CN215680921U - Miniaturized LTCC band-pass filter - Google Patents
Miniaturized LTCC band-pass filter Download PDFInfo
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- CN215680921U CN215680921U CN202121420760.XU CN202121420760U CN215680921U CN 215680921 U CN215680921 U CN 215680921U CN 202121420760 U CN202121420760 U CN 202121420760U CN 215680921 U CN215680921 U CN 215680921U
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- polar plate
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Abstract
The utility model discloses a miniaturized LTCC band-pass filter, which comprises: the ceramic body, locate the input pad of ceramic body bottom surface left end, locate the output pad of ceramic body bottom surface right-hand member, locate the ground connection pad in ceramic body bottom surface middle part to and locate the inside metal level of ceramic body. The band-pass filter can achieve the purpose of miniaturization, adopts a 4-order design, forms 4 transmission zeros outside a band, and can meet the requirement of out-of-band high rejection.
Description
Technical Field
The utility model relates to a filter, in particular to a miniaturized LTCC band-pass filter.
Background
A band-pass filter refers to a filter that passes frequency components in a certain frequency range, but attenuates frequency components in other ranges to an extremely low level. An ideal bandpass filter should have a completely flat passband with no amplification or attenuation within the passband and with all frequencies completely attenuated outside the passband, and with out-of-passband conversion being accomplished over a very small frequency range.
In the application of the band-pass filter, not only the out-of-band high rejection of the band-pass filter is required, but also the volume of the band-pass filter is required to be as small as possible, and the size of the band-pass filter can be reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a miniaturized LTCC band-pass filter, which comprises: the ceramic body, locate the input pad of the left end of bottom surface of the ceramic body, locate the output pad of the right end of bottom surface of the ceramic body, locate the earthing pad in the middle part of bottom surface of the ceramic body, and locate the metal layer inside the ceramic body;
the metal layer comprises the following components which are arranged from bottom to top in sequence:
a first metal layer comprising: the first polar plate is positioned above the grounding bonding pad, the left extending part extends from the left end of the rear side of the first polar plate to the position above the input bonding pad, and the right extending part extends from the right end of the rear side of the first polar plate to the position above the output bonding pad; the first polar plate is electrically connected with the left half part of the grounding bonding pad through a first through hole; the first polar plate is electrically connected with the right half part of the grounding bonding pad through the second through hole;
a second metal layer comprising: the second polar plate is positioned above the left half part of the first polar plate, and the third polar plate is positioned above the right half part of the first polar plate;
a third metal layer comprising: the first microstrip line extends from the front side of the first polar plate to the upper part of the input pad;
a fourth metal layer comprising: the sixth polar plate is positioned above the input bonding pad, and the seventh polar plate is positioned above the output bonding pad; the sixth polar plate is electrically connected with the input bonding pad through a third through hole; the seventh polar plate is electrically connected with the output bonding pad through the fourth through hole;
a fifth metal layer comprising: the eighth polar plate is positioned above the second polar plate and the third polar plate, and the third microstrip line is positioned above the rear side of the first polar plate; the third microstrip line extends along the left and right direction; the left end of the eighth polar plate also extends to the upper part of the sixth polar plate; the right end of the eighth polar plate also extends to the position above the seventh polar plate;
a sixth metal layer comprising, sequentially from left to right: a fourth microstrip line, a fifth microstrip line, a sixth microstrip line, and a seventh microstrip line; the fourth microstrip line, the fifth microstrip line, the sixth microstrip line and the seventh microstrip line extend along the front-back direction;
the front end of the fourth microstrip line is positioned above the first microstrip line and the sixth polar plate, and is electrically connected with the sixth polar plate and the first microstrip line through a fifth via hole; the rear end of the fourth microstrip line is positioned above the left extension part of the first polar plate, and is electrically connected with the left extension part of the first polar plate through a sixth via hole;
the front end of the fifth microstrip line is positioned above the second pole plate and is electrically connected with the second pole plate through a seventh through hole; the rear end of the fifth microstrip line is positioned above the left end of the third microstrip line and is electrically connected with the left end of the third microstrip line and the first polar plate through an eighth via hole;
the front end of the sixth microstrip line is positioned above the third polar plate and is electrically connected with the third polar plate through a ninth via hole; the rear end of the sixth microstrip line is positioned above the right end of the third microstrip line, and is electrically connected with the right end of the third microstrip line and the first polar plate through a tenth via hole;
the front end of the seventh microstrip line is positioned above the second microstrip line and the seventh polar plate, and the front end of the seventh microstrip line is electrically connected with the seventh polar plate and the second microstrip line through an eleventh via hole; the rear end of the seventh microstrip line is positioned above the right extension part of the first polar plate, and the rear end of the seventh microstrip line is electrically connected with the right extension part of the first polar plate through a twelfth through hole.
Preferably, the input pad and the output pad are symmetrically arranged.
Preferably, the second polar plate and the third polar plate are symmetrically arranged.
Preferably, the fourth polar plate and the fifth polar plate are symmetrically arranged.
Preferably, the first microstrip line and the second microstrip line are symmetrically arranged.
Preferably, the sixth polar plate and the seventh polar plate are symmetrically arranged.
Preferably, the fourth microstrip line and the seventh microstrip line are symmetrically arranged.
Preferably, the fifth microstrip line and the sixth microstrip line are symmetrically arranged.
Preferably, the eighth via hole and the tenth via hole are symmetrically arranged.
Preferably, the size of the whole miniaturized LTCC band-pass filter is 1.6mm × 0.8mm × 0.7 mm.
The utility model has the advantages and beneficial effects that: the miniaturized LTCC band-pass filter has the overall size of 1.6mm multiplied by 0.8mm multiplied by 0.7mm, can achieve the purpose of miniaturization, adopts a 4-order design, forms 4 transmission zeros outside a band, and can achieve the requirement of out-of-band high suppression.
Drawings
FIGS. 1 and 2 are schematic diagrams of the internal structure of a miniaturized LTCC bandpass filter of the present invention;
fig. 3 is an equivalent circuit diagram of a miniaturized LTCC bandpass filter of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The technical scheme of the specific implementation of the utility model is as follows:
as shown in fig. 1 and 2, the present invention provides a miniaturized LTCC band pass filter, the size of the whole miniaturized LTCC band pass filter is 1.6mm × 0.8mm × 0.7mm, and the miniaturized LTCC band pass filter comprises: the ceramic body, locate the input pad P1 of the left end of ceramic body bottom surface, locate the output pad P2 of the right end of ceramic body bottom surface, locate the ground pad GND of the middle part of ceramic body bottom surface, and locate the metal layer inside the ceramic body; the input pad P1 and the output pad P2 are symmetrically arranged;
the metal layer comprises the following components which are arranged from bottom to top in sequence:
a first metal layer comprising: the first pole plate 101 is positioned above the ground pad GND, a left extension part extends from the left end of the rear side of the first pole plate 101 to the position above the input pad P1, and a right extension part extends from the right end of the rear side of the first pole plate 101 to the position above the output pad P2; the first plate 101 is electrically connected with the left half part of the ground pad GND through a first via 201; the first plate 101 is electrically connected with the right half of the ground pad GND through the second via 202;
a second metal layer comprising: a second plate 102 positioned above the left half of the first plate 101, and a third plate 103 positioned above the right half of the first plate 101; the second plate 102 and the third plate 103 are symmetrically arranged;
a third metal layer comprising: a fourth plate 104 located above the second plate 102, a first microstrip line 31 extending from the front side of the fourth plate 104 to above the input pad P1, a fifth plate 105 located above the third plate 103, and a second microstrip line 32 extending from the front side of the fifth plate 105 to above the output pad P2; the fourth polar plate 104 and the fifth polar plate 105 are symmetrically arranged; the first microstrip line 31 and the second microstrip line 32 are symmetrically arranged;
a fourth metal layer comprising: a sixth plate 106 positioned above the input pad P1, and a seventh plate 107 positioned above the output pad P2; the sixth plate 106 is electrically connected to the input pad P1 through the third via 203; the seventh plate 107 is electrically connected to the output pad P2 through the fourth via 204; the sixth polar plate 106 and the seventh polar plate 107 are symmetrically arranged;
a fifth metal layer comprising: an eighth plate 108 located above the second plate 102 and the third plate 103, and a third microstrip line 33 located above the rear side of the first plate 101; the third microstrip line 33 extends in the left-right direction; the left end of the eighth polar plate 108 also extends above the sixth polar plate 106; the right end of the eighth polar plate 108 also extends to the upper part of the seventh polar plate 107;
a sixth metal layer comprising, sequentially from left to right: a fourth microstrip line 34, a fifth microstrip line 35, a sixth microstrip line 36, and a seventh microstrip line 37; the fourth microstrip line 34, the fifth microstrip line 35, the sixth microstrip line 36, and the seventh microstrip line 37 all extend in the front-rear direction; the fourth microstrip line 34 and the seventh microstrip line 37 are symmetrically arranged; the fifth microstrip line 35 and the sixth microstrip line 36 are symmetrically arranged;
the front end of the fourth microstrip line 34 is located above the first microstrip line 31 and the sixth polar plate 106, and the front end of the fourth microstrip line 34 is electrically connected with the sixth polar plate 106 and the first microstrip line 31 through a fifth via hole 205; the rear end of the fourth microstrip line 34 is located above the left extension part of the first plate 101, and the rear end of the fourth microstrip line 34 is electrically connected with the left extension part of the first plate 101 through a sixth via hole 206;
the front end of the fifth microstrip line 35 is located above the second pole plate 102, and the front end of the fifth microstrip line 35 is electrically connected with the second pole plate 102 through a seventh via hole 207; the rear end of the fifth microstrip line 35 is located above the left end of the third microstrip line 33, and the rear end of the fifth microstrip line 35 is electrically connected with the left end of the third microstrip line 33 and the first pole plate 101 through an eighth via hole 208;
the front end of the sixth microstrip line 36 is located above the third plate 103, and the front end of the sixth microstrip line 36 is electrically connected with the third plate 103 through a ninth via 209; the rear end of the sixth microstrip line 36 is located above the right end of the third microstrip line 33, and the rear end of the sixth microstrip line 36 is electrically connected with the right end of the third microstrip line 33 and the first pole plate 101 through a tenth via 210; the eighth via hole 208 and the tenth via hole 210 are symmetrically arranged;
the front end of the seventh microstrip line 37 is located above the second microstrip line 32 and the seventh polar plate 107, and the front end of the seventh microstrip line 37 is electrically connected with the seventh polar plate 107 and the second microstrip line 32 through an eleventh via hole 211; the rear end of the seventh microstrip line 37 is located above the right extending portion of the first plate 101, and the rear end of the seventh microstrip line 37 is electrically connected to the right extending portion of the first plate 101 through a twelfth via hole 212.
The equivalent circuit diagram of the miniaturized LTCC band pass filter of the present invention is shown in fig. 3, wherein:
the first inductor L1 is mainly composed of the fourth microstrip line 34 and a through hole connected thereto;
the second inductance L2 is mainly formed by the first microstrip line 31;
the third inductor L3 mainly consists of the fifth microstrip line 35 and a through hole connected thereto;
the fourth inductance L4 is mainly formed by an eighth via hole;
the fifth inductance L5 is mainly formed by the third microstrip line 33;
the sixth inductance L6 is mainly formed by the tenth via hole;
the seventh inductor L7 is mainly composed of the sixth microstrip line 36 and a through hole connected thereto;
the eighth inductor L8 is mainly composed of the seventh microstrip line 37 and a through hole connected thereto;
the ninth inductance L9 is mainly formed by the second microstrip line 32;
the first capacitor C1 mainly comprises a fourth plate 104 and a second plate 102;
the second capacitor C2 is mainly formed by the eighth plate 108, the second plate 102 and the third plate 103;
the third capacitor C3 is mainly formed by the eighth plate 108 and the sixth plate 106;
the fourth capacitor C4 is mainly composed of the second plate 102 and the first plate 101;
the fifth capacitor C5 is mainly formed by the third plate 103 and the first plate 101;
the sixth capacitor C6 mainly comprises a fifth plate 105 and a third plate 103;
the seventh capacitor C7 is mainly formed by the eighth plate 108 and the seventh plate 107;
l1 and C3, L4 and C4, L6 and C5, L8 and C7 form four vibrators;
introducing L2 and L9 to enable the filter to form two zeros at the high end;
c2 is introduced to make the filter form a zero at the low and high ends, respectively.
The miniaturized LTCC band-pass filter realizes high integration level by a low-temperature co-fired ceramic three-dimensional integration technology, has the overall size of 1.6mm multiplied by 0.8mm multiplied by 0.7mm, and can achieve the purpose of miniaturization; and the filter adopts a 4-order design, and mainly forms 4 transmission zeros outside a band by introducing C2, L2 and L9 into the structure, so that the requirement of out-of-band high suppression can be met.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A miniaturized LTCC bandpass filter, comprising: the ceramic body, locate the input pad of the left end of bottom surface of the ceramic body, locate the output pad of the right end of bottom surface of the ceramic body, locate the earthing pad in the middle part of bottom surface of the ceramic body, and locate the metal layer inside the ceramic body;
the metal layer comprises the following components which are arranged from bottom to top in sequence:
a first metal layer comprising: the first polar plate is positioned above the grounding bonding pad, the left extending part extends from the left end of the rear side of the first polar plate to the position above the input bonding pad, and the right extending part extends from the right end of the rear side of the first polar plate to the position above the output bonding pad; the first polar plate is electrically connected with the left half part of the grounding bonding pad through a first through hole; the first polar plate is electrically connected with the right half part of the grounding bonding pad through the second through hole;
a second metal layer comprising: the second polar plate is positioned above the left half part of the first polar plate, and the third polar plate is positioned above the right half part of the first polar plate;
a third metal layer comprising: the first microstrip line extends from the front side of the first polar plate to the upper part of the input pad;
a fourth metal layer comprising: the sixth polar plate is positioned above the input bonding pad, and the seventh polar plate is positioned above the output bonding pad; the sixth polar plate is electrically connected with the input bonding pad through a third through hole; the seventh polar plate is electrically connected with the output bonding pad through the fourth through hole;
a fifth metal layer comprising: the eighth polar plate is positioned above the second polar plate and the third polar plate, and the third microstrip line is positioned above the rear side of the first polar plate; the third microstrip line extends along the left and right direction; the left end of the eighth polar plate also extends to the upper part of the sixth polar plate; the right end of the eighth polar plate also extends to the position above the seventh polar plate;
a sixth metal layer comprising, sequentially from left to right: a fourth microstrip line, a fifth microstrip line, a sixth microstrip line, and a seventh microstrip line; the fourth microstrip line, the fifth microstrip line, the sixth microstrip line and the seventh microstrip line extend along the front-back direction;
the front end of the fourth microstrip line is positioned above the first microstrip line and the sixth polar plate, and is electrically connected with the sixth polar plate and the first microstrip line through a fifth via hole; the rear end of the fourth microstrip line is positioned above the left extension part of the first polar plate, and is electrically connected with the left extension part of the first polar plate through a sixth via hole;
the front end of the fifth microstrip line is positioned above the second pole plate and is electrically connected with the second pole plate through a seventh through hole; the rear end of the fifth microstrip line is positioned above the left end of the third microstrip line and is electrically connected with the left end of the third microstrip line and the first polar plate through an eighth via hole;
the front end of the sixth microstrip line is positioned above the third polar plate and is electrically connected with the third polar plate through a ninth via hole; the rear end of the sixth microstrip line is positioned above the right end of the third microstrip line, and is electrically connected with the right end of the third microstrip line and the first polar plate through a tenth via hole;
the front end of the seventh microstrip line is positioned above the second microstrip line and the seventh polar plate, and the front end of the seventh microstrip line is electrically connected with the seventh polar plate and the second microstrip line through an eleventh via hole; the rear end of the seventh microstrip line is positioned above the right extension part of the first polar plate, and the rear end of the seventh microstrip line is electrically connected with the right extension part of the first polar plate through a twelfth through hole.
2. The miniaturized LTCC bandpass filter of claim 1 wherein the input pads and the output pads are symmetrically disposed.
3. The miniaturized LTCC band pass filter of claim 1, wherein the second plate and the third plate are symmetrically disposed.
4. The miniaturized LTCC band pass filter of claim 1, wherein the fourth plate and the fifth plate are symmetrically disposed.
5. The miniaturized LTCC band pass filter of claim 1, wherein the first microstrip line and the second microstrip line are symmetrically disposed.
6. The miniaturized LTCC bandpass filter of claim 1, wherein the sixth plate and the seventh plate are symmetrically disposed.
7. The miniaturized LTCC band pass filter of claim 1, wherein the fourth microstrip and the seventh microstrip are symmetrically disposed.
8. The miniaturized LTCC band pass filter of claim 1, wherein the fifth microstrip line and the sixth microstrip line are symmetrically disposed.
9. The miniaturized LTCC band pass filter of claim 1, wherein the eighth via is disposed symmetrically to the tenth via.
10. The miniaturized LTCC band pass filter of claim 1, wherein the entire miniaturized LTCC band pass filter has dimensions of 1.6mm x 0.8mm x 0.7 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121420760.XU CN215680921U (en) | 2021-06-25 | 2021-06-25 | Miniaturized LTCC band-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121420760.XU CN215680921U (en) | 2021-06-25 | 2021-06-25 | Miniaturized LTCC band-pass filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215680921U true CN215680921U (en) | 2022-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121420760.XU Active CN215680921U (en) | 2021-06-25 | 2021-06-25 | Miniaturized LTCC band-pass filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215680921U (en) |
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2021
- 2021-06-25 CN CN202121420760.XU patent/CN215680921U/en active Active
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