CN215729270U

CN215729270U - Ceramic thin film integrated circuit photoetching glue homogenizing table

Info

Publication number: CN215729270U
Application number: CN202122055974.8U
Authority: CN
Inventors: 范赟棋
Original assignee: Zhongxin Jianhai Semiconductor Technology Anhui Co ltd
Current assignee: Zhongxin Jianhai Semiconductor Technology Anhui Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-02-01
Anticipated expiration: 2031-08-30

Abstract

The utility model discloses a photoresist homogenizing table for a ceramic thin film integrated circuit. The automatic glue spreading device comprises a base, wherein a control panel is installed on one side of the base, a cylindrical groove is installed at one end of the top of the base, an electric telescopic rod is arranged at the bottom of the inner portion of the cylindrical groove, a fixed block is installed at the output end of the electric telescopic rod and extends to the outer portion of the top of the cylindrical groove, a rotating block is rotatably installed at the top of the fixed block, a connecting block is installed at the top of the rotating block, a glue spreading device is installed on one side, close to the control panel, of the connecting block, and a glue spreading table is installed at the center of the top of the base. According to the utility model, after glue homogenizing, the fixed plate is moved, so that the heating block at the bottom of the fixed plate can be used for carrying out baking solidification on the ceramic thin film integrated circuit on the glue homogenizing table, and the glue homogenizing solidification is directly carried out after the glue homogenizing is finished, so that the ceramic thin film integrated circuit is not required to be baked by other baking equipment, and the operation is simple, and the glue homogenizing of the ceramic thin film integrated circuit is not easy to damage because the glue is not solidified.

Description

Ceramic thin film integrated circuit photoetching glue homogenizing table

Technical Field

The utility model relates to the technical field of a photoresist uniformizing table, in particular to a photoresist uniformizing table for a ceramic thin film integrated circuit.

Background

The spin coater is a device which drips various glue solutions on a substrate rotating at a high speed, and the glue solutions dripped on the substrate are uniformly coated on the substrate by utilizing centrifugal force, and the thickness of a film depends on the rotating speed of the spin coater and the viscosity of the glue solution.

The traditional spin coater does not have a baking function after the spin coating is finished, and needs to be baked by other baking equipment, so that the spin coating which is more complicated in operation and easy to damage a ceramic thin film integrated circuit because glue is not solidified is possible, and meanwhile, manual glue dispensing is needed on a spin coating table, so that the inaccuracy of glue dispensing amount can cause errors in the spin coating process.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a photoresist homogenizing table for a ceramic thin film integrated circuit, which aims to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: a photoresist homogenizing table for a ceramic thin film integrated circuit photoresist comprises a base, wherein a control panel is installed on one side of the base, a cylindrical groove is installed at one end of the top of the base, an electric telescopic rod is arranged at the bottom inside the cylindrical groove, a fixed block is installed at the output end of the electric telescopic rod and extends to the outside of the top of the cylindrical groove, a rotating block is rotatably installed at the top of the fixed block, a connecting block is installed at the top of the rotating block, a dispensing device is installed on one side, close to the control panel, of the connecting block, a photoresist homogenizing table is installed at the center of the top of the base, a protective frame is arranged at the position, close to the center of the photoresist homogenizing table, of the top of one side, close to the control panel, of the base and far away from the cylindrical groove, a first sliding groove is formed in one end of one side, close to the control panel, of the base, a pull handle is slidably installed inside the first sliding groove, and a connecting rod is installed at the top of the pull handle, the fixed plate is installed at the top of connecting rod, the bottom of fixed plate is provided with the heating piece, the second spout has been seted up to the one end that the cylinder groove was kept away from at the top of base, electric connection between control panel, electric telescopic handle, the adhesive deposite device, electric connection between even gluey platform and the control panel, electric connection between control panel and the heating piece.

Preferably, the connecting rod is slidably connected inside the second sliding groove.

Preferably, the sliding distances of the first sliding chute and the second sliding chute are equal.

Preferably, the fixed plate and the glue homogenizing table are identical in shape and correspond in position to each other.

Preferably, the height of the protective frame is higher than that of the glue homogenizing table.

Preferably, the outer surface of the protective frame is provided with a through hole which corresponds to the shape of the fixing plate and is matched with the position of the fixing plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. this even gluey platform of ceramic film integrated circuit photoetching, after even gluey back, through removing the fixed plate, the ceramic film integrated circuit that makes the heating block of fixed plate bottom can be for even gluey bench goes on, makes even gluey complete directly toast and solidify, just so need not borrow other baking equipment again and toast it, also can not destroy ceramic film integrated circuit's even gluey easily because glue does not solidify when easy operation like this.

2. This even platform of gluing of ceramic thin film integrated circuit photoetching is glued through using adhesive deposite device to the ceramic thin film integrated circuit point on even gluey platform, just so need not artifical point and glues, has avoided the inaccurate even process time emergence error that leads to even gluing of artifical point glue water yield.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is a schematic top view of the present invention.

In the figure: 1. a base; 2. a control panel; 3. a cylindrical groove; 4. a fixed block; 5. rotating the block; 6. connecting blocks; 7. a dispensing device; 8. a protective frame; 9. a first chute; 10. pulling a handle; 11. a connecting rod; 12. a fixing plate; 13. a heating block; 14. an electric telescopic rod; 15. a glue homogenizing table; 16. a second runner.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, an embodiment of the present invention is shown: a photoresist homogenizing table for a ceramic thin film integrated circuit photoetching comprises a base 1, a control panel 2 is installed on one side of the base 1, a cylindrical groove 3 is installed at one end of the top of the base 1, an electric telescopic rod 14 is arranged at the bottom inside the cylindrical groove 3, a fixed block 4 is installed at the output end of the electric telescopic rod 14, the fixed block 4 extends to the outside of the top of the cylindrical groove 3, a rotating block 5 is rotatably installed at the top of the fixed block 4, a connecting block 6 is installed at the top of the rotating block 5, a glue dispensing device 7 is installed at one side of the connecting block 6 close to the control panel 2, a photoresist homogenizing table 15 is installed at the center of the top of the base 1, a protective frame 8 is arranged at the center of the top of the base 1 close to the photoresist homogenizing table 15, a first chute 9 is arranged at one end of one side of the base 1 close to the control panel 2 and far away from the cylindrical groove 3, a pull handle 10 is slidably installed inside the first chute 9, and a connecting rod 11 is installed at the top of the pull handle 10, fixed plate 12 is installed at the top of connecting rod 11, and the bottom of fixed plate 12 is provided with heating block 13, and second spout 16 has been seted up to the one end that cylinder groove 3 was kept away from at the top of base 1, and electric connection between control panel 2, electric telescopic handle 14, adhesive deposite device 7, and electric connection between even gluey platform 15 and the control panel 2, electric connection between control panel 2 and heating block 13.

In this embodiment, the connecting rod 11 is slidably connected to the inside of the second slide groove 16, and the pull handle 10 moves in the first slide groove 9 and the connecting rod 11 slides in the inside of the second slide groove 16.

In this embodiment, the sliding distances of the first chute 9 and the second chute 16 are equal, and the moving distance of the pull handle 10 in the first chute 9 is equal to the moving distance of the connecting rod 11 in the second chute 16, so that the fixing plate 12 can move above the glue homogenizing table 15.

In this embodiment, the fixing plate 12 and the glue leveling table 15 have the same shape and the corresponding positions, and when the fixing plate 12 moves above the glue leveling table 15, the heating block 13 is heated by the control panel 2, so that the glue on the ceramic thin film integrated circuit on the glue leveling table 15 can be solidified by the heating block 13.

In this embodiment, the height of the protection frame 8 is higher than that of the glue homogenizing table 15, so that the glue on the ceramic thin film integrated circuit can be prevented from splashing out in the rotating process of the glue homogenizing table 15, and the protection frame 8 plays a role in protection.

In this embodiment, the outer surface of the protection frame 8 is provided with a through hole corresponding to the shape of the fixing plate 12 and matched with the fixing plate in position, so that the fixing plate 12 can move to the upper side of the glue homogenizing table 15 through the through hole on the protection frame 8.

The working principle is as follows: the ceramic thin film integrated circuit is placed on a glue homogenizing table 15, a button on a control panel 2 is pressed, an electric telescopic rod 14 in a cylindrical groove 3 drives a glue dispensing device 7 to move up and down through a fixed block 4, a rotating block 5 and a connecting block 6 to adjust a proper position, when the direction needs to be adjusted, the connecting block 6 drives the rotating block 5 to rotate, when the position of the glue dispensing device 7 is adjusted, the button on the control panel 2 is pressed, the glue dispensing device 7 dispenses on the ceramic thin film integrated circuit on the glue homogenizing table 15, so that manual glue dispensing is not needed, errors in the glue homogenizing process caused by inaccuracy of glue dispensing amount are avoided, after glue dispensing is finished, the button on the control panel 2 is pressed, the glue homogenizing table 15 starts to rotate, and a protective frame 8 can prevent the glue from splashing when the glue homogenizing table 15 performs glue homogenizing in the rotating process, after glue homogenizing, the pulling handle 10 slides in the first sliding groove 9, the connecting rod 11 also slides in the second sliding groove 16, the connecting rod 11 drives the fixing plate 12 to penetrate through the through hole in the outer surface of the protective frame 8 to enter the upper part of the glue homogenizing table 15, the button on the control panel 2 is pressed, the heating block 13 at the bottom of the fixing plate 12 can heat glue on the ceramic thin film integrated circuit to be solidified, so that the ceramic thin film integrated circuit does not need to be baked by other baking equipment, and the glue homogenizing operation is simple and the glue can not be easily damaged because the glue is not solidified.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Claims

1. The utility model provides a ceramic thin film integrated circuit photoetching glue homogenizing table, includes base (1), its characterized in that: the automatic glue homogenizing device is characterized in that a control panel (2) is installed on one side of a base (1), a cylindrical groove (3) is installed at one end of the top of the base (1), an electric telescopic rod (14) is arranged at the bottom of the interior of the cylindrical groove (3), a fixed block (4) is installed at the output end of the electric telescopic rod (14), the fixed block (4) extends to the outside of the top of the cylindrical groove (3), a rotating block (5) is rotatably installed at the top of the fixed block (4), a connecting block (6) is installed at the top of the rotating block (5), a glue dispensing device (7) is installed on one side, close to the control panel (2), of the connecting block (6), a glue homogenizing table (15) is installed at the center of the top of the base (1), a protective frame (8) is arranged at the center, close to the glue homogenizing table (15), a first sliding groove (9) is formed in one end, close to the top of one side of the control panel (2) and far away from the cylindrical groove (3), of the base (1), the utility model discloses a glue homogenizing machine, including base (1), the inside slidable mounting of first spout (9) has and draws handle (10), draw the top of handle (10) and install connecting rod (11), fixed plate (12) are installed at the top of connecting rod (11), the bottom of fixed plate (12) is provided with heating block (13), second spout (16) have been seted up to the one end that cylinder groove (3) were kept away from at the top of base (1), electric connection between control panel (2), electric telescopic handle (14), adhesive deposite device (7), electric connection between even gluey platform (15) and control panel (2), electric connection between control panel (2) and heating block (13).

2. The photoresist track of claim 1, wherein: the connecting rod (11) is connected in a sliding manner inside the second sliding groove (16).

3. The photoresist track of claim 1, wherein: the sliding distances of the first sliding chute (9) and the second sliding chute (16) are equal.

4. The photoresist track of claim 1, wherein: the fixed plate (12) and the glue homogenizing table (15) are identical in shape and correspond in position to each other.

5. The photoresist track of claim 1, wherein: the height of the protective frame (8) is higher than that of the glue homogenizing table (15).

6. The photoresist track of claim 1, wherein: the outer surface of the protective frame (8) is provided with a through hole which corresponds to the shape of the fixing plate (12) and is matched with the position of the fixing plate.