CN215593228U - Electroplating packaging equipment's stores pylon - Google Patents
Electroplating packaging equipment's stores pylon Download PDFInfo
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- CN215593228U CN215593228U CN202120981431.6U CN202120981431U CN215593228U CN 215593228 U CN215593228 U CN 215593228U CN 202120981431 U CN202120981431 U CN 202120981431U CN 215593228 U CN215593228 U CN 215593228U
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Abstract
A hanging rack of electroplating packaging equipment comprises a hanging rack main body (1), a conductive component (2) and a sealing cover plate (3); the main body of the hanging rack is a vertical plate, two rows of vertical and symmetrical pin spring mounting holes and a plurality of sealing cover plate fixing holes are drilled on the plate surface; the conductive assembly includes: the cross section of each conductive pressing strip is in a step shape, opposite edges of the outer surface protrude inwards to form a limiting step, and a limiting step bulge is arranged at the bottom of the limiting step; one end of the two conducting wires is connected with a power supply of the rectifier, and the other end of the two conducting wires is electrically connected with the conducting pressing bar; the sealing cover plate is a rectangular frame type flat plate, and the plate surface is provided with an inner sealing ring and an outer sealing ring; the conductive pressing strip is connected to the hanger main body, a gap is reserved between the conductive pressing strip and the hanger main body, and the stepped pin is sleeved with the spring to enable the conductive pressing strip to be separated from the hanger main body; the inner and outer sealing rings of the sealing cover plate seal the conductive area of the circuit board, and press the conductive pressing strip to enable the conductive pressing strip to compress the spring and enable the convex edge of the limiting step of the conductive pressing strip to tightly press the conductive area of the circuit board to be conductive.
Description
Technical Field
The utility model relates to a component of electroplating packaging equipment, in particular to a circuit board and a hanging frame of semiconductor electroplating packaging equipment.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improve the appearance. Electroplating plays an important role in a semiconductor packaging process, and the requirements of electroplated copper column height and redistribution layer resolution on electroplated products are higher and higher, and the requirements of uniformity are better and better. The current density of conventional VCP plating is limited to 5ASD, and since the time difference between the pretreatment and the plating time is large, the plating time is generally increased by increasing the length of the copper bath. However, the requirement of electroplating packaging exceeds the electroplating capability of VCP, and the electroplating requirements of long time, high efficiency and high stability cannot be met. The production needs can be met only by adopting a high-stability hanging rack to carry out gantry type electroplating.
In the traditional process, the surface of a wafer needs to be pretreated when the wafer is processed, and the wafer is suspended in a cavity in a mode of being horizontally or vertically placed without any sealing protection. This method is generally applicable only to electroless plating, and if electroplating is performed, the following disadvantages are encountered: 1. wiring hermeticity issues (copper plating also occurs if no hermetic protection is performed); 2. the stability problem of clamping (because the current electroplating product generally only keeps 10-15mm of edge distance); and 3, products are divided into double-sided electroplating and single-sided electroplating, and the single-sided electroplating cannot be carried out in the mode.
The chinese utility model with patent No. ZL2019203364686 discloses an electroplating rack which is applied by the applicant and can simultaneously carry out two single-side electroplating, and the electroplating rack clamps the circuit board 10 through an electroplating clamp 4. The rack is suitable for single-side electroplating products with insulated back surfaces and without protection or products with slightly different double-side electroplating areas. However, the hanger has the following disadvantages: the sealing area is not needed, so that the plated area and the conductive area are plated; the pinch point 404 of the plating clip requires a hermetic encapsulation process, so the plating area is smaller, resulting in a lower maximum current density; the main problem is the electrical conduction and sealing of the hanger. For example, a customer product has a product size of 310 x 320, with an effective plating area of 290 x 290, a peripheral conductive area of 15mm above and below and 10mm to the left and right. The product can only be electroplated on the effective electroplating area, and the conductive area only has the conductive function and can not be electroplated.
The electric conduction means that a negative wire of the rectifier is connected to a conductive area of the product, and a positive electrode is connected to an anode to form a loop.
Since both the wire and the conductive area are conductive, these areas need to be sealed in a copper bath to prevent plating in areas where plating is not needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of providing a hanging rack of electroplating packaging equipment, which can be designed to be single-sided electroplating or double-sided electroplating; and the upper plate is convenient, conductive and stable in sealing, and can realize high-current-density long-time electroplating.
The technical scheme adopted by the utility model is as follows:
the utility model provides a stores pylon of electroplating packaging equipment which characterized in that: comprises a hanging rack main body 1, a conductive component 2 and a sealing Cover Plate (CPF) 3;
the hanger main body 1 is a vertical plate, two rows of vertical and symmetrical pin spring mounting holes 14 (countersunk threaded holes) and a plurality of sealing cover plate fixing holes 13 (both through holes and threaded holes) are drilled on two plate surfaces respectively;
the conductive member 2 includes: two conductive pressing strips 21, which are drilled with a through hole corresponding to the pin spring mounting hole on the hanger main body and a wire terminal connecting through hole for connecting a wire, wherein the cross sections of the two conductive pressing strips are in a step shape, the opposite sides of the outer surface protrude inwards to form a limiting step, and a limiting step bulge is arranged at the bottom (the limiting step is used for limiting the left and right positions of the circuit board in the hanger main body and blocking the circuit board from falling down, and the bulge at the bottom is used for supporting the bottom of the circuit board); two conducting wires 22, one end of each conducting wire is connected with a power supply of the rectifier, and the other end of each conducting wire is electrically connected with the conducting pressing bar;
the sealing cover plate 3 is a rectangular frame type flat plate, the surface of the rectangular frame is at least provided with an inner sealing ring 31 and an outer sealing ring 31, so that a conductive area of a circuit board or a semiconductor to be plated is positioned between the two sealing rings (the plating area is positioned in the inner sealing ring), and the surface of the plate is correspondingly drilled with a sealing cover plate fixing through hole 32;
the conductive pressing strip 21 is connected to a pin spring mounting hole of the hanger main body 1 through a step pin 4, a gap is reserved between the pin spring mounting hole and the pin spring mounting hole, a spring 5 is sleeved on the step pin, one end of the spring is propped against the hanger main body, and the other end of the spring is propped against the conductive pressing strip so that the conductive pressing strip is separated from the hanger main body; the sealing cover plate is fixed on the hanger main body through a connecting piece, the inner sealing ring and the outer sealing ring seal the conductive area of the circuit board 6, and the conductive pressing strip is pressed to enable the conductive area of the circuit board to be conductive, wherein the conductive area compresses the convex edge of the limiting step of the conductive pressing strip and the spring to be compressed.
On the basis of the above, the present invention may have various modifications as follows:
the pin spring mounting holes 14 (countersunk head threaded holes) are distributed in two vertical and symmetrical conductive component limiting grooves 12, the sealing cover plate fixing holes 13 (through holes and threaded holes can be formed) are distributed outside the conductive component limiting grooves, two walking conductive grooves are formed in the two plate surfaces respectively, one end of each walking conductive groove is communicated with one conductive component limiting groove, the other end of each walking conductive groove reaches the plate edge directly, and the lead 22 is electrically connected with the conductive pressing strip through the walking conductive grooves.
A plurality of silica gel pads 7 are arranged between the inner and outer sealing rings on the inner plate surface of the sealing cover plate 3 corresponding to the conductive pressing strips, so that a certain compression space exists when the sealing cover plate presses the conductive pressing strips.
And one end of the lead 22 is welded with a wiring terminal and a nut which are made of the same material, and is connected with the conductive pressing strip through a conductive groove by a bolt.
The utility model has the following advantages:
the interior of the hanging rack is free of an electric appliance structure, and the hanging rack is convenient to maintain.
And the conductive areas of the hanging rack are dispersed, thereby being beneficial to the uniformity of electroplating.
And the conductive pressing strip of the hanging rack is designed, the upper plate is directly inserted between the conductive pressing strip and the main body from the upper part of the hanging rack, and the upper plate is convenient and quick.
And fourthly, the gap between the conductive pressing strip and the hanging rack main body can meet the requirement that the interval of the plate thickness range is larger.
Drawings
FIG. 1 is a schematic exploded view of an embodiment of the present invention;
FIG. 2 is a second exploded perspective view of the embodiment of the present invention;
FIG. 3 is a third exploded perspective view of the present invention;
FIG. 4 is a schematic front view of an embodiment of the present invention;
FIG. 5 is a schematic horizontal cross-sectional view of FIG. 4;
FIG. 6 is an enlarged partial schematic view of FIG. 5;
FIG. 7 is a schematic front view of an embodiment of the present invention with the CPF removed;
FIG. 8 is a schematic perspective cross-sectional view of FIG. 7;
FIG. 9 is an enlarged partial schematic view of FIG. 8;
FIG. 10 is a perspective view of one embodiment of the conductive bead assembly;
fig. 11 is a second perspective view of the conductive bead assembly of the present embodiment;
FIG. 12 is a third perspective view of the conductive bead assembly of the present embodiment;
FIG. 13 is a third perspective view of the conductive bead assembly of the present embodiment;
fig. 14 is a front view schematically illustrating the sealing cover plate of the present embodiment.
Reference numerals in the figures refer to: the method comprises the following steps of 1-hanger main body, 2-conductive component, 3-sealing cover plate, 11-conductive groove, 12-conductive component limiting groove, 13-sealing cover plate fixing hole, 14-pin spring mounting hole, 21-conductive pressing bar, 22-lead, 31-sealing ring, 4-step pin, 5-spring, 6-circuit board, 7-silica gel pad, 111-hanger induction sheet, 23-stainless steel conductive terminal, 24-stainless steel nut, 25-limiting step, 26-limiting step bulge and 32-sealing cover plate fixing hole.
Detailed Description
Referring to the drawings, the rack of the electroplating packaging equipment of the embodiment of the utility model comprises a rack body 1, a conductive assembly 2 and a sealing cover plate 3.
The hanger main body 1 is a vertical plate, two vertical and symmetrical pin spring mounting holes 14 (countersunk head threaded holes) are drilled on two plate surfaces respectively, and a plurality of sealing cover plate fixing holes 13 (both threads and through holes) are distributed on the two plate surfaces.
The conductive member 2 includes: two conductive pressing strips 21, through holes corresponding to pin spring mounting holes on the hanger main body and a lead terminal connecting through hole for connecting a lead are drilled on the conductive pressing strips, the cross sections of the two conductive pressing strips are in a step shape, opposite sides of the outer surface protrude inwards to form a limiting step 25, and a limiting step bulge 26 is arranged at the bottom (the limiting step is used for limiting the left and right positions of the circuit board in the hanger main body and blocking the circuit board from falling outwards, and the bulge at the bottom is used for supporting the bottom of the circuit board); and one end of each conducting wire is connected with a power supply of the rectifier, and the other end of each conducting wire is electrically connected with the conducting pressing bar.
The sealing cover plate 3 is a rectangular frame type flat plate, the surface of the rectangular frame is at least provided with an inner sealing ring 31 and an outer sealing ring 31, so that a conductive area of a circuit board or a semiconductor needing to be electroplated is positioned between the two sealing rings (the electroplating area is positioned in the inner sealing ring), and the surface is correspondingly drilled with a sealing cover plate fixing through hole 32 corresponding to the periphery of the circuit board.
The conductive pressing strip 21 is connected to a pin spring mounting hole of the hanger main body 1 through a step pin 4, a gap is reserved between the pin spring mounting hole and the pin spring mounting hole, a spring 5 is sleeved on the step pin, one end of the spring is propped against the hanger main body, and the other end of the spring is propped against the conductive pressing strip so that the conductive pressing strip is separated from the hanger main body; the sealing cover plate is fixed on the hanger main body through a connecting piece, the inner sealing ring and the outer sealing ring seal the conductive area of the circuit board 6, and the conductive pressing strip is pressed to enable the conductive area of the circuit board to be conductive, wherein the conductive area compresses the convex edge of the limiting step of the conductive pressing strip and the spring to be compressed.
The pin spring mounting holes 14 are countersunk threaded holes and are distributed in two vertical and symmetrical conductive component limiting grooves 12, the sealing cover plate fixing holes 13 (threaded holes) are distributed outside the conductive component limiting grooves, two conductive grooves are respectively formed in the two plate surfaces, one end of each conductive groove is communicated with one conductive component limiting groove, the other end of each conductive groove directly reaches the plate edge, and one end of each lead 22 is welded with a wiring terminal and a nut which are made of the same materials and are connected with the conductive pressing strips through the conductive grooves and bolts.
A plurality of silica gel pads 7 are arranged between the inner and outer sealing rings on the inner plate surface of the sealing cover plate 3 corresponding to the conductive pressing strips, so that a certain compression space exists when the sealing cover plate presses the conductive pressing strips.
When the circuit board is required to be loaded, the spring bounces the conductive pressing strip by means of elasticity, a certain gap is formed between the limiting step of the conductive pressing strip and the hanger main body, the plate is inserted into the gap from the upper side of the conductive pressing strip, the conductive pressing strip is pressed downwards through the sealing cover plate, the spring is deformed, and the conductive pressing strip and the conductive area of the circuit board are in contact conduction.
Furthermore, in order to facilitate the disassembly, the nut and the terminal are made of the same material and are welded together, and then the conductive pressing strip is fixed together with the terminal through the nut.
The sealing cover plate is at least provided with two sealing rings, wherein the relative position of the conductive area of the circuit board is between the sealing rings at the two sides. The silica gel pad is also arranged between the sealing rings and is positioned above the conductive pressing strip, so that a certain compression space exists when the sealing cover plate presses the conductive pressing strip.
At ordinary times, the spring bounces the conductive pressing strip by means of elasticity, a certain gap is formed between the limiting step of the conductive pressing strip and the hanger main body, when a circuit board needs to be loaded, the circuit board is inserted into the gap from the upper side of the conductive pressing strip, the conductive pressing strip is pressed downwards through the sealing cover plate, the spring is deformed, and the conductive pressing strip and a conductive area of the circuit board are in contact conduction.
The wire guide groove is bent upwards and extends to the upper part of the hanging frame, and the wire guide groove is used for installing a conductive wire.
As shown in fig. 2, further, the structure can be modified into a double-sided hanger, which is different from the single-sided hanger in the hanger body. And a bottom conductive strip sealing strip is arranged on the back surface of the circuit board, namely the hanger main body.
Claims (4)
1. The utility model provides a stores pylon of electroplating packaging equipment which characterized in that: comprises a hanger main body (1), a conductive component (2) and a sealing cover plate (3);
the hanger main body is a vertical plate, two rows of vertical and symmetrical pin spring mounting holes (14) are drilled on two plate surfaces respectively, and a plurality of sealing cover plate fixing holes (13) are distributed on the two plate surfaces;
the conductive assembly includes: the cross sections of the two conductive pressing strips are in a step shape, the opposite edges of the outer surfaces protrude inwards to form a limiting step, and a limiting step bulge is arranged at the bottom of the two conductive pressing strips; one end of each conducting wire is connected with a power supply of the rectifier, and the other end of each conducting wire is electrically connected with the conducting pressing bar;
the sealing cover plate is a rectangular frame type flat plate, the surface of the rectangular frame is at least provided with an inner sealing ring and an outer sealing ring (31), so that a conductive area of a circuit board or a semiconductor needing to be electroplated is positioned between the two sealing rings, and the surface is correspondingly drilled with a sealing cover plate fixing through hole (32);
the conductive pressing strip (21) is connected to a pin spring mounting hole of the hanger main body (1) through a step pin (4), a gap is reserved between the conductive pressing strip and the pin spring mounting hole, a spring (5) is sleeved on the step pin, one end of the spring is abutted to the hanger main body, and the other end of the spring is abutted to the inside of the conductive pressing strip so that the conductive pressing strip is separated from the hanger main body; the sealing cover plate is fixed on the hanging rack main body through a connecting piece, the inner sealing ring and the outer sealing ring seal the conductive area of the circuit board (6), and the conductive pressing strip is pressed to enable the conductive area of the circuit board to be conductive, wherein the conductive area compresses the convex edge of the limiting step of the conductive pressing strip and the compression spring to be conductive.
2. The rack of electroplating packaging equipment according to claim 1, characterized in that: the pin spring mounting holes (14) are distributed in two vertical and symmetrical conducting component limiting grooves 12, the sealing cover plate fixing holes (13) are distributed outside the conducting component limiting grooves, two walking conducting grooves are further formed in the two plate surfaces, one end of each walking conducting groove is communicated with one conducting component limiting groove, the other end of each walking conducting groove reaches the plate edge, and the conducting wire (22) is electrically connected with the conducting pressing strip through the walking conducting grooves.
3. The rack of electroplating packaging equipment according to claim 1, characterized in that: a plurality of silica gel pads (7) are arranged between the inner and outer sealing rings on the inner plate surface of the sealing cover plate (3) corresponding to the conductive pressing strips, so that a certain compression space exists when the sealing cover plate presses the conductive pressing strips.
4. The rack of electroplating packaging equipment according to claim 1, characterized in that: and one end of the lead (22) is welded with a wiring terminal and a nut which are made of the same material, and is connected with the conductive pressing strip through a conductive groove by a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120981431.6U CN215593228U (en) | 2021-05-10 | 2021-05-10 | Electroplating packaging equipment's stores pylon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120981431.6U CN215593228U (en) | 2021-05-10 | 2021-05-10 | Electroplating packaging equipment's stores pylon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215593228U true CN215593228U (en) | 2022-01-21 |
Family
ID=79872822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120981431.6U Active CN215593228U (en) | 2021-05-10 | 2021-05-10 | Electroplating packaging equipment's stores pylon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215593228U (en) |
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2021
- 2021-05-10 CN CN202120981431.6U patent/CN215593228U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A hanging rack for electroplating packaging equipment Effective date of registration: 20230110 Granted publication date: 20220121 Pledgee: Zengcheng sub branch of Bank of Guangzhou Co.,Ltd. Pledgor: GUANGZHOU MING YI ELECTRONIC MACHINERY Co.,Ltd. Registration number: Y2023980030728 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |