the electrodeless bonding pad (4) are all arranged on the bottom plate (1),
the light-emitting chip (5) is arranged on the anode bonding pad (2), the anode and the cathode of the light-emitting chip (5) are respectively connected with the anode bonding pad (2) and the cathode bonding pad (3),
the rectifier diode (6) is arranged on the cathode bonding pad (3), the anode and the cathode of the cathode bonding pad (3) are respectively connected with the anode bonding pad (2) and the cathode bonding pad (3),
the chip resistor (7) is connected in series on the negative electrode bonding pad (3) and the electrodeless bonding pad (4).
2. An integrated high voltage powered LED lamp as claimed in claim 1, characterized in that said light emitting dice (5) are one or more.
3. The integrated high voltage powered LED lamp according to claim 1, wherein the positive electrode pad (2) is provided with a groove, and the light emitting chip (5) is located in the groove.
4. The integrated high-voltage power supply type LED lamp as claimed in claim 1, wherein the phosphor is respectively coated on the light emitting chip (5) by dispensing and is positioned in the groove.
5. An integrated high voltage powered LED lamp as claimed in claim 1, characterized in that the base plate (1) is a transparent base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122305870.8U CN215771142U (en) | 2021-09-23 | 2021-09-23 | Integrated high-voltage power supply type LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122305870.8U CN215771142U (en) | 2021-09-23 | 2021-09-23 | Integrated high-voltage power supply type LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771142U true CN215771142U (en) | 2022-02-08 |
Family
ID=80090449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122305870.8U Active CN215771142U (en) | 2021-09-23 | 2021-09-23 | Integrated high-voltage power supply type LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215771142U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504906A (en) * | 2023-06-29 | 2023-07-28 | 厦门普为光电科技有限公司 | High luminous efficiency LED light source |
-
2021
- 2021-09-23 CN CN202122305870.8U patent/CN215771142U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504906A (en) * | 2023-06-29 | 2023-07-28 | 厦门普为光电科技有限公司 | High luminous efficiency LED light source |
| CN116504906B (en) * | 2023-06-29 | 2023-10-27 | 厦门普为光电科技有限公司 | High luminous efficiency LED light source |
| JP7471033B1 (en) | 2023-06-29 | 2024-04-19 | 厦門普為光電科技有限公司 | High light efficiency light emitting diode light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007123609A (en) | Led lighting device | |
| JP2005159270A (en) | Led package | |
| CN215771142U (en) | Integrated high-voltage power supply type LED lamp | |
| CN104282676A (en) | Integrated LED lamp panel packaging structure and technology | |
| CN203218325U (en) | Mixed light LED structure | |
| CN205480223U (en) | High stable pottery COB encapsulation LED lamp | |
| CN101118920B (en) | Submount type high voltage light emitting diode wafer having resistance | |
| CN210467885U (en) | Triangular polycrystalline electrodeless chip | |
| CN208011331U (en) | A kind of LED lamp bead and LED light source | |
| CN216480335U (en) | Plug-in type filament and bulb and lamp string using same | |
| CN203787420U (en) | Array COB light source capable of changing connection | |
| CN208951719U (en) | A kind of light emitting device and light-emitting component | |
| CN210052760U (en) | LED packaging module | |
| CN211208444U (en) | Novel packaging structure of RGB product | |
| CN206370442U (en) | Display screen, light fixture and its LED encapsulation structure | |
| CN208189630U (en) | A kind of LED light integrated encapsulation structure | |
| CN217182184U (en) | Eight-leg lamp bead | |
| CN206116398U (en) | Mixed light source paster LED | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN215299280U (en) | Double-cup lamp bead | |
| CN210088505U (en) | Three-wire copper wire lamp based on IC | |
| CN211295143U (en) | Non-pressure-drop lamp strip LED transparent lamp bead | |
| CN214625040U (en) | Double-color COB packaging light source | |
| CN215069981U (en) | LED packaging structure and lighting device | |
| CN219036328U (en) | LED strip-shaped light source structure and lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An Integrated High Voltage Powered LED Lamp Effective date of registration: 20230619 Granted publication date: 20220208 Pledgee: Hubei Science and Technology Financing Guarantee Co.,Ltd. Pledgor: HUBEI XIEJIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2023980044553 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |