CN215576507U

CN215576507U - Display card radiator

Info

Publication number: CN215576507U
Application number: CN202120779575.3U
Authority: CN
Inventors: 李允权
Original assignee: Guangdong Fusheng Runfeng Precision Manufacturing Technology Co ltd
Current assignee: Guangdong Fusheng Runfeng Precision Manufacturing Technology Co ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2022-01-18
Anticipated expiration: 2031-04-16

Abstract

The utility model discloses a display card radiator, which comprises a substrate, wherein the top surface of the substrate is provided with a plurality of first radiating fins and a mounting platform, the first radiating fins are uniformly arranged along the left-right direction, a first ventilation gap is formed between any two adjacent first radiating fins, the top surface of the mounting platform is provided with a plurality of second radiating fins, the second radiating fins are arranged along the left-right direction, a second ventilation gap is formed between any two adjacent second radiating fins, the top surfaces of the first radiating fins and the second radiating fins are flush with each other, the top surface of the mounting platform is provided with a mounting hole, the left side of the substrate is provided with a left clamping part, and the right side of the substrate is provided with a right clamping part, so that the utility model directly uses the whole radiator to radiate all chips on a display card, improves the radiating efficiency and reduces the trouble of independently installing a plurality of radiators on the display card, the installation of the radiator is more convenient.

Description

Display card radiator

Technical Field

The utility model relates to a heat exchange device, in particular to a display card radiator.

Background

The display card can generate a large amount of heat in the working process, a radiator, a fan and the like are required to be used for radiating the display card, the traditional radiator is a plurality of mutually independent structural parts, each radiator is correspondingly installed on each chip, and therefore the display card is correspondingly installed one by one when the radiator is assembled, the display card is very inconvenient, and a structure for pre-positioning installation is not arranged between the radiator and the display card, so that the dislocation is easily caused between the radiator and the display card when a connecting piece is driven in, and the display card is very troublesome.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a graphics card heat sink, which solves one or more of the problems of the prior art and provides at least one of the advantages of the present invention.

The solution of the utility model for solving the technical problem is as follows:

the utility model provides a display card radiator, includes the base plate, the top surface of base plate is provided with first fin and mount table, first fin has a plurality ofly, arbitrary adjacent two along controlling direction align to grid about, first ventilative clearance has between the first fin, the top surface of mount table is provided with the second fin, the second fin has a plurality ofly, arbitrary adjacent two along controlling the direction range, has the ventilative clearance of second between the second fin, the top surface of first fin with the top surface of second fin flushes each other, the top surface of mount table is provided with the mounting hole, the left side of base plate is provided with left joint portion, the right side of base plate is provided with right joint portion.

The technical scheme at least has the following beneficial effects: the base plate is arranged on the radiating surface of the peripheral display card, the base plate can be quickly positioned and arranged on the base plate by utilizing the left clamping part and the right clamping part of the base plate, then the connecting piece passes through the mounting hole on the mounting platform to fasten the base plate on the display card, thus the installation of the radiator is completed, the whole base plate can cover all chips on the display card, the heat of the chips is transferred from the base plate to the first radiating fin and the second radiating fin, the whole radiating area is increased by the first radiating fin and the first radiating fin, thereby the heat radiation is accelerated, the air can flow through the first ventilation gap and the second ventilation gap to take away the heat on the first radiating fin and the second radiating fin, the radiating efficiency is further improved, therefore, the utility model directly uses the whole radiator to radiate all chips on the display card, not only the radiating efficiency is improved, but also the trouble of independently installing a plurality of radiators on the display card is reduced, the installation of the radiator is more convenient.

As a further improvement of the above technical solution, the width of the first heat sink and the width of the second heat sink are both gradually reduced from bottom to bottom. The first radiating fin and the second radiating fin are gradually narrowed from bottom to top, so that heat transfer can be accelerated, and radiating efficiency is improved.

As a further improvement of the above technical solution, a plurality of third heat dissipation fins are arranged on the top surface of the base plate in the left-right direction, a third air-permeable gap is provided between any two adjacent third heat dissipation fins, and the height of each third heat dissipation fin is smaller than that of the first heat dissipation fin. The third radiating fin with lower part height is arranged on the substrate, and the third radiating fin can also radiate heat conducted out of the substrate and can also avoid an external structural part.

As a further improvement of the above technical solution, the width of the third heat sink is gradually reduced from bottom to top. Similarly, the third radiating fin is gradually narrowed from bottom to top, so that the heat transfer can be accelerated, and the radiating efficiency is improved.

As a further improvement of the above technical solution, the left clamping portion includes a first through groove disposed on a left side surface of the substrate, and the first through groove extends in a front-rear direction. The first through groove on the left side of the substrate provides a clamping space, and peripheral components are conveniently loaded into the substrate.

As a further improvement of the above technical solution, the right engaging portion includes a second through groove disposed on the right side surface of the substrate, and the second through groove extends in the front-rear direction. The second through groove on the right side of the substrate also provides a clamping space for the right side of the substrate, and external components are conveniently loaded into the substrate.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures are only some embodiments of the utility model, not all embodiments, and that a person skilled in the art can also derive other designs and figures from them without inventive effort.

Fig. 1 is an overall front view of the present invention.

In the drawings: 100-substrate, 110-first through groove, 120-second through groove, 200-first heat sink, 300-mounting table, 400-second heat sink, 500-third heat sink.

Detailed Description

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the connection relations mentioned herein do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. All technical characteristics in the utility model can be interactively combined on the premise of not conflicting with each other.

Referring to fig. 1, a display card radiator includes a substrate 100, the top surface of the substrate 100 is provided with a plurality of first cooling fins 200 and a mounting platform 300, the first cooling fins 200 are uniformly arranged in a left-right direction, any adjacent two first air gaps are provided between the first cooling fins 200, the top surface of the mounting platform 300 is provided with a second cooling fin 400, the second cooling fins 400 are arranged in a left-right direction in a plurality of numbers, any adjacent two second air gaps are provided between the second cooling fins 400, the top surface of the first cooling fins 200 and the top surface of the second cooling fins 400 are flush with each other, the top surface of the mounting platform 300 is provided with a mounting hole, the left side of the substrate 100 is provided with a left clamping portion, and the right side of the substrate 100 is provided with a right clamping portion.

From the above, the substrate 100 is mounted on the peripheral display card surface to be heat-dissipated, the substrate 100 can be positioned and mounted on the substrate 100 quickly by the left and right clamping portions of the substrate 100, and then the connecting member is passed through the mounting hole of the mounting stage 300 to fasten the substrate 100 on the display card, so as to complete the mounting of the heat sink, the whole substrate 100 can cover all chips on the display card, the heat of the chips is transferred from the substrate 100 to the first and second heat dissipation fins 200 and 400, the whole heat dissipation area is increased by the first and second heat dissipation fins 200 and 200, so as to accelerate the heat dissipation, and the air can flow through the first and second air-permeable gaps to take away the heat on the first and second heat dissipation fins 200 and 400, so as to further improve the heat dissipation efficiency, therefore, the present invention directly uses a whole heat sink to dissipate the heat of all chips on the display card, which not only improves the heat dissipation efficiency, the trouble of independently installing a plurality of radiators on the display card is reduced, and the radiators are more convenient to install.

As a further structural embodiment of the first heat sink 200 and the second heat sink 400, the width of the first heat sink 200 and the width of the second heat sink 400 are both gradually reduced from bottom to bottom. The first heat sink 200 and the second heat sink 400 are gradually narrowed from bottom to top, so that heat transfer can be accelerated, and heat dissipation efficiency can be improved.

In the above embodiment, the first heat sink 200 and the second heat sink 400 are provided only to achieve the overall heat dissipation and mounting functions, and in order to avoid mounting of the external structure, in the present embodiment, a plurality of third heat sinks 500 are provided on the top surface of the substrate 100, the plurality of third heat sinks 500 are arranged in the left-right direction, a third air-permeable gap is provided between any two adjacent third heat sinks 500, and the height of the third heat sink 500 is smaller than the height of the first heat sink 200. The third heat sink 500 with a lower height is disposed on the substrate 100, and the third heat sink 500 can also dissipate heat conducted from the substrate 100 and can also avoid peripheral structural members.

As a further structural embodiment of the third heat dissipation fin 500, the width of the third heat dissipation fin 500 is gradually reduced from bottom to top. Similarly, the third heat sink 500 is gradually narrowed from bottom to top, so that heat transfer can be accelerated, and heat dissipation efficiency can be improved.

In order to facilitate the positioning and installation of the substrate 100, as a further embodiment of the left clamping portion, the left clamping portion includes a first through groove 110 disposed on the left side surface of the substrate 100, and the first through groove 110 extends along the front-back direction. The first through-groove 110 at the left side of the substrate 100 provides a clamping space to facilitate loading of peripheral components into the substrate 100.

As a further embodiment of the right clamping portion, the right clamping portion includes a second through groove 120 disposed on the right side surface of the substrate 100, and the second through groove 120 extends in the front-back direction. The second through-slot 120 on the right side of the substrate 100 also provides a clamping space for the right side of the substrate 100, which facilitates the assembly of peripheral components into the substrate 100.

While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the utility model as set forth in the claims appended hereto.

Claims

1. A display card radiator is characterized in that: including base plate (100), the top surface of base plate (100) is provided with first fin (200) and mount table (300), first fin (200) have a plurality ofly, arbitrary adjacent two along left right direction align to grid first air gap has between first fin (200), the top surface of mount table (300) is provided with second fin (400), second fin (400) have a plurality ofly along left right direction align to grid, arbitrary adjacent two second air gap has between second fin (400), the top surface of first fin (200) with the top surface of second fin (400) flushes each other, the top surface of mount table (300) is provided with the mounting hole, the left side of base plate (100) is provided with left joint portion, the right side of base plate (100) is provided with right joint portion.

2. The graphics card heat sink of claim 1, wherein: the width of the first cooling fin (200) and the width of the second cooling fin (400) are gradually reduced from bottom to bottom.

3. The graphics card heat sink of claim 1, wherein: the top surface of the base plate (100) is provided with a plurality of third radiating fins (500), a plurality of the third radiating fins (500) are arranged along the left-right direction, a third air-permeable gap is formed between any two adjacent third radiating fins (500), and the height of each third radiating fin (500) is smaller than that of each first radiating fin (200).

4. The graphics card heat sink of claim 3, wherein: the width of the third radiating fin (500) is gradually reduced from bottom to top.

5. The graphics card heat sink of claim 1, wherein: the left clamping portion comprises a first through groove (110) formed in the left side face of the substrate (100), and the first through groove (110) extends in the front-back direction.

6. The graphics card heat sink of claim 1, wherein: the right clamping portion comprises a second through groove (120) formed in the right side face of the substrate (100), and the second through groove (120) extends in the front-back direction.