CN215683021U

CN215683021U - Structure for reducing heating of controller

Info

Publication number: CN215683021U
Application number: CN202121121111.XU
Authority: CN
Inventors: 郑奕; 周振雨
Original assignee: Wuxi Deboni Electromechanical Technology Co ltd
Current assignee: Wuxi Deboni Electromechanical Technology Co ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2022-01-28
Anticipated expiration: 2031-05-24

Abstract

The utility model discloses a structure for reducing heating of a controller, and relates to the technical field of controllers. The utility model includes PCB board, PCB board is equipped with connecting pipe, air-cooling fin is equipped with a plurality of power tubes, the power tube includes: the grid, the drain electrode positioned on one side of the grid and the source electrode positioned on one side of the drain electrode. The utility model can effectively increase the contact area with air by increasing the number of the radiating fins and thinning the radiating fins, increases the radiating efficiency, and reduces the heating problem of the controller by reducing the current flowing way and directly contacting the surface of the drain electrode of the power tube and increasing the heating area.

Description

Structure for reducing heating of controller

Technical Field

The utility model belongs to the technical field of controllers, and particularly relates to a structure for reducing heating of a controller.

Background

The controller is a master device for controlling the starting, speed regulation, braking and reversing of the motor by changing the wiring of a main circuit or a control circuit and changing the resistance value in the circuit according to a preset sequence.

The controller belongs to a driver device, a heating phenomenon exists, the heating quantity is correspondingly increased along with the increase of output power, the performance requirement on the controller is stricter, and the driving damage is caused by overhigh temperature of a power tube in most cases;

the traditional structure conducts current through a pin, then flows to the positive electrode of a power supply through a back copper strip to form a closed loop, and has the defect that the current conducted by the power pin is limited and is not suitable for a high-power controller; under the same current condition, the shorter the path is, the lower the heat loss is, and the structure needs to be conducted to the copper bar through the pin and then flows back to the power supply, so that the current path is increased virtually, and the heat loss is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a structure for reducing the heating of a controller, and solves the technical problem that the temperature of the conventional power tube is too high.

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model provides a reduce structure that controller generates heat, includes the PCB board, and PCB board facial make-up is equipped with connecting pipe, fin, and the fin facial make-up is equipped with a plurality of power tubes, and the power tube includes: the grid, the drain electrode positioned on one side of the grid and the source electrode positioned on one side of the drain electrode.

Optionally, the PCB is provided with a connecting plate, and the heat sink is arranged on the connecting plate.

Optionally, a copper bar is arranged on the drain electrode, and one end of the copper bar is connected with a power supply anode.

Optionally, the drain is located between the gate and the drain.

Optionally, a power tube hole site adapted to the power tube is formed on the connecting plate.

Optionally, the power tube is located on the upper side of the PCB board.

The embodiment of the utility model has the following beneficial effects:

according to the embodiment of the utility model, the contact area with air can be effectively increased by increasing the number of the radiating fins and thinning the radiating fins, the radiating efficiency is also increased, and the heating problem of the controller is reduced by reducing the current flowing path and directly contacting the surface of the drain electrode of the power tube and increasing the heating area.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

fig. 1 is a schematic plan view of a power transistor according to an embodiment of the utility model;

FIG. 2 is a diagram illustrating a conventional structure of a controller in the prior art;

fig. 3 is a schematic view of a novel conductive heat dissipation structure according to an embodiment of the utility model;

fig. 4 is a schematic view of a combination structure of a controller housing according to an embodiment of the utility model.

Wherein the figures include the following reference numerals:

the structure comprises a copper bar 1, a grid 2, a drain electrode 3, a source electrode 4, a radiating fin 5, a connecting pipe 6, a PCB 7 and a power tube hole site 8.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses.

To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the utility model have been omitted.

Referring to fig. 1-4, in the present embodiment, a structure for reducing heat generation of a controller is provided, including: PCB board 7, PCB board 7 facial make-up are equipped with connecting pipe 6, fin 5, and fin 5 facial make-up is equipped with a plurality of power tubes, and the power tube includes: a gate 2, a drain 3 on the gate 2 side, and a source 4 on the drain 3 side.

When the controller is needed to be used, the power tube, the aluminum strip and the copper strip are fixed together, a complete control system is formed by welding through wave soldering tin dipping, heat dissipation silicone grease is uniformly coated on the upper surface of the aluminum strip and is screwed with the shell, the position of the drain electrode plane of the power tube is directly connected with the anode of the power supply through the copper strip, the current flowing path is greatly shortened and is not limited by the pin current, at the moment, the copper strip is connected with the drain electrode plane of the power tube, the effective contact area is increased, and therefore the borne current value is only dependent on the characteristics of the power tube. It should be noted that the electric devices referred to in this application may be powered by a storage battery or an external power source.

The contact area with air can be effectively increased by increasing the number of the radiating fins and thinning the radiating fins, the radiating efficiency is also increased, and the heating problem of the controller is reduced by reducing the current flowing way and the surface of the drain electrode of the power tube which is directly contacted with the surface of the drain electrode of the power tube and increasing the heating area.

It should be noted that: the traditional structure conducts current through a pin, then flows to the positive electrode of a power supply through a back copper strip to form a closed loop, and has the defect that the current conducted by the power pin is limited and is not suitable for a high-power controller; under the same current condition, the shorter the path is, the lower the heat loss is, and the structure needs to be conducted to the copper bar through the pin and then flows back to the power supply, so that the current path is increased virtually, and the heat loss is increased.

The power tube consists of three electrodes: in the N-channel power tube, when VGS > turn-on voltage, the power tube is conducted and in a working state, but due to the limitation of the structure and materials, the power tube is not completely conducted, wherein the resistance value of several milliohms to dozens of milliohms exists, the resistance is the root cause of heat generation, and since process materials cannot be changed, the heat generation can be reduced only by heat conduction and internal resistance reduction as much as possible, the heat stability of the product is further improved, and the heat loss is reduced.

In this embodiment, as shown in fig. 2, the PCB 7 is provided with a connecting plate, the heat sink 5 is mounted on the connecting plate, and the connecting plate is provided with a power tube hole site 8 adapted to the power tube, so as to facilitate fixing the power tube.

In this embodiment, as shown in fig. 1, a copper bar 1 is mounted on the drain 3, one end of the copper bar 1 is connected to a positive electrode of a power supply, and the drain 3 is located between the gate 2 and the drain 3.

In the present embodiment, as shown in fig. 2, the power tube is located on the upper side of the PCB board 7.

The above embodiments may be combined with each other.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Claims

1. An arrangement for reducing heat generation in a controller, comprising: PCB board (7), PCB board (7) facial make-up is equipped with connecting pipe (6), fin (5), and fin (5) facial make-up is equipped with a plurality of power tubes, and the power tube includes: the transistor comprises a grid (2), a drain (3) positioned on one side of the grid (2) and a source (4) positioned on one side of the drain (3).

2. A structure for reducing heat generation of a controller as claimed in claim 1, wherein the PCB (7) is provided with a connection plate, and the heat sink (5) is provided on the connection plate.

3. The structure for reducing the heat generation of the controller according to claim 1, wherein the drain electrode (3) is provided with a copper bar (1), and one end of the copper bar (1) is connected with a power supply anode.

4. A structure for reducing heat generation of a controller as claimed in claim 1, characterized in that the drain (3) is located between the gate (2) and the drain (3).

5. The structure for reducing heat generation of the controller as claimed in claim 2, wherein the connecting plate is provided with a power tube hole site (8) adapted to the power tube.

6. A structure for reducing heat generation of a controller according to claim 1, wherein the power tube is located on an upper side of the PCB board (7).