CN100471668C - Metal/ceramic adhered products - Google Patents
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- CN100471668C CN100471668C CNB021522901A CN02152290A CN100471668C CN 100471668 C CN100471668 C CN 100471668C CN B021522901 A CNB021522901 A CN B021522901A CN 02152290 A CN02152290 A CN 02152290A CN 100471668 C CN100471668 C CN 100471668C
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Abstract
The present invention provides a metal/ceramic bonded product. It can ensure sufficient high temp.-resisting quickly-changing property, small exterior size of matrix, at the same time has high reliability, and it is miniature. Said metal/ceramic bonded product contains ceramic matrix and sheet metal bonded on the ceramic matrix by means of soldering process. The length of the described soldering flux layer extended from undersurface of sheet metal is greater than 30 micrometers, and is 250 micrometers or shorter or said length is 25% of thickness of sheet metal or longer.
Description
FIELD OF THE INVENTION
Present invention relates in general to a kind of metal/ceramic adhesive article, these goods have ceramic substrate and sheet metal, and described sheet metal is adhered on the ceramic substrate by brazing solder.More particularly, the present invention relates to be equipped with above it parts of semiconductor and so on, can be used for the metal/ceramic adhesive article that power module or amber ear paste component module.
Technical background
At the ceramic circuit board of making power module or install in the above in the semi-conductive conventional method, at first be that a sheet metal and a ceramic substrate is bonded to each other.For example, industrial employing direct adhesive bonding method arranged, be that copper sheet is placed on the ceramic substrate, copper sheet directly contacts ceramic substrate, heating copper sheet and ceramic substrate in inert gas make both bonded to each other then.Industrial also adopt soldering and soft soldering method arranged, across containing for example brazing solder of Ti, Zr or Hf of reactive metal, copper sheet is placed on the ceramic substrate, heating in a vacuum makes ceramic substrate and copper sheet bonded to each other then.In method for welding, this reactive metal and ceramic substrate are adhered to the effect on the sheet metal.Specifically be the reaction of ceramic substrate and brazing solder, form product.It has been generally acknowledged that reactive metal in the brazing solder and oxide ceramics matrix is Al for example
2O
3Reaction, the oxide of formation reactive metal; With the ceramic substrate of non-oxidized substance for example AlN or Si
3N
4Reaction, the nitride of formation reactive metal; With for example SiC reaction of ceramic substrate of carbide, form the carbide of reactive metal; These products just are glued together ceramic substrate and copper sheet.That is the brazing solder layer after, bonding comprises layer that mainly contains metal and the layer that mainly contains interfacial product between brazing solder and the ceramic substrate.
For circuit or radiation, as at bonding good sheet metal for example after the copper sheet, form pattern and make the method for the circuit of reservation shape, also adopt engraving method to form printed circuit board (PCB) etc.Because this method is easy to obtain meticulous pattern, and can relatively easily be adapted to the change of circuit design, so be widely used.In the method, for example the mixed solution of iron chloride or copper chloride, hydrochloric acid and hydrogen peroxide is used as for example etchant of copper sheet of sheet metal usually.Under the situation of above-mentioned direct adhesive bonding method, this etchant can carry out etching and form pattern, and can not cause problem, and this is because can not consider product this moment.But, under the situation of soldering and method for welding, though this etchant energy dissolution of metals sheet, but it can not dissolve the product (brazing solder and product thereof are referred to as " brazing solder etc. " below) of brazing solder and brazing solder and ceramic substrate, as a result brazing solder etc. stay between the circuit board pattern and/or the substrate edge face on.Because brazing solder etc. is a conductor, so can not satisfy, circuit pattern is separated each other, and/or the circuit board basic demand that separates each other of the front of plate and reverse side.As the method for removing brazing solder etc., known can adopt separately hydrofluoric acid or hydrofluoric acid and at least a inorganic acid that is selected from nitric acid, sulfuric acid and hydrochloric acid mixed acid, perhaps adopt the solution contain chloroazotic acid, NaOH and/or potassium hydroxide, handle and remove brazing solder etc. (seeing Japan Patent No2594475).The known also useful solution-treated brazing solders that contain hydrogen halides and/or ammonium halide etc. are then with the solution-treated that contains inorganic acid and hydrogen peroxide, the method (seeing Japan Patent No7-36467) of removing brazing solder.
Metal/ceramic adhesive matrix goods form by said method pattern metallic circuit part on, according to its purposes, can carry out nickel plating, nickel plating alloy, gold-plated or protective treatment.
In addition, chip component, for example semiconductor element pastes component module by mounted thereto of methods such as soldering as power module or amber ear.
In recent years, power module and Po Er paste component module and have been applied in the severe rugged environment, and their employed elements just require to have high reliability.When especially being used as auto parts or being used for outdoor part, require to improve its spalling resistance.On the other hand, for example in metal is adhered to some metal/ceramic adhesive matrix goods on the ceramic substrate by brazing solder, design the cross sectional shape of circuit pattern marginal portion, just can further improve its performance.
In order to improve the reliability of performances such as spalling resistance by brazing solder, be known that in the marginal portion of sheet metal to make brazing solder stretch out one section the thermal stress that can relax and cause effectively because of thermal expansion coefficient difference between metal in the adhesion process and the pottery.For example, day, patent No10-326949 of the present disclosure proposed a kind of matrix, it has such structure, the basal surface of the peripheral part of metallic circuit and the difference of the size between the top surface be the 50-100 micron (this difference be by sheet metal basal surface one end perpendicular to the plane of sheet metal principal plane and by and sheet metal top surface one end of the above-mentioned end same side of sheet metal basal surface and perpendicular to the distance between the plane on master metal surface, be that the length that L1 represents among Fig. 5 is (if the area of basal surface is greater than the area of top surface, this value thinks+, this distance is called " skirt extension length " below), the length (this length is represented with L2 among Fig. 5) of the brazing solder that stretches out from sheet metal and bonding thereon the interface of brazing solder, this length is called " brazing solder layer the second month in a season go out length " below, is-50-+30 microns.In addition, Japan Patent 2797011 has proposed a kind of matrix, and it has such structure, and wherein the brazing solder length of stretching out of the interface between sheet metal and bonding thereon brazing solder is 250 microns or longer.
But,, can not obtain to be enough to satisfy the spalling resistance of market demands even the brazing solder length that stretch out at the interface between sheet metal and bonding thereon brazing solder is-50-+30 microns.If the brazing solder length that stretch out at the interface between sheet metal and bonding thereon brazing solder is 250 microns or longer, just can obtain sufficiently high spalling resistance.But, obviously emphasizing in the small-sized and flexible market trend in recent years, if the length that brazing solder stretches out is very long, the external dimensions of matrix just is difficult to meet designing requirement, so just need provide, even external dimensions is littler, it also is comparable to the spalling resistance that extension elongation is 250 microns situations.
The general introduction of invention
Therefore, the objective of the invention is to avoid the problems referred to above, a kind of metal/ceramic adhesive article is provided, it can guarantee enough spalling resistances, and has the matrix of little external dimensions, and it is the reliability height, is again miniaturization.
In order to realize above-mentioned and other purposes, the inventor has carried out conscientious research, discovery is by controlling brazing solder layer extension elongation best, make it possible to design a kind of bigger element erection space, a kind of metal/ceramic adhesive article just can be provided, and it can guarantee enough spalling resistances, and has the matrix of little external dimensions, and its both reliability height, small-sized again.As a result, the inventor has finished the present invention.
According to an aspect of the present invention, a kind of metal/ceramic adhesive article is provided, it comprises ceramic substrate and is adhered to sheet metal on the ceramic substrate by brazing solder, and wherein brazing solder is longer than 30 microns from the length that the basal surface of sheet metal stretches out, and is 250 microns or shorter.
According to a further aspect in the invention, another kind of metal/ceramic adhesive article is provided, it comprises ceramic substrate and is adhered to sheet metal on the ceramic substrate by brazing solder, wherein the brazing solder layer length of stretching out from the basal surface of sheet metal be sheet thicknesses 25% or more.
In above-mentioned each metal/ceramic adhesive article, the length of the extension of brazing solder layer can be the 50-200 micron.Imagine two planes, one is above-mentioned by sheet metal basal surface one end and perpendicular to the plane of sheet metal principal plane, another is perpendicular to the plane of sheet metal principal plane by sheet metal top surface one end of the above-mentioned end same side of sheet metal basal surface, distance between these two planes can be 50 microns or littler, when bottom surface area during greater than top surface area, this distance thinks+.Ceramic substrate can be formed by the material that is selected from oxide, nitride and carbide.Sheet metal can be that the alloy of principal component, the material that aluminium is the alloy of principal component form by being selected from copper, aluminium, copper.Brazing solder can contain silver and reactive metal.Brazing solder can comprise aluminium.Sheet metal and brazing solder layer can carry out at least a processing in nickel plating, nickel plating alloy, the gold-plated and protective treatment.
Brief description of drawings
From the accompanying drawing of the following detailed description and the demonstration preferred embodiment for the present invention, can more fully understand the present invention.But described accompanying drawing does not mean that the present invention is limited to the described specific embodiment that they only are used for explaining and explanation the present invention.
In the accompanying drawings,
Figure 1A-1C is the profile that the step of metal/ceramic adhesive article of the present invention is made in explanation;
Fig. 2 A-2C is the profile that the step of metal/ceramic adhesive article of the present invention is made in explanation;
Fig. 3 A-3C is the profile that the step of metal/ceramic adhesive article of the present invention is made in explanation;
Fig. 4 A-4C is the profile that the step of metal/ceramic adhesive article of the present invention is made in explanation;
Fig. 5 is the schematic diagram of explanation skirt extension length and brazing solder layer extension elongation;
Fig. 6 is the microphoto that is presented at the section of the metal/ceramic adhesive article that obtains among the embodiment 1;
Fig. 7 is the graph of a relation of brazing solder layer extension elongation (micron) and tolerance (number of times) by stove in embodiment and the Comparative Examples;
Fig. 8 is the graph of a relation of brazing solder layer extension elongation (micron) and bending strength (MPa) in embodiment and the Comparative Examples.
The detailed description of preferred implementation
The preferred implementation of metal/ceramic adhesive article of the present invention is described with reference to the accompanying drawings.
The preferred implementation of metal/ceramic adhesive article of the present invention, comprise a ceramic substrate and be adhered to a sheet metal on the ceramic substrate by brazing solder, wherein the brazing solder layer length of stretching out from the sheet metal basal surface is longer than 30 microns, it is 250 microns or shorter, be preferably the 50-200 micron, perhaps the brazing solder layer length of stretching out from the sheet metal basal surface be sheet thicknesses 25% or longer, preferred 30% or longer.
Be about at the thickness that is generally used for power module under the situation of metallic circuit sheet of 0.25-0.4mm, when brazing solder layer extension elongation increases, during standing thermal shocking, the damaged condition of the matrix strength that stress caused that the metallic circuit peripheral part causes is just improved, if brazing solder layer extension elongation is 30 microns or longer, preferred 50 microns or longer, just can obtain enough spalling resistance performances.If brazing solder layer extension elongation is set to the maximum length that the matrix design size is allowed, just can obtain high spalling resistance.
If the thickness of metallic circuit sheet is about 0.15mm or thinner, when thermal expansion metal and thermal contraction, the stress to matrix that is produced reduces, therefore, even the length that the brazing solder layer stretches out from the interface between metallic circuit sheet and the brazing solder layer also might be kept spalling resistance less than 30 μ m.The outstanding length of brazing solder layer be preferably the metallic circuit segment thickness 25% or bigger, more be preferably 30% or bigger.If the outstanding length of brazing solder layer is set to the maximum length that the matrix size is allowed, just can obtain high spalling resistance.
About being used for the material of ceramic substrate of the present invention, Al
2O
3The characteristics of (aluminium oxide) are inexpensive, though the characteristics of AlN are valency height, thermal conductivity is good, Si
3N
4With the characteristics of SiC are intensity height, toughness is also high.According to the characteristics of these ceramic substrates, Al
2O
3Can form inexpensive ceramic circuit board, AlN can utilize its good radiance, forms the semi-conductive ceramic circuit board that is applicable to higher calorific value, for example big electric power chip, Si
3N
4Can utilize their good intensity with SiC, form spalling resistance height and environmental resistance height, can be used in the severe rugged environment, for example the ceramic circuit board in the automobile.
Be used for the brazing solder that sheet metal is adhered on the ceramic substrate can be selected according to the physical property of the pottery of the metal of sheet metal and ceramic substrate.If sheet metal is a copper sheet, and if ceramic substrate be AlN matrix or Al
2O
3Matrix, the metal group achievement of brazing solder preferably contains 65-99 weight %Ag, 1-10 weight % reactive metal, all the other are Cu substantially.The element that can add at least a Ti of being selected from or Zr can add for example TiO of very a spot of the 4th kind of component as reactive metal
2Play the stress relaxation effect.Brazing solder can be located on the whole surface of ceramic substrate, also can only be positioned on some precalculated positions.Therefore, if desired, brazing solder just can use selectively according to its purposes.The brazing solder that uses can be any form, for example pasty state or paper tinsel shape.If sheet metal is an aluminium flake, the metal component of brazing solder just preferably mainly contains aluminium so, for example Al-Si or Al-Si-Ti, and its form is unimportant, for example pasty state or paper tinsel shape.
As sheet metal, consider that copper sheet has good electrical conductivity, often use copper sheet.Usually use a kind of method, resist is covered behind this sheet metal its etching, form predetermined circuit pattern.
As the chemical substance that does not need part of removing brazing solder etc., can use the chemical substance of dissolving brazing solder, for example fluoride or huge legendary turtle compound are because the mixed solution of normally used iron chloride or copper chloride, hydrochloric acid and hydrogen peroxide can not fully dissolve brazing solder etc.
Since remove with chemical substance brazing solder etc. do not need part after, brazing solder layer extension elongation is zero or very short, so just need further processing, obtains desired brazing solder layer extension elongation.As the method that obtains desired such brazing solder layer extension elongation, for example can be on the surface of circuit pattern, to apply the resist of undersized in the circuit pattern of etched sheet metal, come the dissolution of metals sheet by etching or chemical polishing then, obtain desired brazing solder layer extension elongation.In addition, brazing solder layer extension elongation also can rely on the condition of regulating etched or chemical polishing and change a lot, and can be subjected to for example control of condition such as temperature and spray pressure.Obtain the method for desired brazing solder layer extension elongation as another kind, also can on ceramic substrate, form brazing solder with certain pattern form by methods such as printings, objective circuit pattern with respect to sheet metal, this pattern form expection can obtain required brazing solder layer extension elongation, then, the sheet metal that will be obtains certain pattern form by punch process or etching with brazing solder is adhered on the ceramic substrate.But the present invention should not be confined to these methods.
About the basal surface of metallic circuit part and the size of top surface, will there be the area of top surface of Si chip bigger above it, this is favourable.But the engraving method that very difficult employing is carried out usually forms little size difference.In order to prevent to increase to the possibility of adjacent metal circuit part discharge, the difference in size (area of top surface is bigger than the area of basal surface) that size between top surface and the basal surface is preferably negative, and reach the degree that can not discharge, this difference in size is 40 microns or littler.Reach this scope by changing etch process and/or etching condition.
In order to improve the weatherability that will on the metal/ceramic adhered circuit board, form the metal of circuit pattern, and in order to prevent that its scolder wettability in time and variation is preferably carried out nickel plating, nickel plating alloy, gold-plated or protective treatment.The technology of described plating for example is that common chemical plating method is implemented, and described chemical plating is after carrying out preliminary treatment in degreasing, chemical polishing with the chemical substance of Pd activation, to adopt the chemical substance that contains hypophosphites to carry out chemical plating as the Ni-P chemical plating solution; Perhaps the electrode contact patterns is carried out electric plating method.In addition, also preferably carry out protective treatment with common azole compounds.
On the metallic circuit sheet of metal/ceramic adhered circuit board manufactured according to the present invention, electrical equipment and electronic component be semiconductor chip and resistance for example, burn-ons and with methods such as solderings fin is burn-on on its back side with methods such as solderings.In addition, carry out following steps again: the bonding plastic casing etc. of going up, with the line of the bonding usefulness of ultrasonic wave external lug is connected on the circuit board, the injection gel that insulate is loaded onto top cover, finally forms an assembly.
With reference to the accompanying drawings, describe the embodiment of metal/ceramic adhesive article of the present invention in detail.
Embodiment 1
Weigh up the metal dust weight of metallic components, make each component be: 91 weight % silver, 7 weight % copper, 1.5 weight %Ti, 0.5 weight %TiO
2In this metal powder, add about 10% acrylic acid carrier.Adopt automatic mortar and three tumbling mills, mediate this mixture, just made the brazing solder of pasty state with usual way.
Then, shown in Figure 1A-1C, make ceramic substrate 10 (Figure 1A), on the two sides of ceramic substrate 10, apply brazing solder 12 (Figure 1B) with silk screen print method.Then, on its two sides, respectively place the copper sheet 14 of thick 0.25mm, in vacuum drying oven, copper sheet 14 is adhered on the ceramic substrate 10 at 835 ℃.In order to check the thickness of brazing solder layer 12, bonding like this sample is cut, measure the thickness of brazing solder layer 12.The result is that the thickness of brazing solder layer 12 is about 20 microns.The S level AlN matrix of using the manufacturing of ATG company is as ceramic substrate 10.
Then, in vacuum drying oven, take out bonding like this sample.Then shown in Fig. 2 A-2C, apply on the two sides of bonding copper sheet 14 that to have desired circuit pattern and thickness be that the alkalescence of the ultraviolet light polymerization of 10-15 micron is peeled off resist 16 (Fig. 2 A).Remove the unwanted part (Fig. 2 B) of copper sheet 14 with the etchant that contains copper chloride, hydrogen peroxide and hydrochloric acid.Afterwards, remove resist 16 (Fig. 2 C) with 3.5% sodium hydrate aqueous solution.
Then, for remove between the circuit pattern and the substrate edge face on unwanted brazing solder part, sample is immersed the mixed solution that contains 1.4%EDTA, 6% hydrogen peroxide and 3% ammonia, the part (Fig. 3 A) of removing unwanted brazing solder 12.Then, on the two sides of copper sheet 14, apply ultraviolet light polymerization alkalescence once more and peel off resist 18 (Fig. 3 B), reach 15 minutes (Fig. 3 C) with the etchant etching copper sheet 14 that contains copper chloride, hydrogen peroxide and hydrochloric acid once more with desired circuit pattern.Then, remove resist 18 (Fig. 4 A), carry out the Ni-P chemical plating again and obtain coating 20 (Fig. 4 B) with 3.5% sodium hydrate aqueous solution.
Fig. 6 shows the microphoto of section of the metal/ceramic adhesive article of such acquisition.For the metal/ceramic adhesive article that obtains at this embodiment, measure the skirt extension length of brazing solder layer extension elongation and metallic circuit part, make described length be respectively 102 microns and＜0 micron.For the metal/ceramic adhesive article that obtains in this embodiment, implement processing (in reducing atmosphere (nitrogen 4+ hydrogen 1) at 370 ℃ of heating products after 10 minutes) with its cooling by stove, use tolerance (number of times) to estimate reliability by stove.That is whether, handling the back visual inspection by stove has crackle to produce in ceramic segment, put up with cause the crack pass through pass through the tolerance (number of times) of stove number of processes conduct before the stove number of processes by stove.Estimate the reliability of metal/ceramic adhesive article by the tolerance of stove with this.The tolerance of passing through stove of the metal/ceramic adhesive article of making in this embodiment as a result, is 58.
Embodiment 2
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 101 microns, skirt extension length＜0 of metallic circuit part micron.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 58.
Embodiment 3
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 95 microns, the skirt extension length of metallic circuit part is 3 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 68.
Embodiment 4
Except the etching second time was carried out 20 minutes, all the other steps were identical with embodiment 1, obtained such metal/ceramic adhesive article, and its brazing solder layer extension elongation is 124 microns, skirt extension length＜0 of metallic circuit part micron.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 84.
Embodiment 5
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 88 microns, the skirt extension length of metallic circuit part is 11 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 78.In addition, for the metal/ceramic adhesive article that obtains in this embodiment, use the equipment (SHIMADZUAGS-1000D that measures bending strength, Shimadzu Seisakusho produces) measure initial bending strength and three times by the bending strength behind the stove, measuring condition is that load speed is 0.5mm/min, and the length of span is 30mm, the result, initial bending strength is 615MPa, and three times is 535MPa by the bending strength behind the stove.
Embodiment 6
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 133 microns, skirt extension length＜0 of metallic circuit part micron.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 98.
Embodiment 7
Except the etching second time was carried out 10 minutes, all the other steps were identical with embodiment 1 described method, obtain such metal/ceramic adhesive article, and its brazing solder layer extension elongation is 73 microns, 8 microns of the skirt extension length of metallic circuit part.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 74.
Embodiment 8
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 82 microns, the skirt extension length of metallic circuit part is 4 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 58.In addition, similar to embodiment 5, for the metal/ceramic adhesive article that obtains in this embodiment, bending strength after measuring initial bending strength and passing through stove for three times, as a result, initial bending strength is 609MPa, and three times is 570MPa by the bending strength behind the stove.
Embodiment 9
Identical with similarly to Example 1 method, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 83 microns, the skirt extension length of metallic circuit part is 11 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 42.
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 93 microns, the skirt extension length of metallic circuit part is 5 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 52.
Embodiment 11
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 65 microns, the skirt extension length of metallic circuit part is 21 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 32.
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 53 microns, the skirt extension length of metallic circuit part is 23 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 32.
Embodiment 13
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 62 microns, the skirt extension length of metallic circuit part is 31 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 32.
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 54 microns, the skirt extension length of metallic circuit part is 15 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 40.
Embodiment 15
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 57 microns, the skirt extension length of metallic circuit part is 26 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 26.
Embodiment 16
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 55 microns, the skirt extension length of metallic circuit part is 25 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 30.
Embodiment 17
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 55 microns, the skirt extension length of metallic circuit part is 26 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 32.
With method similarly to Example 4, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 134 microns, skirt extension length＜0 of metallic circuit part micron.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 92.
Embodiment 19
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 52 microns, the skirt extension length of metallic circuit part is 18 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 26.In addition, described similar to embodiment 5, for the metal/ceramic adhesive article that obtains in this embodiment, bending strength after measuring initial bending strength and passing through stove for three times, as a result, initial bending strength is 622MPa, and three times is 549MPa by the bending strength behind the stove.
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 62 microns, the skirt extension length of metallic circuit part is 10 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 36.
Embodiment 21
With method similarly to Example 7, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 62 microns, the skirt extension length of metallic circuit part is 20 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 38.
Comparative Examples 1
Carry out 5 minutes except the etching second time, other steps are identical with embodiment 1, obtained such metal/ceramic adhesive article, and its brazing solder layer extension elongation is-20 microns, and the skirt extension length of metallic circuit part is 45 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 11, little than among the embodiment 1-21.In addition, similar to embodiment 5, for the metal/ceramic adhesive article that obtains in this embodiment, bending strength after measuring initial bending strength and passing through stove for three times, as a result, initial bending strength is 548MPa, and three times is 203MPa by the bending strength behind the stove.These two kinds of intensity are little than in embodiment 5,8 and 19 all.
Comparative Examples 2
With method similarly to Example 1, obtain such metal/ceramic adhesive article, its brazing solder layer extension elongation is 0 micron, the skirt extension length of metallic circuit part is 30 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 19, little than among the embodiment 1-21.In addition, similar to embodiment 5, for the metal/ceramic adhesive article that obtains in this embodiment, bending strength after measuring initial bending strength and passing through stove for three times, as a result, initial bending strength is 590MPa, and three times is 331MPa by the bending strength behind the stove.These two kinds of intensity are little than in embodiment 5,8 and 19 all.
Comparative Examples 3
With method similarly to Example 1, obtained such metal/ceramic adhesive article, its brazing solder layer extension elongation is 30 microns, the skirt extension length of metallic circuit part is 15 microns.Metal/ceramic adhesive article for obtaining has in this embodiment carried out the processing by stove, uses the tolerance (number of times) by stove to estimate reliability.As a result, the tolerance (number of times) by stove is 25, little than among the embodiment 1-21.In addition, similar to embodiment 5, for the metal/ceramic adhesive article that obtains in this embodiment, bending strength after measuring initial bending strength and passing through stove for three times, as a result, initial bending strength is 610MPa, and three times is 510MPa by the bending strength behind the stove.Two kinds of intensity is little than in embodiment 5,8 and 19 all.
The result of embodiment 1-21 and Comparative Examples 1-3 is as shown in the table.
Table 1
| Extension elongation (micron) | Skirt extension length (micron) | Tolerance (number of times) by stove | Initial bending strength (MPa) | Three times by bending strength (MPa) behind the stove | |
| Embodiment 1 | 102 | <0 | 58 | ||
| Embodiment 2 | 101 | <0 | 58 | ||
| Embodiment 3 | 95 | 3 | 68 | ||
| Embodiment 4 | 124 | <0 | 84 | ||
| Embodiment 5 | 88 | 11 | 78 | 615 | 535 |
| Embodiment 6 | 133 | <0 | 98 | ||
| Embodiment 7 | 73 | 8 | 74 | ||
| Embodiment 8 | 82 | 4 | 58 | 609 | 570 |
| Embodiment 9 | 83 | 11 | 42 | ||
| |
93 | 5 | 52 | ||
| Embodiment 11 | 65 | 2 | 32 | ||
| |
53 | 23 | 32 | ||
| Embodiment 13 | 62 | 31 | 32 | ||
| |
54 | 15 | 40 | ||
| Embodiment 15 | 54 | 26 | 26 | ||
| Embodiment 16 | 55 | 25 | 30 | ||
| Embodiment 17 | 55 | 26 | 32 | ||
| |
134 | <0 | 92 | ||
| Embodiment 19 | 52 | 18 | 26 | 622 | 549 |
| |
62 | 10 | 36 | ||
| Embodiment 21 | 62 | 20 | 38 |
| Comparative Examples 1 | -20 | 45 | 11 | 548 | 203 |
| Comparative Examples 2 | 0 | 30 | 19 | 590 | 331 |
| Comparative Examples 3 | 30 | 15 | 25 | 610 | 510 |
Fig. 7 and 8 has shown brazing solder layer extension elongation (micron) respectively and by the relation between the tolerance (number of times) of stove, and the relation between brazing solder layer extension elongation (micron) and the bending strength (MPa).As shown in Figure 7, if brazing solder layer extension elongation surpasses about 30 microns, by the just very fast increase of tolerance (number of times) of stove, if brazing solder layer extension elongation surpasses about 130 microns, the variation of passing through the tolerance of stove so just descends so.In addition, as shown in Figure 8, if brazing solder layer extension elongation surpasses about 30 microns, so initial bending strength and three differences by the bending strength behind the stove just diminish.Thus, as can be seen, if brazing solder layer extension elongation surpasses about 30 microns, spalling resistance will improve greatly so.
Though described the present invention according to preferred implementation, purpose is to help to understand better the present invention, should be understood that do not breaking away under the principle situation of the present invention, and the present invention can realize in many ways.Thus, should be understood that do not breaking away under the described principle situation of the present invention of claims, the present invention includes and to embody all possible embodiment of the present invention and the improved procedure of described embodiment.
Claims (6)
1. metal/ceramic adhesive article, it comprises:
Ceramic base material;
Sheet metal, it is bonded on the described ceramic base material with brazing solder;
Wherein the brazing solder layer is the 50-200 micron from the length that the basal surface of described sheet metal stretches out;
By sheet metal basal surface one end perpendicular to the plane of sheet metal principal plane, and is 50 microns or littler by sheet metal top surface one end of the above-mentioned end same side of sheet metal basal surface perpendicular to the distance between the plane of sheet metal principal plane, when bottom surface area during greater than top surface area, this distance think on the occasion of.
2. metal/ceramic adhesive article as claimed in claim 1 is characterized in that described ceramic substrate is formed by the material that is selected from oxide, nitride and carbide.
3. metal/ceramic adhesive article as claimed in claim 1 is characterized in that described sheet metal forms by being selected from following material: copper, and aluminium, copper are the alloy of main component, aluminium is the alloy of main component.
4. metal/ceramic adhesive article as claimed in claim 1 is characterized in that described brazing solder contains silver and reactive metal, and described reactive metal is selected from: Ti or Zr.
5. metal/ceramic adhesive article as claimed in claim 1 is characterized in that described brazing solder comprises aluminium.
6. metal/ceramic adhesive article as claimed in claim 1, it is characterized in that described sheet metal and brazing solder through nickel plating, nickel plating alloy and gold-plated at least a mode handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021522901A CN100471668C (en) | 2002-11-20 | 2002-11-20 | Metal/ceramic adhered products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021522901A CN100471668C (en) | 2002-11-20 | 2002-11-20 | Metal/ceramic adhered products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1502463A CN1502463A (en) | 2004-06-09 |
| CN100471668C true CN100471668C (en) | 2009-03-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021522901A Expired - Lifetime CN100471668C (en) | 2002-11-20 | 2002-11-20 | Metal/ceramic adhered products |
Country Status (1)
| Country | Link |
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| CN (1) | CN100471668C (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346963C (en) * | 2004-12-17 | 2007-11-07 | 清华大学 | Metal/ceramic laminated composite material prevention plate |
| US8299604B2 (en) * | 2008-08-05 | 2012-10-30 | Cooligy Inc. | Bonded metal and ceramic plates for thermal management of optical and electronic devices |
| CN101538166B (en) * | 2009-04-30 | 2014-01-29 | 清华大学 | Method for connecting ceramic with aluminium or aluminium alloy |
| CN103524148B (en) * | 2009-04-30 | 2015-10-28 | 清华大学 | A kind of manufacture method of surface metallised ceramic |
| US10424529B2 (en) | 2014-02-21 | 2019-09-24 | Denka Company Limited | Ceramic circuit board |
| CN105829266A (en) * | 2014-03-20 | 2016-08-03 | 三菱综合材料株式会社 | Bonded body, substrate for power modules, power module and method for producing bonded body |
| CN105643993A (en) * | 2014-10-28 | 2016-06-08 | 廖树汉 | Copper plate substitute copper-glass composite plate with weight lower than aluminum and cost reduced by times |
| CN105882018A (en) * | 2014-10-28 | 2016-08-24 | 廖树汉 | Copper-ceramic composite plate having lighter weight and several-times lower price than aluminum and used for replacing copper plate |
| CN105563894A (en) * | 2014-10-28 | 2016-05-11 | 廖树汉 | Stainless steel-ceramic composite plate being lighter than aluminum and much cheaper than stainless steel plates and used for replacing stainless steel plates |
| CN105880532A (en) * | 2014-10-28 | 2016-08-24 | 廖树汉 | Steel and ceramic compounded plate which is lighter than aluminum, reduced in price by over a half and capable of replacing steel plate |
| WO2019022133A1 (en) * | 2017-07-25 | 2019-01-31 | デンカ株式会社 | Ceramic circuit board and production method therefor |
-
2002
- 2002-11-20 CN CNB021522901A patent/CN100471668C/en not_active Expired - Lifetime
Non-Patent Citations (2)
| Title |
|---|
| JP 03 261669 A 1991.11.21 |
| JP 10 326949 A 1998.12.08 |
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|---|---|
| CN1502463A (en) | 2004-06-09 |
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