CN215644546U - UVLED encapsulates support and UVLED lamp pearl - Google Patents

Abstract

The utility model provides a UVLED packaging support and a UVLED lamp bead, wherein the UVLED packaging support comprises: the dam is arranged on one surface of the substrate in a protruding mode, the pad is arranged on the substrate and located in a cavity formed by the dam in a surrounding mode, and the conducting layer is arranged on one surface, opposite to the dam, of the substrate; the bonding pad is internally provided with a first bonding pad and a second bonding pad which are opposite in electrical property and are mutually separated, and the bonding pad is internally provided with a transition region which is positioned between the first bonding pad and the second bonding pad. The UVLED packaging support provided by the utility model is used for at least solving the technical problem that the existing UVLED packaging support is difficult to process into a UVLED lamp bead directly matched with a power supply voltage.

Description

UVLED encapsulates support and UVLED lamp pearl

Technical Field

The utility model relates to the technical field of LED packaging, in particular to a UVLED packaging support and a UVLED lamp bead.

Background

Ultraviolet (UV) Light Emitting Diodes (LEDs), i.e. UV Light sources, are a widely used Light source of LEDs, and the wavelength range of the UVLED is: 200-400nm is invisible light with single wavelength, and the UVLED emitting ultraviolet rays with specific wavelength has wide application prospect in the fields of sterilization, disinfection, polymer curing, biochemical detection, non-line-of-sight communication, special illumination and the like. Compared with an ultraviolet light source mercury lamp, the UVLED has many well-known advantages such as environmental protection, small size, portability, low power consumption, and low voltage, and has attracted more and more attention in recent years.

Generally, rated voltage of the UVLED chip is between 5V and 7V, and the larger the current is, the larger the power is, and thus, many inconveniences exist in practical application of the UVLED lamp bead obtained by the UVLED package support and the UVLED chip packaged on the UVLED package support. For example, in a power supply system with Direct Current (DC) 12V or 24V as an output standard, a UVLED lamp bead with a rated voltage of 5V to 7V cannot be matched with a commonly used power supply voltage of 12V or 24V, and voltage division may be performed by connecting the UVLED lamp bead to an external resistor or a driving chip, but excessive voltage is distributed to the resistor or the driving chip, which may cause the resistor or the driving chip to generate heat, and the larger the current is, the more serious the heating is, the lower the power utilization efficiency is, and reliability and service life of the UVLED lamp bead are affected.

Therefore, it is urgently needed to develop a UVLED package support and a UVLED lamp bead, so that the UVLED package support and the UVLED lamp bead can be directly matched with a common power supply voltage without changing a package process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a UVLED packaging support and a UVLED lamp bead, which are used for at least solving the technical problem that the existing UVLED packaging support is difficult to process into the UVLED lamp bead directly matched with power supply voltage.

In order to achieve the above object, the present invention provides a UVLED package support including: the dam is arranged on one surface of the substrate in a protruding mode, the pad is arranged on the substrate and located in a cavity formed by the dam in a surrounding mode, and the conducting layer is arranged on one surface, opposite to the dam, of the substrate; the bonding pad is internally provided with a first bonding pad and a second bonding pad which are opposite in electrical property and are mutually separated, and the bonding pad is internally provided with a transition region which is positioned between the first bonding pad and the second bonding pad.

In the UVLED packaging support, the welding pads are internally provided with transition regions positioned between the first welding pads and the second welding pads, and the transition regions are arranged to facilitate the serial installation of at least two UVLED chips on the UVLED packaging support, so that bonding wires do not need to be interconnected on the at least two UVLED chips in the packaging process. Therefore, the UVLED packaging support provided by the utility model is convenient to process into a UVLED lamp bead with a compact structure, so that the UVLED lamp bead can be processed into a UVLED lamp bead directly matched with a common 12V power supply on the premise of not changing the existing packaging process.

In a possible implementation manner, a third pad and a fourth pad are disposed in the transition region, the third pad and the fourth pad are communicated with each other or separated from each other by a trench, and the third pad and the fourth pad are electrically connected.

In one possible implementation manner, the conductive layer is electrically connected with a first pin and a second pin, and the first pin and the second pin are opposite in electrical property and are separated from each other.

In a possible implementation manner, a first through hole and a second through hole are formed in the substrate, the first through hole is located on the first pad, and the first pad is electrically connected to the first pin through a conductive material filled in the first through hole; the second through hole is formed in the second bonding pad, and the second bonding pad is electrically connected with the second pin through a conductive substance filled in the second through hole.

In a possible implementation manner, the substrate is further provided with a third through hole and a fourth through hole, the third through hole is located on the third pad, and the fourth through hole is located on the fourth pad;

the third bonding pad is electrically connected with the conducting layer through the conducting substance filled in the third through hole, and the fourth bonding pad is electrically connected with the conducting layer through the conducting substance filled in the fourth through hole; or the third pad is electrically connected to the external circuit through the conductive substance filled in the third through hole, and the fourth pad is electrically connected to the external circuit through the conductive substance filled in the fourth through hole.

In one possible implementation manner, the first bonding pad and the second bonding pad are separated from each other through the groove; the width of the groove is 100 um-300 um.

The utility model also provides a UVLED lamp bead, which comprises a first UVLED chip, a second UVLED chip, a transparent piece and the UVLED packaging bracket of any one of the claims; the first UVLED chip is stacked on a first bonding pad and a third bonding pad of the UVLED package support, and the first UVLED chip is coupled to at least one part of the first bonding pad and at least one part of the third bonding pad in a crossing mode; the second UVLED chip is stacked on a second bonding pad and a fourth bonding pad of the UVLED package support, and the second UVLED chip is coupled to at least one part of the second bonding pad and at least one part of the fourth bonding pad in a crossing mode; the first UVLED chip and the second UVLED chip are connected in series; the transparent piece is arranged on the dam of the UVLED packaging support in a sealing mode.

According to the UVLED lamp bead, due to the adoption of the UVLED packaging support, the rated voltage is 10V-12V, and when a 12V direct current power supply supplies power, an external resistor or a driving circuit is not required to be connected to share excessive voltage, so that the electric energy utilization efficiency is improved, and the reliability is improved.

In one possible implementation, the chip further includes a zener diode chip stacked on the first pad and the second pad, and the zener diode chip is coupled across at least a portion of the first pad and at least a portion of the second pad.

In one possible implementation, the semiconductor device further includes two zener diode chips, one of the two zener diode chips being stacked on the first pad and the fourth pad and one of the zener diode chips being coupled across at least a portion of the first pad and at least a portion of the fourth pad; and/or

The other of the two zener diode chips is disposed in a stack on the second pad and the third pad, and the other of the two zener diode chips is coupled across at least a portion of the second pad and at least a portion of the fourth pad.

In a possible implementation manner, the number of the first UVLED chips is greater than or equal to 1, the number of the second UVLED chips is greater than or equal to 1, and the number of the first UVLED chips is the same as or different from the number of the second UVLED chips.

In a possible implementation manner, the peak wavelength range of the first uv led chip is 250nm to 320nm, the peak wavelength range of the second uv led chip is 250nm to 320nm, and the peak wavelength of the first uv led chip is the same as or different from the peak wavelength of the second uv led chip.

In one possible implementation, the first uv led chip is a flip structure chip or a vertical structure chip; and/or the second UVLED chip is a flip chip or a vertical chip.

In a possible implementation manner, the rated voltage of the first UVLED chip is 5V to 7V, the rated voltage of the second UVLED chip is 5V to 7V, and the sum of the rated voltage of the first UVLED chip and the rated voltage of the second UVLED chip is less than or equal to 12V.

The UVLED lamp bead provided by the utility model can be packaged and processed into a 12V power supply which is directly matched with a common 12V power supply on the premise of not changing a packaging process, at least two UVLED chips do not need to be interconnected through welding wires in the packaging process, and the processing and the use are convenient.

According to the UVLED lamp bead provided by the utility model, the Zener diode chip is arranged, so that the first UVLED chip and the second UVLED chip can be effectively prevented from being damaged by electrostatic discharge, and the Zener diode chip can be conveniently connected with the first UVLED chip and the second UVLED chip in parallel.

In addition to the technical problems solved by the embodiments of the present invention, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions, other technical problems that can be solved by the UVLED package support and the UVLED lamp bead provided by the embodiments of the present invention, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic perspective view of a conventional LED lamp bead;

fig. 2 is a top view of a UVLED package support according to an embodiment of the present invention;

fig. 3 is a bottom view of a UVLED package support according to an embodiment of the present invention;

fig. 4 is a schematic front view of a UVLED package support installed as a UVLED lamp bead according to an embodiment of the present invention;

fig. 5 is a top view of a further UVLED package support according to an embodiment of the present invention;

fig. 6 is a top view of a further UVLED package support according to an embodiment of the present invention;

fig. 7 is a bottom view of a further UVLED package support according to an embodiment of the present invention;

fig. 8 is a bottom view of a further UVLED package support according to an embodiment of the present invention;

fig. 9 is a top view of a UVLED lamp bead provided in an embodiment of the present invention;

fig. 10 is a driving circuit diagram of a UVLED lamp bead according to an embodiment of the present invention;

fig. 11 is a circuit diagram of a first UVLED chip and a first UVLED chip of a UVLED lamp bead according to an embodiment of the present invention.

Description of reference numerals:

10-a substrate;

11-a first via;

12-a second via;

13-a third via;

14-a fourth via;

20-a box dam;

21-a cavity;

30-a transparent member;

40-a first UVLED chip;

50-a zener diode chip;

60-a pad;

61-a first pad;

62-a second pad;

63-a third pad;

64-a fourth pad;

65-a trench;

70-a conductive layer;

71-a first pin;

72-a second pin;

73-a third pin;

74-fourth pin;

75-heat sink;

80-a second UVLED chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, generally, only one UVLED chip or only 2 UVLED chips connected in parallel are packaged in a conventional UVLED package support with a size of 3.5mm by 3.5mm, and a rated voltage of the UVLED chip is generally between 5V and 7V. In practical applications, the output voltage of the rechargeable battery or the conventional driving power source is most commonly specified as DC 12V. If a 12V power supply is connected with a 6V UVLED lamp bead through a driving circuit, the driving circuit will passively share redundant 6V voltage. Unnecessary voltage that drive circuit shared out will all release with thermal form finally to lead to drive circuit self to generate heat seriously, not only the electric energy utilization efficiency is low, and it generates heat and can cause adverse effect to the heat dissipation of UVLED lamp pearl self. Especially when a plurality of UVLED lamp pearls are parallelly connected, the electric current among the drive circuit is big, causes drive circuit's heat dissipation burden to aggravate.

In view of the above background, the heat dissipation of the driving circuit can be solved by adopting the connection form of the series-connected UVLED lamp beads to share the redundant voltage, however, the requirement on the voltage parameter of the UVLED lamp beads is high by the method, and the total number of the UVLED lamp beads can only be an integral multiple of 2. According to the UVLED packaging support, at least two UVLED chips are conveniently installed on the UVLED packaging support in series, an external resistor or a driving circuit does not need to be connected to share excessive voltage, the load of the driving circuit is reduced, the voltage is shared through the two UVLED chips, the current passing through the first UVLED chip 40 and the second UVLED chip 80 can be reduced, the power consumption is reduced, and therefore heating can be effectively reduced.

The UVLED package support and the UVLED lamp bead provided by the embodiment of the utility model are described below with reference to the accompanying drawings.

Referring to fig. 2 and 3, the present invention provides a UVLED package support, including: the semiconductor package structure comprises a substrate 10, a dam 20, a pad 60 and a conductive layer 70, wherein the dam 20 is convexly arranged on one surface of the substrate 10, the pad 60 is arranged on the substrate 10, the pad 60 is positioned in a cavity 21 defined by the dam 20, the pad 60 is internally provided with a first pad 61 and a second pad 62 which are opposite in electrical property and are mutually separated, the pad 60 is internally provided with a transition region, the transition region is positioned between the first pad 61 and the second pad 62, and as shown in fig. 3 and 4, the conductive layer 70 is arranged on one surface of the substrate 10, which faces away from the dam 20.

In the UVLED packaging support, the bonding pads 60 are internally provided with transition regions between the first bonding pads 61 and the second bonding pads 62, and the transition regions are arranged to facilitate the serial installation of at least two UVLED chips on the UVLED packaging support without performing bonding wire interconnection on the at least two UVLED chips in the packaging process. Therefore, the UVLED packaging support provided by the utility model is convenient to process into a UVLED lamp bead with a compact structure, and can be used for processing into the UVLED lamp bead directly matched with a common 12V power supply on the premise of not changing the existing packaging process.

Referring to fig. 3 and 4, the dam 20 may be disposed on one side of the substrate 10, the dam 20 may be located near the edge of the substrate 10, and the cavity 21 defined by the dam 20 is in the shape of a concave bowl.

The bonding pad 60 may be a metal bonding pad. The first pad 61 and the second pad 62 have different positive and negative electrical properties, that is, one of the first pad 61 and the second pad 62 is a positive electrode pad, and the other is a negative electrode pad.

Referring to fig. 2 and 5, a third pad 63 and a fourth pad 64 are provided in the transition region. In a possible implementation, the third pad 63 and the fourth pad 64 communicate with each other, and the third pad 63 and the fourth pad 64 communicate with each other, so that the third pad 63 and the fourth pad 64 are integrated. In another possible implementation, as shown in fig. 6, the third pad 63 and the fourth pad 64 may also be separated from each other by a trench 65, and the third pad 63 and the fourth pad 64 are electrically connected.

In one possible implementation, as shown with reference to fig. 6, the first pad 61, the third pad 63, the second pad 62, and the fourth pad 64 may be arranged in a clockwise or counterclockwise direction. The sizes and shapes of the first pad 61, the third pad 63, the second pad 62, and the fourth pad 64 may be substantially the same or different.

Referring to fig. 2 and 5, of course, the first pads 61 and the second pads 62 may be diagonally arranged in the pads 60.

In one possible implementation, the pads 60 are circular, as shown with reference to fig. 2 and 5.

Referring to fig. 3, the conductive layer 70 is electrically connected to a first lead 71 and a second lead 72, the first lead 71 and the second lead 72 have opposite electrical properties and are separated from each other, one of the first lead 71 and the second lead 72 is a positive electrode lead, and the other is a negative electrode lead. The first lead 71 and the second lead 72 may be made of a conductive metal material.

In a possible implementation manner, referring to fig. 7, the conductive layer 70 further has a third pin 73 thereon, the third pin 73 is used for heat conduction, and the third pin 73 is located between the first pin 71 and the second pin 72.

In one possible implementation, referring to fig. 3, the conductive layer 70 further has a heat sink 75 thereon, the heat sink 75 is located between the first pin 71 and the second pin 72, and the heat sink 75 is used for heat conduction.

Referring to fig. 4 and 5, a first through hole 11 and a second through hole 12 are formed in the substrate 10, the first through hole 11 is located on the first pad 61, and the first pad 61 is electrically connected to the first lead 71 through a conductive material filled in the first through hole 11; the second via 12 is located on the second pad 62, and the second pad 62 is electrically connected to the second lead 72 through the conductive material filled in the second via 12.

Referring to fig. 6, the substrate 10 is further provided with a third through hole 13 and a fourth through hole 14, the third through hole 13 is located on the third pad 63, and the fourth through hole 14 is located on the fourth pad 64;

the third pad 63 is electrically connected to the conductive layer 70 through the conductive material filled in the third via 13, and the fourth pad 64 is electrically connected to the conductive layer 70 through the conductive material filled in the fourth via 14.

For convenience of connection, in the orthogonal projection direction of the UVLED package support, the first pins 71 correspond to the positions of the first pads 61, and the second pins 72 correspond to the positions of the second pads 62. The third lead 73 corresponds to the position of the third pad 63, and the fourth lead 74 corresponds to the position of the fourth pad 64.

In one possible implementation, a blanket solder resist protective layer is laminated over conductive layer 70.

Referring to fig. 6, the first pad 61 and the second pad 62 are separated from each other by a trench 65; the width of the groove 65 is 100um to 300 um.

Referring to fig. 2 and 6, the groove 65 may include a horizontal groove and a vertical groove, both of which are connected to an edge position of the pad 60, and the horizontal groove and the vertical groove may be connected perpendicular to each other or may be connected by an inclined groove section.

The material of the substrate 10 may be PPA, EMC, alumina, aluminum nitride ceramic, or the like.

The conductive material filled in the first through hole 11, the second through hole 12, the third through hole 13, and the fourth through hole 14 may be conductive paint or the like.

The following 3 embodiments are electrically connected with respect to the third pad 63 and the fourth pad 64:

example one

Referring to fig. 2, the third pad 63 and the fourth pad 64 are communicated with each other, and the third pad 63 and the fourth pad 64 are directly electrically connected.

Example two

Referring to fig. 6 and 7, a first through hole 11 and a second through hole 12 are formed in the substrate 10, the first through hole 11 is located on the first pad 61, and the first pad 61 is electrically connected to the first lead 71 through a conductive material filled in the first through hole 11; the second via 12 is located on the second pad 62, and the second pad 62 is electrically connected to the second lead 72 through the conductive material filled in the second via 12.

The first through hole 11 may be filled with a conductive paint to electrically connect the first pad 61 and the first lead 71, and to electrically connect the second pad 62 and the second lead 72. Since the first lead 71 and the second lead 72 are electrically connected to the conductive layer 70, the first pad 61 is electrically connected to the second pad 62 through the conductive layer 70.

A conductive layer 70 is provided on a side of the substrate 10 facing away from the dam 20, and the third pad 63 and the fourth pad 64 may also be electrically connected through the conductive layer 70.

The third pad 63 and the fourth pad 64 are separated from each other, the conductive layer 70 is further provided with a third pin 73, the third pad 63 is electrically connected with the third pin 73 of the conductive layer 70 through the conductive material filled in the third through hole 13, and the fourth pad 64 is also electrically connected with the third pin 73 of the conductive layer 70 through the conductive material filled in the fourth through hole 14, so that the third pad 63 and the fourth pad 64 are electrically connected.

EXAMPLE III

Referring to fig. 6 and 8, the third pad 63 is electrically connected to an external circuit through the conductive material filled in the third via 13, and the fourth pad 64 is electrically connected to the external circuit through the conductive material filled in the fourth via 14.

The third pad 63 and the fourth pad 64 are separated from each other, the conductive layer 70 is further provided with a third pin 73 and a fourth pin 74, the third pin 73 and the fourth pin 74 are electrically separated from each other, both the third pin 73 and the fourth pin 74 are electrically connected with the conductive layer 70, the third pad 63 is electrically connected with the third pin 73 of the conductive layer 70 through a conductive material filled in the third through hole 13, the fourth pad 64 is electrically connected with the fourth pin 74 of the conductive layer 70 through a conductive material filled in the fourth through hole 14, the third pin 73 and the fourth pin 74 are simultaneously connected in series with an external circuit, and the third pad 63 and the fourth pad 64 are electrically connected.

The third pad 63 and the fourth pad 64 are electrically connected in various forms, so that flexible selection is facilitated.

Referring to fig. 4 and 9, the utility model further provides a UVLED lamp bead, which includes a first UVLED chip 40, a second UVLED chip 80, a transparent member 30 and the above-mentioned UVLED package support; the first UVLED chip 40 is stacked on the first pad 61 and the third pad 63 of the UVLED package support, and the first UVLED chip 40 is coupled across at least a portion of the first pad 61 and at least a portion of the third pad 63; the second UVLED chip 80 is stacked on the second bonding pad 62 and the fourth bonding pad 64 of the UVLED package support, and the second UVLED chip 80 is coupled across at least a portion of the second bonding pad 62 and at least a portion of the fourth bonding pad 64; the first uv led chip 40 and the second uv led chip 80 are connected in series with each other. The transparent member 30 is sealingly disposed on the dam 20 of the UVLED package support.

According to the UVLED lamp bead, the rated voltage is 10V-12V, when a common 12V direct current power supply supplies power, an external resistor or a driving circuit does not need to be connected to share excessive voltage, so that the burden of the driving circuit is reduced, the UVLED lamp bead can be directly connected with the 12V direct current power supply, and the UVLED lamp bead is convenient to use.

According to the UVLED lamp bead, the UVLED packaging support is internally provided with the first bonding pad 61, the third bonding pad 63, the second bonding pad 62 and the fourth bonding pad 64 for welding at least two UVLED chips, the first UVLED chip 40 and the second UVLED chip 80 are connected in series, the driving circuit is arranged outside the UVLED packaging support, and therefore the first UVLED chip 40 and the second UVLED chip 80 do not need to be connected in a welding line mode in the packaging process of the UVLED lamp bead.

The first UVLED chip 40 is stacked on the first pad 61 and the third pad 63 of the UVLED package support, where the first UVLED chip 40 may be soldered on the first pad 61 and the third pad 63 by solder such as solder paste, gold-tin alloy, and conductive silver paste, and the positive electrode and the negative electrode of the first UVLED chip 40 are soldered on the first pad 61 and the third pad 63 respectively.

The second UVLED chip 80 is stacked on the second bonding pad 62 and the fourth bonding pad 64 of the UVLED package support, and the second UVLED chip 80 may be soldered on the second bonding pad 62 and the fourth bonding pad 64 by solder such as solder paste, gold-tin alloy, and conductive silver paste, and the positive electrode and the negative electrode of the second UVLED chip 80 are soldered on the second bonding pad 62 and the fourth bonding pad 64, respectively.

In a possible implementation manner, in order to avoid damage to the first uv led chip 40 and the second uv led chip 80 caused by electrostatic discharge, the present embodiment provides a uv led lamp bead further including a zener diode chip 50, wherein the zener diode chip 50 is stacked on the first bonding pad 61 and the second bonding pad 62, and the zener diode chip 50 is coupled across at least a portion of the first bonding pad 61 and at least a portion of the second bonding pad 62. The zener diode chip 50 is connected in parallel with the series structure of the first UVLED chip 40 and the second UVLED chip 80.

The breakdown voltage of the zener diode chip 50 should be at least higher than the sum of the voltages of the ends of the series circuit composed of the first UVLED chip 40 and the second UVLED chip 80.

It is easily understood that, the first pads 61 and the second pads 62 are arranged in different orders, and the connected positions and the connected number of the zener diode chips 50 are different.

Referring to fig. 4 and 9, in another possible implementation manner, the uv led lamp bead provided in this embodiment further includes two zener diode chips 50, one of the two zener diode chips 50 is stacked on the first bonding pad 61 and the fourth bonding pad 64, and one of the zener diode chips 50 is coupled across at least a portion of the first bonding pad 61 and at least a portion of the fourth bonding pad 64; and/or the other of the two zener diode chips 50 is stacked on the second pad 62 and the third pad 63, and the other of the two zener diode chips 50 is coupled across at least a portion of the second pad 62 and at least a portion of the fourth pad 64.

In this embodiment, it is realized that one of the two zener diode chips 50 is connected in parallel with the first uv led chip 40 and has a breakdown voltage at least higher than a terminal voltage of the first uv led chip 40, the other of the two zener diode chips 50 is connected in parallel with the second uv led chip 80 and has a breakdown voltage at least higher than a terminal voltage of the second uv led chip 80, and the first uv led chip 40 and the second uv led chip 80 are connected in series with each other.

Referring to fig. 4 and 9, in a possible implementation, the transparent member 30 may be formed by pouring sealant into the cavity 21 defined by the dam 20 and solidifying the sealant, so as to seal the first uv led chip 40, the second uv led chip 80 and the zener diode chip 50 in the cavity 21.

In a possible implementation, the transparent member 30 may also be a transparent resin or a transparent quartz glass sheet, and the cavity 21 surrounded by the dam 20 forms a sealing structure by adhering the transparent resin or the transparent quartz glass sheet to the dam 20, so that the first uv led chip 40, the second uv led chip 80 and the zener diode chip 50 are sealed in the cavity 21.

The shape of the transparent member 30 is not limited to a square, a circle or an irregular figure, and the surface of the transparent member 30 may be flat or curved.

In a possible embodiment, the first pad 61 and the third pad 63, and the second pad 62 and the fourth pad 64 are arranged in an order that the first pad 61 and the second pad 62 are disposed opposite to each other, the third pad 63 and the fourth pad 64 are disposed opposite to each other, and the third pad 63 and the fourth pad 64 may be connected or separated from each other.

When the first bonding pad 61 is a positive electrode and the second bonding pad 62 is a negative electrode, the directions of the positive and negative electrodes of the first UVLED chip 40 stacked on the first bonding pad 61 and the third bonding pad 63 of the UVLED package support are the same as the directions of the positive and negative electrodes of the second UVLED chip 80 stacked on the second bonding pad 62 and the fourth bonding pad 64 of the UVLED package support, so that in the packaging process, the directions of the positive and negative electrodes of the first UVLED chip 40 and the directions of the positive and negative electrodes of the second UVLED chip 80 are not required to be distinguished, and the production is facilitated. The first bonding pad 61 and the second bonding pad 62 are respectively located on two sides of a central axis of the UVLED package support, and in the structural design, the substrate 10 is conveniently provided with the first through hole 11 and the second through hole 12, and the substrate 10 is also conveniently provided with the third through hole 13 and the fourth through hole 14, so that the distribution positions of the first pin 71 and the second pin 72 on the back surface of the substrate 10 are left-right distribution structures or left-middle-right distribution structures.

In one possible implementation, the first pad 61, the third pad 63, the second pad 62 and the fourth pad 64 are arranged in a clockwise or counterclockwise direction. When the first bonding pad 61 is a positive electrode and the second bonding pad 62 is a negative electrode, the first bonding pad 61 and the second bonding pad 62 are located on the same side of the central axis of the UVLED package support, the positive and negative electrode orientations of the first UVLED chip 40 stacked on the first bonding pad 61 and the third bonding pad 63 of the UVLED package support are different from the positive and negative electrode orientations of the second UVLED chip 80 stacked on the second bonding pad 62 and the fourth bonding pad 64 of the UVLED package support, the positions of the first through hole 11 and the second through hole 12 formed in the substrate 10, and the distribution positions of the first pin 71 and the second pin 72 on the back surface of the substrate 10 are located on the same side of the central axis of the UVLED package support.

The positive and negative electrodes are oriented in the same direction, it is understood that the positive electrodes of the first UVLED chip 40 and the second UVLED chip 80 are oriented in the same direction, and the negative electrodes are oriented in the same direction. The different orientation of the positive electrode and the negative electrode is understood to mean that the positive electrode of the first UVLED chip 40 faces the direction of the negative electrode of the second UVLED chip 80, and the negative electrode of the first UVLED chip 40 faces the direction of the positive electrode of the second UVLED chip 80.

In one possible embodiment, the width of the groove 65 is 100um to 300um, and particularly, the width of the groove 65 is adapted to the distance between the positive electrode and the negative electrode of the second UVLED chip 80, and the width of the groove 65 is adapted to the distance between the positive electrode and the negative electrode of the first UVLED chip 40.

The number of the first UVLED chips 40 is more than or equal to 1, the number of the second UVLED chips 80 is more than or equal to 1, and the number of the first UVLED chips 40 is the same as or different from that of the second UVLED chips 80.

In a possible implementation, the number of the first UVLED chips 40 is equal to 1, and the number of the second UVLED chips 80 is equal to 1.

The peak wavelength range of the first UVLED chip 40 is 250nm to 320nm, the peak wavelength range of the second UVLED chip 80 is 250nm to 320nm, and the peak wavelength of the first UVLED chip 40 is the same as or different from the peak wavelength of the second UVLED chip 80.

In one possible implementation, the peak wavelength of the first UVLED chip 40 may be 265nm or 310 nm; the peak wavelength of the second UVLED chip 80 may be 265nm or 310 nm.

The first UVLED chip 40 is a flip chip or a vertical chip; and/or the second uv led chip 80 is a flip chip or a vertical chip.

The rated voltage of the first UVLED chip 40 is 5V-7V, the rated voltage of the second UVLED chip 80 is 5V-7V, and the sum of the rated voltage of the first UVLED chip 40 and the rated voltage of the second UVLED chip 80 is less than or equal to 12V. It is easily understood that the first UVLED chip 40 and the second UVLED chip 80 are connected in series, the rated voltage of the first UVLED chip 40 may be the same as or different from the rated voltage of the second UVLED chip 80, and the sum of the rated voltage of the first UVLED chip 40 and the rated voltage of the second UVLED chip 80 is less than or equal to 12V.

It is to be understood that the first uv led chip 40 and the second uv led chip 80 may have the same or different size specifications. The optoelectronic parameters of the first uv led chip 40 and the second uv led chip 80 may be the same or different. When the first UVLED chip 40 and the second UVLED chip 80 are connected in series in the same UVLED lamp bead, the number, specification, and photoelectric parameters of the first UVLED chip 40 and the second UVLED chip 80 may be different.

In order to ensure the consistency of the packaging parameters, the first UVLED chip 40 and the second UVLED chip 80 may be selected from different types of chips having the same or similar size and photoelectric parameters.

Referring to fig. 10, a driving circuit diagram of the UVLED lamp bead provided in this embodiment is shown, where the driving circuit of the UVLED lamp bead is configured to convert a constant voltage into a constant current, and provide a constant input current for the UVLED lamp bead provided in this embodiment. Fig. 11 is a circuit diagram of a first UVLED chip 40 of a UVLED lamp bead according to an embodiment of the present invention, and is a circuit diagram of a second UVLED chip 80.

During the use, first UVLED chip 40 all is connected on this drive circuit with the circuit electricity of second UVLED chip 80 for the UVLED lamp pearl that this embodiment provided can reduce the electric current of first UVLED chip 40 and second UVLED chip 80, and the consumption that drive circuit shared is little, improves electric energy utilization efficiency, improves the reliability.

Referring to a driving circuit diagram of the UVLED lamp bead shown in fig. 10, an adopted driver is HX317, the driver is a domestic huaxing photoelectric constant current driving chip, the driver mainly functions to convert an external constant voltage input into a constant current output, the output current can be adjusted, and the driver also functions to divide voltage. The pin of the driver is connected to ground.

The parallel capacitor C1 and the parallel capacitor C2 both play a role of protection or current limitation.

It is easy to understand that, when the UVLED lamp bead provided in this embodiment is powered by the driving circuit of the UVLED lamp bead shown in fig. 10 under an input voltage of 12V, since the rated voltage of the UVLED lamp bead of the present invention is in a region close to 12V, for example: 10V-12V, therefore most of voltage will be exerted on UVLED lamp pearl, and the drive circuit of this UVLED lamp pearl apportionment power consumption is very little.

It should be noted that the numerical values and numerical ranges referred to in this application are approximate values, and there may be some error due to the manufacturing process, and the error may be considered to be negligible by those skilled in the art.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "circumferential", and the like, are used to indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the utility model and to simplify the description, and do not indicate or imply that the position or element referred to must have a particular orientation, be of particular construction and operation, and thus, are not to be construed as limiting the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; may be mechanically coupled, may be electrically coupled or may be in communication with each other; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (13)

1. A UVLED package support, characterized in that includes: the circuit board comprises a substrate (10), a dam (20), a pad (60) and a conductive layer (70), wherein the dam (20) is arranged on one surface of the substrate (10) in a protruding mode, the pad (60) is arranged on the substrate (10), the pad (60) is located in a cavity (21) defined by the dam (20), and the conductive layer (70) is arranged on one surface, back to the dam (20), of the substrate (10);

the bonding pad (60) is internally provided with a first bonding pad (61) and a second bonding pad (62) which are opposite in electrical property and are separated from each other, and the bonding pad (60) is internally provided with a transition region which is positioned between the first bonding pad (61) and the second bonding pad (62).

2. A UVLED package support according to claim 1, characterized in that a third pad (63) and a fourth pad (64) are provided in the transition region, the third pad (63) and the fourth pad (64) are in communication with each other or separated from each other by a trench (65), and the third pad (63) and the fourth pad (64) are electrically connected.

3. A uv led package support according to claim 2, wherein the conductive layer (70) has electrically connected thereto a first lead (71) and a second lead (72), the first lead (71) and the second lead (72) being electrically opposite and spaced apart from each other.

4. The UVLED package support of claim 3, wherein said substrate (10) has a first through hole (11) and a second through hole (12) formed therein, said first through hole (11) is located on said first bonding pad (61), said first bonding pad (61) is electrically connected to said first lead (71) through a conductive material filled in said first through hole (11); the second through hole (12) is located on the second bonding pad (62), and the second bonding pad (62) is electrically connected with the second pin (72) through a conductive substance filled in the second through hole (12).

5. The UVLED package support of claim 4, wherein said substrate (10) further defines a third through hole (13) and a fourth through hole (14), said third through hole (13) is located on said third bonding pad (63), said fourth through hole (14) is located on said fourth bonding pad (64);

the third pad (63) is electrically connected with the conductive layer (70) through a conductive substance filled in the third through hole (13), and the fourth pad (64) is electrically connected with the conductive layer (70) through a conductive substance filled in the fourth through hole (14); or

The third bonding pad (63) is electrically connected to an external circuit through the conductive material filled in the third through hole (13), and the fourth bonding pad (64) is electrically connected to the external circuit through the conductive material filled in the fourth through hole (14).

6. A UVLED package support according to any one of claims 2 to 5, characterised in that said first pads (61) and said second pads (62) are mutually separated by said grooves (65);

the width of the groove (65) is 100 um-300 um.

7. A UVLED lamp bead, characterized in that it comprises a first UVLED chip (40), a second UVLED chip (80), a transparent member (30) and a UVLED package support according to any one of claims 1 to 6;

the first UVLED chip (40) is arranged on the first bonding pad (61) and the third bonding pad (63) of the UVLED package support in a stacking mode, and the first UVLED chip (40) is coupled to at least one part of the first bonding pad (61) and at least one part of the third bonding pad (63) in a crossing mode;

the second UVLED chip (80) is arranged on the second bonding pad (62) and the fourth bonding pad (64) of the UVLED package support in a stacking mode, and the second UVLED chip (80) is coupled to at least one part of the second bonding pad (62) and at least one part of the fourth bonding pad (64) in a crossing mode;

the first UVLED chip (40) and the second UVLED chip (80) are connected in series with each other;

the transparent member (30) is hermetically disposed on a dam (20) of the UVLED package support.

8. The UVLED lamp bead of claim 7, further including a Zener diode chip (50), said Zener diode chip (50) being disposed in a stacked relationship on said first bonding pad (61) and said second bonding pad (62), and said Zener diode chip (50) being coupled across at least a portion of said first bonding pad (61) and at least a portion of said second bonding pad (62).

9. The UVLED lamp bead of claim 7, further comprising two Zener diode chips (50), one of said two Zener diode chips (50) being disposed in a stack on said first bonding pad (61) and said fourth bonding pad (64), and one of said Zener diode chips (50) being coupled across at least a portion of said first bonding pad (61) and at least a portion of said fourth bonding pad (64); and/or

The other of the two zener diode chips (50) is disposed in a stacked relationship on the second pad (62) and the third pad (63), and the other of the two zener diode chips (50) is coupled across at least a portion of the second pad (62) and at least a portion of the fourth pad (64).

10. The UVLED lamp bead of claim 7, wherein the number of said first UVLED chips (40) is 1 or more, the number of said second UVLED chips (80) is 1 or more, and the number of said first UVLED chips (40) is the same as or different from the number of said second UVLED chips (80).

11. The UVLED lamp bead of claim 7, wherein said first UVLED chip (40) has a peak wavelength in the range of 250nm to 320nm, said second UVLED chip (80) has a peak wavelength in the range of 250nm to 320nm, and said first UVLED chip (40) has a peak wavelength that is the same as or different from a peak wavelength of said second UVLED chip (80).

12. A UVLED lamp bead according to claim 7, characterised in that said first UVLED chip (40) is a flip chip or a vertical chip; and/or

The second UVLED chip (80) is a flip chip or a vertical chip.

13. The UVLED lamp bead of claim 7, wherein said first UVLED chip (40) is rated at a voltage of 5V to 7V, said second UVLED chip (80) is rated at a voltage of 5V to 7V, and the sum of said first UVLED chip (40) rated voltage and said second UVLED chip (80) rated voltage is 12V or less.

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