CN215727778U

CN215727778U - Wafer appearance detection module and wafer appearance detection equipment

Info

Publication number: CN215727778U
Application number: CN202121993680.3U
Authority: CN
Inventors: 肖治祥; 许锐; 朱涛; 饶兴
Original assignee: Wuhan Jingce Electronic Group Co Ltd; Suzhou Hirose Opto Co Ltd
Current assignee: Wuhan Jingce Electronic Group Co Ltd; Suzhou Hirose Opto Co Ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-02-01
Anticipated expiration: 2031-08-23

Abstract

The utility model discloses a wafer appearance detection module and wafer appearance detection equipment, and belongs to the technical field of wafer detection. The wafer appearance detection module is simple in structure and convenient to set, can realize simultaneous setting of the 2D camera and the 3D camera, meets different detection requirements of wafers to be detected, avoids frequent replacement of the detection module in wafer appearance detection equipment and multiple moving and positioning of the wafers to be detected, simplifies the procedures of wafer appearance detection, improves the efficiency and quality of wafer appearance detection, reduces the production and application cost of the wafers, and has good application prospect and popularization value.

Description

Wafer appearance detection module and wafer appearance detection equipment

Technical Field

The utility model belongs to the technical field of wafer detection, and particularly relates to a wafer appearance detection module and wafer appearance detection equipment.

Background

With the rapid development of electronic products, the demand of the electronic market for wafers is increasing day by day, and higher requirements are put forward on the product quality, the product specification, the preparation process and the like of the wafers.

In the production process of the wafer, the inspection process of the wafer is indispensable, which often relates to the reliability and accuracy of the subsequent use of the wafer. At present, the variety of equipment for wafer detection is various, and the detection process of wafer products can be met to a certain extent. However, the wafer detection equipment in the prior art is often single and fixed in model, and most of the equipment can only detect a certain defect of a certain wafer in a targeted manner or can only detect a certain defect of a wafer in a single manner, so that the detection efficiency of the wafer is low, the detection at various stages in the wafer production process cannot be fully met, and the efficiency and the cost of wafer detection are restricted.

SUMMERY OF THE UTILITY MODEL

Aiming at one or more of the defects or the improvement requirements in the prior art, the utility model provides the wafer appearance detection module and the wafer appearance detection equipment, which can simultaneously realize the application of a 2D camera and a 3D camera on the detection module, can realize the detection of various defects of the wafer without frequently replacing the detection module on the equipment, and improve the functionality and the compatibility of the wafer detection equipment.

In order to achieve the above object, according to one aspect of the present invention, a wafer appearance inspection module is provided, which includes a support;

the support includes first mounting panel, and one side of this first mounting panel is provided with at least one 2D camera mounting bracket that is used for installing the 2D camera, just be provided with at least one on the first mounting panel the 2D camera.

As a further improvement of the utility model, a second mounting plate is further arranged on one side of the first mounting plate, which is far away from the 2D camera mounting frame;

the second mounting panel with first mounting panel interval sets up, connects through a plurality of connecting plates between the two to be formed with the installation space that is used for the installation of 3D camera between the two.

As a further improvement of the present invention, the two 2D camera mounting frames are symmetrically arranged, and are respectively provided with the same 2D camera.

As a further improvement of the present invention, the 2D camera mount comprises a first rotating plate;

one side of the first rotating plate is hinged to the first mounting plate, so that the first rotating plate and the 2D camera connected to the first rotating plate can rotate relative to the plate surface of the first mounting plate.

As a further improvement of the present invention, the 2D camera mounting frame further comprises a mounting support plate and a second rotation plate for mounting the 2D camera;

one side of the installation support plate is fixed on the first rotating plate, and one side of the second rotating plate is hinged to one side of the installation support plate, which is far away from the first rotating plate, so that the second rotating plate and the 2D camera installed on the second rotating plate can rotate relative to the plate surface of the installation support plate.

As a further improvement of the present invention, the plate surface of the mounting stay is perpendicular to the plate surface of the first rotating plate.

As a further improvement of the utility model, a connecting piece is arranged at one end of the first rotating plate, which is opposite to the hinge position, so that the free end of the first rotating plate can be in limit connection with the first mounting plate;

and/or

And a connecting piece is arranged at one end of the second rotating plate, which is opposite to the hinged position, so that the free end of the second rotating plate can be in limit connection with the installation support plate.

As a further improvement of the utility model, the bottom of the first mounting plate is provided with at least one nitrogen blowing nozzle for blowing and dedusting the surface of the wafer to be tested.

As a further improvement of the utility model, a dust collecting device is arranged at the bottom of the first mounting plate corresponding to the nitrogen blow nozzle and is used for collecting dust blown by the nitrogen blow nozzle.

In another aspect of the utility model, a wafer appearance detection device is provided, which comprises a detection station, wherein the detection station is provided with the wafer appearance detection module.

The above-described improved technical features may be combined with each other as long as they do not conflict with each other.

Generally, compared with the prior art, the technical scheme conceived by the utility model has the following beneficial effects:

(1) according to the wafer appearance detection module, the first mounting plate, the second mounting plate, the 2D camera mounting frame and the like on the support are correspondingly arranged, so that the 2D camera and the 3D camera can be simultaneously arranged on the wafer appearance detection module, the wafer appearance detection module can simultaneously detect different defects of a wafer to be detected, the detection process of the wafer is simplified, multiple moving positioning and frequent replacement of the detection module in the wafer detection process are avoided, the wafer detection cost is reduced, and the wafer detection efficiency and quality are improved.

(2) According to the wafer appearance detection module, the plurality of 2D camera mounting frames are arranged on the first mounting plate at the same time, the first rotating plate and the second rotating plate are correspondingly arranged on the 2D camera mounting frames, and the rotation adjustment of the 2D camera in the front-back direction and the left-right direction is effectively realized by utilizing the rotation connection between the first rotating plate and the first mounting plate and between the second rotating plate and the mounting support plate, so that the adjustment range of the 2D camera detection is enlarged, the detection module can meet the wafer detection under different detection environments and different detection objects, the adjustment flexibility and compatibility of the detection module are improved, and the application cost of the wafer detection equipment is reduced.

(3) According to the wafer appearance detection module, through the corresponding arrangement of the nitrogen blow nozzle, the dust collection device and other components on the support, the dust and impurities on the surface of the wafer to be detected can be accurately removed during wafer detection, the accuracy of wafer detection is ensured, the integration degree of equipment is further improved, the design of extra arrangement stations is reduced, and the utilization of the internal working space of the wafer detection equipment is optimized.

(4) The wafer appearance detection module is simple in structure and convenient to set, can realize simultaneous setting of the 2D camera and the 3D camera, meets different detection requirements of wafers to be detected, avoids frequent replacement of the detection module in wafer appearance detection equipment and multiple moving and positioning of the wafers to be detected, simplifies the procedures of wafer appearance detection, improves the efficiency and quality of wafer appearance detection, reduces the production and application cost of the wafers, and has good application prospect and popularization value.

Drawings

FIG. 1 is a schematic view of a bracket structure of a wafer appearance inspection module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating an overall structure of a wafer appearance inspection module according to an embodiment of the present invention;

in all the figures, the same reference numerals denote the same features, in particular:

1. a first mounting plate; 2. a 2D camera mounting bracket; 3. a second mounting plate; 4. a connecting plate; 5. a nitrogen blow nozzle; 6. a light source fixing plate; 7. a dust collection device; 8. a 2D camera; 9. a 3D camera;

201. a first rotating plate; 202. mounting a support plate; 203. a second rotating plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example (b):

referring to fig. 1 and 2, a wafer appearance inspection module according to a preferred embodiment of the present invention includes a support structure and an inspection unit disposed on the support structure, and the wafer appearance inspection module is mounted on a corresponding displacement module or a corresponding mounting bracket, so as to be applied to a wafer inspection apparatus.

Specifically, in a preferred embodiment, the bracket of the wafer appearance inspection module includes a first mounting plate 1 having a plate-shaped structure, and a mounting area for the 2D camera 8 is formed on one side of the first mounting plate 1, and a mounting area for the 3D camera 9 is formed on the other side.

In more detail, one side of the first mounting plate 1 is provided with a plurality of 2D camera mounting frames 2 including a first rotation plate 201, a mounting plate 202, and a second rotation plate 203. One side of the first rotating plate 201 is hinged to the first mounting plate 1, and the first rotating plate 201 and the first mounting plate 1 are preferably connected through a rotating shaft, so that the first rotating plate 201 can rotate relative to one side of the first rotating plate, that is, an included angle between the first rotating plate 201 and the first mounting plate 1 is changed, and a position of the 2D camera 8 arranged on the 2D camera mounting frame 2 is changed.

Meanwhile, the mounting plate 202 in the preferred embodiment is fixedly attached to the plate surface of the first rotating plate 201 at one side thereof, and is preferably attached to one end near the rotational axis of the first rotating plate 201. Preferably, the mounting plate 202 is disposed perpendicular to the plate surface of the first rotating plate 201, as shown in fig. 1.

Next, the second rotation plate 203 in the preferred embodiment is hinged at one end to the side of the mounting plate 202 facing away from the first rotation plate 201, so that the second rotation plate 203 can rotate relative to the mounting plate 202, so that the second rotation plate 203 can rotate from a position facing the end face of the mounting plate 202 to a position parallel to or coinciding with the end face thereof. Accordingly, a plurality of connection holes are spaced apart on the second rotation plate 203 for connection and installation of the 2D camera 8.

Through the corresponding arrangement of the 2D camera mounting frame 2 on one side of the first mounting plate 1, the rapid arrangement of the 2D camera on the bracket can be realized, and the rotation arrangement between the first rotating plate 201 and the first mounting plate 1 enables the 2D camera 8 to perform position adjustment in the extending direction of the first mounting plate 1, namely left-right adjustment, which is recorded as position adjustment in the X direction; the second rotating plate 203 and the mounting plate 202 are rotatably disposed so that the 2D camera 8 can perform position adjustment in a direction perpendicular to the plate surface of the first mounting plate 1, i.e., front-back adjustment, which is referred to as position adjustment in the Y direction. Obviously, through the above-mentioned setting of 2D camera mounting bracket 2, not only can realize the installation of 2D camera, still can realize the position adjustment after 2D camera 8 sets up.

Preferably, in order to achieve the stability of the 2D camera 8 after being set, in a preferred embodiment, a connecting member is disposed on a side of the first rotating plate 201 and/or the second rotating plate 203 away from the hinged end, so that the movable end of the first rotating plate 201 can be correspondingly connected to the first mounting plate 1, and/or the movable end of the second rotating plate 203 can be correspondingly connected to the mounting plate 202, thereby ensuring the stability and reliability of the 2D camera 8.

Further, in a preferred embodiment, the 2D camera mounting frames 2 on one side of the first mounting plate 1 are correspondingly arranged in a plurality, for example, two as shown in fig. 1, and can be used for simultaneously mounting two or more 2D cameras 8 on the first mounting plate 1, so as to meet the detection requirement and the re-inspection requirement of the wafer to be inspected. Meanwhile, the structural forms of the 2D cameras 8 on the plurality of 2D camera mounting frames 2 may be the same or different, which may be optimized according to practical situations, in a specific embodiment, the two 2D camera mounting frames 2 on the first mounting plate 1 are symmetrically arranged, and the 2D cameras 8 mounted on the two 2D camera mounting frames 2 have the same structure.

Accordingly, a light source fixing plate 6 is provided on the first mounting plate 1 corresponding to a part or all of the 2D camera mounting frame 2 for performing mounting of a light source, as shown in fig. 1. Meanwhile, a nitrogen blowing nozzle 5 for blowing air to the surface of the wafer to be tested and a dust collecting device 7 for collecting dust on the surface of the wafer to be tested are preferably arranged at the bottom of the first mounting plate 1. In the preferred embodiment, the nitrogen blow nozzle 5 is disposed opposite to the dust collecting means 7 so that the dust blown off by the nitrogen blow nozzle 5 can be just collected by the dust collecting means 7.

Further, in the preferred embodiment, a second mounting plate 3 is further disposed on a side of the first mounting plate 1 facing away from the 2D camera mounting frame 2, and is used for mounting the 3D camera 9. The second mounting plate 3 is preferably arranged in parallel with the first mounting plate 1 at a distance, and is correspondingly connected with the first mounting plate 1 by a plurality of connecting plates 4, and a fixed space of the 3D camera 9 is formed between the two mounting plates, as shown in fig. 1.

In a preferred embodiment, the 3D camera 9 may be embedded between the two mounting plates and attached to the second mounting plate 3, as shown in fig. 2.

Through the corresponding setting of above-mentioned support, can realize 2D camera 8, 3D camera 9 setting when detecting on the module simultaneously, detect when satisfying the different defects of wafer that awaits measuring, avoided detecting the frequent change of module. Moreover, the rotation setting of the corresponding rotating plate on the 2D camera mounting frame 2 is utilized, the corresponding adjustment of the 2D camera 8 in the front-back direction and the left-right direction (namely, the XY axis direction) is effectively realized, and the different detection requirements of the detection module are met, so that the detection module is higher in use flexibility and better in compatibility.

In another embodiment, a wafer appearance inspection apparatus is provided, wherein the wafer appearance inspection module is disposed on an inspection station, and the module can be disposed on an X-axis, Y-axis and/or Z-axis displacement assembly, and can correspondingly adjust the displacement in the X-direction, Y-direction and/or Z-direction, that is, the wafer to be inspected can be aligned with the module by the movement of a corresponding camera. Certainly, the wafer appearance detection module can also be fixedly arranged, so that the wafer to be detected is adsorbed and fixed on the corresponding displacement module, and the alignment adjustment with the corresponding camera is realized through the movement of the wafer to be detected.

The wafer appearance detection module is simple in structure and convenient to set, can realize simultaneous setting of the 2D camera and the 3D camera, meets different detection requirements of wafers to be detected, avoids frequent replacement of the detection module in wafer appearance detection equipment and multiple moving and positioning of the wafers to be detected, simplifies the procedures of wafer appearance detection, improves the efficiency and quality of wafer appearance detection, reduces the production and application cost of the wafers, and has good application prospect and popularization value.

It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the utility model, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A wafer appearance detection module is characterized by comprising a bracket;

2. The wafer appearance inspection module of claim 1, wherein a second mounting plate is further disposed on a side of the first mounting plate facing away from the 2D camera mounting frame;

3. The wafer appearance inspection module according to claim 1, wherein the two 2D camera mounts are symmetrically disposed and respectively provided with the same 2D camera.

4. The wafer appearance inspection module of any one of claims 1 to 3, wherein the 2D camera mount comprises a first rotation plate;

5. The wafer appearance inspection module of claim 4, wherein the 2D camera mount further comprises a mounting plate and a second rotation plate for 2D camera mounting;

6. The wafer appearance inspection module of claim 5, wherein the plate surface of the mounting plate is perpendicular to the plate surface of the first rotating plate.

7. The wafer appearance inspection module of claim 5, wherein a connector is disposed at an end of the first rotating plate opposite to the hinge position so that a free end of the first rotating plate can be in limit connection with the first mounting plate;

and/or

8. The wafer appearance inspection module according to any one of claims 1 to 3 and 5 to 7, wherein the bottom of the first mounting plate is provided with at least one nitrogen blowing nozzle for blowing and dedusting the surface of the wafer to be inspected.

9. The wafer appearance inspection module according to claim 8, wherein a dust collecting device is disposed at a bottom of the first mounting plate corresponding to the nitrogen blow nozzle for collecting dust blown by the nitrogen blow nozzle.

10. Wafer outward appearance check out test set, includes detection station, characterized in that, be provided with the wafer outward appearance of any claim 1 ~ 9 on the detection station and detect the module.