CN215757125U - Compound heat conduction foam - Google Patents
Compound heat conduction foam Download PDFInfo
- Publication number
- CN215757125U CN215757125U CN202121025386.3U CN202121025386U CN215757125U CN 215757125 U CN215757125 U CN 215757125U CN 202121025386 U CN202121025386 U CN 202121025386U CN 215757125 U CN215757125 U CN 215757125U
- Authority
- CN
- China
- Prior art keywords
- layer
- film
- heat
- conducting
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses composite heat-conducting foam which comprises a low-hardness heat-conducting silica gel layer, wherein a substrate film is coated on the outer side of the low-hardness heat-conducting silica gel layer, a tin coating layer is arranged on the outer side surface of the substrate film, an acrylic adhesive layer is arranged on the outer side surface of the tin coating layer, a release film is arranged on one side, away from the tin coating layer, of the acrylic adhesive layer, the acrylic adhesive layer is not coated with the tin coating layer, a filler in the structure is an ultra-soft-hardness heat-conducting silica gel component, and a metal coating layer is used as a thin film of an inner layer and an outer layer and is formed by high-temperature processing. The solder has the advantages of smooth surface, excellent rebound resilience, high temperature resistance of 260 ℃, excellent conductivity and oxidation resistance, good welding strength, good contact between the solder and tin used in reflow soldering, good contact strength with a PCB after soldering, and wide application range.
Description
Technical Field
The utility model relates to the field of electronics, in particular to composite heat-conducting foam.
Background
The original wrapped foam mostly uses woven cloth as an outer wrapping layer, PU foam used in the wrapped foam is damaged if the product temperature needs to reach 85 ℃ or above during application, and therefore the requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide the composite heat-conducting foam which is excellent in rebound resilience and high-temperature resistant.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the composite heat-conducting foam comprises a low-hardness heat-conducting silica gel layer, wherein a substrate film is coated on the outer side of the low-hardness heat-conducting silica gel layer, a tin coating layer is arranged on the outer side surface of the substrate film, an acrylic adhesive layer is arranged on the outer side surface of the tin coating layer, and a release film is arranged on one side, away from the tin coating layer, of the acrylic adhesive layer;
the acrylic adhesive layer is not coated with a tin coating.
Further, the method comprises the following steps: the substrate film includes a PI film or a PET film.
Further, the method comprises the following steps: the PI film is a heat-conducting PI film.
Further, the method comprises the following steps: the thickness of PI membrane is 0.015 ~ 0.1um, the thickness of tin coating is 1 ~ 2 um.
Further, the method comprises the following steps: the thickness of the low-hardness heat-conducting silica gel layer is 0.3-15 mm.
The utility model has the beneficial effects that: the filler in the structure is a super-soft-hardness heat-conducting silica gel component, and the filler is formed by processing a metal coating as a thin film of an inner layer and a thin film of an outer layer at a high temperature. The foam has the characteristics of smooth surface, excellent rebound resilience and high temperature resistance at 260 ℃, has excellent conductivity and oxidation resistance, has good welding strength, ensures that the solder used in reflow soldering is in good contact with tin, has good contact strength with a PCB after soldering, and has wide application range.
Drawings
Fig. 1 is a schematic diagram of composite heat-conducting foam.
Labeled as: the heat-conducting film comprises a release film 1, a substrate film 21, a tin-plated layer 22, an acrylic adhesive layer 3 and a low-hardness heat-conducting silicon adhesive layer 4.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a compound heat conduction foam comprises a low-hardness heat conduction silica gel layer 4, the outside of the low-hardness heat conduction silica gel layer is coated with a substrate film 21, the outside of the substrate film 21 is provided with a tin coating layer 22, the outside of the tin coating layer 22 is provided with an acrylic adhesive layer 3, the acrylic adhesive layer 3 is far away from the tin coating layer 22 and is provided with a release film 1, and the acrylic adhesive layer 3 is not coated with the tin coating layer 22.
The substrate film comprises a PI film or a PET film, and particularly, the PI film is preferably a heat-conducting PI film, and the heat-conducting PI film can increase the heat-conducting property of the PI film.
During manufacturing, a heat-conducting PI film single-side tin coating layer 22 is firstly coated, the thickness of the heat-conducting PI film is 0.015-0.1 um, the thickness of the tin coating layer 22 is 1-2 um, the tin coating layer is coated outside a low-hardness heat-conducting silica gel layer 4 according to different thickness requirements, the thickness of the low-hardness heat-conducting silica gel layer is 0.3-15 mm, the heat conductivity coefficient of the low-hardness heat-conducting silica gel layer is 1W/mk-8W/mk, the hardness of the low-hardness heat-conducting silica gel layer is Shore 0010-40, the tin-coating heat-conducting PI film and a heat-conducting silica gel sheet are coated according to a pre-designed mold, the structure can be manufactured into a shape with the length of 1 mm-50 mm, the width of 1 mm-50 mm and the thickness of 1 mm-15 mm, the back adhesive thickness of 0.03 mm-0.1 mm, the structure has good cohesiveness and can be manufactured into a shape like, and can be welded on a circuit board through SMT, and can be used for occasions of EMI, grounding or electric conduction terminals.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a compound heat conduction bubble is cotton which characterized in that: the adhesive film comprises a low-hardness heat-conducting silica gel layer (4), wherein a substrate film (21) is coated on the outer side of the low-hardness heat-conducting silica gel layer, a tin-plated layer (22) is arranged on the outer side surface of the substrate film (21), an acrylic adhesive layer (3) is arranged on the outer side surface of the tin-plated layer (22), and a release film (1) is arranged on one side, away from the tin-plated layer (22), of the acrylic adhesive layer (3);
the acrylic adhesive layer (3) is not coated with a tin coating.
2. The composite type heat-conducting foam as claimed in claim 1, wherein: the substrate film includes a PI film or a PET film.
3. The composite type heat-conducting foam as claimed in claim 2, wherein: the PI film is a heat-conducting PI film.
4. The composite type heat-conducting foam as claimed in claim 2, wherein: the thickness of PI membrane is 0.015 ~ 0.1um, the thickness of tin coating is 1 ~ 2 um.
5. The composite type heat-conducting foam as claimed in claim 2, wherein: the thickness of the low-hardness heat-conducting silica gel layer (4) is 0.3-15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121025386.3U CN215757125U (en) | 2021-05-13 | 2021-05-13 | Compound heat conduction foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121025386.3U CN215757125U (en) | 2021-05-13 | 2021-05-13 | Compound heat conduction foam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215757125U true CN215757125U (en) | 2022-02-08 |
Family
ID=80097159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121025386.3U Active CN215757125U (en) | 2021-05-13 | 2021-05-13 | Compound heat conduction foam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215757125U (en) |
-
2021
- 2021-05-13 CN CN202121025386.3U patent/CN215757125U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3413693B1 (en) | Highly conductive transparent glass-based circuit board | |
| KR200428000Y1 (en) | Solderable Electric contact terminal | |
| JP2011233495A (en) | Elastic electric contact terminal | |
| CN106847767A (en) | A kind of graphite Copper Foil heat sink compound | |
| KR101018871B1 (en) | Ground Form Gasket for Surface Mount Device and Method for manufacturing it | |
| CN210958958U (en) | Flexible bending-resistant printed circuit board | |
| JP2009010321A (en) | Surface-mount type overcurrent and overheat protective device | |
| CN215757125U (en) | Compound heat conduction foam | |
| CN100471668C (en) | Metal/ceramic adhered products | |
| US20170218512A1 (en) | Method of Fabricating High-Conductivity Thick-film Copper Paste Coated with Nano-Silver for Being Sintered in the Air | |
| CN110190037A (en) | Preparation method, radiating piece and the mobile terminal of radiating piece | |
| CN101896049A (en) | Heat radiating module and production method thereof | |
| CN216057999U (en) | Metal substrate liquid metal phase transition piece | |
| CN216057624U (en) | Easily weld high temperature resistant and electrically conductive shielding bubble cotton of heat conduction | |
| KR20090078294A (en) | Elastic conductive interface member capable of reflow soldering | |
| CN208917121U (en) | Heat dissipation copper foil is pasted based on ultra-thin materials composite molding | |
| EP3412446A1 (en) | Highly conductive transparent laminated glass article | |
| CN211240300U (en) | Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil | |
| CN204518208U (en) | Flexible printed circuit board and electronic equipment | |
| CN212013364U (en) | High-temperature-resistant electric-conduction and heat-conduction elastomer capable of being produced by paster | |
| CN102903467A (en) | Micro resistor element having soft material layer, and manufacturing method thereof | |
| CN207491319U (en) | A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate | |
| CN218473476U (en) | Circuit board that possesses anti-oxidant function | |
| CN205800352U (en) | The composite fin of electrographite/copper | |
| CN216687980U (en) | Conductive shielding heat dissipation film adhesive tape for mobile phone product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |