CN215731663U - Packaging heat dissipation cover and BGA packaging device - Google Patents

Abstract

The utility model provides a packaging heat dissipation cover and a BGA (ball grid array) packaging device, and relates to the technical field of semiconductor packaging. Compared with the prior art, the radiating cover body is provided with the hollowed-out holes, the first elastic adhesive layer is filled in the hollowed-out holes, the hollowed-out holes and the first elastic adhesive layer are utilized, an effective buffering effect can be achieved, and the problem that a chip is damaged due to large die closing pressure in a die closing process is effectively solved.

Description

Packaging heat dissipation cover and BGA packaging device

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a packaging heat dissipation cover and a BGA packaging device.

Background

With the rapid development of the semiconductor industry, the BGA Ball Array Package (Ball Grid Array Package) structure is widely used in the semiconductor industry. The BGA package structure is generally adopted to realize heat dissipation through mounting a heat dissipation sheet, the heat dissipation sheet is required to meet the heat dissipation requirement, a heat dissipation sheet groove is usually designed on a package mold, then the package mold fixes the heat dissipation sheet during plastic package, and plastic package materials are injected into the heat dissipation sheet and a chip component to complete injection molding operation.

In the prior art, in order to meet the heat dissipation requirement, the heat dissipation fins are usually made of rigid materials such as metal, the hardness of the heat dissipation fins is high, and in the injection molding process, the mold clamping pressure is high, so that a chip which is blown inside easily is cracked or even damaged due to the high mold clamping pressure, and the reliability of the product is not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a packaging heat dissipation cover and a BGA packaging device, which can avoid damage to a chip in a mold closing process.

The embodiment of the utility model is realized by the following steps:

in a first aspect, the present invention provides a package heat dissipation cover, including a heat dissipation cover body, where the cover body has a mold contact surface and a molding contact surface opposite to each other, where the mold contact surface is used to join a mold, so that the heat dissipation cover body is fixed on the mold, the molding contact surface is used to attach to a plastic package body, the molding contact surface is provided with a plurality of hollow holes, each hollow hole extends toward the mold contact surface, and each hollow hole is filled with a first elastic adhesive layer.

In an optional implementation mode, each hollowed-out ring groove is formed in the plastic joint surface around each hollowed-out hole, the hollowed-out ring groove is annularly arranged around the hollowed-out holes, and each hollowed-out ring groove is internally filled with a second elastic glue layer.

In an optional embodiment, the fretwork annular groove with fretwork hole interval sets up, just the periphery of fretwork hole is provided with the shaping crown plate, the inboard of shaping crown plate with the fretwork hole meets, the outside of shaping crown plate with the fretwork annular groove meets.

In an optional embodiment, the hollow hole includes a first hole section and a second hole section which are concentrically arranged, the first hole section is connected with the second hole section, the first hole section extends to the mould contact surface, the second hole section extends to the mould contact surface, and the aperture of the first hole section is smaller than that of the second hole section, so that an annular step surface is formed at the connection position of the first hole section and the second hole section.

In an optional embodiment, the heat dissipation cover body includes a first heat dissipation metal layer and a second heat dissipation metal layer attached together, the mold contact surface is located on a surface of the first heat dissipation metal layer, the mold contact surface is located on a surface of the second heat dissipation metal layer, and the hollow hole at least penetrates through the second heat dissipation metal layer.

In an alternative embodiment, a plurality of the hollow hole arrays are distributed on the plastic joint surface, and the distance between every two adjacent hollow holes is equal.

In an optional implementation manner, the edge of the heat dissipation cover body is further provided with a first glue blocking rail, the first glue blocking rail is located at the mold connecting surface and surrounds the edge of the mold connecting surface, and the first glue blocking rail is convexly arranged towards the direction far away from the mold connecting surface.

In an optional implementation manner, a second glue retaining rail is further arranged at the edge of the heat dissipation cover body, the second glue retaining rail is located on the plastic connection surface and surrounds the edge of the plastic connection surface, and the second glue retaining rail is arranged in a protruding manner towards the direction away from the mold connection surface.

In an optional embodiment, the plastic joint surface is further coated with a green paint layer or electroplated with a burred layer to improve the bonding force between the heat dissipation cover body and the plastic package body.

In a second aspect, the present invention provides a BGA package device, which includes a substrate, a chip, a plastic package body, and the heat dissipation cover of any one of the foregoing embodiments, wherein the chip is attached to the substrate, the plastic package body is disposed on the substrate and covers the chip, and the heat dissipation cover body is attached to the plastic package body through the plastic joint surface.

The embodiment of the utility model has the beneficial effects that:

according to the packaging heat dissipation cover and the BGA packaging device, the hollow holes are formed in the heat dissipation cover body, the first elastic adhesive layer is filled in the hollow holes, the hollow holes and the first elastic adhesive layer are utilized, an effective buffering effect can be achieved, and the problem that a chip is damaged due to large die clamping pressure in the die clamping process is effectively solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a package heat dissipation cover according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a package heat dissipation cover according to a first embodiment of the present invention in a second view;

fig. 3 is a schematic cross-sectional view of a heat dissipation cover of a package according to a first embodiment of the utility model;

fig. 4 is a schematic structural diagram of a package heat dissipation cover according to a second embodiment of the present invention;

FIG. 5 is a schematic view of the slotted structure of the hollow holes and the hollow ring grooves in FIG. 4;

FIG. 6 is a schematic diagram of a glue filling structure of the hollow holes and the hollow ring grooves in FIG. 4;

fig. 7 is a schematic structural view of a hollow hole on a package heat sink cover according to a third embodiment of the utility model;

fig. 8 is a schematic structural diagram of a BGA packaged device according to a fourth embodiment of the utility model.

Icon:

100-packaging a heat dissipation cover; 110-heat dissipation cover body; 111-a first heat-dissipating metal layer; 113-a second heat dissipating metal layer; 115-a first glue stop rail; 117-second glue blocking rail; 119-a rounded corner structure; 130-mold junction; 150-molding a junction surface; 170-hollowed out holes; 171-a first elastic glue layer; 173 — a first bore section; 175-a second bore section; 190-hollowed-out ring grooves; 191-a second elastic glue layer; 193-forming a ring plate; 200-BGA package device; 210-a substrate; 230-chip; 250-plastic package body.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As disclosed in the background art, the conventional heat sink usually uses an integral rigid material, which is hard, and during the mold clamping process, the chip, which is fragile inside, is easily cracked due to excessive mold clamping pressure, which affects the reliability of the product. In addition, in the plastic package process of the conventional heat radiating fin, due to the extrusion effect of the mold, the plastic package material may climb to the upper side surface of the heat radiating fin along the side wall of the heat radiating fin, glue overflow is left on the surface of the heat radiating fin, and once the glue overflow is left on the upper side surface of the heat radiating fin, the heat radiating efficiency of the heat radiating fin and the tidiness of the appearance of a product are directly influenced. Therefore, in the prior art, an additional photoresist removing process is required, which undoubtedly directly increases the packaging cost and may damage the heat sink.

In order to solve the problems, the utility model provides a packaging heat dissipation cover and a BGA packaging device, which can avoid damage to a chip in a die assembly process, ensure the reliability of a product, effectively avoid the problem of glue overflow to the upper side surface of a heat dissipation fin, and ensure the heat dissipation efficiency of the heat dissipation fin and the tidiness of the appearance of the product. It is to be noted that the features in the embodiments of the present embodiment may be combined with each other without conflict.

First embodiment

Referring to fig. 1 to 3, the present embodiment provides a package heat dissipation cover 100, which can prevent a chip 230 from being damaged during a mold assembly process, ensure reliability of a product, effectively avoid a problem of glue overflow during a plastic package process, and ensure heat dissipation efficiency and tidiness of product appearance.

The package heat dissipation cover 100 provided by the embodiment includes a heat dissipation cover body 110, the cover body has a mold connection surface 130 and a molding connection surface 150 opposite to each other, the mold connection surface 130 is used for being connected to a mold, so that the heat dissipation cover body 110 is fixed on the mold, the molding connection surface 150 is used for being attached to a plastic package body 250, a plurality of hollow holes 170 are formed in the molding connection surface 150, each hollow hole 170 extends toward the mold connection surface 130, and a first elastic adhesive layer 171 is filled in each hollow hole 170.

During actual plastic packaging, firstly, the heat dissipation cover body 110 is combined on the die joint surface 130 through a die, so that the heat dissipation cover body 110 is kept fixed, then, a plastic package material is injected, the plastic package material is shaped under the extrusion of the heat dissipation cover body 110, because the heat dissipation cover body 110 is provided with the plurality of hollow holes 170, a first elastic adhesive layer 171 is filled in each hollow hole 170, the heat dissipation cover body 110 has a certain buffering effect during the whole extrusion, and the problem that the chip 230 is damaged due to large die joint pressure in the die joint process is effectively avoided.

It should be noted that in the present embodiment, the hollow holes 170 may penetrate through the heat dissipation cover body 110, and the elastic modulus of the first elastic adhesive layer 171 is obviously lower than that of the heat dissipation cover body 110, so that a certain buffering effect can be achieved by the plurality of first elastic adhesive layers 171. The first elastic adhesive layer 171 may be filled in the hollow hole 170 by printing or dispensing.

In the present embodiment, the plurality of hollow holes 170 are distributed in the plastic-molded surface 150, and the distance between every two adjacent hollow holes 170 is equal. Specifically, the plurality of hollow holes 170 are uniformly distributed, and the distribution density thereof may be determined according to actual requirements or simulation experiments.

In this embodiment, the first elastic adhesive layer 171 may be a heat conductive adhesive, which can perform a heat conductive function, so as to ensure a heat dissipation function of the heat dissipation cover body 110.

In the embodiment, the heat dissipation cover body 110 includes a first heat dissipation metal layer 111 and a second heat dissipation metal layer 113 adhered together, the mold contact surface 130 is located on the surface of the first heat dissipation metal layer 111, the molding contact surface 150 is located on the surface of the second heat dissipation metal layer 113, and the hollow hole 170 at least penetrates through the second heat dissipation metal layer 113. Specifically, the first heat dissipation metal layer 111 and the second heat dissipation metal layer 113 are both copper foils, and the hollow holes 170 are formed in the lower surface of the second heat dissipation metal layer 113, i.e., formed in the molding surface 150, and upwardly penetrate through to the upper surface of the first heat dissipation metal, i.e., penetrate through to the molding surface 130.

It should be noted that the hollow-out hole 170 may also only penetrate through the second heat dissipation metal layer 113, and during actual manufacturing, a laser grooving process may be used to form the hollow-out hole 170 on the second heat dissipation metal layer 113, and then the first elastic adhesive layer 171 is filled with an adhesive to form the first elastic adhesive layer 171, and then the first heat dissipation metal layer 111 is attached to the first elastic adhesive layer, so as to achieve adhesion by using the adhesive layer. And adopt this kind of structure, can reduce the incomplete copper rate of copper foil by a wide margin, reduce processing cost.

In this embodiment, the edge of the heat dissipating cap body 110 is further provided with a first glue blocking rail 115, the first glue blocking rail 115 is located on the mold connecting surface 130 and surrounds the edge of the mold connecting surface 130, and the first glue blocking rail 115 is protruded towards the direction away from the mold connecting surface 150. Specifically, after the heat dissipation cover body 110 is formed, a groove is formed in the mold connecting surface 130 by using a laser grooving or punching process, the first glue blocking rail 115 is formed at the edge of the groove, and the first glue blocking rail 115 is arranged, so that the plastic package material can be effectively prevented from climbing to the upper side surface of the heat dissipation cover body 110 during plastic package, and the glue overflow phenomenon on the upper side surface of the heat dissipation cover body 110 is prevented.

Further, in this embodiment, the edge of the heat dissipation cover body 110 is further provided with a second glue-blocking rail 117, the second glue-blocking rail 117 is located at the plastic-molded surface 150 and surrounds the edge of the plastic-molded surface 150, and the second glue-blocking rail 117 protrudes toward the direction away from the mold-molded surface 130. Specifically, after the heat dissipation cover body 110 is formed, the laser grooving or punching process is utilized to perform grooving on the molding surface 150, the second glue retaining fence 117 is formed at the edge of the grooving, the second glue retaining fence 117 is arranged, the side climbing phenomenon of the plastic package material can be further prevented, the overflow phenomenon of the plastic package material can be slowed down, and the occurrence of the glue overflow phenomenon on the upper side surface of the heat dissipation cover body 110 is further prevented.

In this embodiment, at least one groove is further disposed inside the first glue blocking rail 115 and the second glue blocking rail 117, and the groove located inside the first glue blocking rail 115 can play a role in storing the plastic package material, so that even if the plastic package material climbs to the upper side surface of the heat dissipation cap body 110, most of the plastic package material can be stored in the groove, and the plastic package material is prevented from further flowing towards the central position of the heat dissipation cap body 110. The groove located on the inner side of the second glue retaining rail 117 can play a role in storing the plastic package material, so that the plastic package material is prevented from overflowing, and the bonding force between the plastic package material and the heat dissipation cover body 110 is also improved, so that the heat dissipation cover body 110 is prevented from falling off during plastic packaging.

It should be noted that, in this embodiment, the heat dissipation cover body 110 is further provided with a cutting track, the cutting track is a product cutting track, and the cutting track is located inside the first glue blocking rail 115 and the second glue blocking rail 117, so that the first glue blocking rail 115 and the second glue blocking rail 117 can be cut off after the product is cut, and the consistency of the appearance of the packaged product is ensured.

In the present embodiment, the mold surface 130 of the heat sink cap body 110 is further formed with an oxidation-resistant metal layer by electroplating, specifically, the oxidation-resistant metal layer may be formed by combining an outer layer of chromium and an inner layer of nickel, wherein the chromium material can improve the wear resistance and the oxidation resistance, and the nickel material can improve the bonding force between the oxidation-resistant metal layer and the heat sink cap body 110.

In this embodiment, the molding surface 150 of the heat dissipating cap body 110 is further coated with a green paint layer to improve the bonding force between the heat dissipating cap body 110 and the plastic package body 250. Specifically, the green paint layer is solder resist ink, and has a strong binding force, so that the plastic package material and the heat dissipation cover body 110 can be plastically packaged into a whole. Of course, the plastic joint surface 150 of the heat dissipation cover body 110 may also be formed with a knurled layer by electroplating, and specifically, a honeycomb knurled surface is formed on the plastic joint surface 150 by an electroplating roughening process, which can also improve the bonding force with the plastic package material.

In this embodiment, the heat dissipation cover body 110 is rectangular, the specification and size of the heat dissipation cover body 110 can be determined according to the size of the plastic package body 250, and the rounded corner structures 119 are arranged around the heat dissipation cover body 110 to increase the separation angle between the heat dissipation cover body 110 and the mold. Specifically, R chamfers are designed around the heat dissipation cover body 110, the chamfers can increase the separation angle between the heat dissipation cover body 110 and the mold groove, and the mold can be better separated after the encapsulation heat dissipation cover 100 is pressed.

In summary, the present embodiment provides a package heat sink cover 100, wherein the hollow-out hole 170 is formed on the heat sink cover body 110, and the first elastic adhesive layer 171 is filled in the hollow-out hole 170, so that the heat sink cover body 110 has a certain buffering effect during the whole extrusion process, thereby effectively avoiding the problem of damage to the chip 230 due to large mold clamping pressure during the mold clamping process. And the plastic sealing material is effectively prevented from climbing to the mold connecting surface 130 through the first glue blocking rail 115 and the second glue blocking rail 117, the phenomenon of residual glue overflow is avoided, and the heat dissipation capability of the packaging heat dissipation cover 100 and the appearance tidiness of the product are ensured.

Second embodiment

Referring to fig. 4 to 6, the present embodiment provides a heat dissipating package cover 100, the basic structure and principle and the technical effect thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment for the parts not mentioned in the present embodiment.

The packaging heat dissipation cover 100 includes a heat dissipation cover body 110, the cover body has a mold contact surface 130 and a molding contact surface 150 opposite to each other, the mold contact surface 130 is used for being joined to a mold, so that the heat dissipation cover body 110 is fixed on the mold, the molding contact surface 150 is used for being attached to a molding body 250, a plurality of hollow holes 170 are formed in the molding contact surface 150, each hollow hole 170 extends toward the mold contact surface 130, and a first elastic adhesive layer 171 is filled in each hollow hole 170.

In the present embodiment, the molding surface 150 around each hollow-out hole 170 is further provided with a hollow-out ring groove 190, the hollow-out ring groove 190 is disposed around the hollow-out hole 170, and the second elastic adhesive layer 191 is filled in each hollow-out ring groove 190. Specifically, the hollow ring groove 190 and the hollow hole 170 may be formed together by a laser grooving process, and the first elastic adhesive layer 171 and the second elastic adhesive layer 191 may be formed by one-time dispensing, so that the process flow is saved. Alternatively, the first elastic adhesive layer 171 may be formed by dispensing in the hollow hole 170, and then the hollow ring groove 190 may be formed by laser grooving, and the second elastic adhesive layer 191 may be formed by dispensing again. Also, the second elastic adhesive layer 191 may be made of the same adhesive material as the first elastic adhesive layer 171.

In this embodiment, the hollow-out ring groove 190 and the hollow-out hole 170 are disposed at an interval, a forming ring plate 193 is disposed at the periphery of the hollow-out hole 170, the inner side of the forming ring plate 193 is connected to the hollow-out hole 170, and the outer side of the forming ring plate 193 is connected to the hollow-out ring groove 190. Specifically, the forming ring plate 193 has a cylindrical shape and a thickness of 0.5mm to 1 mm. Through the hollowed-out ring grooves 190 and the hollowed-out holes 170 which are arranged at intervals, the first elastic adhesive layer 171 and the second elastic adhesive layer 191 are isolated from each other, so that the buffering effect is achieved respectively, and the buffering effect is further improved.

In this embodiment, through the additional hollow-out ring groove 190 that sets up to fill second elastic adhesive layer 191 in hollow-out ring groove 190, combine first elastic adhesive layer 171 to play the elastic buffer effect, improved the effect of elastic buffer, further avoided chip 230 impaired.

Third embodiment

Referring to fig. 7, the basic structure and principle of the heat dissipating cap 100 and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment except for the parts mentioned in this embodiment.

In the present embodiment, the heat dissipation cap 100 includes a heat dissipation cap body 110, the cap body has a mold surface 130 and a molding surface 150 opposite to each other, the mold surface 130 is used for being joined to a mold, so that the heat dissipation cap body 110 is fixed on the mold, the molding surface 150 is used for being attached to a plastic package body 250, a plurality of hollow holes 170 are formed in the molding surface 150, each hollow hole 170 extends toward the mold surface 130, and a first elastic adhesive layer 171 is filled in each hollow hole 170.

In the embodiment, the hollow hole 170 includes a first hole section 173 and a second hole section 175 which are concentrically arranged, the first hole section 173 is connected to the second hole section 175, the first hole section 173 extends to the molding surface 130, the second hole section 175 extends to the molding surface 150, and the diameter of the first hole section 173 is smaller than that of the second hole section 175, so that a circular step surface is formed at the connection position of the first hole section 173 and the second hole section 175. Specifically, the first hole segment 173 and the second hole segment 175 may be formed through a laser grooving process, wherein the first hole segment 173 is located at an upper portion, the second hole segment 175 is located at a lower portion, and a diameter of the second hole segment 175 is 1-2 times a diameter of the first hole segment 173, so that a hole expanding structure is formed at a lower portion of the hollow hole 170, so as to further increase a lower volume of the first elastic adhesive layer 171, thereby improving a buffering effect thereof.

It should be noted that in this embodiment, the first hole section 173 and the second hole section 175 are both straight hole sections, that is, the hole diameter of the first hole section 173 is the same everywhere, and the hole diameter of the second hole section 175 is the same everywhere, which facilitates forming by using a laser grooving process. Of course, in other preferred embodiments, the second hole section 175 may also be formed in an inverted trumpet shape, so as to form the first glue layer with a lower frustum shape, thereby achieving a better buffering effect.

Fourth embodiment

Referring to fig. 8, the present embodiment provides a BGA package device 200, which includes a substrate 210, a chip 230, a molding compound 250 and a package heat sink cap 100, wherein the basic structure and principle of the package heat sink cap 100 and the technical effects thereof are the same as those of the first embodiment, the second embodiment or the third embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment, the second embodiment or the third embodiment for parts that are not mentioned in the present embodiment.

The present embodiment provides a BGA package device 200, which includes a substrate 210, a chip 230, a molding compound 250 and the package heat dissipation cap 100 according to any of the foregoing embodiments, wherein the package heat dissipation cap 100 includes a heat dissipation cap body 110, the cap body has a mold surface 130 and a mold surface 150 opposite to each other, the mold surface 130 is used for being bonded to a mold, so that the heat dissipation cap body 110 is fixed on the mold, the mold surface 150 is used for being attached to the molding compound 250, the mold surface 150 is provided with a plurality of hollow holes 170, each hollow hole 170 extends toward the mold surface 130, and each hollow hole 170 is filled with a first elastic adhesive layer 171. The chip 230 is attached to the substrate 210, the plastic package body 250 is disposed on the substrate 210 and covers the chip 230, and the heat dissipation cover body 110 is attached to the plastic package body 250 through the plastic connection surface 150.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides an encapsulation heat dissipation lid, its characterized in that, includes the heat dissipation lid body, the lid body has relative mould face and moulds the face of connecting, the mould face of connecting is used for joining the mould, so that the heat dissipation lid body is fixed on the mould, mould the face of connecting and be used for laminating plastic-sealed body, mould and seted up a plurality of fretwork holes on the face of connecting, every the fretwork hole towards the mould face of connecting extends, and every it has first elastic adhesive layer to fill in the fretwork hole.

2. The heat dissipating package cover according to claim 1, wherein a hollow ring groove is further disposed around each hollow hole on the molding surface, the hollow ring groove is disposed around the hollow hole, and a second elastic adhesive layer is filled in each hollow ring groove.

3. The heat dissipating package cover according to claim 2, wherein the annular through-holes are spaced apart from the through-holes, and a ring-shaped plate is disposed around the through-holes, the inner side of the ring-shaped plate is connected to the through-holes, and the outer side of the ring-shaped plate is connected to the annular through-holes.

4. The heat sink cover according to claim 1, wherein the hollow hole comprises a first hole section and a second hole section concentrically arranged, the first hole section is connected to the second hole section, the first hole section extends to the molding surface, the second hole section extends to the molding surface, and the first hole section has a smaller diameter than the second hole section, so that a circular step surface is formed at the connection position of the first hole section and the second hole section.

5. The package heat sink cover according to any of claims 1-4, wherein the heat sink cover body comprises a first heat sink metal layer and a second heat sink metal layer bonded together, the molding surface is located on a surface of the first heat sink metal layer, the molding surface is located on a surface of the second heat sink metal layer, and the hollow hole at least penetrates through the second heat sink metal layer.

6. The heat dissipating cover of any one of claims 1 to 4, wherein a plurality of the hollow holes are distributed in the plastic contact surface, and the distance between every two adjacent hollow holes is equal.

7. The packaged heat sink cap according to any one of claims 1 to 4, wherein the edge of the heat sink cap body is further provided with a first glue blocking rail, the first glue blocking rail is located at the mold-joining surface and surrounds the edge of the mold-joining surface, and the first glue blocking rail is protruded away from the mold-joining surface.

8. The package heat sink cover according to claim 7, wherein a second glue-blocking rail is further disposed on an edge of the heat sink cover body, the second glue-blocking rail is located on the molding surface and surrounds the edge of the molding surface, and the second glue-blocking rail protrudes toward a direction away from the molding surface.

9. The encapsulated heat sink cap as claimed in any one of claims 1-4, wherein the molding surface is further coated with a green paint layer or plated with a beading layer to improve the bonding force between the heat sink cap body and the molding body.

10. A BGA package device, comprising a substrate, a chip, a plastic package body and the heat dissipation cover of any one of claims 1-9, wherein the chip is attached to the substrate, the plastic package body is disposed on the substrate and covers the chip, and the heat dissipation cover body is attached to the plastic package body through the plastic joint surface.

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