CN216687980U

CN216687980U - Conductive shielding heat dissipation film adhesive tape for mobile phone product

Info

Publication number: CN216687980U
Application number: CN202122451317.5U
Authority: CN
Inventors: 陈艳
Original assignee: Hanping Kunshan Electronic Co ltd
Current assignee: Hanping Kunshan Electronic Co ltd
Priority date: 2021-10-12
Filing date: 2021-10-12
Publication date: 2022-06-07
Anticipated expiration: 2031-10-12

Abstract

The utility model discloses a conductive shielding heat dissipation film adhesive tape for a mobile phone product, which comprises a graphite sheet and a metal layer, wherein the graphite sheet and the metal layer are connected in a liquid phase deposition mode, a glue layer is arranged on one side, away from the graphite sheet, of the metal layer, the glue layer is of a reticulate structure, a reticulate release film covers the glue layer, graphite and copper foil in the structure are connected through a liquid phase deposition process, and any auxiliary bonding material (such as a hot melt adhesive, a curing adhesive, a double-sided adhesive and the like) is not directly compounded between the graphite and the copper, so that the thermal conduction resistance in the Z-axis direction can be reduced, the thermal conductivity coefficient is improved, and the thermal conductivity is enhanced.

Description

Conductive shielding heat dissipation film adhesive tape for mobile phone product

Technical Field

The utility model relates to the field of shielding heat dissipation adhesive tapes, in particular to a conductive shielding heat dissipation film adhesive tape for a mobile phone product.

Background

Along with the coming of the 5G era, the introduction of high frequency, the upgrading of cell-phone spare part, a plurality of APP software operate simultaneously and make the consumption of cell-phone constantly increase, calorific capacity also rises fast thereupon, the cell-phone can produce the heat for a long time using, lead to inside ambient temperature rising, can influence user experience when the temperature reaches the certain degree, influence the cell-phone life-span even, electromagnetic interference between the inside electronic component of cell-phone and the component itself is everywhere, electromagnetic interference and electromagnetic radiation are also serious day by day to electronic equipment's harm, based on this, need develop a high heat conduction electric conduction shielding heat dissipation membrane sticky tape.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide the conductive shielding heat dissipation film adhesive tape for the mobile phone product, which can reduce the conductive thermal resistance in the Z-axis direction, improve the heat conductivity coefficient and enhance the heat conductivity.

The technical scheme adopted by the utility model for solving the technical problem is as follows: the utility model provides a conductive shielding heat dissipation membrane sticky tape for cell-phone product, includes graphite flake and metal level, graphite flake and metal level pass through the liquid phase deposition mode and connect, the metal level is kept away from graphite flake one side and is provided with the glue layer, the glue layer is the reticulation structure, the glue layer coats and is stamped the reticulation and leaves the type membrane.

Further, the method comprises the following steps: the metal layer is a copper foil layer.

Further, the method comprises the following steps: the glue layer is conductive acrylic pressure-sensitive adhesive.

Further, the method comprises the following steps: the thickness of the graphite sheet is 0.003 um-0.3 mm.

Further, the method comprises the following steps: the thickness range of the metal layer is 0.006 mm-0.3 mm.

The utility model has the beneficial effects that:

1. the graphite and the copper foil are connected by a liquid phase deposition process, and no auxiliary bonding material (such as hot melt adhesive, curing adhesive, double faced adhesive tape and the like) is directly compounded between the graphite and the copper, so that the thermal conduction resistance in the Z-axis direction can be reduced, the thermal conductivity coefficient is improved, and the thermal conductivity is enhanced.

2. The structure has good conductivity, the resistance is less than 0.05 omega, and simultaneously, the structure has excellent shielding effectiveness, the shielding effectiveness is more than 90dB under 10 MHz-1.5 GHz, simultaneously, the stripping force of the structure is more than 1500gf, the retention force is more than 24H, and the structure can resist temperature for a long time under the environment of 150 ℃.

3. The Z-direction heat conduction coefficient of the structure can reach 760W/mk which is 3 times of that of aluminum, 2 times of copper and 50 times of graphite, so that the heat dissipation performance advantage is obvious, the density of the copper is 8.89g/cm3, and the density of the graphite copper-plated foil is 4.5g/cm3, so that the density of the graphite copper-plated foil is about 2 times less than that of the copper foil, and the structure is more consistent with the design trend of thinning and weight reduction of electronic products of mobile phones.

Drawings

Fig. 1 is a schematic structural diagram of a conductive shielding heat dissipation film tape for a mobile phone product according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a glue layer structure of a conductive shielding heat dissipation film tape for a mobile phone product according to an embodiment of the present application.

Fig. 3 is a schematic diagram of the thermal conductivity of graphite.

Fig. 4 is a schematic diagram of the thermal conduction of the graphite metal layer in the conductive shielding heat dissipation film tape for mobile phone products according to the embodiment of the present application.

Labeled as: 1. a graphite sheet; 2. a copper foil layer; 3. a glue layer; 4. reticulate pattern is from type membrane.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 and fig. 2, an embodiment of the present application discloses a conductive shielding heat dissipation film adhesive tape for a mobile phone product, which structurally includes a graphite sheet 1 and a metal layer, the graphite sheet 1 and the metal layer are connected by liquid phase deposition, a glue layer 3 is disposed on one side of the metal layer away from the graphite sheet 1, the glue layer 3 is a reticulate structure, and a reticulate release film 4 covers the glue layer 3;

specifically, the metal layer may be another metal foil or alloy such as copper, aluminum, nickel, etc., but the three-way thermal conductivity of copper is 400W/mk, and the three-way thermal conductivity of aluminum is 240W/mk, so the copper foil is preferred in this embodiment.

As shown in fig. 3, the heat conductivity coefficient of the graphite Z is low, heat cannot be well conducted, and only can be conducted in the X-Y direction, while as shown in fig. 4, the heat generated by the graphite copper-clad heat source can be quickly conducted on the metal surface of the copper foil through the metal copper foil Z, and the heat passes through the metal layer, is quickly conducted in the X-Y direction on the conductive graphite layer, so that the heat is quickly diffused from a point heat source to a surface heat source, and the heat conduction and radiation effect is improved. In the structure, the graphite sheet 1 and the copper foil are connected together in a liquid phase deposition mode (instead of connecting the graphite sheet and the metal layer by using an adhesive in the prior art), so that no auxiliary adhesive material exists between the graphite and the copper foil, the heat conduction resistance in the Z-axis direction can be reduced, the heat conduction coefficient is improved, the heat conduction performance is enhanced,

experiments prove that the Z-direction heat conduction coefficient of the structure can reach 760W/mk which is 3 times that of aluminum, 2 times that of copper and 50 times that of graphite, so that the heat dissipation performance advantage is obvious, the density of the copper is 8.89g/cm3, and the density of the graphite copper-plated foil is 4.5g/cm3, so that the density of the graphite copper-plated foil is about 2 times that of the copper foil, and the structure is more consistent with the design trend of thinning and weight reduction of electronic products of mobile phones.

Meanwhile, the glue layer 3 is made into a reticulate pattern structure by the structure, the structure not only can effectively enhance the air exhaust property and the heat conductivity, but also can avoid local overheating of the adhesive tape and the electronic component, the uniformity of air exhaust and heat conduction of the adhesive tape is realized, the service life of the adhesive tape and the electronic component is favorably prolonged, the adhesive surface of the conventional conductive shielding heat dissipation film adhesive tape on the market at present is a plane, bubbles are easily generated when the adhesive tape is attached to the electronic component, the attachment effect is influenced, the air heat conductivity coefficient in the bubbles is only 0.023W/mK, the heat conduction rate of the electronic component to copper foil graphite through the adhesive surface is seriously influenced, the adhesive surface of the grid structure can avoid the generation of the bubbles when the adhesive tape is attached, the heat conduction path from the electronic component is optimized, and the heat dissipation effect is improved.

In this embodiment, the glue layer 3 is a conductive acrylic pressure-sensitive adhesive.

The conductive acrylic pressure-sensitive adhesive takes acrylic acid glue as a main body, and conductive particles and high-temperature-resistant resin are added to improve the overall temperature resistance and conductivity, wherein the high-temperature-resistant resin can be rosin resin, and the conductive particles can be conductive metal particles such as nickel powder, silver powder, nickel-coated graphite powder and the like.

This product passes through the setting of electrically conductive acrylic acid pressure sensitive adhesive multiplicable product at holistic electric conduction, heat conduction and temperature resistance.

In this embodiment, the graphite sheet 1 has a thickness of 0.003um to 0.3 mm.

Specifically, the thickness of the graphite sheet 1 can be selected to be 0.003 mm, 0.017mm, 0.025mm, 0.04mm, 0.07mm, 0.3mm and the like, the graphite sheet 1 can be selected from artificial graphite or natural graphite, preferably artificial graphite, the graphite has the characteristics of light weight density of 1.6g/cm3, rapid heat dissipation and adaptability to any surface, and the unique crystal structure of the graphite causes high thermal conductivity in a plane, can rapidly remove hot spots and reduce temperature.

In this embodiment, the thickness of the metal layer ranges from 0.006mm to 0.3 mm.

Specifically, the thickness of the metal layer may be 0.008mm, 0.015mm, 0.02mm, 0.03mm, 0.3mm, or the like.

The structure is verified through experiments, and has the following advantages:

1. the resistance is less than 0.05 omega.

2. Has excellent shielding effectiveness which is more than 90dB under 10 MHz-1.5 GHz.

3. The peeling force is more than 1500gf, and the holding force is more than 24H.

4. Can resist temperature for a long time in the environment of 150 ℃.

5. The Z-direction heat conduction coefficient can reach 760W/mk, and quick heat conduction can be realized.

The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a conductive shielding heat dissipation membrane sticky tape for cell-phone product which characterized in that: including graphite flake (1) and metal level, graphite flake (1) and metal level pass through the liquid phase deposition mode and connect, the metal level is kept away from graphite flake (1) one side and is provided with glue layer (3), glue layer (3) are the reticulation structure, glue layer (3) coats and is stamped reticulation and leave type membrane (4).

2. The conductive shielding heat-dissipating film tape for cellular phone products as claimed in claim 1, wherein: the metal layer is a copper foil layer (2).

3. The conductive shielding heat-dissipating film tape for cellular phone products as claimed in claim 1, wherein: the glue layer (3) is a conductive acrylic pressure-sensitive adhesive.

4. The conductive shielding heat-dissipating film tape for cellular phone products as claimed in claim 1, wherein: the thickness of the graphite sheet (1) is 0.003 um-0.3 mm.

5. The conductive shielding heat-dissipating film tape for cellular phone products as claimed in claim 1, wherein: the thickness range of the metal layer is 0.006 mm-0.3 mm.